D&R Headline News (September 2009)

Headlines for Wednesday Sep. 30, 2009

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Arasan Chip Systems First to Release MIPI D-PHY Compliant with the version 1.0 Specification

Arasan announced the availability of the MIPI® D-PHY IP compliant with the v1.0 standard released September 22, 2009 by the MIPI Alliance. With this release, Arasan continues to demonstrate its commitment to its Strategic Mobile Initiative by being the first to deliver fully verified MIPI IP comprising of software stacks, controllers and the D-PHY.

• MindTree To Acquire Kyocera Wireless India
• Sarance, Spirent Communications Partner To Develop Next Generation 40/100G Ethernet Test Solution
• Accellera Members Approve VIP Standard Best Practices Guide, Continue Improving EDA Verification and Interoperability
• MIPS Technologies Joins the Open Handset Alliance

Headlines for Tuesday Sep. 29, 2009

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Virage Logic Expands SiPro(TM) Product Portfolio with New Production-Proven Advanced Interface IP Offerings

Virage today announced new additions to its recently introduced SiPro(TM) product line of production-proven advanced interface IP. The expanded product line now includes complete standards-based solutions for PCI Express (PCIe) and Mobile Industry Processor Interface (MIPI(R)) as well as a unique multi-protocol IP solution for High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI) and DisplayPort interfaces. The Virage Logic SiPro product portfolio is the result of a collaboration with AMD (NYSE: AMD) that was announced in January 2009.

• On2 Announces Early Termination of HSR Waiting Period in Connection with Proposed Acquisition of On2 by Google
• Moortec Announces SPI Block (MR74040) for Low Power Applications
• ARM gets to sit beside Intel inside Dell laptop
• EVE's ZeBu-Server Proven Fastest Emulator on the Market
• Silicon Image Revises Third Quarter 2009 Revenue Outlook
• Leading Companies Form Mobile High-Definition Interface Working Group to Drive Industry Standard for Mobile Wired Connectivity
• eASIC announces NEW ASIC-in-a-box Design Kits
• Silicon Image Announces Departure of CEO; Harold Covert Appointed as President and COO
• Tower and Jazz Semiconductor Announce Deep-Silicon-Via™ Technology for Cellular and WiFi SiGe Power Amplifiers and Front-End Modules

Headlines for Monday Sep. 28, 2009

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ARM will overtake Intel in netbooks, smartbooks, says analyst

Intel Corp. will claim 94 percent of the netbook/smartbook market in 2009 but ARM Holdings plc and its processor licensees with take the lead in 2012, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).

• Forte Design Systems Acquires Arithmatica
• Broadcom Licenses Latest ARM Cortex A9 Multiprocessor Technology
• Dolphin Integration announces the availability of assessment result of its High Density stem for benchmarking purposes
• TSMC Appoints Dr. Shang-Yi Chiang as Senior Vice President
• Pulsic tools deployed by Toshiba for layout of next generation Flash Memory

Headlines for Friday Sep. 25, 2009

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AppliedMicro-TSMC Collaboration Brings Power Architecture Microprocessors to TSMC Technology Platforms

AMCC and TSMC today announced a collaboration enabling AppliedMicro’s Power Architecture® microprocessors to be manufactured on TSMC’s industry-leading technology platform first at 90nm then moving to 65nm and 40nm soon after.

• For notebooks, Light Peak is in, USB 3.0 is out? Join the conversation
• SMIC Chooses Kilopass Embedded Non-Volatile Memory (NVM) for Its 65nm and 45nm CMOS Logic Processes
• Intel Unveils 45nm System-on-Chip for Internet TV
• Fast interfaces overlap at IDF

Headlines for Thursday Sep. 24, 2009

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Sidense Secure Embedded OTP Enables Encrypted USB Drive

Sidense today announced that Faraday selected Sidense’s 1T-Fuse™ single- transistor bit cell, one-time programmable (OTP) macros for use in a USB secure drive application. The 16Kbit Sidense macro provides a highly secure storage medium for protecting data, applications and IDs on the drive.

• Sightic Vista chooses the Cortus APS3 for their CCTV DSP
• Analysis: Intel and SoC -- try, try again
• Wipro France CEO discusses Sophia Antipolis site viability

Headlines for Wednesday Sep. 23, 2009

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ARM Makes Multi-Chip Debug Affordable In End Product

ARM has introduced multi-drop support into the ARM® CoreSight™ Serial Wire Debug (SWD) solution, enabling simultaneous connection to multiple devices from a single debug host.This latest version of SWD with multi-drop support brings a high performance and low cost 2-pin debug solution to complex, multi-core, multi-chip products such as mobile devices, making debug implementation more affordable in the end product.

• MIPS Technologies Welcomes New Ecosystem Partners for Android on MIPS Initiative
• Altera's Stratix IV GX FPGAs Move to Volume Production
• Xilinx Raises September Quarter Sales Guidance
• Evatronix Introduces the World's Fastest SD/SDIO/MMC Host Controller
• SMIC Selects Virage Logic's AEON(R) Embedded Multi-Time Programmable (MTP) Non-Volatile Memory (NVM) For RFID Applications
• eMemory Breaks New Ground in Launching Its Industrial Grade Embedded NVM for Power Management Solution
• LX Extends Leadership in USB with New USB 3.0 Solutions for Multiple Markets
• LSI Introduces Industry's First 40nm Serial PHY for Notebook, Desktop and Enterprise Hard Disk Drives

Headlines for Tuesday Sep. 22, 2009

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Synopsys First IP Vendor to Demonstrate SuperSpeed USB 3.0 Host, Hub and Device IP in a Single Demonstration

Synopsys today announced the company will be the first IP vendor to show SuperSpeed USB 3.0 data transfers of an xHCI Host, Hub and Device digital controller IP in a single demonstration.

• On2 Technologies Licenses VP6 Video Decoder Technology to videantis
• Imagination announces POWERVR Insider SDK 2.5
• Vivante Graphics Processing Unit (GPU) Technology Selected by Cavium Networks
• Samsung's New 5-Megapixel SoC Image Sensor Brings Digital Still Camera Capabilities to High-end Mobile Phones
• Symwave and MCCI Demonstrate the World’s Highest Performance USB 3.0 System
• Arrow Electronics and Altera Place Soft-Core Processors at the Fingertips of Embedded Designers with BeMicro Evaluation Board

Headlines for Monday Sep. 21, 2009

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ARM and NXP Launch mbed To Enable Rapid Prototyping With Microcontrollers

ARM has developed mbed, the industry's first online platform for fast, low-risk prototyping of microcontroller-based systems. The mbed tools launch with integral hardware and software support for the NXP LPC1768 ARM® Cortex™-M3 processor-based MCU, making cutting-edge microcontroller technology accessible to a wide audience.

• NEC Electronics Rolls Out USB 3.0 SOC Design Solution to Speed Customer Time to Market
• MIPS Licenses Processor IP to Shanghai-Based Opulan Technologies
• New Firmware Catalog Enhances Actel's Tool Suite for Embedded Software Developers
• InterDigital Signs Pantech to Worldwide Patent License Agreement Covering 2G, 3G and LTE Standards
• Dolphin Integration Library portfolio at 65 nm
• Long, bumpy transition seen for USB 3.0
• Optimization key to the future, says EDA pioneer
• Intel's Ambitious Process Roadmap
• Atmel and Global Unichip Announce Collaboration for Systems-on-Chip based on Atmel's AT91CAP Customizable Microcontroller

Headlines for Friday Sep. 18, 2009

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IBM Announces Industry's Densest, Fastest On-Chip Dynamic Memory in 32-Nanometer, Silicon-on-Insulator Technology

IBM has successfully developed a prototype of the semiconductor industry's smallest, densest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technology that can offer improved speed, power savings and reliability for products ranging from servers to consumer electronics.

• Recore Systems receives US$ 3 million funding
• Analyst: IC sales set for 'V' shaped recovery
• InterDigital Signs Cinterion to Worldwide Patent License Agreement
• Imagination Technologies - Interim Management Statement
• Wind River Adds CGL 4.0 Compliance for MIPS Architectures
• Fresco Logic Shipping its FL1000 PCI Express to USB 3.0 Single-Chip Host Controller

Headlines for Thursday Sep. 17, 2009

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Faraday SATA 3G PHY & controller First to Achieve Compliance in UMC's 90nm Process Technology

Faraday Technology today announced that their SATA 3G solution is the first to pass SATA-IO compliance test in UMC's 90 nanometer process technology, and becomes the 2nd IP provider in the world to have IP in SATA-IO's Building Block Listing.

• Rambus and Kingston Co-Develop Threaded Module Prototype for Multi-Core Computing
• Evatronix hires Carsten Elgert as VP of Marketing and Sales
• Cycleo unveils its first innovative semiconductor IP bringing unprecedented range to wireless data transmission
• USPTO Affirms Key MMP Portfolio(TM) Patents After Multiple Reexams
• X-FAB Announces Half-Year Results
• Sequans Partners with Hellosoft for WiMAX VoIP CPE Solution

Headlines for Wednesday Sep. 16, 2009

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ARM Announces 2GHz Capable Cortex-A9 Dual Core Processor Implementation

ARM announced today the development of two Cortex™-A9 MPCore™ hard macro implementations for the TSMC 40nm-G process, enabling silicon manufacturers to have a rapid and low-risk route to silicon for high-performance, low-power Cortex-A9 processor-based devices. The speed-optimized hard macro implementation will enable devices to operate at frequencies greater than 2GHz.

• Denali Announces PureSpec Solution Featured in IBM's New PowerPC PLB-6 CoreConnect Toolkits
• Achronix Unveils 120 Gbps Reprogrammable Networking System
• Commentary: ARM's Osprey broadens the battle front with Intel
• Micrium Offers Expanded Support for uC/OS-II RTOS for Entire Tensilica Dataplane Processor Line
• Xilinx Extends Next Generation Serial Connectivity Portfolio from Low-Cost Systems to 100 Gigabit Applications and Beyond
• Actel Corporation Updates Third Quarter Guidance
• K-micro announces availability of MontaVista Linux for CatsEye development platform
• Virage Logic Declares Offer to Acquire ARC International Unconditional in All Respects
• Arasan Chip Systems adds IEEE 1588 PTP support to Ethernet IP Core
• Microtronix Boosts Performance of MDDR Memory Controller IP Core to 200 MHz
• Rambus Raises Third Quarter Guidance

Headlines for Tuesday Sep. 15, 2009

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IBM Announces Highest Performance Embedded Processor for System-on-Chip Designs

IBM Corporation today announced the industry's highest performance, highest throughput processor for system-on-chip (SoC) product families in the communication, storage, consumer, and aerospace and defense markets

• Tata Elxsi & Wintegra collaborate to demonstrate LTE eNodeB reference solution
• ARM Joins The Linux Foundation
• Virage Logic Announces Level of Acceptances and Extension of the Offer to Acquire Arc International
• Altium's Radical New FPGA-based Development Board Makes Instant Prototyping of Electronic Designs Easy
• IPextreme Announces Partnership with Toppan Printing to Provide Easy Access to Freescale and National Semiconductor Microprocessor IP Cores
• EVE's New ZeBu-Server Offers Fast Compile Time

Headlines for Monday Sep. 14, 2009

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Cypress Revolutionizes Embedded Design with High Performance, Low Power PSoC® PSoC 5 Programmable System-on-Chip Architectures

New Scalable Platform Combines Programmable Precision Analog and Digital Logic with High Performance ARM-Cortex M3 and 8051-Based MCU Sub-Systems, Delivering Unmatched Time-to-Market, Integration, and Flexibility for 8-, 16- and 32-bit Applications

• Intel Announces Organizational Changes
• Altera Extends Its Technology Leadership with the 820K-LE Stratix IV FPGA
• TSMC Selects Synopsys HSIM Simulator for Sub-40nm Memory IP Characterization
• Innodul AG selects Rad3's advanced FEC IP for its Plastic Optical Fiber products
• Element CXI Announces nGEN Elemental Computing Array, a Fully Reconfigurable Platform for 4G Networks
• Silicon Hive busy with video processing
• Toshiba announces availability of free and low-cost development tools for ARM microcontroller families

Headlines for Friday Sep. 11, 2009

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intoPIX showcases its new PRISTINE JPEG 2000 Board

PRISTINE is a PCIe x8 board designed to handle uncompressed audiovisual material for its compression & decompression with JPEG 2000, faster than real-time. PRISTINE also provides a 3GSDI interface with four 3G inputs and outputs. PRISTINE supports virtually all SD, HD, 2K and 4K formats and offers embedded audio channels.

• Motorola Launches Advanced Multi-Format Encoding Platform for 1080P Content
• VIA Adopts Sequans Mobile WiMAX Chip Technology for New VIA eNote Turnkey Solution
• Qualcomm and GlobalWireless Sign 3G Femtocell License Agreement
• Xilinx FPGAs Enable TeamCast Digital TV and Mobile TV Modules for Professional Broadcast Systems
• Viewpoint: Why programmability is now a game changer
• Lattice Semiconductor Updates Guidance for Third Quarter 2009
• 10G-EPON Standard Ratified

Headlines for Thursday Sep. 10, 2009

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Cypress Partners with ARM for Next-Generation Embedded Platform Solutions

ARM and Cypress announced today that Cypress has licensed a broad range of intellectual property (IP) from ARM for use in next-generation programmable platforms. Cypress has licensed the ARM® Cortex™-M3 and ARM9™ family processors, along with more than 75 other IP elements.

• TSMC August 2009 Sales Report
• GLOBALFOUNDRIES Appoints Vice President of Marketing
• NEC Electronics and Wind River Expand Collaboration on Linux Solutions for Portable Audio/Visual Devices Market
• Synopsys Increases Stock Repurchase Authorization to $500 Million
• Wavesat Introduces LTE Chipset Featuring 100 Mb/s Downlink Capability

Headlines for Wednesday Sep. 09, 2009

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Synopsys First to Announce DDR3 IP with Support for 2133 Mbps Data Rates and 1.35V DDR3L

Synopsys today announced that its DesignWare® DDR3/2 PHY and digital controller IP supports the emerging 1866 and 2133 Megabits per second (Mbps) data rates currently being added to the JEDEC DDR3 standard.

• Radiocomp releases 4G Ready OBSAI RP3 v4.1 IP core for LTE, WCDMA and WIMAX
• Opinion: Winners, losers in ATIC-Chartered deal
• Altera Updates Third Quarter Guidance
• Apache Design Solutions Acquires Sequence Design
• GlobalFoundries to give UMC a run for its money

Headlines for Tuesday Sep. 08, 2009

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Cavium Networks Introduces ECONA Family of Super Energy Efficient ARM-Based System-on-Chip (SoC) Processors for the Digital Home That Break the 1 Watt Barrier

The ECONA CNS3XXX Family of Single and Dual Core ARM® SoC Processors Enable High Performance, Intelligent Home Networks While Slashing Power and Cost for Next-Generation Gateways, Storage and Consumer Electronics (CE) Devices in the Digital Home

• Carbon Design Systems Adds Co-Simulation Model Library to Expanding System-Level Validation Tool Suite
• Xilinx Demonstrates New Broadcast Offerings That Lower Cost and Power of Serial Digital Interfaces
• Dolby Digital Professional Encoder Now Available on Xilinx FPGAs for High Performance, Low Power Audio Broadcast Applications
• Broadcom's New International Cable Set-Top Box SoC Solutions Drive Compelling High Definition TV and Advanced Connectivity
• Barco and Merging Technologies join efforts to present a HD JPEG 2000 Player & Ingester
• Lattice Delivers Low Cost and Convenience to Designers of Consumer Products
• Black Sand Technologies Announces World's First 3G CMOS RF Power Amplifier
• Gemalto Acquires Trusted Logic, a Leading Provider of Secure Software Platforms
• Imagination passes 200 million unit milestone

Headlines for Monday Sep. 07, 2009

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ATIC Makes Bid to Acquire Chartered

Advanced Technology Investment Company LLC (ATIC) of Abu Dhabi and Chartered Semiconductor Manufacturing (Chartered) of Singapore today announced a definitive agreement whereby ATIC would acquire Chartered, one of the world’s top dedicated semiconductor foundries.

• Barco delivers its JPEG 2000 IP cores on all 40nm FPGA platforms
• Chartered-GlobalFoundries marriage to change landscape
• Analysis: Wipro's French unit closure may signal semi IP exit
• Chartered Updates Guidance For Third Quarter

Headlines for Friday Sep. 04, 2009

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July chip figures: What analysts are saying

What do July's chip figures mean? So far, analysts from Carnegie ASA, Gartner and Semico have separately interpreted the data. Now, Cowan, Databeans and Semiconductor Intelligence have added fuel to the fire.

• NXP Brings Unrivalled Performance to Mainstream HD DVRs and Set-Top Boxes with Industry's First Fully Integrated 45nm SoC Platform
• Wipro-NewLogic to close site in Sophia Antipolis, say employees

Headlines for Thursday Sep. 03, 2009

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Mentor Graphics Launches Precise-IP Vendor-independent IP Platform for FPGA Design

Mentor Graphics today announced Precise-IP™ — a new vendor-independent IP (Intellectual Property) platform as part of the Mentor Graphics® Precision® Synthesis product line. The platform includes vendor-independent configurable IP from Mentor Graphics and links to categorized third-party IP from leading vendors.

• TSMC sees Q3 demand as it solidifies roadmap

Headlines for Wednesday Sep. 02, 2009

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Analyst: Freescale to sell 3G IP to Chinese firm

Freescale Semiconductor Inc. plans to transfer its 3G cellular intellectual property (IP) to Beijing Capital Semiconductor in a deal valued at between $30 million and $40 million, according to a market analyst.

• Tower Semiconductor Announces Higher Third Quarter Revenue Guidance
• USB-IF Launches Certification and Compliance Program for SuperSpeed USB Products
• ARM Licenses Cortex-M3 Processor To Fujitsu Microelectronics
• SiliconGate Introduces 50 nA Crystal Oscillator for 0.35um to 40-nm Process Technologies
• Mentor Graphics Veloce Emulation System Adopted by MIPS to Accelerate Verification for Processor IP

Headlines for Tuesday Sep. 01, 2009

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EVE's New Emulation System Supports High-Capacity Designs of Up to One-Billion ASIC Gates

EVE today announced that its new emulation system ZeBu-Server supports high-capacity designs of up to one-billion application specific integrated circuit (ASIC) gates.

• Actel Announces Availibility of RTAX-DSP Prototype FPGAs
• MegaChips Licenses Low-Power IP Core from MIPS Technologies for Single-Chip LSI Solutions
• Altera's RapidIO IP Core Passes RIOLAB Device Interoperability Testing