Silicon Image Appoints Garcia-Meza as Vice President of Storage Business
SUNNYVALE, Calif., February 24, 2005 - Silicon Image, Inc. (Nasdaq: SIMG), a leader in multi-gigabit semiconductor solutions for the secure transmission and storage of rich digital media, today announced the appointment of Jimmy Garcia-Meza as vice president of storage products business-reporting to Silicon Image president and chief executive officer, Steve Tirado.
Silicon Image has a demonstrated history in delivering technology innovation and market leadership in the storage arena. Its market-leading SATALink™ Serial ATA (SATA) host controllers, coupled with its recently announced SteelVine™ SATA-based storage architecture and systems products for small-to-medium business and consumer electronics applications, have provided a tremendous growth platform for the Company.
Tirado commented, "Jimmy's sales and marketing expertise was instrumental in launching the SteelVine product line and developing the distribution channels to fuel this exciting new business. As he has demonstrated in the past, I am confident that Jimmy will provide the overall leadership and management skills necessary to successfully grow our storage business to the next level."
Commenting on his appointment, Garcia-Meza said, "I am excited to be in a position of such strategic impact on the overall success of the business. Our storage solutions, both semiconductor and systems, are world-class, and I look forward to expanding their use and application worldwide."
Immediately prior to this position, Garcia-Meza served as vice president of worldwide sales and business development, storage division, and for the three years prior, as Silicon Image vice president of worldwide sales, where under his guidance revenues more than tripled. Prior to Silicon Image, he held venture capital positions at The Corporate Finance Group in Geneva, where he was a general partner for the Milestone Capital I Limited Partnership, and at Index Ventures, also in Geneva, as venture director.
Garcia-Meza has extensive high-tech sales and corporate management expertise, anchored by more than 12 years at Sun Microsystems, where he held the position of corporate director of Integrated Operations and Business Support Systems Solutions for Sun's worldwide telecommunications business. Earlier, based in Geneva, he served as director of telecommunications sales development for Europe, Asia and Latin America. Garcia-Meza has a bachelor's degree in electrical engineering and a master's degree in telecommunications and computer networks from the University of Kansas.
About Silicon Image
Headquartered in Sunnyvale, Calif., Silicon Image, Inc. designs, develops and markets multi-gigabit semiconductor and system solutions for a variety of communications applications demanding high-bandwidth capability. With its proprietary Multi-layer Serial Link (MSL™) architecture, Silicon Image is well positioned for leadership in multiple mass markets including PCs, consumer electronics and storage. Currently, Silicon Image leads the global PC/display arena with its innovative digital interconnect technology, and has emerged as a leading player in the consumer electronics and storage markets-offering robust, high-bandwidth semiconductors. For more information on Silicon Image, visit www.siliconimage.com
This news release contains forward-looking information within the meaning of federal securities regulations, regarding, among other things, our plans, strategies and prospects, both business and financial, and financial results. These forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those anticipated by these forward-looking statements and the Company cannot assure that it will achieve or realize its plans, intentions or expectations. In particular, the company's future financial results may differ materially from those currently anticipated. In addition, see "Management's Discussion and Analysis of Financial Condition and Results of Operations - Factors Affecting Future Results" in the most recent Quarterly Report on Form 10-Q and Annual Report on Form 10-K filed by Silicon Image with the SEC. Silicon Image assumes no obligation to update this forward-looking information.
###
Silicon Image, SATALink, SteelVine, MSL and www.siliconimage.com are trademarks, registered trademarks or service marks of Silicon Image, Inc. in the United States and other countries.
|
Related News
- Silicon Image Appoints New Vice President of Engineering
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth
- Cortus S.A.S Appoints Mr. Gordon Yang Guo-dong as Vice President of Business Development
- Credo Semiconductor Appoints Jeff Twombly as Vice President of Sales and Business Development
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |