D&R Headline News (January 2010)

Headlines for Friday Jan. 29, 2010

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Dolphin Integration announces the availability of a complete FREE evaluation kit for its Memory CACHE controller

Dolphin Integration announces the availability of a complete FREE evaluation kit for its Memory CACHE controller. Its name I-Stratus-LP stands for its position at level L1 as Instruction Cache for any processor in search for Low-Power.

• ASIC pioneer reinvents 3-D FPGAs
• Chipus starts partnership with LFoundry to develop analog IP cores
• Rambus Reports Fourth Quarter and Year-End Financial Results
• Agnisys announces support for OVM Register Package in IDesignSpec
• MIPS Technologies Reports Second Quarter Fiscal 2010 Financial Results

Headlines for Thursday Jan. 28, 2010

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Analyst rails against the fab-lite

The fabless chip vendors and pursuers of fab-lite manufacturing strategies are about to get a shock, according to Malcolm Penn, principal analyst with Future Horizons (Sevenoaks, England). Some companies could under-perform, others could be driven out of business in a market that should be booming for them; and all because they have lost control of manufacturing.

• TSMC Reports Fourth Quarter EPS of NT$1.26
• Synopsys Showcases Silicon-Proven DesignWare IP Solutions for SuperSpeed USB 3.0, DDR and PCI Express at DesignCon 2010
• CEVA, Inc. Announces Fourth Quarter and Year End 2009 Financial Results
• Arasan Chip Systems hosts panel discussion on Total IP Solutions at DesignCon 2010

Headlines for Wednesday Jan. 27, 2010

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Aeroflex Gaisler Announces the Next Generation Leon Processor

Aeroflex Gaisler today announced the next generation LEON processor - the LEON4, providing the industry a high performing, licensable 32-bit processor core based on the SPARC V8 architecture. The LEON4 complements the widely used LEON3 processor for high-performance embedded applications across a broad spectrum of demanding consumer and industrial applications.

• OCP-IP Delivers Even More OSCI TLM 2.0 Compatibility in Advanced SystemC TLM Kit
• ROHM Signs Major 1T-SRAM Technology License Agreement with MoSys
• Altera Announces Fourth Quarter Results Sales Up Strongly
• Shinco Electronics Enters Into MPEG LA's MPEG-2 License
• Actel Announces Compliance with Quality Management Standards SAE/AS9100 and ISO 9001

Headlines for Tuesday Jan. 26, 2010

• Mindspeed 3G/4G/LTE Baseband Solution Deploys CEVA DSP Processor to Deliver Best-in-Class Performance for Next-Generation Base Stations
• Evatronix Announces a Software Driver that Supports its ONFi 2.2 compatible NAND Flash Memory Controller
• CHiL Semiconductor Corporation Selects Kilopass' XPM Field-Programmable Embedded Non-Volatile Memory
• Renesas Adopts Cadence Virtuoso Technology for Mixed-Signal and Analog Design at its Global Design Centers

Headlines for Monday Jan. 25, 2010

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Synopsys Expands DesignWare IP Portfolio with MIPI IP Solutions

Synopsys today announced the addition of silicon-proven DesignWare® MIPI IP consisting of 3G DigRF Controllers and PHY, Camera Serial Interface 2 (CSI-2) Host Controller and D-PHY to its IP portfolio.

• Lauterbach, Discretix Announce Alliance To Provide Secure Chip Debug Capability
• Mentor Graphics Catapult C Adds SystemC Synthesis and Expands Full-Chip Capabilities
• Dolphin Integration: the embedded audio CODEC with smallest power consumption on the market
• Mindspeed 3G/4G/LTE Baseband Basestation Solution Uses Latest ARM Cortex A9 MPCore in Advanced 40-Nanometer Process Technology
• Cadence OVM SystemVerilog Solution Enables More Thorough Verification and Reduces Costs at Mitsubishi Electric
• Synopsys Launches DesignWare HDMI 1.4 Tx/Rx Controller and PHY IP Solutions for 40-nm Process Technologies
• Sandeep Vij Appointed CEO of MIPS Technologies
• Arasan Chip Systems provides complete solutions for the key Bus Interfaces in the emerging Netbook market
• Toshiba Information Systems (Japan) Standardizes on VMM-LP Low Power Verification Methodology

Headlines for Friday Jan. 22, 2010

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ARM-based Processors Will Overtake x86 in Ultra-mobile Devices in 2013

While an estimated 90% of Ultra-mobile Devices (UMDs) shipped in 2009 were based on an x86 processor architecture, the introduction of ARM-based systems introduces greater choice and differentiation for system vendors.

• ITC Administrative Law Judge Rules in Favor of Rambus in Matter Regarding NVIDIA Products
• ChipWrights' Hardware Development Kit Speeds the Design of Video Processing Applications
• Infineon Files Patent Infringement Lawsuit Against Volterra Semiconductor
• Nallatech Completes First Customer Shipment of 10Gb Ethernet PCI Express FPGA Accelerator Card
• eASIC Slashes Power with Low Voltage Devices

Headlines for Thursday Jan. 21, 2010

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Qualcomm and AMD Lead List of Top 25 Fabless IC Suppliers

Cellular phone chip supplier Qualcomm remained the number one fabless IC supplier, registering $6.6 billion in sales in 2009, a 2% increase. The most impressive gain by a large (i.e., greater than $1.0B in sales) fabless IC suppler in 2009 was MediaTek, which registered a strong 22% increase in sales to $3.5 billion.

• Arasan Chip Systems strengthens engagement in Japan - Appoints JBP Ltd. as its Representative
• Xilinx Posts Record Sales of $513 Million
• DIAMOND Project to Provide Integrated Diagnosis and Correction for Spec, Design and Soft Errors

Headlines for Wednesday Jan. 20, 2010

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Vivante and Animated Media Partner to Offer Embedded Flash Solutions Optimized for Vivante OpenGL ES 2.0 Graphics Processors

Flash Tools Can Be Used to Create Browser-less Embedded Flash Applications that are Translated To OpenGL ES 2.0 and Rendered by the Vivante GPU

• NXP and Intrinsic-ID collaborate to raise the bar in chip security
• LSI Expands Custom IP Portfolio for Enterprise Networking and Storage Applications
• Actel's Low-Power FPGAs Take to the Sky With Boeing's 787 Dreamliner
• Xilinx Virtex-6 FPGA Family Achieves Full Production Qualification on UMC's High-Performance 40nm
• Coronis, an Elster Group company, chooses the Cortus APS3 CPU for their next generation System-on-Chip solution
• Ukalta Engineering Introduces FPGA-Based Fading Channel Simulators
• Samsung and Rambus Sign Comprehensive Agreement
• International CES Highlights MIPS Technologies' Growing Presence in Connected Digital Home and Beyond

Headlines for Tuesday Jan. 19, 2010

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Chips&Media Ships over 20million Unit SoCs

Chips&Media today announced that its Semiconductor partners including Freescale, Mtekvision and Korea based top-tier semiconductor company, have shipped over 20 million system-on-chips(SoCs) integrated into smart phones, mobile internet devices(MIDs), smart books, portable media players(PMPs), digital televisions(DTVs) and set-top boxes(STBs).

• Cycleo to Partner with Japan's leading IP distributor, Spinnaker Systems
• SiTune unveils Ultra low power Mobile Analog CMOS TV Tuner for power sensitive devices
• BDTI Certified Results Show PICO High Level Synthesis Platform Produces Quality of Results Comparable to Hand-coded RTL

Headlines for Monday Jan. 18, 2010

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Intelop announces Xilinx FPGA development platform for their TCP-Offload Engine SoC IP

Intelop announces Xilinx FPGA development platform for their TCP-Offload Engine SoC IP for customers to easily develop networking solutions with TCP/IP acceleration. This second generation Customizable Full TCP offload integrates GEMAC, ARP module, PLB/AMBA 2.0 bus interfaces with Optional PCIe interfaces running at 2-Gbps also is capable of managing hundreds of simultaneous TCP sessions at delivering 10-20 times performance improvement over TCP/IP software implementations.

• Dolphin Integration strengthens their portfolio of Standard Cell libraries with the DUAL innovation targeting Low Power designs
• MOSAID Boosts Guidance for Annual Revenues and Pro Forma Net Income
• MOSAID and Samsung Reach Comprehensive Agreement
• Tata Consultancy Services (TCS) alliances with Qualcore Logic
• Evatronix USB 2.0 Controller Secures USB Certification for Richnex High Speed USB Transceivers
• Magillem, provider of the "one of a kind" IP-Reuse based SOC design methodology, expands its operations in Japan.
• Avnera Announces $10 Million Venture Financing

Headlines for Friday Jan. 15, 2010

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IDT Acquires Mobius Microsystems

IDT today announced it has acquired Mobius Microsystems, the leader in precision all-silicon oscillator technology . The transaction, which closed today, January 14, 2010, is an all-cash agreement for the outstanding Mobius shares. The agreement has already received appropriate board approvals.

• Analysis: Don't bet on Intel buying major FPGA vendor
• Xilinx to go with TSMC at 28-nm, says analyst

Headlines for Thursday Jan. 14, 2010

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Mentor Graphics Delivers Hardware-assisted Solution for the Accelerated Verification of USB 2.0 Products

Mentor Graphics today announced a hardware-assisted solution to accelerate the verification of Universal Serial Bus (USB) 2.0 products, including hard disk drives and other mass storage devices.

• EDA Consortium Reports Industry Revenue Down in Third Quarter 2009
• ARM raises royalty rate with Cortex
• GoAhead Software acquires S3's embeddedMIND Business
• Open Kernel Labs Enhances ARM Solution Center for Android With OK:Android
• Presto Engineering Receives Venture Funding To Expand its Pioneering Labless Strategy into Europe

Headlines for Wednesday Jan. 13, 2010

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Analyst: Intel may acquire FPGA vendor

Intel Corp. may look to acquire an FPGA supplier such as Xilinx Inc. or Altera Corp. in 2010 in an effort to expand its presence in the embedded market as well as SoCs, according to a Wall Street analyst.

• Synopsys Announces DesignWare Protocol Analyzer for Verification of SuperSpeed USB 3.0-based Designs
• Sidense OTP Memory IP Helps "Green Up" Audium's Power Amplifier
• Coreworks chosen by IEC as 2010 DesignVision Award Finalist
• Socle Technology realizes success using Cosmic Circuits' Analog IP across designs

Headlines for Tuesday Jan. 12, 2010

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Open-Silicon Targets Derivative IC Market with SLE Acquisition

Open-Silicon announced today the acquisition of Silicon Logic Engineering (SLE) to enhance the company’s derivative IC design capabilities. The SLE team, based in Eau Claire, Wis., joined Open-Silicon effective December 7, 2009.

• Synopsys Introduces Industry's First SystemC TLM-2.0 SuperSpeed USB 3.0 Models
• Industry's Biggest, Highest Performance FPGA Now Shipping from Xilinx
• Triad Semiconductor Announces Availability of World's First Configurable ARM Cortex-M0 Mixed-signal ASIC Solution
• Elliptic Confirms GSM Mobile Phone Security Flaw
• Arasan Chip Systems Adds DigRFSM 3G IP to its MIPI IP Portfolio
• Evatronix IP Cores Now Available in the LFoundry Process Design Kit (PDK)
• Virage Logic Establishes Corporation and R&D Center of Excellence in the Netherlands

Headlines for Monday Jan. 11, 2010

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Atmel Reduces System Cost in Industrial Applications With High-Quality Video Decoding ARM926-Based Microprocessor

Atmel today announced the SAM9M10, a high-performance ARM926EJ™-based embedded microprocessor (MPU) that integrates a video decoder and 2D acceleration (scaling, rotating, color space conversion, picture in picture) to provide high-quality video performance in industrial embedded applications.

• Freescale Semiconductor Collaborates with Mentor Graphics on Tessent Silicon Test, Yield Analysis, Calibre Physical Verification and DFM
• MapuSoft Extends Support to Android, Enabling Legacy Code Reuse on the Mobile Platform
• Synopsys Speeds Timing Signoff by 2X With Latest Multicore Technology
• Deutschmann Automation Selects Innovasic Semiconductor’s Ethernet Connectivity Solution
• Xilinx Demonstrates Plug-and-Play HDTV Reference Design at CES 2010
• Tuxera NTFS for Windows CE Announced
• Virage Logic and Conexant Collaborate to Deliver Advanced Audio Solutions for a Broad Range of PCs and Laptops

Headlines for Friday Jan. 08, 2010

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Imagination announces META AXD audio processor IP platform

Imagination Technologies, a leading multimedia chip technologies company announces META AXD, a full audio IP platform delivering a complete multi-standard and multi-stream audio solution for System-on-Chip (SoC) designs.

• Qualcomm and TSMC Collaborating on 28nm Process Technology
• TSMC December 2009 Sales Report
• Imagination Technologies announces POWERVR SGX545 graphics IP core with full DirectX 10.1, OpenGL 3.2 and OpenCL 1.0 capabilities
• New Imagination Technologies' video decoder cores to support On2 VP6 video format
• Discretix Announces Embedded Security Solutions for Media Phones
• Virage Logic Inks Deal with IDT to Provide Its Sonic Focus Software on PC Codecs

Headlines for Thursday Jan. 07, 2010

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Imagination demonstrates real time Wi-Fi and reveals ATSC capabilities on latest ENSIGMA UCCP310 communications IP platform

Imagination Technologies is demonstrating a test chip incorporating Imagination’s latest ENSIGMA UCCP310 IP platform . This is the only multi-standard communications IP core available in the market today that can be demonstrated to deliver both 802.11 a/b/g Wi-Fi connectivity and a broad suite of demodulators required for digital TV broadcasts worldwide, including ATSC and all of the major European and Japanese terrestrial standards, in a single programmable IP core.

