D&R Headline News (February 2007)

Headlines for Wednesday Feb. 28, 2007

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Analysis: BDTI Certifies ARC's H.264 Performance

This month BDTI and silicon intellectual property licensor ARC International announced completion of BDTI Solution Certification™ of the H.264 decode performance of the ARC Video Subsystem. The ARC Video Subsystem, the first product to be certified under BDTI's Solution Certification Service, is a programmable subsystem capable of supporting multiple video standards.

• CAST PCI Express Core Achieves PCI-SIG Certification

Headlines for Tuesday Feb. 27, 2007

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Elliptic Responds to Customer Demand for Security Software with Ellipsys

Ellipsys will speed development cycles and enable security solutions that are a mix of hardware acceleration and software best suited to the end application. Ellipsys is designed to be portable across multiple operating systems such Linux, VxWorks and Windows Embedded CE and implements the most popular symmetric and asymmetric cryptographic algorithms.

• Kaben Developing FM Tuner IP
• ARM7-based Motor Control Development Kit from STMicroelectronics Simplifies Vector Drive Design for Cost-Sensitive Applications
• W&W Communications Introduces H.264 Codec Chipset for Live HD Broadcast Applications
• Xilinx Delivers Industry's First 90nm Non-Volatile FPGA Solution with New Spartan-3AN Platform

Headlines for Monday Feb. 26, 2007

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Chartered Extends Technology Development Agreement with IBM to 32nm

As with previous nodes, 32nm development activities will be conducted at IBM's state-of-the-art 300 millimeter (mm) semiconductor fabrication facility in East Fishkill, N.Y. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities.

• Orbital Research Inc. and Gaisler Research AB signs license agreement for LEON3
• Cypress Announces Foundry Relationship with UMC
• Tensilica's New Energy Estimator Tool Guides Designers to Energy-Efficient SOC Architectures
• Texas Instruments Launches New Development Platform for DaVinci Technology to Speed Development of Digital Video Products

Headlines for Friday Feb. 23, 2007

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MOSAID to Sell Memory Test Assets to Teradyne; Focused on Intellectual Property

Teradyne is purchasing the assets and intellectual property associated with a MOSAID high performance tester platform. Teradyne will also receive an exclusive license to certain patented and non-patented intellectual property associated with MOSAID's current ATE product lines, and a non-exclusive patent license for Teradyne's ATE products.

• Sidense Strengthens Market Position with ViXS License Deal
• HDL Design House becomes member of the ARM Connected Community
• MOSAID Wins Competitive Bid for Essential WiFi and WiMAX Patents from Agere Systems
• MOSAID Announces Third Quarter Results for Fiscal Year 2007

Headlines for Thursday Feb. 22, 2007

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Arasan Chip Systems Licenses the Compact Flash IP Core to Samsung Electronics

Arasan has licensed its CompactFlash (CF) IP Core to Samsung Electronics, Korea. Arasan's IP will be used in a wide range of Samsung Products. Samsung had also licensed Arasan's SDIO Device Controller IP which has now been used in multiple designs.

• NEC shuts fabs, exits structured ASICs
• Renesas Introduces 324MHz, 583-MIPS SuperH Microprocessor for Multimedia and Office Automation Applications
• Ricoh Selects SonicsMX(R) SMART Interconnect(TM) Solution for Its Image Processing Platform SoC Strategy
• Chipidea Opens New Radio Frequency Design Center in France
• Sasken Application Framework Powers Rich Media Phones on Texas Instruments OMAP-Vox Platform

Headlines for Wednesday Feb. 21, 2007

• Japan-based PALTEK selects Avalon Microelectronics
• Xilinx and NSA Deliver New Design Flow and Verfication Process for High Assurance Industry
• Gaisler Research and Aldec partner to increase IP core availability and portability
• ARC Announces Return of Successful ConfigCon Conference Series with New Locations Added for 2007
• Wi-LAN Announces $40 Million Bought Deal Financing

Headlines for Tuesday Feb. 20, 2007

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ChipX Purchases OKI's U.S. ASIC Business Assets and Signs Business Collaboration Agreement

As a result of the collaboration between the two companies, Oki Semiconductor has become a turnkey foundry for ChipX and has licensed its embedded array and Gate array technology and internally developed IP to ChipX. Oki Semiconductor has assigned all of its U.S. ASIC product backlog to ChipX and has contracted the completion of the ongoing customer designs to ChipX.

• TI talks about IC production strategy
• Xilinx Simplifies Design of PCI Express, Gigabit Ethernet and Xaui with New Virtex-5 Protocol Packs
• IPextreme to Sell and Support IP Portfolio from National Semiconductor including AMBA Peripheral Library and CR16 Processor
• Global Unichip Selects Denali for DDR Memory System Deployment
• Patriot Scientific Momentum Continues as Funai Purchases Moore Microprocessor Patent(TM) Portfolio License
• Tower Semiconductor Begins Production of CopperGate’s Next Generation HomePNA Product

Headlines for Monday Feb. 19, 2007

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Arteris ships Arteris NoC Solution 1.6, lowers power requirements, improves flexibility, usability of Network-On-Chip (NoC)

The latest release of the IP library and accompanying tool set incorporates a range of customer-requested features to improve the efficiency and ease-of-use of implementing NoCs for multi-media, telecom infrastructure and wireless SoC designed in leading-edge manufacturing processes down to 45-nanometer (nm). Key to the release is a low-power version of the Arteris NoC IP library, aimed specifically at demanding wireless and consumer applications.

• CoFluent Design closes $2.6 million in its first round of funding
• ARC and BDTI Announce the Industry's First Certified H.264 Decoder Performance Benchmark Results
• IntellaSys Adds Two New Memory Reader Controller Chips to OnSpec Line
• Mixed-signal chip firm sees more mergers
• Proven Software Solutions joins Renesas Alliance Partner Program as Platinum Partner
• JEDA Brings Key Verification Technologies to SystemC

Headlines for Friday Feb. 16, 2007

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Faraday Announces FPGACompanion ARM(TM) CPU Device

With an embedded ARM core and on-chip peripheral functions in the FC device, ASIC customers can use FC in system level SoC design verification together with customer logic implemented on FPGA devices. Faraday's FC has been sampled at several customer sites, with general availability starting immediately

• Hitachi and Renesas Technology Develop 1.5-V Low-Power, High-Speed Phase Change Memory Module for On-Chip Nonvolatile Memory Applications

Headlines for Thursday Feb. 15, 2007

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Chipidea to Acquire Data Converter Business Unit from Nordic Semiconductor ASA

Nordic Semiconductor and Chipidea today announced that they have entered into a definitive agreement for Chipidea to acquire the assets of Nordic Semiconductor's Data Converter IP Business Unit for $6 million in cash.

• Radionor Communications AS and Gaisler Research AB signs license agreement for LEON3
• Altera and TES Partner on FPGA-Based PCI Graphics Controller IP
• Philippe Geyres Rejoins Arteris Board of Directors
• Altera Automotive Graphics Platform Enables ''Design Once, Make Many'' Applications
• Court Rules for TI in Patent Case Brought by Licensing Company
• Video special: Interview with TSMC Chairman Morris Chang

Headlines for Wednesday Feb. 14, 2007

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Synopsys IP for PCI Express 2.0 (Gen II) Passes PCI-SIG Compliance

The DesignWare digital controller IP for PCI Express 2.0 is fully compliant with the recently released PCI Express 2.0 specification and has successfully passed the latest PCI Express compliance testing at the PCI-SIG interoperability workshop held in the United States in December 2006.

• Hantro Delivers Windows Media Video on austriamicrosystems' High Performance Mobile Entertainment Platform
• ARC International Announces Unaudited Preliminary Results for the Year Ended 31 December 2006
• Synopsys' DesignWare IP for PCI Express Supports NXP Semiconductors' PXPIPE PHY Interface
• Faraday Receives the Frost & Sullivan Award for Customer Service Innovation in the Area of VLSI Design Services
• IBM Unveils World's Fastest On-Chip Dynamic Memory Technology

Headlines for Tuesday Feb. 13, 2007

Top Story

STMicroelectronics Licenses AMD Next-Generation Graphics Technology for Mobile Multimedia

ST's Nomadik application processor to offer cutting-edge 3D games capability resulting from a strategic license with AMD for market-leading graphics acceleration technology

• Microbridge Completes $5 Million Extension Round of Funding From an International Syndicate of Investors, Raises $12.5 Million to Date
• Elliptic Semiconductor Algorithms NIST Certified to FIPS140-2
• Micronas Selects ARM Mali200 Graphics Processor for Next-Generation TV and STB Chipset Designs
• Imagination Technologies' PowerVR SGX Graphics Accelerator Technology Used in Texas Instruments OMAP 3 Platform
• Xilinx Expands Reach in Aerospace and Defense Market with Virtex-4 QPro Product Family
• Penstar Technology Licenses Tensilica's Diamond Standard 330HiFi Audio Processor Core for AVS Standard in China
• ARM Cortex-A8 Processor Provides Industry Leading Performance in TI OMAP3430
• Hantro Demonstrates Ultra Low Power Video IP Products
• IP Cores, Inc. Announces an Ultracompact 3DES IP Core
• Hard IP Extension of the VSIA QIP Metric Enters Beta Testing
• MoSys, Inc. Reports Fourth Quarter and Fiscal 2006 Financial Results

Headlines for Monday Feb. 12, 2007

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ARM Builds Graphics Stack And Broadens Portfolio With Mali200 And Mali55 Processors

The ARM Mali200™ processor delivers visually stunning 3D graphics for next-generation mobile games on smartphones and other high-end portable devices. With an extraordinarily small footprint, the ARM Mali55™ processor brings rich 3D graphics capabilities to low-cost feature phones for the first time.

• Marvell Expands its 3G Portfolio; Marvell to License 3G Protocol Software Stack from Motorola
• Comsys EGGware To Power Next Generation Mobile Handset Solution From Infomax
• Rambus Unveils Low Power Initiative For Multi-Gbps Platforms
• CoWare Integrates ARM RealView Development Suite with Its Virtual Platform Product Family
• LSI Adopts Denali's PCI Express 2.0 Solutions to Streamline RAID Technology
• Renesas Technology Expands Relationship With ARM For Faster Development Of Mobile/Consumer Devices At Lower Cost
• Hantro Multi-Format Video Codecs to be Integrated into Magic Pixel’s Next Generation Application Processor IC’s
• Rambus Ruling To Fuel Reforms
• MagnaChip Semiconductor Ltd. Licenses Silicon Hive’s HiveFlex ISP 2200 Processor For New Imaging Sensor
• Chipnuts Technology Selects CEVA Audio Subsystem and Software for Low-Power Multimedia Processors
• IMEC realizes world's first digital UWB transmitter IC for IEEE 802.15.4a
• CEVA and Comsys Partner for Development of Multimode WiMAX Processors
• Cellular3G Integrates CEVA-X DSP Core Into UMTS Baseband Chip for 3G Mobile Phone Applications
• Unique Key and Serial Number ID for Programmable Logic Solutions Opens Up Flexible Security Options for Embedded System Developers
• Stream Processors, Inc. Licenses MIPS32(R) 4KEc(R) Core for Use in Breakthrough Stream Processor Architecture
• Five Billionth ARM Processor for Mobile Devices
• Broadcom Expands Its Mobile Technology Leadership with Industry's First 65nm Single-Chip EDGE System Solution
• eInfochips Opens 4th Design Center in Ahmedabad
• Imagination Technologies Demonstrates 'One Seg' on its Multi-Standard Mobile TV IP Platform at 3GSM
• Tough Times Prompt Murmurs That Transmeta Might Be On Block
• Stream Processors, Inc. Announces Storm-1 Family of Data-Parallel Digital Signal Processors
• Plato Networks Adopts Tensilica's Diamond Standard 108Mini For Upcoming 10Gigabit PHY Design

Headlines for Friday Feb. 09, 2007

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Jetstream Media Technologies Announces Multi-Gigabit GCM CCM XTS Triple-Mode Security IP Core

Industry's first multi-gigabit GCM/CCM/XTS triple-mode security IP core that empowers SoC vendors to design high-performance robust security products.

• India needs to develop IPs to move up design chain, says Tensilica exec
• Cellular3G Uses eASIC’s Nextreme Structured ASICs for its TopHat™ W-CDMA (3GPP) Baseband Solution
• Broadcom Corporation Expands Relationship with MIPS Technologies to License Entire Range of MIPS Cores for Next-Generation Products
• Saifun Board of Directors Authorizes the Repurchase of Up to 1.5 Million of Saifun Ordinary Shares
• Silicon Image Reports Record Revenue and Net Income for Q4 2006
• Analogix Denies All Charges in Lawsuit Filed by Silicon Image

Headlines for Thursday Feb. 08, 2007

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NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson to Jointly Develop Platform for 3G Mobile Phone Handsets

The new platform will be based on the SH-Mobile G3, a single-chip system LSI which implements a baseband processor supporting HSDPA cat. 8/W-CDMA and GSM/GPRS/EDGE communications and an application processor with high-end multimedia functions, together with a reference design integrating audio, power supply, and RF front-end modules.

• Patriot Scientific Announces Purchase by NEC of First 2007 Moore Microprocessor Patent(TM) Portfolio License
• Frontier Silicon and S3 demonstrate world’s first turn-key solution for multi-mode mobile'DTV
• Zoran Demonstrates APPROACH Multimedia Processor Platform with Expanded Feature Set at 3GSM 2007
• Rambus Receives Stay from NASDAQ for Continued Listing

Headlines for Wednesday Feb. 07, 2007

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Denali and NXP Demonstrate Silicon-Proven and Fully Compliant PCI Express 1.1 Solution

Denali Software and NXP today announced that the Databahn™ PCI Express (PCIe) IP core and NXP PCIe PHY PX1011A provide customers a silicon-proven PCIe solution which is version 1.1 specification compliant.

• CEO confirms ''at least three'' ARM processors in iPhone
• Aware, Inc. Reports Fourth Quarter and 2006 Financial Results
• Faraday Monthly Sales Report – January 2007
• DigiBee Partners with CEVA for Multimedia and Baseband Platform Solutions

Headlines for Tuesday Feb. 06, 2007

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ARM Holdings Plc Reports Results For The Fourth Quarter And Full Year Ended 31 December 2006

Total dollar license revenues in Q4 2006 grew by 26% to $55.5 million, representing 43% of group revenues, compared to $44.1 million in Q4 2005. License revenues comprised $37.4 million from PD and $18.1 million from PIPD, representing the highest ever quarterly licensing revenue for that division.

• AM3D's 3D Mobile Handset Audio Now Available for Tensilica's HiFi 2 Audio Engine
• Sonics Expands SMART Interconnect Adoption to New Computing Paradigm
• India’s IC Design Services Industry Growing At Over 20% A Year According to In-Stat
• Silicon Image Agrees to License Advanced Digital TV System-on-a-Chip Intellectual Property From Sunplus
• MOSAID, Semico and Fidus Announce SoC Design Forum

Headlines for Monday Feb. 05, 2007

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Transmeta Corporation Streamlines Operations to Focus on Core Business of IP Licensing

On Friday, February 2, 2007, Transmeta began the initial phase of its re-alignment by decreasing its worldwide workforce by approximately 39 percent, or 75 employees, most of whom worked in the Company's engineering services business. The Company also took the initial steps to close its sales and support offices in Taiwan and Japan.

• Federal Trade Commission Issues Remedy in Case Against Rambus
• ChipX Introduces Embedded Array Products as Alternatives to Standard Cell ASICs
• Xilinx Ships World's Highest Performance DSP Platform with New Virtex-5 SXT FPGAs
• MoSys and TSMC Extend 1T-SRAM Embedded Memory Licensing Agreement
• Forza Silicon Joins Tower Semiconductor's Authorized Design Center Program
• CoWare's Processor Designer Provides Increased Support for Next-Generation VLIW Processors
• Bluespec Sets New Direction for IP Design, Reuse
• LG Electronics Licenses Tensilica's Diamond Standard 330HiFi
• Faraday Announces SoC Alliance with Palmchip Design Services
• Spansion Joins Denali Memory Vendor Program
• P.A. Semi Successfully Develops the Most Power-Efficient High-Performance Processor Ever Designed
• eASIC and ASIC Architect Partner to Deliver New High-Speed PCI Express and DDR2 Interfaces for Nextreme Structured ASICs
• Silistix Gets Silicon Valley Veteran Bruce Bourbon as New Board of Directors Chair
• TSMC Opens Office in India
• Xilinx Virtex Series FPGAs Surpass $5B in Revenue
• S2C Becomes Newest Tensilica Prototyping Partner in China

Headlines for Friday Feb. 02, 2007

• Commentary / Analysis: Real men have fabs, but maybe not Infineon, NXP, TI and ST.
• Commentary: How ESL can regain credibility
• MPEG LA Sues Mintek Digital, Inc. for Breach of MPEG-2 License Agreement
• MOSAID Announces Changes to Board of Directors

Headlines for Thursday Feb. 01, 2007

Top Story

OKI Electric Industry Selects Eureka Technology 4-Lane PCI Express IP Core

The Eureka PCI Express Controller Core includes the Transaction Layer, Data Link Layer and Physical Layer of the PCI Express Specification. It conforms to the latest PCI Express revision and supports industrial standard PIPE interface for on-chip PHY core and external PHY chips. With technology independent design methodologies, Eureka’s PCI Express Controller Core can be implemented virtually in all ASIC and FPGA technologies available today.

• Centrality and Athena Sign Intellectual Property Licensing Agreement
• Tensilica Licenses Xtensa LX2 Configurable Processor to Marvell
• ARM and Northwest Logic Announce the Availability of Complete PCI-SIG Certified PCI Express ASIC Solution
• Faraday Expands Commitment to ARM with V5TEJ and 926EJS Licenses
• Silicon Image Sues Analogix Semiconductor for Copyright Infringement and Misappropriation of Trade Secrets
• Virage Logic Reports First-Quarter Fiscal 2007 Results