D&R Headline News (April 2009)

Headlines for Thursday Apr. 30, 2009

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ARM Forecast To Become The Leading 32-bit Microcontroller Architecture In 2011

Findings from the Semicast study on the global market for 32/64-bit microcontrollers (MCUs) and embedded microprocessors (eMPUs) show that automotive and industrial (including medical) applications are forecast to be the two key growth sectors, with total revenues for ARM-based MCUs/eMPUs set to increase at a CAGR of 21% over the period 2007-2013. Revenue growth for ARM-based MCUs is forecast to be driven in particular by the introduction of low cost parts based on the ARM Cortex M3 and M0 cores.

• Gennum Not to Match Competing Offer for Tundra
• AMCC Licenses Elliptic 3GPP/LTE Cellular Basestation Security Solution for use in its Latest Power Architecture Processor
• ARM Licenses Securcore SC300 Processor To Toshiba For Secure Applications
• TSMC Reports First Quarter EPS of NT$0.06
• Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology
• Cadence Reports Q1 2009 Financial Results
• Virage Logic Reports Second Quarter Fiscal 2009 Results
• ASUS Licenses On2 VP7 Video Codec for Skype Videophones

Headlines for Wednesday Apr. 29, 2009

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ARM Holdings plc Reports Results for the First Quarter Ended 31 March 2009

ARM announces its unaudited financial results for the first quarter ended 31 March 2009. Revenues at $120.9m down 10% year-on-year. 17 processor licenses.

• Toshiba Exceeds Quality Goals for 65-nm Multimedia Chips Using Synopsys Test Solution
• IC Manage Releases Global Design Management Survey Results
• MoSys, Inc. Reports First Quarter 2009 Financial Results
• Actel Announces First Quarter 2009 Financial Results

Headlines for Tuesday Apr. 28, 2009

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Passing the Compliance Test, Faraday Launch PCIe2.0 at 90nm

Faraday today announced that their PCIe GenII PHY, developed based on the PCI Express 2.0 specification, has passed PCI-SIG® APAC compliance test in April. This PHY is designed for UMC 90nm process and now available for ASIC customers.

• U.S. District Court Issues Decision Regarding Samsung Contract Claims in Rambus Case
• Ember and ARM Target High Performance ZigBee Networks
• Aeroflex Gaisler announces new LEON3 licensing agreements
• Silicon Line extends its ultra-low power technology with world-record setting SerDes IC
• Toshiba to Launch World's First 32nm Process NAND Flash Memory
• Tego Standardizes on VMM and Synopsys VCS Solution to Speed Verification of Radio Frequency Identification Tags
• Jasper, AMD Ink Long-Term Formal Verification Deal

Headlines for Monday Apr. 27, 2009

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NEC Electronics and Renesas to Integrate Business Operations

NEC Electronics, Renesas Technology, NEC Corporation, Hitachi, and Mitsubishi Electric today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas.

• Gennum Provides Update on Proposed Acquisition of Tundra
• Vivante GPU IP Selected for MPRC SoC Solution Designed for 3C Convergence Computing Platform
• MIPS Technologies Licenses Processor IP to Leader in China's Thriving DTV and Set-top Box Markets
• CoWare and Carbon Announce CoWare Model Library Availability of Implementation-Accurate Models of ARM IP
• Xilinx Drives Evolution of FPGA Design With Domain-specific Methodology for Targeted Design Platforms
• TranSwitch Chooses Kilopass as their 65nm OTP Provider
• SpringSoft, UMC Support Custom Chip Design with 65nm Process Design Kit
• Qualcomm and Broadcom Reach Settlement and Patent Agreement
• Imagination Technologies Group plc - Imagination Technologies and Toumaz Holdings extend relationship
• GLOBALFOUNDRIES Appoints New Technology Leader
• Magillem Design Services announces release of new Generation Register View
• Actel and Avnet Offer Comprehensive Solution for Display Applications
• Cypress Unveils Market's First SRAM on 65-nm Process Technology
• TÜV NORD - IFM and Dolphin Integration announce their partnership for VHDL-AMS modeling and verification with SLED and SMASH

Headlines for Friday Apr. 24, 2009

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Digital Core Design Announces World's smallest and fastest 8051 Core

DCD releases World's smallest and fastest 8051 core. The 7150 ASIC gates for complete system including 8051-CPU, full duplex UART, Timers 0&1, Advanced Power Management Unit, eight I/O lines, eight external interrupts INT0-INT7 and 2-wire DoCD on-chip debugger is the best achievement on the IP Market. DT8051 runs Dhrystone 2.1 benchmark program 8.1 times faster than the original 80C51 at the same frequency.

• Faraday Reported 2009 First Quarter Results
• Rambus Reports First Quarter Earnings
• Silicon Image Reports First Quarter 2009 Financial Results
• Lattice Semiconductor Reports First Quarter Financial Results

Headlines for Thursday Apr. 23, 2009

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Jungo Expands USB Collaboration with Synopsys to Include Software Support for SuperSpeed USB 3.0

Jungo today announced that its USBware™ for SuperSpeed USB 3.0 stacks will be integrated with the Synopsys DesignWare SuperSpeed USB IP offering. The result is a complete turnkey solution for silicon manufacturers.

• Oki Semiconductor Signs DRAM License With MOSAID
• Silicon Creations Successfully Tapes Out Complex RF Chip Using Simucad's Complete RF Tool Flow

Headlines for Wednesday Apr. 22, 2009

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ARM and Mindspeed Extend Relationship With Cortex-A9 Processor Agreement

ARM and Mindspeed today announced that Mindspeed has licensed the ARM® Cortex™-A9 MPCore™ processor for use in their next generation multiservice networking platforms, designed to support voice and data services across wireline and wireless networks.

• Bluetooth Technology Gets Faster with Bluetooth 3.0
• Timesys Announces Factory Support for MIPS32 Processor Cores
• HDL Design House announces high performance AHB SPI flash memory controller (HIP 3100)
• Percello Ltd. Achieves First-Pass Silicon Success With Denali Design and Verification IP Products
• IMEC presents functional 22nm SRAM cells fabricated using EUV technology
• MPEG LA Sues Apex Digital Again for Breach of MPEG-2 License
• Altera Announces First Quarter Results
• Xilinx Enables China's First HDTV I/O Card from Dayang
• LogicVision Reports First Quarter Financial Results

Headlines for Tuesday Apr. 21, 2009

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TSMC Launches Integrated Sign-Off Flow To Shorten Design Cycle, Enhance Tape-Out Quality

The new flow is available now for 65nm designs. Integrated Sign-Off Flow is an automated RTL to GDSII chip implementation flow that tightly integrates all process-specific items including pre-qualified library and IP, selected EDA tools, production-quality flow, advanced design methodology, and TSMC foundry technology files that have been proven and refined over hundreds of applications.

• Shanghai Info Micro-electronics Expands SoC Platform with Vivante GPU IP for Mobile Gaming
• Sidense OTP Memory IP Enables 65nm Mobile Handset Chip
• TSMC Announces Foundry's First Mixed Signal/RF Reference Design Kit
• Dolphin Integration -- A 19% growth rate of the mid-year sales turnover in an industry disturbed by the crisis
• Denali Software and Prism Circuits Prove DDR3 Controller-PHY Interoperability
• Prism Announces Mindspeed Technologies to License Interconnect IP
• OCP-IP Delivers New Advanced SystemC TLM Kit
• ChipWrights Solves Video and Power Performance Issues for Netbook Developers
• Altera Delivers Stratix IV GX Transceiver Signal Integrity Development Kit
• Innovision announces a Joint Marketing and License Agreement
• AmbaCast 6000 Platform from Ambarella Ushers in a New Era of Broadcast Video Processing
• Enterprise License Agreement Expands Freescale Access to Virtutech Simics

Headlines for Monday Apr. 20, 2009

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ARM Announces Availability of Industry's Broadest 40nm G Physical IP Platform

ARM today announced the availability of the industry’s most comprehensive IP platform for TSMC’s 40nm G manufacturing process. This latest silicon-validated physical IP from ARM enables cost-effective development of performance driven consumer devices requiring advanced functionality without increasing power consumption.

