7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Rambus invests $5 million in NurLogic, sees synergy in business models
![]() |
Rambus invests $5 million in NurLogic
By Semiconductor Business News
January 22, 2001 (4:06 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010122S0043
SAN DIEGO -- NurLogic Design Inc. here today announced $5 million in funding from Rambus Inc., which is helping the four-year-old company to finance development of new communications and connectivity chip technologies. Privately-held NurLogic supplies high-speed chip technologies for broadband CMOS and silicon-germanium (SiGe) ICs. Rambus, the developer of wide-bandwidth DRAMs and memory interfaces, sees the investment as a "natural fit given the synergy between the two companies' business models, high-speed I/O technologies, and share vision for future connectivity requirements," said Kevin Donnelly, vice president of the Network Connections Division at Rambus. "As part of the agreement, both companies will work together to ensure NurLogic's future products interface with Rambus' serial link technologies for broader industry deployment," added the Rambus vice president, based in Los Altos, Calif. The $5 million investment marks the first ti me that NurLogic has received funding from another company in the past four years. According to company officials, NurLogic is profitable. "NurLogic has been seeking a strategic investor in order to more fully exploit today's explosive growth in the connectivity and communications markets," said Dave Matty, president and CEO of the San Diego company. "Rambus is an ideal partner for us in that they offer the potential for product collaboration based on a shared vision for high-speed connectivity. NurLogic will also benefit from the experience of Rambus' successful pioneering work in the IP industry." In addition to licensing its Rambus DRAM architecture, Rambus has begun collecting additional royalties for its patents in high-speed synchronous DRAM interfaces, and it is involved in lawsuits with Infineon, Micron, and Hyundai.
Related News
- Rambus Initiates $100 Million Accelerated Share Repurchase Program
- Faraday Reports Fourth Quarter 2020 Revenues at NT$1,430 Million, 2020 Annual Revenues NT$5,495 Million, Mass Production Up 18% YoY
- Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights
- Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round
- Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |