MoSys Signs First EDA to Its International Sales Representative Network; Newest Partnership Covers UK and Ireland
SUNNYVALE, Calif., Mar 21, 2005 (BUSINESS WIRE) -- Monolithic System Technology, Inc. (MoSys), (Nasdaq:MOSY) the industry's leading provider of high-density system-on-chip (SoC) embedded memory solutions today announced that First EDA Ltd, of Banbury, UK is MoSys' newest sales representative, covering the United Kingdom and Ireland.
First EDA specializes in the distribution and support of leading-edge EDA solutions for designers involved in the specification, implementation and verification of custom silicon devices. For more information on First EDA, please visit the corporate web pages at http://www.firsteda.com.
"We are excited about the opportunity to represent MoSys, one of the true pioneers in memory technology," said Julian Lonsdale, sales director for First EDA Ltd. "Our UK and Ireland customers are very active in developing innovative IC solutions with mass market potential. MoSys' patented 1T-SRAM technology will give our customers an optimum route for their embedded memory needs."
"The United Kingdom and Ireland are very important for MoSys and we are pleased First EDA has joined our international network of sales representatives," said Karen Lamar, MoSys' vice president of Sales and Marketing. "The combination of market knowledge and engineering expertise that has been garnered by First EDA's staff over many years will play a key role in establishing MoSys as the preferred high density embedded memory provider."
ABOUT MOSYS
Founded in 1991, MoSys (Nasdaq:MOSY), develops, licenses and markets innovative memory technologies for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM memory results in the technology achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes. 1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, these technologies can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making them ideal for embedding large memories in System on Chip (SoC) designs. MoSys' licensees have shipped more than 80 million chips incorporating 1T-SRAM embedded memory technologies, demonstrating excellent manufacturability in a wide range of silicon processes and applications. MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys' website at http://www.mosys.com.
FORWARD LOOKING STATEMENTS
This press release may contain forward-looking statements about the Company including, without limitation, benefits and performance expected from use of the Company's 1T-SRAM technology.
Forward-looking statements are based on certain assumptions and expectations of future events that are subject to risks and uncertainties. Actual results and trends may differ materially from historical results or those projected in any such forward-looking statements depending on a variety of factors. These factors include but are not limited to, customer acceptance of our 1T-SRAM technologies, the timing and nature of customer requests for our services under existing license agreements, the timing of customer acceptance of our work under such agreements, the level of commercial success of licensees' products such as the Nintendo GAMECUBE and cell phone hand sets, ease of manufacturing and yields of devices incorporating our 1T-SRAM, our ability to enhance the 1T-SRAM technology or develop new technologies, the level of intellectual property protection provided by our patents, the vigor and growth of markets served by our licensees and customers and operations of the Company and other risks identified in the Company's most recent annual report on Form 10-K filed with the Securities and Exchange Commission, as well as other reports that MoSys files from time to time with the Securities and Exchange Commission. MoSys undertakes no obligation to update publicly any forward-looking statement for any reason, except as required by law, even as new information becomes available or other events occur in the future.
1T-SRAM(R) is a MoSys trademark registered in the U.S. Patent and Trademark Office. All other trade, product, or service names referenced in this release may be trademarks or registered trademarks of their respective holders.
SOURCE: MoSys
|
Related News
- MoSys Strengthens Presence in Taiwan Markets; Signs Sales Representative Agreement with Terasic Technologies, Inc.
- MoSys Signs Sales Representative Agreement with Crescendo Technologies Ltd.; Partnership Strengthens Market Presence in China
- NewLogic Appoints New Northern European Sales Representative for UK, Ireland and Nordic Countries
- Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada
- Faraday Announces the Expansion of its Manufacturer Representative Network for Eastern and Central US and Canada
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |