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D&R Headline News (December 2003)
Headlines for Monday Dec. 29, 2003
Latest News- Green Hills Software Announces Royalty-Free CANbus Support for Its INTEGRITY Real-Time Operating System
- Motorola Broadband To Integrate Altera FPGAs In New High-Definition Satellite Receiver
Headlines for Wednesday Dec. 24, 2003
Latest News- Patriot Scientific (PTSC) Files Additional Patent Infringement Lawsuits
- CEO: UMC to get 91 new IPs based on 65-nm technologies
- Rambus Completes Acquisition of Serial Interface Assets of Velio Communications, Inc.
- Xilinx Provides Unprecedented System Integration with New DUC and Enhanced FEC DSP Cores
Headlines for Tuesday Dec. 23, 2003
Latest News- Patriot Scientific (PTSC) Files Lawsuits to Enforce Patents
- Shanghai Jiao Tong University Licenses ARM922T Core For Advanced SoC Research
Headlines for Monday Dec. 22, 2003
Latest News- Holiday Wish Lists Topped with MIPS-Based Gifts
- TSMC Files Law Suit Against SMIC for Patent Infringement and Trade Secret Misappropriation
- Faraday Adopts Legend's Toolset for Efficient Memory Characterization Based on Layout Extraction
Headlines for Thursday Dec. 18, 2003
Latest News- MOSAID Announces Intention to Make Normal Course Issuer Bid
- Digital Core Design announces new uCLinux testing platform for the D68000 Microprocessor Core
- 0-In Announces Sun Microsystems Renews and Expands Corporate License
- Advanced video IP gains Amphion membership in IBM Blue Logic Collaboration Program
Headlines for Wednesday Dec. 17, 2003
Latest News- Duolog Releases its Embedded Wireless LAN 802.11g Baseband Core as part of its WLAN Platform
- STMicroelectronics Announces Embedded Dual-Mac DSP Core Running Above 600MHz
- Intelliga Integrated Design, a UK design house develops LIN core for Xilinx
- Elliptic Semiconductor Welcomes Japanese Distributor Microtek to Partners’ Program.
- Xilinx Enables Next Generation Metro Area Networks by Delivering Ethernet Over Sonet/SDH Solutions
- ChipIdea Microelectronics SA ranked as 115th on 2003 Europe’s 500 Listing of fast growing, job creating companies
- 0-In Design Automation Helps AMD Verify Complex Networking and Processor Chipsets
- Shanghai Fudan Microelectronics Licenses ARM7TDMI Core For Media Processors In Consumer Electronics Product
Headlines for Tuesday Dec. 16, 2003
Latest News- Mentor Graphics Announces Co-Verification Models for PMC-Sierra MIPS-based Microprocessors to Speed Verification of Embedded Applications
- Samsung Electronics Licenses Silicon Image SATA Core
- CEVA Sharpens Focus on Digital Signal Processors, Updates Q4 Guidance, and Targets Profitability in 2004
Headlines for Monday Dec. 15, 2003
Latest News- Aptix Introduces Pathfinder IP Validation Station
- 0-In Verification IP Portfolio Grows to Include More than 25 CheckerWare Monitors
- ARC International Introduces ARC 501 32-bit RISC Processor Core
- GDA Technologies Selected by QLogic for PCI Express Cores
- Fulcrum Microsystems Announces License Agreement With PMC-Sierra For Crossbar Switch Technology
- Standard Microsystems (SMSC) Reports Record Third Quarter Semiconductor Revenues
- UMC Introduces Breakthrough RFCMOS Design Methodology
- Verification leader TransEDA names former Semiconductor Executive as Chief Executive Officer
- Spreadtrum Commences Shipments Of GSM/GPRS Chip Powered By CEVA-TeakLite DSP Core To Chinese Market
- NEC Electronics Announces SerDes ASIC Macro for OBSAI RP3
- Broadcom Utilizes CEVA DSP Core To Power Edge Cellular Solution
- MIPS Architecture Expands Set-Top Box Market Leadership Into Fast-Growing Satellite Segment
- Sanyo Licenses MoSys' 1T-SRAM Embedded Memory
- Faraday Announces Silicon Proven 3G Serial ATA Technology
- TriCN introduces RLDRAM II Interface IP
- Tower Semiconductor adopts Legend’s CharFlo-Memory! for quality assurance of commercially available memory compilers
- UMC adopts Legend Design Technology’s CharFlo-Memory! toolset
Headlines for Friday Dec. 12, 2003
Latest NewsHeadlines for Thursday Dec. 11, 2003
Latest News- Silicon & Software Systems (S3) is appointed as the world's first Designated Design House for Toshiba's MeP
- Verisity to Acquire Axis Systems; Acquisition Will Extend Verification Process Automation -VPA- Solution to Pursue Billion Dollar Verification Market
- Unisys Selects Denali for PCI Express Interface Development
- IC Mask Design delivers on Motorola's latest chip design
Headlines for Wednesday Dec. 10, 2003
Latest News- Ericsson introduces Bluetooth interoperability testing of consumer products
- Chip Express Names Amnon Fisher President and Chief Executive Officer
- NEC Electronics and Cadence Announce Encounter Platform to Support NEC Electronics' ISSP Structured ASIC Platform
- MIPS Architecture Extends into Automotive Telematics Sector With Strategic Partnership Between DENSO and Toshiba
- NEC Electronics and Mysticom Ink Ethernet Core License Agreement
- Napatech and Xilinx Announce World's First 10Gbps Programmable Ethernet Adapter
- Xilinx Spartan-3 Devices Enable High Performance DSP Functions at Breakthrough Low Cost Price Points
Headlines for Tuesday Dec. 09, 2003
Latest News- Genesis Microchip Takes License for MIPS Technologies’ MIPS32 4KEc Core
- Silicon Image Joins Verisity's Pure IP Program; Provides Automated Process for Integrating Silicon Image's SATA, HDMI and DVI IP
Headlines for Monday Dec. 08, 2003
Latest News- New downloadable toolkit for Cambridge Consultants XAP2 processor takes the risk out of ASICs
- Sand Video to release industry's first low power MPEG4-AVC/H.264 decoder core for video enabled mobile applications
- Multiband-OFDM Alliance seeks to lift UWB licensing clouds
- Analog IP from LTrim Technologies rolls for TSMC processes
- Actel Enhances Libero Tool Suite to Boost Performance and Support for ProASICPLUS FPGAs
- Altera HardCopy Devices Speed Development of New Motorola Horizon II BTS Portfolio
- Faraday adopts Cadence Encounter Platform for Structured ASIC design
- Xilinx Unveils Revolutionary FPGA Architecture, Enables Next-Generation Platform FPGAs
- Tower Semiconductor standardizes on TriCN's interface IP
- AMI Semiconductor Integrates 8051 Core and I3T- based SoC Enabling Reduced Component Count Designs
- ParthusCeva Changes Name to CEVA, Inc.
- CEVA Announces Launch And Licensing Of Pioneering CEVA-X DSP Architecture
- Actel's Advanced Packaging Technology Delivers High-Density, Programmable Alternative to Known Good Die
- Fujitsu/Fujitsu VLSI adopts Legend Design Technology's CharFlo-Memory! Toolset for Memory Characterization
Headlines for Thursday Dec. 04, 2003
Latest News- Actel’s Protocol Design Services Group Selects HelloSoft’s Wireless LAN IP
- ARC International plc announces the resignation and departure from his position with immediate effect of Mike Gulett, Chief Executive Officer
- DCM Technologies announces availability of IEEE802.11 Mulitmode MAC on the Accelerated Technology Nucleus Plus Kernel
Headlines for Wednesday Dec. 03, 2003
Latest News- HelloSoft Introduces Industry’s First Fully Customizable Wireless LAN IP Solution
- Townshend Intellectual Property LLC claims legal victory over ADI in modem suit
- NewLogic Releases its Embeddable Wireless LAN 802.11g Modem IP Core
- New ARM9E Family Core Provides Unrivalled Low-Power Performance
- LG Electronics Picks Tensilica’s Xtensa Processor For the Digital Multimedia Broadcasting Project of the Korean Government
- UbiNetics' wireless technology integrated into Emerging Technologies' PDA
Headlines for Tuesday Dec. 02, 2003
Latest News- High-Density Packaging Solution Further Extends Actel's Reach Into Space and Military Markets
- TTPCom delivers 802.11 Wireless Multimedia Extensions
- Denali and StarGen Team on Advanced Switching Product Roll-out
Headlines for Monday Dec. 01, 2003
Latest News- StarCore LLC Secures Third Round of Funding
- CoWare Advances Design of Ultra Wideband (UWB) Wireless Networking Products With Library Support Through Its Signal Processing Worksystem (SPW)
- Lattice Field Programmable System-on-a-Chip Demonstrates 4G Fibre Channel Capability
- Guido Arnout, a Silicon Valley EDA veteran, joins Elixent board
- LogicVision appoints James T. Healy as President and CEO; Dr. Vinod Agarwal becomes Executive Chairman and Chief Strategist
- ARC International Introduces the ARC 600 Development Tool Suite
- ARC International Introduces the ARC 600 Digital Audio Platform, Optimized for System Area and Power