2D Vector Graphics Accelerator / GPU (Graphics Processing Unit)
UbiNetics unveils PUMA 3G modem platform to speed up availability of 3G handsets
February 3, 2005 -- UbiNet<>ics, the world leader in WCDMA and HSDPA terminal and test and measurement technology, has revealed its plans to launch PUMA – a multimode 3G platform for mobile phone manufacturers wishing to make the transition to 3G.>
The PUMA platform provides a ‘reference design’ for the essential radio ‘modem’ building block within a 3G mobile, the key new component for 3G phones compared with current 2/2.5G (GSM/GPRS) products. The hardware part of the platform includes ‘best in breed’ baseband and RF chipsets from premium silicon vendors, together with UbiNetics’s circuit designs and PCB layout. The key software component is the UbiNetics 3G multimode protocol stack, which has undergone extensive inter-operability testing through its use in UbiNetics test mobile products.
Other benefits of PUMA include lower BOM (Bill Of Materials) cost and lower component count than today’s handsets, and EDGE capability – no current 3G handset offers combined WCDMA and EDGE functionality. The platform is provided with all software and hardware ‘pre-integrated’. Users can easily adapt the platform to their specific requirements by minor changes to the hardware and software, with support from UbiNetics.
“Handset players are facing a big hurdle in transitioning their 2G portfolio to cover 3G models,” said Raj Gawera, Vice-President in charge of the PUMA platform development at UbiNetics. “The PUMA offering from UbiNetics is designed to give these players a springboard to execute this transition swiftly and smoothly. The design of the PUMA platform will allow them to make the leap to 3G with reduced timescales, risk and development effort.”
The initial release of the PUMA platform supports GSM, GPRS, EDGE and WCDMA functionality. Later evolutions of PUMA will support HSDPA – a technology which UbiNetics is heavily involved in through its TM500 Test Mobile solution which is already being used to test early HSDPA networks.
|
Related News
- Infineon and InterDigital expand cooperation; InterDigital Announces Availability of Complete Dual-Mode 2G/3G Wireless Modem Platform based on 2G GSM/ GPRS/EDGE Technology from Infineon
- Infineon Introduces Complete UMTS Handset Platform Solution Development Time and Costs Savings for 3G Handsets of up to 50 Percent
- TowerJazz Announces Availability of its Next-Generation Power Management Platform Enabling up to 30% Efficiency Boost and Form Factor Reduction
- IMEC unveils tools to speed design of energy-efficient multi-processor SoC platforms
- NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson to Jointly Develop Platform for 3G Mobile Phone Handsets
Breaking News
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |