D&R Headline News (October 2010)

Headlines for Friday Oct. 29, 2010

• MoSys, Inc. Reports Third Quarter 2010 Financial Results
• Zoran Corporation Announces Expiration of Hart-Scott-Rodino Waiting Period for Proposed Merger With Microtune, Inc.
• Faraday Reported 2010 Third Quarter Results
• Sankalp Semiconductor Enters into a Sales Agreement with ChipStart to Promote GPIO IP

Headlines for Thursday Oct. 28, 2010

Top Story

Synopsys' Silicon-Proven DesignWare HDMI 1.4a Tx Controller and PHY IP Receive HDMI Certification

Synopsys today announced that Synopsys' DesignWare® High-Definition Multimedia Interface™ (HDMI™) 1.4a Transmitter (Tx) digital controller and PHY IP solutions in the 40-nanometer (nm) process node have achieved certification from an HDMI Authorized Training Center (ATC).

• TSMC Reports Third Quarter EPS of NT$1.81
• eSilicon's eFlexCAM cores enable 725 million searches per second
• New Solid State Drive (SSD) Form Factor Working Group Aims to Promote Interoperability, Scalability & Choice
• Sital receives a formal patent approval for Tails-Code-Key
• Cavium Networks Extends MIPS Architecture License
• Xilinx Expands Secure Mobility and Ruggedized Performance Offering with Next Generation of Defense-Grade Families
• Microchip Licenses MIPS32 M14K Cores for Next-Generation 32-bit PIC32 Microcontrollers
• NetLogic Microsystems Announces Availability of Comprehensive XLP multi-core Processor Hardware and Software Development Kit
• Tuxera Launches Tuxera File System Suite, First to Combine NTFS, exFAT and HFS+ for Android
• Five good, five bad signs for IC market
• Cadence Reports Q3 2010 Financial Results
• Don't blame Obama for fabless America
• Chipworks Launches World's First Reverse Engineering eStore

Headlines for Wednesday Oct. 27, 2010

Top Story

Renesas Electronics to Spin Off its Mobile Multimedia SoC Business

Renesas Electronics today announced that it has decided to spin off, through an absorption-type separation, its Mobile Multimedia SoC Business Division and transfer the business to a new consolidated subsidiary, Renesas Mobile Corporation, effective as of December 1, 2010.

• New PAC-Designer 6.0 Software Enables Designers to Transform Board Management With New Platform Manager Devices
• Dongbu HiTek Accelerates Drive into Automotive Electronics ICs Winning AEC-Q100 Certifications for Process Technologies and IP
• Semiconductor Revenue to Post Only Modest Gains Next Year
• CSR collaborates with Infineon Technologies to integrate wireless connectivity onto mobile phone platforms
• Microprocessor Trends Beyond 2010: Follow the Money
• Cadence Unveils Holistic Approach to Silicon Realization
• Cummins Inc. Purchases MMP Portfolio(TM) License, According to Patriot Scientific Corporation
• Silicon Image Continues Revenue and Earnings Growth in the Third Quarter
• Open-Silicon Expands ASIC Architecture and RTL Design Team to Support Derivative SoC Solutions

Headlines for Tuesday Oct. 26, 2010

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ARM Holdings plc Reports Results for the Third Quarter and Nine Months Ended 30 September 2010

RM Holdings plc announces its unaudited financial results for the third quarter and nine months ended 30 September 2010. Continuing adoption of ARM technology by leading semiconductor companies in a broad range of end-markets is delivering strong revenues, profits and cash.

• Broadcom Corporation to Acquire Percello Ltd.
• Gennum Advances 10G EPON Technology for FTTx Deployments
• MIPS Technologies' First Quarter Revenue Grows 50% Year-to-Year
• Hynix Standardizes on SpringSoft's Verification Enhancement and Custom IC Design Solutions
• DP8051 - accelerated world's fastest Digital Core Design 8051 IP Core
• Axell Corporation Chooses Forte's High-level Synthesis and Design IP
• CEVA, Inc. Announces Third Quarter 2010 Financial Results
• Faraday's USB 3.0 Solution, from PHYs to Device Controllers, Are All Certified with Logo on Products
• Gennum Delivers World's Fastest Crosspoint Switch
• Synopsys Power-Aware Test Speeds Time to Volume Production at Realtek
• K-micro initiates development of IEEE 1901 compliant PLC LSI

Headlines for Monday Oct. 25, 2010

• Sidense Achieves Record Results for FY2010
• Tri-Star Design, Inc. Becomes Member of Elite Xilinx Alliance Program
• Himax Standardizes on Synopsys Implementation, Verification and IP Solutions for Video SoC Products
• Sankalp Semiconductor is a Finalist for the 2010 Red Herring 100 Asia Award

Headlines for Friday Oct. 22, 2010

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PMC-Sierra Accelerates Entry into Mobile Backhaul with Acquisition of Wintegra

PMC-Sierra today announced that it has signed a definitive agreement to acquire Wintegra

• DOLPHIN Integration promotes a complete offering of detectors for on-the-fly checking
• Lattice Semiconductor Reports Third Quarter 2010 Results
• Atrenta and TSMC Develop a Soft IP Qualification Flow
• Rambus Reports Third Quarter Earnings

Headlines for Thursday Oct. 21, 2010

Top Story

Elliptic First To Offer Commercial IP For New LTE-Advanced Security Algorithms

Elliptic Technologies today launched its family of IP solutions in support of two new algorithms intended for Long Term Evolution (LTE) and LTE-Advanced 3GPP wireless networks acceptable to key Asian markets.

• 4G Chipset Provider Sequans Communications Licenses MIPS Technologies' Processor Core
• Synopsys Awarded TSMC's 'Interface IP Partner of the Year'
• CAST Signs Advanced Semiconductor Technology Ltd. (AST) as Israeli Representative
• Xilinx Announces Fourth Consecutive Quarter of Record Sales; Operating Margin Reaches 36%
• Analysts fret over FPGA lead times

Headlines for Wednesday Oct. 20, 2010

Top Story

Silicon Image Releases Enhanced, Scalable 4K-3D and Multi-Channel Video Decoder IP Core

Silicon Image today announced its enhanced, scalable cineramIC™ ultra high-definition video decoder. The cineramIC IP core is now capable of decoding up to 4Kx2K 3D at 60 frames per second — the leading edge of digital video technology advancements for prosumer and professional cameras and displays, including support for multi-channel decoding of up to 16 HD video streams simultaneously.

• Rochester Electronics Provides Industry's Only Established Semiconductor Replication Process
• STMicroelectronics and Green Hills Software Announce Software Support for SPEAr Microprocessor Families
• Altera Announces Record Third Quarter Results
• National Instruments Increases IP Availability With New NI LabVIEW FPGA IPNet

Headlines for Tuesday Oct. 19, 2010

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CEVA Expands Into 4G Wireless Infrastructure Market With Industry-First Vector DSP for Software Defined Radio Platforms

CEVA-XC323™ DSP delivers up to 4x performance improvement for 4G processing compared to incumbent infrastructure VLIW DSPs; Supports multi-core architectures and seamless software migration path from previous-generation infrastructure DSP vendors

• Acorn Technologies Announces HellaPHY IP Core for Industry-Leading Performance in 4G Wireless Networks
• France's CNRS offers nano-memory IP
• Tata Elxsi, CommAgility, and Radiocomp collaborate to demonstrate LTE eNodeB Reference Architecture Using a MicroTCA and Remote Radio Head
• Xilinx FPGA Development Platforms Jump Start Innovation for Smarter Automotive System Designs at SAE Convergence 2010
• DesignArt Networks Relies on Tensilica for 4G SoC Family
• Automotive developers find easier path to ISO26262 safety conformance through Texas Instruments and Yogitech Collaboration
• Tata Elxsi extends its LTE Software Portfolio for Cavium Networks OCTEON II Processors
• Report: Altera to get TSMC's 28-nm in Q4
• Report: Intel to announce new fab
• NXP LPC1100L and LPC1300L MCUs Based on ARM Cortex-M Series Achieve Industry's Lowest 32-Bit Operating Power
• Lattice Announces Serial RapidIO 2.1 AMC Evaluation Platform
• Actel's ProASICPLUS and ProASIC3 FPGAs Selected by Advantech for Networking and Gaming Platforms
• IBM sees 28% growth in ICs
• Analysts sees 'PLD inflection point'
• US District Court Accepts Kilopass' Expanded Complaint and Denies Sidense's Motion for Dismissal in Patent Lawsuit

Headlines for Monday Oct. 18, 2010

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Altera Cuts Development Time and Increases Industrial Design Flexibility With a Kit and a Click

Altera today announced the expansion of its Industrial Networking Partner Program (INPP) with a new Industrial Networking Kit (INK) from Terasic. Through one convenient online site at altera.com, designers can now access the kit and Altera's industrial intellectual property (IP) partners in one place.

• Xilinx Transforms Ecosystem to Accelerate Mainstream Adoption of Programmable Platforms
• Mindspeed Collaborates with ArrayComm and Continuous Computing on Scalable, Single-Chip 4G Basestation Solutions
• Rohde & Schwarz and Blue Wonder Communications to demonstrate TD-LTE functionality at 4G World in Chicago
• Trilinear Technologies Adds DV Decode Solution to IP Core Portfolio
• Sequans Announces New WiMAX System-in-Package
• Lattice Ships 50 Millionth MachXO Programmable Logic Device
• Evatronix to Give a Keynote about IP Verification at the SSIP Seminar in Shanghai
• Lantiq Announces World's First GPON SoC Family with Integrated Optical Control Circuitry featuring breakthrough level of Integration for Next Generation Networks

Headlines for Friday Oct. 15, 2010

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Sidense Reports: US Court Rules That "No Further Amendments of the Complaint Will Be Allowed" by Kilopass

Sidense announced that Judge Illston has granted Kilopass permission to file its proposed Second Amended Complaint (Kilopass's third version of a complaint), but ruled that "No further amendments of the complaint will be allowed."

• Dolphin Integration launch their unique JAXpower structure for optimized power regulators
• Texas Instruments opens the company's first semiconductor manufacturing plant in China
• Tata Elxsi announces LTE Femto/Pico reference solution for next generation SoC platforms

Headlines for Thursday Oct. 14, 2010

• Skyviia Corporation Selects Sonics' MemMax AMP for Next-Generation Mobile and Digital Multimedia SoCs
• Sonics Opens Design Center in Taiwan
• Why Microsoft Windows 8 will run on ARM
• Analysis: Inside Broadcom's bid for Beceem
• Mentor Graphics Announces Inflexion Platform User Interface (UI) for Android-Based Device Development

Headlines for Wednesday Oct. 13, 2010

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Broadcom Corporation to Acquire Beceem Communications Inc., a Leader in 4G Wireless

Broadcom today announced that it has signed a definitive agreement to acquire Beceem Communications Inc., a privately-held company that is a leading provider of fourth generation (4G) wireless platform solutions. Beceem has announced the industry's first 4G multimode platform that can support both LTE and WiMAX 4G networks.

• Vitesse Leverages MIPS Processor IP for New Eco-Ethernet Switch Families
• HDL Design House announces high performance serializer deserializer (SerDes) for Serial Rapid IO protocol 2.1 (HIPA 21000) IP core
• PMC-Sierra reportedly in talks to buy Wintegra
• GLOBALFOUNDRIES Expands Design Services Ecosystem with Three New Partners
• Patriot Scientific Corporation Releases First Fiscal Quarter Report

Headlines for Tuesday Oct. 12, 2010

Top Story

Altera Launches Embedded Initiative with New System Level Integration Tool for Embedded Systems Configurability

Altera today announced its Embedded Initiative. With this initiative, Altera is providing designers a single FPGA design flow based on its Quartus® II development software—including the new Qsys system-level integration tool, a common FPGA intellectual property (IP) library, and new ARM® Cortex™-A9 MPCore™ and MIPS® Technologies MIPS32 embedded processor offerings.

• IUNIKA Licenses MIPS Technologies' Coherent Multiprocessing Systems for Computing and Mobile Computing Devices
• EDA Consortium Reports Revenue Increase for Q2 2010
• OCP-IP Partners with Duolog Technologies to Provide OCP Performance Analysis Solution
• Arteris Joins TSMC Soft IP Alliance
• Recore Systems Selects Synopsys' Galaxy Implementation Platform for Reconfigurable SoC Development
• S2C Represents Allegro DVT H.264/AVC Certification Streams and IP in China
• Chips&Media Joins TSMC's Soft-IP Alliance Program
• Hyperstone selects Toshiba's ASIC technology, IP and services for development and manufacture of fabless semiconductor company's next-generation ICs
• Accent Closes 5 Million Euro In Series B Funding To Expand Smart Grid Technology Offering
• Sonics Teams With Chinese Systems Innovator to Deliver High-Performance, Low Power Laptop, Tablet SoCs
• Lattice Announces Update to ispLEVER FPGA Design Tool Suite
• New Lattice "Platform Manager" Transforms Board Power and Digital Management
• Cosmic Circuits receives TSMC's "Analog/Mixed Signal IP Partner of the Year" Award
• Lattice Semiconductor Appoints Darin Billerbeck President and CEO

Headlines for Monday Oct. 11, 2010

Top Story

Evatronix Receives USB-IF Certification for Its SuperSpeed USB 3.0 Device IP Core

Evatronix SA, announces today its high performance SuperSpeed USB 3.0 Device Controller IP core has been officially certified by USB-Implementers ForumF, the organization behind the USB standards, as fully compatible with the latest version of the SuperSpeed USB 3.0 specification.

• Jungo and Renesas Electronics America partner on USB for SuperH MPUs
• Sonics Joins TSMC's Soft IP Alliance Program
• C-Compiler Support Now Available for LatticeMico8 Microcontroller
• ARM and SMIC Extend Comprehensive Product Portfolio of Free Libraries of Physical IP to 65nm and 40nm LL Process Technology
• TowerJazz and Crocus Complete First Stage Integration of TAS MRAM into 130nm CMOS Platform
• NXP Introduces New Energy Metering Chip
• SMIC CEO: China foundry vendor back on track
• Vivante Joins TSMC IP Alliance Program
• MIPS Technologies Joins TSMC IP Alliance to Speed Customers' Time-to-Market

Headlines for Friday Oct. 08, 2010

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intoPIX delivers its high performance 4K JPEG 2000 decoder to Sony Corporation

intoPIX today announced that Sony has licensed and integrated the intoPIX 4K JPEG2000 decoder into the 4K SXRD digital cinema system. With its smart single chip FPGA implementation, impressive performance and quality, the 4K decoder offers a unique solution, making it the technology of choice for the digital cinema industry.

• Dolphin Integration releases the evaluation kit for benchmarking at once Libraries and Memories
• TSMC September 2010 Sales Report

Headlines for Thursday Oct. 07, 2010

• Ensphere Leverages TowerJazz's 0.18-micron SiGe BiCMOS Process to Achieve Fully Integrated One Chip Optical Transceiver IC
• EnSilica and Pebble Bay collaborate to target automotive electronics design
• Atego Ships its first Multi-core Virtual Machine for ARM Processors

Headlines for Wednesday Oct. 06, 2010

Top Story

Semiconductor Intellectual Property Market Consolidating, Not Weakening

The SIP market is undergoing a round of consolidation with the number of companies shrinking approximately 50% by 2010 compared to 2000. However, this is not a sign of a weakening market, but rather of the market sorting itself out with strong contenders consolidating their positions. Semico projects this market to continue to grow, exhibiting a CAGR of 12.6% from 2010 - 2015.

• MindTree Unveils IP Suite to Target Bluetooth Low Energy Market
• LSI Accelerates Innovation with 28nm Custom Silicon Platform
• Qualcore Successfully validates USB 2.0 PHY in TSMC 90nm Technology
• First look inside iPhone 4 reveals high reuse
• 4M Wireless Completes LTE Protocol Stack Software Port For Tensilica's 3GPP LTE Reference Architecture
• eASIC Enables Early Rollout of On-Ramp Wireless' eNODE Solutions
• Sundance First to Combine FPGA and Power-PC440 with PCI Express for PC/104

Headlines for Tuesday Oct. 05, 2010

Top Story

Xilinx ISE Design Suite 12.3 Introduces AMBA 4 AXI4 IP Cores, Enhances PlanAhead Design and Analysis Cockpit, Extends Power Optimization

Xilinx today announced the release of ISE(R) Design Suite 12.3, kicking-off the FPGA leader's roll-out of Intellectual Property (IP) cores that meet the AMBA(R) 4 AXI4(TM) specification for interconnecting functional blocks in System-on-Chip (SoC) design, as well as introducing productivity enhancements to the PlanAhead(TM) Design and Analysis cockpit, and Intelligent Clock Gating support for reducing dynamic power consumption in Spartan(R)-6 FPGA designs.

• Elliptic Partners With Carbon Design Systems To Create Accurate System-Level Models
• Adesto Technologies Corporation Acquires Key Qimonda CBRAM Memory IP and Patents
• TSMC Expands IP Alliance to Include Soft IP
• WiLAN Initiates Litigation
• NetLogic Microsystems licenses Imagination Technologies' visual IP technologies
• Microsemi CEO would kill some Actel products
• Why the Microsemi-Actel deal makes complete sense
• Moore Microprocessor Portfolio (MMP) Inventor Files Lawsuit against TPL Group
• LSI Introduces Its First Standard Product System-on-a-Chip for Hard Disk Drive Manufacturers
• Appareo Systems Chooses Tuxera NTFS for Flight Data Monitoring Device

Headlines for Monday Oct. 04, 2010

Top Story

Microsemi Corporation to Acquire Actel

Microsemi announced today that it has entered into a definitive agreement to acquire Actel for $20.88 per share through a cash tender offer. The total transaction value is approximately $430 million, net of Actel’s projected cash balance at closing.

• Silicon Image Unveils First MHL Products
• MOSAID Signs Wireless Patent License Agreement With a Top-Ranked Semiconductor Supplier
• Microelectronics Technology Inc. and RadioComp ApS Sign Equity and Intellectual Property Acquisition Agreements

Headlines for Friday Oct. 01, 2010

• A dynamic adaptation of libraries to performance with Dolphin Integration's mixing of standard cells stems
• OptNgn Delivers 2D-FFT FPGA Library Elements for use in Imaging and DSP applications
• SiliconBlue's New Paradigm Breaks Through the Volume Barrier
• CEA-Leti Makes a R&D 20nm Fully Depleted SOI Process available through CMP
• Acacia Subsidiary Enters into Settlement Agreement with Hynix
• TSMC gets nod for 130-nm production in China