Top Story
Denali today announced availability and first customer shipments of the latest Denali Databahn(TM) controller IP cores, based on the current preliminary version of the PCI Express® (PCIe) 3.0 specification, for use in next-generation chip designs.
Top Story
The Keil MPS is the first prototyping system incorporating a full-speed Cortex-M0 or Cortex-M3 processor implemented in FPGA which can be integrated with third-party peripheral IP to deliver a prototyping system for hardware and software application development.
Top Story
The prospects for the semiconductor industry are better than they were a month ago, according to a Reuters report that quotes Morris Chang, chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) as its source.
Top Story
Agilent today announced a major restructuring of its Electronic Measurement businesses in response to the most severe global downturn in the company's history. Fiscal 2009 revenue in the company's Electronic Measurement Segment is expected to be down roughly 30 percent from 2008 to the lowest level in the company's 10-year history.
Top Story
Comsys Communication & Signal Processing Ltd. has announced the launch of their latest ComMAX™ reference design platform, the CM1125RD - an optimized multimode mobile WiMAX/GSM EDGE smartphone reference design platform.
Top Story
GDA Technologies, Inc., a leading supplier of configurable, reliable and production-proven Intellectual Property (IP) solutions and services for Communication, Storage and Consumer markets, today announced that it has entered into an agreement to become an IBM Power Architecture Power Design Center. The agreement provides GDA the right to directly sublicense PowerPC processor cores as part of its IP and Services offerings.
Top Story
NXP, the independent semiconductor company founded by Philips, today announced the world’s first functional ARM® Cortex™-M0 silicon. The Cortex-M0 processor represents a breakthrough in terms of size, low power and energy efficiency while its simplicity makes it one of the easiest architectures to use on the market today.
Top Story
Gennum and Tundra today announced they have entered into a definitive agreement providing for the acquisition by Gennum of all of the issued and outstanding shares of Tundra, a supplier of system interconnect products and intellectual property (IP) to the world’s leading communications, computing and storage companies. The transaction, which is valued at approximately Cdn$86 million, adds new digital switch and bridge products and functionality to Gennum and builds on Gennum’s growth strategy of extending its high-speed signal integrity expertise and solutions to a broader set of markets.
Top Story
MAZeT GmbH offers IP cores for the Interbus protocol (SUPI4 / Phoenix Contact) for implementation in FPGAs and ASICs. The protocol chip for serial communication interfaces in automation technology was developed and maintained by MAZeT.
Top Story
MIPS Technologies today announced that its 40nm USB 2.0 High-Speed PHY IP achieved certification from the USB Implementers Forum (USB-IF) and met TSMC’s TSMC9000 standards in its 40nm LP process.
Top Story
IPextreme today announced another business model innovation for the semiconductor IP industry, its Constellations™ program. Constellations provides the business level infrastructure for enabling an open community of independent semiconductor IP companies to collaborate at the sales level by sharing sales intelligence and market wisdom to provide a virtual world-wide sales footprint.
Top Story
Silistix Inc. today announced CHAINworks 3.0, enabling architects and designers of complex chips to synthesize Networks-on-Chip (NoC) using both synchronous and asynchronous circuit techniques.
Top Story
Offering to 8051 software developers a complete set of debugging features - unlimited watchpoints, unlimited breakpoints, unlimited trace memory depth, etc - at practically no silicon expense is achievable with the patented solution of Virtual Clone.
Top Story
Venture capital funding is in short supply and won't return to the semiconductor industry even after the current recession, according to Moshe Gavrielov, president and CEO of programmable logic supplier Xilinx Inc.
Top Story
The newly released Carbon Models include implementation-accurate models for all variations of the ARM® Cortex™-A9 MPCore™ multicore processor and PrimeCells®, including the AMBA® 3 Interconnect (PL301) matrix.
Top Story
Synopsys, Inc. , a world leader in software and IP for semiconductor design and manufacturing, today announced that the DesignWare® USB 2.0 nanoPHY IP and PCI Express® 1.1 PHY are the first IP cores to achieve compliance in UMC's 65-nanometer (nm) SP and LL process technologies.
Top Story
The integrated Snowbush device PHY and controller solution satisfies the 5 Gb/s speed requirement of USB 3.0, and exceeds the critical specifications for jitter and jitter tolerance, providing substantial margin to designers for creating robust products with excellent interoperability.
Top Story
Dolphin Integration pursues its unique strategy in the field of standard cells with their unique "Reduced Cell Stem Libraries" by enhancing its celebrated ultra High Density library “SESAME uHD” with the patented Back Tracking Freedom (BTF).
Top Story
Designed in UMC’s leading 65nm manufacturing process node, the ALVADC10_205M65U IP solution from Alvand is a robust 10-bit, 205 Mega-samples-per-second (MSPS) pipeline ADC that features excellent dynamic range performance, with a signal-to-noise ratio (SNR) of 58.5 dBFS, and high immunity to substrate noise.
Top Story
ARM and eSOL today announced that ARM has made a strategic investment in eSOL Co., Ltd , a leading Japanese embedded software developer, and that the two companies plan to collaborate on a series of initiatives aimed at leveraging their combined strengths and delivering compelling ARM® processor-based solutions to the automotive industry, in addition to the digital consumer products.
Top Story
Heading towards a collision course with ARM Holdings plc in the embedded world, Intel Corp. for the first time will transfer a processor technology outside to a silicon foundry.
Top Story
Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions. Under the MOU, Intel would port its Atom processor CPU cores to the TSMC technology platform including processes, IP, libraries, and design flows. The collaboration is intended to expand Intel’s Atom SoCs availability for Intel customers for a wider range of applications through integration with TSMC’s diverse IP infrastructure.