• Kilopass Technology Expands Embedded Non-Volatile Memory Offering To Address Mobile, Consumer, and Computing Markets
• TSMC/GUC 65LP ARM 1176JZF hardened cores Open Doors for 65nm Designers
• Eureka Technology and embWiSe Partners in embedded SD/SDIO solution
• Vanguard Software Solutions Releases IP Cores for Panasonic AVC-Intra and H.264 CABAC; Transcoding Solutions for Video
• Frontier Silicon Selects Mixed-Signal IP from S3 for Advanced Digital Radio SoC
• CoreEL Technologies Creates Broadcast & Professional Video Grade H.264 High Profile Decoder Solution
• Oracle to Buy Sun
• DOCEA Power unveils first ESL solution for modelling, simulating and optimizing the power and heat dissipation of electronic systems
• Sensor to Image Announces a GigE Core Reference Designs for Altera
• DiSTI and TES Electronics Solutions are Driving Down the Costs to Develop On-Screen Displays
• APTX elevates HD digital audio with apt-X Lossless
• Renesas & CoWare Collaborate to Accelerate the Deployment of SH-based Virtual Platforms in Mobile, Automotive and Digital Imaging Applications
• Altera's Stratix III FPGAs Chosen for Harmonic's Next-Generation Universal Broadcast Video Encoder

Headlines for Friday Apr. 17, 2009

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SMIC and Dolphin Integration Announce Strategic Partnership for Portable Media Players

SMIC and Dolphin Integration announced today their partnership for the release of the latest generation of digital-to-analog audio converters that, utilizing Dolphin's expertise, feature ultra-low power consumption.

• Gennum Increases Purchase Price to Acquire Tundra
• MOSAID Extends NXP's Patent License and Signs New Wireless Agreement; Provides update on Qimonda
• Jasper Patent Speeds Debug During Verification

Headlines for Thursday Apr. 16, 2009

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PLDA Announces Industry's First SuperSpeed USB Host Bus Adapter Development Platform

PLDA today announced that it has begun shipping the first SuperSpeed USB Host Bus Adapter (HBA) development platform. This HBA platform will enable leading-edge companies to develop and test USB 3.0 semiconductor designs or USB 3.0 software stacks more easily and efficiently, helping get them to market quicker.

• Mindspeed Integrates Elliptic's Gigabit per Second IPsec Engine in new Comcerto 1000 Family of Processors
• Arasan Chip Systems Releases MIPI UniPro(sm) Software Stack Extending Its Total IP Solution
• IBM Technology Alliance Announces Availability of Advanced 28-Nanometer, Low-Power Semiconductor Technology
• ChipStart Teams with Discretix for Security Solutions
• GDA Technologies Announces Engineering Services Support for Cavium Networks OCTEON II Multicore MIPS64 Processor
• IP Cores, Inc. Announces an Ultracompact Version of the Snow 3G Cipher for 3GPP LTE
• Satin IP Technologies to Demonstrate First Product to Comply with Emerging IEEE Quality IP Metric Standard
• Xilinx Announces Restructuring Plans
• IP Cores, Inc. Announces a New Compact Version of the Elliptic Curve Crypto Accelerator

Headlines for Wednesday Apr. 15, 2009

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Synopsys Introduces Lower Power, High-Performance Architecture for AMBA 3 AXI On-Chip Interconnect

Synopsys today announced that it has enhanced its DesignWare® IP for the ARM® AMBA® 3 AXI™ interconnect with the industry's first hybrid architecture implementation, enabling dedicated high-performance and shared low-performance channels to be combined within a single AMBA 3 AXI on-chip interconnect.

• Where are they now? M2000
• Pigeon Point Systems Ships ATCA Starter Kits Based on Actel Fusion Mixed-Signal FPGA
• NXP Adopts Mentor Graphics’ Veloce Hardware Emulator to Accelerate Time-To-Market for their HDTV and Set-Top-Box Chip Sets

Headlines for Tuesday Apr. 14, 2009

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Lead Tech Design unveils its brand new range of microcontrollers for embedded applications

Lead Tech Design, which specializes in the design of ASIC/FPGA System-on-Chip (SoCs) and embedded software for Linux and Linux hard real time with Xenomai, is extending its offering with aRDAC, a brand new range of configurable microcontrollers, guaranteeing performance of 1 MIPS/MHz.

• Cavium Networks Announces Breakthrough Next Generation OCTEON II Multi-Core MIPS64 Internet Application Processor Family With 1 to 32 Cores
• IP Cores, Inc. Announces Ultracompact Version of Kasumi Cipher for 3G Devices
• Intertrust Announces Patent Licensing Agreement with Samsung Electronics
• Synopsys PrimeTime Advanced On-chip Variation Analysis Enables Renesas to Accelerate Timing Closure at 65-nm and Below
• High-Performance MIPS64 Architecture Drives Cavium Networks' New OCTEON II Processors
• JEDEC Announces Publication of new MMC v4.4 specification

Headlines for Monday Apr. 13, 2009

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Vivante GPU IP Selected for C2 Microsystems' Jazz-Based Media Processor SoC

Vivante today announced that C2 Microsystems has selected Vivante GPU IP technology to bring feature-rich GUI and on-screen display capabilities to their high performance SoC media processors.

• ON Semiconductor Expands Application Specific IC Offering with Investment in 110 nm Technology and Intellectual Property
• ARM netbooks struggle with video, apps
• EVE Significantly Enhances Hardware Debugging Capabilities of Its Leading Emulation Platform
• Altera Arria GX FPGAs Enable Panasonic P2 Drive to Transfer Video Faster Than You Can Say Edit
• Altera and Zilog Settle Patent Infringement Suit
• MindTree Becomes First Indian Company to Receive Texas Instruments Supplier Excellence Award
• DAFCA Partners With Stanford Professor Dr. Per Enge on Signature Technology for Hardware Security and Microelectronic Cyber Security
• Priva Technologies Integrates Synopsys Galaxy Custom Designer Solution Into SoC Design Flow

Headlines for Friday Apr. 10, 2009

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Arasan Chip Systems Extends Its Strategic Mobile Initiative by Offering MIPI UniPro IP Solution

Arasan announced the immediate availability of the Mobile Industry Processor Interface (MIPI(r)) UniPro Controller IP, a layered, high-speed protocol that provides connectivity between applications processors and wireless, multimedia and mobile chipsets. As a leading provider of mobile IP, Arasan continues to strengthen its Strategic Mobile Initiative by expanding its MIPI IP portfolio with the UniPro IP.

• Dolphin Integration launches new microcontroller configurations
• TSMC March 2009 Sales Report
• On2 Technologies Introduces Hantro 9170 HD Video Decoder

Headlines for Thursday Apr. 09, 2009

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RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz

RMI’s next generation architecture will offer much greater processor performance than that available from any other embedded processor in the market today. The combination of the improved design, along with frequencies greater than 2.0 GHz enabled by the 40nm process node, will result in significant performance per watt advantages for RMI’s customers.

• Pericom Reaches New Signal Integrity Benchmarks for PCI Express and Serial ATA Protocols

Headlines for Wednesday Apr. 08, 2009

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Rambus Acquires Inapac Patents

Rambus today announced it has acquired a number of patents from Inapac Technology, Inc. to broaden its offerings for the mobile memory market. These patented innovations complement the high-bandwidth, low-power memory technologies developed by Rambus as part of its Mobile Memory Initiative, announced earlier this year.

• Expedia Media Sued by MPEG LA for Breach of MPEG-2 License Agreement
• Carbon and MIPS Technologies Partner for Model Distribution
• IBM Selects Virage Logic as Its PowerPC Partner
• intoPIX enhances its multichannel JPEG 2000 codec IP-Cores to meet broadcasters' needs for live events
• UMC Delivers Customer ICs Produced on its High Performance 40nm Logic Technology

Headlines for Tuesday Apr. 07, 2009

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DCD Announces the 5th generation of World's fastest and most popular 8051 IP Core

Digital Core Design (DCD) today releases the 5th generation of World's fastest and most popular 8051 core. DP8051 runs Dhrystone 2.1 benchmark program 11.45 to 14.74 times faster than the original 80C51 at the same frequency.

• EDA Consortium Reports Industry Revenue Down in Fourth Quarter 2008
• Synopsys Selected by Marvell as Its Primary EDA Partner
• Faraday Monthly Sales Report -- March 2009
• Pyxis Technology Raises $3.0M in Expansion Capital
• Programmable RF Chip Pioneer, WiSpry Secures $10-Million Series C Financing

Headlines for Monday Apr. 06, 2009

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Gennum's Snowbush IP Group Enables Rapid Deployment of SATA and SAS 6 Gb/s Products

Gennum today announced that its Snowbush IP group has developed a SATA 6 gigabits per second (Gb/s) physical layer (PHY) IP block. The new IP also satisfies the stringent requirements of the latest Serial Attached SCSI (SAS) standard, SAS 2.0 (SAS-2). The SATA/SAS IP is being offered for manufacture in a variety of 65-nm and 45-/40-nm processes, including TSMC, as well as Common Platform Alliance members IBM, Chartered and Samsung.

• Synopsys Introduces Discovery 2009 Delivering Faster, Unified Verification Solutions
• Video: Where hardware and software collide
• Chartered Appoints New Senior Vice President of Worldwide Sales and Marketing

Headlines for Friday Apr. 03, 2009

• SeaSolve Software Announces High Speed Automated ZigBee Production Test Solution

Headlines for Thursday Apr. 02, 2009

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Altera's 40-nm Stratix IV GX FPGAs Achieve PCI-SIG Compliance for the PCI Express 2.0 Architecture

Altera today announced its 40-nm Stratix® IV GX FPGAs are compliant with version 2.0 of the PCI Express® (PCIe®) standard, providing users a comprehensive PCIe solution for high-bandwidth applications. Stratix IV GX FPGAs achieved compliance for PCIe 1.1 and PCIe 2.0 up to x8 lane configurations for end-point applications. Stratix IV GX FPGAs are shipping today with PCIe 2.0 hard intellectual property (IP) blocks.

• Analyst sours on Infineon, ST but touts ARM
• JEDEC Announces Publication of LPDDR2 Standard for Low Power Memory Devices
• LogicVision Delivers New Embedded Boundary Scan Core Reuse Capability
• PLDesignLigne Guest blog: Mike Santarini -- EDA: Get serious about FPGA... your survival may depend on it
• Analysis: Dual Cortex-A9 cores figure drive OMAP 4
• Freescale accelerates multicore 45-nm products to market for next-generation communications systems
• Infineon, SkyTerra and TerreStar Announce Agreement to Develop the World’s First Satellite-Cellular Mobile Platform Based on SDR Technology
• RDA Microelectronics Leverages CEVA Bluetooth IP to Deliver Ultra Low-Power, Single-Chip Bluetooth 2.1 + EDR Solution

Headlines for Wednesday Apr. 01, 2009

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TES Electronic Solutions Selected By NEC Electronics for 3D Embedded Graphics Technology

TES today announced that NEC Electronics Corporation has signed a license agreement for TES's D/AVE-3D Graphics IP for use in NEC Electronics' multifunction system-on-chip (SoC), targeting automotive applications. D/AVE-3D supports industry standard OpenGL-ES 1.1 and OpenVG 1.01 Graphics API.

• Texas Instruments OMAP(TM) 3 hardware reference platform to increase open source innovation on the Symbian platform
• On2 Technologies Licenses VP7 Video Codec To Westec Interactive
• Actel Now Shipping the IGLOO PLUS Starter Kit
• CoWare Releases Reference Library to Accelerate the Design of Long Term Evolution (LTE) Wireless Systems
• Xilinx Starts Shipments of Virtex-6 FPGAs
• IMEC unveils tools to speed design of energy-efficient multi-processor SoC platforms
• Kilopass Executive Harry Luan is Promoted to CTO