Digital Core Design will take part in the EU Gateway to Japan
March 14, 2005 - Brussels, Belgium and Bytom, Poland - Digital Core Design (DCD) , the Intellectual Property (IP) Core provider and System-on-Chip (SoC) design house, will take part in the EU Gateway to Japan - Information and Communication Technologies Trade Mission.
The whole program covers not only preparations and meetings prior the mission, events and business meetings in Japan, but also post-event activities and support in Japan and Europe, including use of facilities and support of JETRO (Japan External Trade Organization) in the form of Trade Tie-Up Promotion Program.
"We started exporting our IP cores to Japan last year, and right after establishing new business contacts we succeeded with projects for such prestigious customers like TOYOTA and SYSMEX. Taking part in the EU Gateway to Japan is viewed by DCD as a next step in our expansion in Asian markets. The promotion and business opportunities offered by European Commission together with Japanese organizations during the EU Gateway to Japan program allow us better understand the Japanese business culture and shorten the path and time to become a full beneficent from co-operation with Japanese companies, resulting in increasing substantially our business with Japan." - said Jacek Hanke, the President of DCD.
Digital Core Design has been keeping one of the leading positions in the Intellectual Property market as a design company of highest quality synthesizable VHDL & Verilog IP Cores for over five years. DCD's IPs are high performance and cost-effective cores that enhance flexibility and reduce time-to-market for companies in many sectors, including: communications, consumer electronics, security, military, medical, automotive and other industrial markets. DCD is an expert in designing the following IP cores:
- Microcontrollers/microprocessors
- Floating point and math functions coprocessors and units (IEEE-754 compliant),
- Bus interfaces and other peripheral cores.
- Getting a silicon proven complete IP solutions (core and debug system) from only one designer,
- Design risks elimination,
- Wide range of peripherals and full customization,
- Global sales network and professional service of experienced engineers.
The functionality of IP solutions offered by DCD were up to date appreciated by over 200 licenses sold for over 150 customers worldwide, such as: INTEL, SIEMENS, PHILIPS, TOYOTA, MAXIM, RAYTHEON, OSRAM, GENERAL ELECTRIC, SAGEM AND GOODRICH. DCD also became a member of first-class branch partner programs like: AMPP program of ALTERA, AllianceCORE of XILINX, LeverCore of LATTICE and IP Catalyst of SYNOPSYS. For more information about Digital Core Design and products, please visit www.dcd.pl
|
Digital Core Design Hot IP
Related News
- CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
- Barco Silex JPEG2000, AES and HMAC IP cores are part of new Barco Alchemy digital cinema projectors
- Lantiq Announces Family of Gigabit Speed Gateway Processors with Industry Leading Performance, Flexibility to Support New Digital Home Services
- Altera and DDD Take 2D Digital Images to 3D
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |