D&R Headline News (February 2009)

Headlines for Friday Feb. 27, 2009

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The Linley Group Reports Processor IP Shipments to Double By 2012

Highlighting the processor intellectual property (IP) market as a growth opportunity for the semiconductor industry, The Linley Group today noted that chip designers will continue to reduce cost and time-to-market by purchasing third-party IP instead of developing the technology in-house and forecasts the market will more than double by 2012.

• Impulse FPGA Image Processing Design Services and IP Reduce Project Risk
• Mentor Graphics Reports Fiscal Fourth Quarter Results
• MOSAID Reports Results for Third Quarter Fiscal 2009 and Dividend
• Nangate Offers Outsourcing Design Services for 28nm Digital Cell Libraries

Headlines for Thursday Feb. 26, 2009

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Perfectus Announces Industry's First SystemVerilog-Based OVM Compliant SuperSpeed USB Verification IP for USB 3.0 Protocol

Perfectus Technology today announced the availability of SuperSpeed USB Verification IP (VIP) product based on the USB 3.0 protocol. The SuperSpeed USB VIP was tested to work in the Mentor Graphics Questa® Verification Platform.

• LogicVision Extends Built-In Self-Test Products to be Directly Controllable From Embedded CPU Cores, Easing System Test and Maintenance
• OVM Extended to Efficiently Manage Coverage Metrics

Headlines for Wednesday Feb. 25, 2009

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Synopsys Enhances DesignWare DDR PHY IP with Service to Verify Signal Integrity

The DesignWare® DDR PHY signal integrity service examines the entire memory subsystem extending far beyond the DDR PHY to help ensure the robustness of the electrical signaling within the system. If necessary, the service offers recommendations for improved performance.

• Gartner Says Worldwide Semiconductor Revenue On Pace to Decline 24 Percent in 2009
• Sidense OTP for Low-Power 90nm Implementation Selected by Fujitsu Microelectronics
• ARC International plc Announces Unaudited Preliminary Results For the Year Ended December 31, 2008
• EU's INTERESTED project to target the rapid design, prototyping and code generation of complex embedded systems and software
• Magillem and STMicroelectronics Win OCP-IP Co-Contributor of the Year Award

Headlines for Tuesday Feb. 24, 2009

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NextIO Adopts Denali's Verification IP for New PCI Express Expansion and I/O Virtualization Module for Blade Systems

Denali today announced that NextIO, the premier provider of next-generation I/O solutions, has successfully utilized PureSpec™ verification IP (VIP) to verify compliance with the latest PCI Express 2.0 Multi-Root-I/O Virtualization (IOV) protocol specifications and validate interoperability on their new generation N1400-PCM High-Speed Switch Module.

• Certess Announces The First C-Level Functional Qualification Tool
• Synopsys, Powerchip and Nikon Collaborate on 42-nm Flash Memory Optimization
• Court Grants Rambus Supplemental Damages in Hynix Case and Orders Negotiation of Compulsory License
• United States Supreme Court Denies FTC Request to Review Rambus Matter

Headlines for Monday Feb. 23, 2009

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ARM Launches Its Smallest, Lowest Power, Most Energy Efficient Processor

ARM today announced the ARM® Cortex™-M0 processor, the smallest, lowest power and most energy-efficient ARM processor available. The Cortex-M0 processor, which consumes as little as 85 microwatts/MHz (0.085 milliwatts) in an area of under 12K gates when using the ARM 180ULL cell library, builds on the unrivaled expertise of ARM as a leader in low-power technology and a key enabler for the creation of ultra low-power devices.

• Lattice Launches Industry's Lowest Power, Highest Value FPGA Devices
• Cadence Extends the Open Verification Methodology Beyond SystemVerilog to Include SystemC and e Language Support
• Cadence Incisive Verification IP Portfolio Delivers 'All-in-One' Flexibility and Higher Value for SoC Developers
• Intelop announces major enhancements to their TCP-Offload Engine SoC IP that has integrated GEMAC, ARP module and AMBA 2.0 bus and PCIe interface running at 2-Gbps also is capable of managing thousands of simultaneous TCP sessions in realtime
• Interview: ST-Ericsson CEO Alain Dutheil on the LTE rollout
• Analysis: Will Synopsys take over the world?
• Luminary declines to license ARM's tiny core
• SpringSoft Agrees to Acquire Certess
• Jasper Design Automation Introduces Design Activation Services To Promote IP and Design Reuse, Driving Higher Customer ROI
• MIPS Technologies Joins the Linux Foundation
• Industry's First Low Power Verification Methodology Manual, Authored by ARM, Renesas Technology and Synopsys, is Now Available
• TSMC executives reach consensus on recovery, says report

Headlines for Friday Feb. 20, 2009

• Aspex Semiconductor reaches profitability - wins significant contracts
• Faraday Reported 2008 Fourth Quarter Results
• Test, Packaging & Delivery - Through Partnership, Moortec Offer Total ASIC Solution

Headlines for Thursday Feb. 19, 2009

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Viewpoint: Consolidation is all about timing

It's time to shift the thought paradigm from "What fabs do I have today, and how do I fill them?" to "What fab base do I need five years from now and how do I get there?"

• Maxim and Universal Electronics Purchase Zilog Universal Remove Control and Secure Transaction Businesses
• Innovative Logic announces USB3.0 Device Controller IP
• Tower Semiconductor Reports Fourth Quarter and Fiscal Year 2008 Financial Results
• ARC International Introduces New Members of Executive Management Team
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2009
• NVIDIA Responds To INTEL Court Filing

Headlines for Wednesday Feb. 18, 2009

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Independent BDTI Benchmarks Recognize CEVA-TeakLite-III as Most Area Efficient and Energy Efficient of all Processors in Its Class

CEVA announced today that BDTI has published certified results for the 32-bit CEVA-TeakLite-III DSP core on its BDTI DSP Kernel Benchmarks™. The CEVA-TeakLite-III achieved highest DSP Area Efficiency and highest DSP Energy Efficiency of all processors in its class certified by BDTI using this benchmark suite.

• Jasper Design Automation Raises $7 Million in Series D Funding
• Actel Rolls Out Low-Cost IGLOO nano Starter Kit
• MOSAID Expands Into New Markets With Acquisition of 300 Communications Patents
• Lime Microsystems selects Jazz Semiconductor's 0.18-micron SiGe process for its Configurable Multi-band, Multi-standard Transceiver Targeting WCDMA, CDMA, LTE and WiMAX Femtocells

Headlines for Tuesday Feb. 17, 2009

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SafeNet Security IP Helps Secure Texas Instruments Next-Generation OMAP Applications Processors

SafeNet today announced that its silicon-proven SafeXcel IP will add security capabilities to the Texas Instruments (TI) Incorporated OMAP4 platform.

• Discretix CryptoCell Security Platform for 4G LTE Chipsets
• ST-Ericsson fails to produce promised Symbian-on-A9 demo
• RAD3 Communications Announces Wireless Communications IP Library
• Texas Instruments extends OMAP 3 family with 45 nm products to address a broad range of mobile performance needs
• Newport Media Announces World's First 65nm System-on-Chip (SoC) for China's CMMB Mobile TV
• Imagination Technologies announces OpenVG 1.1 conformance for POWERVR SGX range of scalable graphics cores
• ZeroG Wireless Announces Availability of the Industry's First 'Wi-Fi I/O' for Embedded Systems

Headlines for Monday Feb. 16, 2009

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ARM Extends Performance, Size and Power Efficiency Leadership with the First Cortex Processor on 32nm Process

ARM today announced that the world’s first ARM processor produced on 32nm High-K Metal Gate (HKMG) process technology will be shown at Mobile World Congress, Barcelona. It is the first ever 32nm Cortex™ family processor core, built with ARM Physical IP, on a test chip from the IBM Common Platform in its 32nm High-K metal gate (HKMG) process.

• ST-Ericsson collaborates with ARM to demonstrate the world's first Symmetric Multi Processing mobile platform technology on Symbian OS
• Imagination delivers HD H.264 High Profile capability in latest video encoder IP cores
• On2 Technologies Announces the Hantro 8270 Area and Speed Optimized 1080p Hardware Video Encoder
• Xilinx and Wintegra Collaborate on LTE Baseband Targeted Design Platform for Faster, Lower Cost Development of 4G Wireless Basestations
• ARM NEON Technology to Help Enable Deployment of Dolby Mobile Technology
• Imagination announces first member of new vector graphics IP core family
• Intelop announces major enhancements to their TCP-Offload Engine SoC IP that also has integrated GEMAC, ARP module and AMBA 2.0 bus and PCIe interface running at 2-Gbps capable of managing thousands of simultaneous TCP sessions
• CircuitSutra partners with GreenSocs to provide high quality SystemC based SoC modelling services
• BitSim AB and the Swedish Institute of Space Physics in Uppsala (IRF) have signed an agreement for electronics development with AD-conversion and signal processing for breakthrough radio research
• ARM Announces 10 Billionth Mobile Processor
• On2 Technologies Licenses Video Codecs to Shanghai InfoTM
• Strength of the ARM Ecosystem Demonstrated at MWC with More Than 60 Partners Showing ARM Technology
• DOLPHIN Integration extends SoC GDS capabilities to include OASIS reading and writing

Headlines for Friday Feb. 13, 2009

• SP Devices Launches New 1.1 GS/s 12 bit Digitizer
• OVP Simulator Smashes SystemC TLM-2.0 Performance Barrier
• Global Unichip reports 9.28B NTD 2008 revenue; Delivers 9th consecutive year of top line growth; More than 66%NRE revenue from 90nm and below projects

Headlines for Thursday Feb. 12, 2009

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Eureka Technology and Dolphin Technology offer complete DDR2/DDR3 Solution for High Performance SoC/ASIC Designs

Eureka Technology and Dolphin Technology today announced a joint offering of a complete and seamless DDR memory interface solution. The combination of Eureka DDR controller and Dolphin physical interface (DDR PHY) transceiver provide chip designers a fully integrated and validated solution for high speed DDR2 and DDR3 memory interface integration.

• eInfochips announces VMM based HDMI Verification IP for the Synopsys DesignWare Verification IP Alliance program
• ARM Mali GPU Licensees Increase to 18 with Addition of Amlogic and Mtekvision
• CEO Interview: Moshe Gavrielov of Xilinx
• Tata Elxsi announces multicore DSP-based WiMAX base station and carrier class CPE for public safety and defence applications
• Rumor mill: UMC to join IBM 'fab club'?
• Analysis: Dell has dragged the Linux-ARM Trojan horse inside the Wintel PC

Headlines for Wednesday Feb. 11, 2009

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Silicon Image Introduces Industry's First Silicon Implementation of 40-nm Low-Power HDMI Version 1.3 Transmitter Analog IP Core

New Ultra Low-Power IP Core Targets Mobile Products Requiring HDMI(TM) or Mobile High-Definition Link (MHL(TM)) Interconnect to Digital Televisions

• GDT announces H.264 XE silicon IP core
• New DesignWare Verification IP Alliance Program Expands Availability of High-Quality VMM-Enabled Verification IP
• CEVA Unveils Industry's Highest Performance DSP Architecture for 3.5G/4G Terminals and Infrastructure SoCs
• Mitsubishi Electric Develops High-Speed and Compact IP Core for Processing Graphics in Built-in Display Systems
• Tower Semiconductor and Triune Systems to Collaborate on Power Management Platform
• Legend's MSIM SPICE Circuit Simulator Certified for TSMC's Advanced Nanometer Circuit Designs
• Mentor Graphics Announces Preliminary Fiscal 2009 Results and Schedules Fourth Quarter Conference Call
• Tensilica Enables New Bluetooth Devices with the SBC Decoder and Encoder on Its HiFi 2 Optimized Audio DSP

Headlines for Tuesday Feb. 10, 2009

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ALLEGRO licenses its H.264/MPEG-4 AVC High-Definition Video Encoding IP to one of the world’s top 10 IC vendors

Allegro announces it has signed a license agreement for its H.264/MPEG-4 AVC high-profile, high-definition hardware video encoding IP with another of the world’s top 10 IC vendors. Allegro’s H.264 encoding IP will be used in a complex System-On-Chip (SOC) for high-volume consumer applications.

• ARM Extends Its Leadership In Media Processing With Acquisition Of Video Technology Company
• CSR and SiRF combine forces for Bluetooth and GPS market leadership
• Accent Expands ASIC Operations and Opens Design Facility in China
• ARM Showcases Innovation in Mobile Technology at 2009 GSMA Mobile World Congress
• Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP at Mobile World Congress in Barcelona

Headlines for Monday Feb. 09, 2009

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Analysis: Plug-and-play IP goal remains elusive

Intellectual property (IP) was a hot topic at the DesignCon show here last week, with frustration over the quality of IP and business models that are described as immature being knocked more than once.

• MoSys, Inc. Reports Fourth Quarter and Full Year 2008 Financial Results
• Avery Design Systems Announces USB 3.0 Verification Solution
• Fastest 8051 IP core downloadable demo from Evatronix.
• CoWare and Rambus Announce Unique ESL Architecture Design Environment for Rambus' XDR Memory Architecture
• TMC and Dolphin Integration enter in a partnership for microprocessor cores to enable better competitiveness in the highly price-sensitive smart-card market
• ESL: Where are we and where are we going
• I&C Technology Selects Mixed-Signal IP from S3 for Mobile TV SoC
• eSilicon CEO sees new ASIC landscape
• Intelop delivers industry's first customizable/scalable multi-port Network Switch + 1G/100 MB EMAC + Motorola CPU interface Silicon IP for industrial automation applications
• SiliconBlue Announces Volume Production Shipments of its iCE65 Ultra-Low Power FPGAs
• Synopsys Defines Next Era of Rapid Prototyping
• IMEC reports low-cost low-power 60GHz solutions in digital 45nm CMOS
• MIPI Alliance Delivers Seven Vital Mobile Device Interface Specifications in 2008
• Toshiba Develops World's Highest-Bandwidth, Highest Density Non-Volatile RAM
• Freescale Introduces 45-nm PowerQUICC III Processor with Low Power, High Performance and Optimal Flexibility

Headlines for Friday Feb. 06, 2009

• SPIRIT's Audio Software Now Available on Freescale's Quad Core DSP chips
• Faraday Monthly Sales Report - January 2009
• SMIC Reports 2008 Fourth Quarter Results

Headlines for Thursday Feb. 05, 2009

Top Story

ARM tips plans for Swift and Sparrow processor cores

ARM has disclosed plans for processor cores to be introduced into its Cortex range, codenamed Swift and Sparrow. Swift is a low-cost, low-power follow-on to the Cortex M3 microcontroller and Sparrow is aimed at the real-time applications catered for by the Cortex-R family of cores.

• Arasan Chip Systems Unveils a Complete USB Solutions' Strategy
• Aeroflex Gaisler extends the GRLIB IP library with USB 2.0 Device Controller
• Digital Core Design Introduces LIN Controller Core
• Cadence Reports Q4 2008 Financial Results
• ARM acquires Swedish video processor company, Logipard AB
• ARM set to cut 3% of jobs, imposes pay freeze
• Hyperstone introduces E2 - 32-Bit RISC/DSP Microcontroller with ADC and Serial Interface Engine
• On2 Technologies Demonstrates High-Definition Mobile Video Solutions at Mobile World Congress

Headlines for Wednesday Feb. 04, 2009

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Video: USB 3.0 and power tool at DesignCon

Silicon blocks for the emerging USB 3.0 interface and software tools to ease the job of power integrity design grabbed my attention on the show floor at DesignCon. Stephane Hauradou, co-founder and chief technology officer of PLDA Inc., gave a demo of his USB 3.0 block running in an FPGA with throughput of about 3.5 Gbits/s.

• Synopsys Expands DesignWare SuperSpeed USB IP Offering With xHCI Host Controller
• ESS Relicenses Kilopass XPM Memory
• ChipX Introduces 10-bit and 12-bit ADC IP Cores For Data Monitoring, Data Acquisition and Analog Front-Ends in Application
• U.S. District Court for Northern California Stays Rambus Case Against Memory Manufacturers
• MIPS Technologies Announces Executive Departure
• Actel Announces Fourth Quarter 2008 Financial Results And Corporate Restructuring

Headlines for Tuesday Feb. 03, 2009

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ARM Holdings plc Reports Results For The Fourth Quarter and Full Year Ended 31 December 2008

Total revenues in Q4 2008 were a record $149.4 million, up 15% on Q4 2007. Q4 sterling revenues were £94.4 million, up 47% year-on-year. Total 2008 full-year revenues were also a record $546.2 million, up 6% on 2007. Full-year sterling revenues were £298.9 million, up 15% on 2007.

• Atmel Acquires MeshNetics ZigBee Intellectual Properties
• CEVA, Inc. Announces Fourth Quarter and Year End 2008 Financial Results
• Virage Logic Selected as Sharp Corporation's Trusted IP Partner for Latest CMOS Image Sensor System-on-Chip
• CAST Improves SDIO Host and NAND Flash Memory Controller Cores
• TSMC Information -- TSMC currently has no plans to conduct a capital reduction
• Ericsson and STMicroelectronics Complete Deal to Create World Leader in Semiconductors and Platforms for Mobile Applications
• D2 Technologies Demonstrates Complete Reference Design for WiMAX Mobile Phone
• SMSC ARC-Based Embedded Controllers Now Shipping in PC Applications
• MPEG LA Updates AVC Patent Portfolio License
• Rambus Implements XDR Memory Interface in Ultra Low-Cost Package

Headlines for Monday Feb. 02, 2009

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Athena Announces the First Cryptography Microprocessor for Embedded and Mobile Applications

The Athena Group, today announced the introduction of the TeraFire® F5200 cryptography microprocessor. Capable of tackling every mainstream PK cryptography algorithm - from RSA to Suite B - and area optimized for even the most challenging applications, the F5200 is the perfect security solution for embedded and mobile products.

• Quartus II Software Version 9.0 Delivers Productivity Leadership for Altera's Portfolio of Transceiver FPGAs and HardCopy ASICs
• Tata Elxsi Licenses Real time Operating System (RoS-ES) for Embedded Devices
• MOSAID and Micron Settle Patent Litigation
• Nokia Licenses MOSAID Wireless Patents
• MIPS Technologies Strengthens Leadership in Analog/Mixed-Signal IP with Innovative Audio Solution for Multimedia Applications
• Dolphin Integration today announces the launch of its new range of embedded codecs
• New Xilinx Virtex-6 FPGA Family Designed to Satisfy Insatiable Demand for Higher Bandwidth and Lower Power Systems
• Virage Logic Extends Comprehensive DDR Interface IP Portfolio with System-Validated DDR3 and New Low Power DDR2
• ARM and Quickoffice Products Conform to Newly Ratified W3C SVG Tiny 1.2 Standard
• Chips&Media Opens New Sales and Support Office in Shanghai, China
• Rambus Announces Groundbreaking Mobile Memory Initiative
• New Xilinx Spartan-6 FPGA Family Brings Low-Power and High-Speed Connectivity to Cost-Sensitive Electronic Systems
• Complete Cost and Power Consumption Optimized Secure Set-Top Box Solution, Based on NEC Electronics EMMA3SL/LP MPEG-4 Standard Definition Digital TV Processor
• Altera Announces Stratix IV GT and Arria II GX FPGAs: Expands Industry's Broadest Integrated Transceiver Portfolio
• Analysis: What's the future of IBM Micro?
• MosChip Launches Pair of System-on-a-Chip (SoC) Network Appliance Processors Touting Market-First Support for PCI Express, Gigabit Ethernet and Display Interfaces