• Marseille Reinvents Fabless Semiconductor Development, Unveils Virtual Tape-Out Methodology
• GLOBALFOUNDRIES and Qualcomm Intend to Collaborate on the Development of Leading-Edge Technology and Pursue a High-Volume Manufacturing Engagement
• Magnum Semiconductor Launches a High Definition Video Compression IP Solution
• Imagination demonstrates POWERVR FRC270 Frame Rate Conversion IP Core
• Nuvoton launches NuMicro Family - 32-bit Microcontroller based on ARM Cortex-M0
• Xilinx Expands Programmable Advantage for Consumer Digital TV Displays
• SoftJin announces PAL-NTSC Encoder IP for various display systems including SDTV and HDTV
• MIPS Technologies Leverages Yahoo! TV Widgets for MIPS-Based DTV Platforms
• ASUS Employs Virage Logic's Sonic Focus(R) Technology and Bang & Olufsen ICEpower Audio System Design to Deliver High Quality Sound on Their NX90 Notebook PC
• Alpha Data Releases New High-Performance Virtex-6 FPGA Based XMC Card
• Ambarella A5s with High-Speed CPU and Low-Power 45nm Technology Makes Pocket-Sized Hybrid Cameras a Richer User Experience

Headlines for Wednesday Jan. 06, 2010

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Cavium Networks Introduces a New Family of PureVu Single Chip H.264 Processors That Break the Price-Performance Barrier for Mass Market Adoption in Wireless Displays, Home Video Distribution, and Video Conferencing

Cavium Networks today announced a new family of full HD (1080p60) system-on-a-chip (SoC) H.264 video processors for consumer and enterprise applications.

• eSilicon and Virage Logic Sign Partner Agreement
• Iridium Technologies Releases Radiation Hardened Cell Library Designed Exclusively Using Simucad EDA Tools and PDKs
• TSMC Helps LSI Reduce Leakage 25 Percent on Next Generation Product
• Phison Licenses Virage Logic's ARC(R) 600 Family of Microprocessor Core IP for Use in Their Flash Controller Applications
• ZiiLABS And ARM Showcase Next-Generation 1080p Blu-Ray Quality Connected HDTV Home Entertainment
• Lantiq Acquires IP and Assets from Metalink and Broadens its Portfolio in Leading Edge WLAN 11n Technologies
• Silicon Image Appoints Camillo Martino Chief Executive Officer
• Virage Logic Showcases Leading Solution-to-Silicon Offerings at CES 2010

Headlines for Tuesday Jan. 05, 2010

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MIPS Technologies Brings Android "Home" with Demos of World's First Android Set-top Boxes; New Partners and Key Technology Milestones

MIPS today announced a compelling lineup of demonstrations, partnerships and technologies aimed at making Android a viable platform for digital home devices such as set-top boxes, Blu-ray Disc players, DTVs and VoIP solutions.

• SiBEAM Invigorates CE and PC Industries with Launch of Products and Partnerships to Fuel WirelessHD Expansion
• Perfectus Announces Availability of Industry’s Most Powerful SystemVerilog-Based OVM-Compliant PCI Express 3.0 Verification IP
• MIPS Technologies Collaborates with Adobe to Optimize Flash Player 10.1 for MIPS Architecture
• World's Leading DTV IC Vendor MStar Licenses MIPS Processor IP
• MIPS Technologies and Partners Accelerate SoC Design for Android-Based Devices
• NXP To Show The First Fully Integrated 45nm Set Top Box SoC Based On ARM Cortex–A9 Processors
• SiliconBlue Technologies Expands iCE65 mobileFPGA Family
• Tensilica Demonstrates Success in Audio/Video and Broadband Communications at CES 2010
• WiLAN and Conexant Enter License Agreement
• ViXS Systems Teams with MIPS Technologies for High-Performance Processors used in Advanced Multimedia Applications

Headlines for Monday Jan. 04, 2010

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TranSwitch to Unveil Latest High Definition Video Interconnect Technology at 2010 International CES

TranSwitch will formally introduce its latest High Definition Multimedia Interface™ (HDMI) for next generation digital television (DTV) and home theatre applications at the 2010 International CES trade show. The HD-PXL™-1.4 includes 3D Video and support for new 4K super resolution displays.

• SIA Reports November Chip Sales
• The ARM Cortex-M3 and the convergence of the MCU market
• MOSAID and Samsung Enter Standstill Agreement
• APTX licenses Enhanced apt-X to Digigram
• Arasan Chip Systems Showcases Comprehensive USB 3.0 IP Portfolio at 2010 International CES
• ASMedia and MCCI Partner for Reliable SuperSpeed USB 3.0 Products