English
Winbond buys stake in Silicon Valley-based NexFlash
 |
Winbond buys stake in Silicon Valley-based NexFlash
By Semiconductor Business News
February 2, 2001 (10:12 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010202S0016
SANTA CLARA, Calif.--Taiwan's Winbond Electronics Corp. has acquired a minority stake in NexFlash Technologies Inc., a Santa Clara-based developer of intellectual property for flash memory. The stake was purchased for $33 million, according to NexFlash, which was established in 1998 by Integrated Silicon Solution Inc. (ISSI) here. "Partnering with Winbond will enable NexFlash to pool the resources to develop very advanced process technologies and products," said Mo Bandali, president of NexFlash. "In addition, the cash infusion will finance our growth as we go forward." About 45% of the funds from Winbond will go directly to NexFlash with the rest being received by shareholders in the privately-held company. The investment was made by the investment arm of Winbond, based in Hsinchu, Taiwan.
Related News
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
- zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
- Axiomise Heads to Silicon Valley Next Week for RISC-V Summit North America
- MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |