D&R Headline News (May 2009)
Headlines for Friday May. 29, 2009
Latest News- Xilinx Announces Ninth Circuit Court Ruling
- Sundance Boosts 4G Offer with New WiMAX Solution
- Mentor Graphics Reports Fiscal First Quarter Results
Headlines for Thursday May. 28, 2009
MindTree Lists Bluetooth Health Device Profile (HDP)
MindTree today announced that its Bluetooth Health Device Profile (HDP) along with its EtherMind 2.1+EDR stack have been successfully listed as a qualified design component by the Bluetooth Special Interest Group (SIG).- Denali MemCon Silicon Valley 2009 "Beacons of Innovation" Agenda Features Industry Leaders' Insight and Visions for Memory and Storage Solutions
- Gartner Says Worldwide Semiconductor Revenue to Decline 22 Percent in 2009
- Radiocomp releases their CPRI v4.0 compliant IP core for LTE, WCDMA, CDMA and WIMAX supporting speeds up to 6.144 Gbps independently from the selected silicon technology
- Sarance Announces Availability of Complete Connectivity Solutions for Netronome's Network Flow Processors
- Start-up claims breakthrough in reconfigurable logic
- HDMI Licensing, LLC Announces Features of the Upcoming HDMI Specification Version 1.4
Headlines for Wednesday May. 27, 2009
Feedback: 6 critical keys to IP licensing success
The IP licensing market is complicated and in this response to a previous EE Times article on the history of Chipidea and MIPS, a reader lists six factors he believes are critical for success in the market segment.- SanDisk and Samsung Renew Patent Cross License and Flash Supply Agreements
- TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies
- Synopsys Releases DesignWare SATA IP for New SATA 6Gbps Data Transfer Rate
- U.S. District Court Orders Hynix to Post Security for Infringing Rambus Patents
- Netronome Licenses ARM Multiprocessing Technology For Next-Generation Network Flow Processor
- Netronome's Network Flow Processor Utilizes Denali's Suite of PCI Express 2.0 Products for Virtualized Servers and Network Equipment
- Jazz Semiconductor's DIRECT Multiproject Wafer (MPW) Shuttle Program Enables Rapid Design Verification and Faster Time-to-Market
Headlines for Tuesday May. 26, 2009
Rambus Unveils New Innovations for Main Memory
Rambus today unveiled a set of innovations that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. These innovations, available for licensing, build on Rambus’ award-winning designs and include patented and patent pending technologies.- NXP Unveils Industry's Lowest Power Cortex-M3 based Microcontrollers
- Dongbu HiTek Selects Kilopass Embedded NVM Solution for 0.18um BCD Process
- CEVA and mimoOn to Collaborate on Development of LTE Baseband Solutions
- ARC and Realtek Sign Agreement to Extend Reach of ARC Sonic Focus Audio Technology into PCs and Laptops
- SiliconXpress Provides One-Stop Design, Fab, Test, and Packaging Services as Newest Tensilica Design Center
Headlines for Monday May. 25, 2009
ELMOS Semiconductor and Dolphin Integration cooperate for innovation in schematics edition
ELMOS and Dolphin Integration announce they have completed together a major joint project for innovating in schematic edition, commercialized by Dolphin Integration under the name of SLED.Headlines for Friday May. 22, 2009
Xilinx & BEEcube to Unveil Next-Generation FPGA-based Multi-core SoC Development Platform for Sun OpenSPARC
Xilinx and BEEcube will jointly unveil a high-performance development environment for multi-core UltraSPARC CMT (chip multi-threaded) processors that reduces the time and effort required to design systems using the SPARC architecture.Headlines for Thursday May. 21, 2009
Latest News- IP Cores from Eureka Technologies Validated for Mentor Graphics' Precision FPGA Synthesis
- Semiconductor Memory Start-Up Unity Semiconductor Closes $22M Series C Financing
- Unity Semiconductor, a Non-Volatile Memory Products Start-up, Exits Stealth Mode; World's First R/W Cross-Point Memory Array Requires No Transistor in Memory Cell
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2009
Headlines for Wednesday May. 20, 2009
GDA Technologies to Demonstrate 'Pravega' Family of Configurable USB 3.0 Controllers
GDA announced today to demonstrate "Pravega"--its USB 3.0 family of cores consisting of a highly configurable Superspeed device, hub and host controllers that are interoperable with third party PIPE compatible USB 3.0 PHY's running at 5 Gbits/s maximum speeds.- ARM RealView Development Suite: Enhanced Platform Support For Atmel, Freescale, Samsung, ST and TI Devices
- Atmel and ARM Expand Strategic Relationship With Subscription License Agreement
- Virage Logic Introduces First Commercially Available Multi-Time Programmable Non-Volatile Memory Solution at 65-Nanometer Low Power
- ARC International plc -- Interim Management Statement
- eMemory Announces Availability of Low Cost OTP Mass Production Solution - NeoROM
- WideSail Technologies announces availability of their 10 Gb Ethernet FEC Decoder
- Fresco Logic showcases World's First Working PCI Express to SuperSpeed USB xHCI Host Single-Chip Solution
- Agilent Technologies to Demonstrate Industry-First USB 3.0 Tests with NEC Electronics’ USB 3.0 Host Controller
Headlines for Tuesday May. 19, 2009
Analysis: Dissecting the MIPS-Chipidea breakup
MIPS executives have blamed its short marriage with Chipidea on a weak economy. But ex-Chipidea employees insist integration of the two companies was botched by MIPS.- MIPS64 Architecture Powers New Superscalar XLP Processor from RMI Corporation
- Tokyo Electron Device Announces ASIC/LSI Prototyping Board Released Featuring DDR3 SDRAM and LV-DDR2 SDRAM
- Mixel Celebrates 10 Years of Mixed-Signal Excellence
- ARM Selects Jasper for Formal Verification of IP
- Incoras Solutions announces MediaDesigner, an Eclipse-based Design and Test Workbench for OpenMAX IL Development
- T-RAM and GLOBALFOUNDRIES Enter into Joint Development Agreement for Application of T-RAM's Thyristor-RAM Embedded Memory to Advanced Technology Nodes
- Cadence and Virtutech Extend Metric-Driven Verification to Virtual Systems Development
- Cadence Speeds Systems Development with Automated Transaction-Level Verification
Headlines for Monday May. 18, 2009
Hynix Semiconductor, LG Electronics, Samsung Electronics and Silicon Image Sign Long-Term Agreement to Create the Next-Generation Memory Interface Technology Specification
Hynix Semiconductor, LG Electronics, Samsung Electronics and Silicon Image today announced the formation of an industry consortium that promotes Serial Port Memory Technology (SPMT) for broad market adoption as an industry standard. As the first-of-its-kind memory specification for dynamic random access memory (DRAM), SPMT will initially target the mobile handset market, enabling a new generation of devices capable of running highly data intensive, media-rich applications while at the same time extending battery life.- The SPIRIT Consortium Announces Release of the SystemRDL Specification
- Innovision and NXP announce joint NFC marketing and licensing agreement
- Altera Ships Arria II GX FPGAs: High-Performance, Low-Cost Transceiver FPGAs for 3-Gbps Applications
- PLDA Achieves IP Success with Cadence SuperSpeed USB (USB 3.0) Verification IP
- NEC Electronics Introduces World's First USB 3.0 Host Controller
- CEVA and Aricent to Demonstrate LTE PHY Platform for Cellular Handsets
- S3 and Percello Collaborate to Produce Latest Femtocell Baseband Processor
- SpringSoft Introduces Structured Method for SystemVerilog Testbench Debug and Analysis
- NXP Semiconductors Accelerates Design Cycle using New Cadence Encounter Digital Implementation System for Industry’s First 45nm Digital TV Processor
Headlines for Friday May. 15, 2009
TI acquires Luminary Micro
TI announced today that it will expand its microcontroller (MCU) portfolio with the acquisition of Luminary Micro, the market-leading supplier of ARM Cortex-M3-based 32-bit MCUs. The addition of Luminary Micro’s Stellaris® family of Cortex-M3 processors will accelerate TI’s ability to provide the industry’s most complete MCU portfolio- LogicVision Delivers Power-Aware Memory Self-Repair
- New patented solutions from Dolphin Integration for pop-up noise reduction
- ARM Welcomes TI Acquisition of Luminary Micro
- XMOS starts shipment of XS1-G2 devices
- SMIC Announces Availability of 65-nanometer Low Leakage Process IP Portfolio
- Texas Instruments introduces first SuperSpeed USB-compliant transceiver test chip
- Virage Logic Announces Extension of Stock Repurchase Program
Headlines for Thursday May. 14, 2009
Enable Customers' Fastrack to USB 3.0, Faraday Pioneers to Launch Its USB 3.0 PHY in UMC 0.13um
Faraday today announced the availability of the commercial USB3.0 physical layer (PHY) at UMC 0.13um high-speed (HS) process. This new component is based upon USB 3.0 version 1.0 specification, functionally and electrically, with the maximum speed of 5.0Gbps.- Synopsys Demonstrates DesignWare SuperSpeed USB 3.0 Controller IP at the SuperSpeed USB Developer's Conference
- Federal Trade Commission Dismisses Case Against Rambus
- SafeNet Unveils the Industry's Highest Security SoCs and Next Generation of Security Co-processors
- Tower Semiconductor Reports First Quarter 2009 Financial Results
- KABEN appoints Tom Willey to the Board of Advisors
- Tundra Semiconductor Announces RapidIO System Modeling Tool
Headlines for Wednesday May. 13, 2009
Video: Intel upbeat on SoCs, recovery
Intel Corp. plans to offer 3G cellular silicon as part of its move into Atom-based systems-on-chip for networked devices, said chief executive of Paul Otellini.Headlines for Tuesday May. 12, 2009
Mentor Graphics Delivers First HDTV Platform for the Accelerated Verification of HDMI and DisplayPort Products
Mentor Graphics today announced its high-performance platform to accelerate the verification of HDTV products. The platform consists of the Veloce® family of hardware-assisted verification products and the iSolveTM Multimedia product for HTDV applications, which provides a cost-effective and efficient solution, delivering a dynamic and accurate verification environment.- Octasic Inc. Appoints New Chief Executive Officer
- Monotype Imaging and TAKUMI to Unveil OpenVG Text Solution
- Open-Silicon, Inc. Executes NXP Product Development in Record Time
- Toshiba Selects Synopsys as Its Key EDA Partner
- Jennic Achieves ZigBee Compliant Platform (ZCP) Certification
Headlines for Monday May. 11, 2009
Analog/digital marriage ends; MIPS/Chipidea not a good idea
MIPS Technologies Inc., which in August 2007 bought Chipidea, a Portuguese analog and mixed-signal IP company, announced Friday (May 8) that it has now divested its analog business group to Synopsys Inc. in an all-cash transaction for $22 million, effective immediately.- eASIC Announces Low-Cost, Single-Chip High Definition H.264 Codec
- Chipsbank Selects Vivante GPU IP for Consumer Electronics
- TAKUMI Starts Licensing New Graphics Accelerator IP cores supporting 2D Vector Graphics
- Actions Semiconductor and Dolphin Integration enable a solution for the next generation of portable audio players
- New Xilinx Virtex-5Q FPGA Family Delivers Higher Performance and Advanced Security Technologies for Defense Systems
- CEVA Partners with SMIC to Deliver Fully Functional Silicon for CEVA-TeakLite-III DSP Core
- Rad3 Communications announces the acquisition of Raithlin Semiconductor's LDPC IP Cores and development team
- Jeff Ball Joins Kilopass as VP of Corporate Development
- SiliconBlue iCE65 mobileFPGA Family Strengthens Consumer Handheld Leadership with World's First Wafer Level Chip Scale Package SRAM FPGAs
- Market Changes in DSP Silicon Warrants New Analysis According To Study
- Synopsys Launches IC Validator, Offers Significant Reduction in Physical Verification Turnaround Time for Advanced Designs
- Pigeon Point Systems Announces MicroTCA Carrier Management Controller BMR Starter Kit Using Fusion Mixed-Signal FPGA
- XMOS Delivers Industry's First Open Source Hardware Solution for Networked Audio & Video over Ethernet
- Aquantia to Deliver World's First Quad 10GBASE-T Solution
- MPEG LA Announces Progress in Facilitation of LTE Patent Pool License
- Northwest Logic Chooses ChipStart as North America and EMEA Distribution Partner
Headlines for Friday May. 08, 2009
Synopsys Acquires Analog Business Group of MIPS Technologies
Synopsys, Inc. , a world leader in software and IP for semiconductor design and manufacturing, today announced it has acquired the Analog Business Group of MIPS Technologies, Inc. for $22 million in cash. The acquisition expands Synopsys' DesignWare® intellectual property (IP) portfolio with a new family of analog IP such as Analog-to-Digital Converters, Digital-to-Analog Converters, Audio Codecs and Power Management. It will also add HDMI TX and RX protocols to Synopsys' existing interface IP solution.- MIPS Technologies Announces Divestiture of its Analog Business Group
- TSMC April 2009 Sales Report
- Wi-LAN Completes Series of Patent Acquisitions
- Wi-LAN and Infineon Settle Patent Litigation
- Another ARC makeover begins as Schlachte departs
Headlines for Thursday May. 07, 2009
Mentor Graphics and LogicVision Sign Definitive Merger Agreement
Mentor Graphics Corporation and LogicVision, Inc. today announced the two companies have signed a definitive merger agreement pursuant to which Mentor Graphics will acquire LogicVision. Under the terms of the agreement, which was approved by the boards of directors of both companies, LogicVision stockholders will receive 0.2006 of a share of Mentor Graphics common stock for each share of LogicVision, for aggregate consideration of approximately $13 million dollars (as of May 7, 2009).- eASIC Accelerates DSP Market Momentum with New IP cores
- Faraday Monthly Sales Report -- April 2009
- Qualcore initiates standard cell library development-new business wing
- ARM Included in Latest UEFI Specification
- Achronix Taps Signali for 10/40/100Gbps Encryption IP in World's Fastest FPGAS
- Cadence Encounter Digital Implementation System Used by Gennum’s Snowbush IP Group to Speed Delivery of Industry’s First 45nm USB 3.0 PHY IP
Headlines for Wednesday May. 06, 2009
OCP-IP Releases OCP 3.0 Specification
Open Core Protocol International Partnership (OCP-IP) today announced the release of the OCP 3.0 specification for member review. This latest version contains extensions to support cache coherence and more aggressive power management, as well as an additional high-speed consensus profile and other new elements.- ARC International plc Board Changes
- EDA Consortium Conducts Multi-Faceted Investigation into EDA Software Piracy
Headlines for Tuesday May. 05, 2009
Sonics Answers Challenge of Designing Embedded SoCs Containing Multiple IP Blocks
Sonics has announced the Sonics Network for AMBA® Protocol or SNAP™. The product is a cost-effective, turn-key solution designed to simplify the on-chip bus design for complex embedded SoCs by turning multilayer bus designs into an IP block.- CEVA, Inc. Announces First Quarter 2009 Financial Results
- NXP ships industry's highest performance Cortex-M3 based microcontrollers
- EVE Integrates Latest Xilinx ISE Design Suite into its Emulation Platforms
Headlines for Monday May. 04, 2009
Is Windows 7 launch set to reveal ARM processor support?
There have been rumors for a while now that Microsoft engineers in Redmond, Washington, have been demonstrating the Windows XP operating system running on chips with ARM processing cores inside.- Apple seen beefing up its chip design efforts
- DOLPHIN Integration Announces High Density BTF Library at 65 nm
- Paradigm Works Announces VMM 1.0 enhancements to its SystemVerilog FrameWorks VMM Template Generator software
- New Actel Design Examples Boost Productivity for Low-Power Designers
- PLX Technology Unveils Industry's First PCI Express-to-USB 2.0 Host Controller Bridge
- Verismo Networks Licenses On2 VP6 Codec for VuNow Internet TV Platform
- Open-Silicon Ships More Than 40 Million Units to Customers
Headlines for Friday May. 01, 2009
Latest News- Agnisys IncEDA startup announces innovative tool for register management of IP and SoCs
- MOSAID Signs First Deal for New Communications Patents in Record Time
- MIPS Technologies Reports Third Quarter Fiscal 2009 Financial Results Highlighting Continued Positive Cash Flow