D&R Headline News (January 2011)

Headlines for Monday Jan. 31, 2011

Top Story

ARM Expands Unmatched Real-Time Cortex Processor Portfolio for Use in Mobile Baseband, Mass Storage and Automotive Applications

ARM today announced the launch of the ARM® Cortex™-R5 MPCore™ and the Cortex-R7 MPCore processors for use in 3G and 4G mobile baseband, mass storage, automotive and industrial markets.

• Intel finds design error in chip
• Kilopass Announces Record Revenue in 2010
• Synopsys Galaxy Implementation Platform Addresses Gigascale Design
• Cadence Drives Giga-gate/Gigahertz Design at 28nm with New Digital End-to-end Flow
• Xilinx Acquires AutoESL to Enable Designer Productivity and Innovation With FPGAs and Extensible Processing Platform
• CEVA, Inc. Announces Record Fourth Quarter and Year End 2010 Financial Results
• Shipment Volumes of CEVA DSP-powered Cellular Baseband Processors Surpass Qualcomm, Texas Instruments and Mediatek
• Arasan Chip Systems appoints Director of Analog and Mixed Signal
• ParadigmWorks Releases VerificationWorks for UVM, Enabling Faster Verification Project Rampup
• Fujitsu Signs Multi-Year Corporate License for Tensilica's Audio, Baseband DSP and Dataplane Processor IP Cores
• Sankalp Opens a New Hybrid Center
• Mentor Graphics Questa Functional Verification Platform Selected by Cypress Semiconductor
• Rambus Achieves Breakthroughs in Memory Signaling
• Apache Design Solutions Releases Next Generation Chip Power Model for Broader Range of Applications

Headlines for Friday Jan. 28, 2011

Top Story

Accellera Approves New Version of Electronic Design System Modeling Standard

Accellera announced today that its Board of Directors approved a new version of Accellera's Standard Co-Emulation Modeling Interface (SCE-MI) specification as a new Accellera verification standard.

• Sofics, ICsense Merge ESD and I/O Technologies, Deliver 3.3V Signalling on Icera's 40nm, 1.8V I/O Baseband Chip
• Motorola and WiLAN Settle Litigation
• Rambus Reports Fourth Quarter And Record Full Year Financial Results
• Rambus and Panasonic Sign Patent License Agreement
• Microsemi Announces High-Level Synthesis Support from Synopsys
• TSMC Reports Fourth Quarter EPS of NT$1.57
• Spreadtrum and TSMC Achieve 3G TD-SCDMA Baseband Processor Milestone
• Cortus presents their range of embedded processors at DesignCon2011 with Avant Technology

Headlines for Thursday Jan. 27, 2011

Top Story

Arasan Chip Systems offers a Complete Solution for UFS IP

Arasan announced that it has been developing the Universal Flash Storage (UFS) IP core, a next generation memory interface being finalized by JEDEC. Arasan has engaged with its strategic lead customers to help them productize this interface.

• USPTO Affirms Kilopass Ownership of The 1T Anti-Fuse Memory Bit Cell
• Magillem promotes IP Reuse, interoperability through IEEE 1685 and launches its IP-XACT Checkers Suite Software and Compliance Lab
• Jasper ActiveProp Automates Assertion-Based Verification for SoC Design
• Four-core ARM A9 to run Sony game console
• Dongbu HiTek licenses EnSilica's eSi-RISC processor cores
• Avnet Electronics Marketing Releases the Nano-ITX/Spartan-6 FPGA Development Kit based on the Intel Atom Processor E640
• EVE Enhances Emulation Platform With Superior Debugging Capabilities

Headlines for Wednesday Jan. 26, 2011

Top Story

Synopsys' DesignWare DDR PHY Compiler Eases Integration of Memory Interface IP

Synopsys today announced the immediate availability of the DesignWare® DDR PHY compiler, supporting DDR2, DDR3, LPDDR and LPDDR2 SDRAMs. The DesignWare DDR PHY compiler offers designers a web-based GUI to assemble a customized, high-performance DDR PHY for their SoCs.

• Sidense Granted all Claims by USPTO in Key Patent Dispute
• CSR Licenses Advanced ARM Cortex Multiprocessor Technology
• Pixelworks Again Chooses Arteris for Network-On-Chip (NoC) Interconnect Fabric IP
• CAST adds H.264 Main Profile Video Encoder Core to Compression IP Family
• MIPS Technologies' Second Quarter Revenue Grows 44% Year-to-Year
• Altera Announces Record Fourth Quarter Results

Headlines for Tuesday Jan. 25, 2011

Top Story

Hewlett Packard licenses Arasan Chip System's SuperSpeed USB 3.0 Controller IP core

Arasan Chip Systems announced that Hewlett Packard has licensed Arasan’s SuperSpeed USB3.0 Controller IP core for next generation products.

• 450-mm fab schedule slips
• Dolphin Integration Announces their Annual Results for the Fiscal Year Ended on September 30, 2010
• Chips&Media to establish R&D center in China

Headlines for Monday Jan. 24, 2011

Top Story

Altera Unveils 28-nm Device Portfolio Tailored to Customers' Diverse Design Requirements

Altera today announced its portfolio of 28-nm devices. Altera is providing customers clearly differentiated solutions across the new Cyclone® V and Arria® V FPGA families, the recently expanded Stratix® V FPGA and previously announced HardCopy® V ASIC families.

• Azini Capital Acquires OneSpin Solutions
• Palmchip Targets Smart Grid Power Management with its new AcurX51 SoC Platform and Palm8051 Core
• Avery Design Systems Enhances USB Solution for xHCI and UASP
• Rambus Acquires Patented Innovations and Technology from Imagine Designs
• A New Open-Source Toolchain to Facilitate Configurable IP Core Packaging
• Nordic Semiconductor launches its first μBlue chip - the industry's lowest power complete Bluetooth low energy solution
• True Circuits PLLs Used by ARM in Verification of Cortex-A9 Microprocessor Cores
• Avery Design Systems Synthesizes Microarchitecture-Level Assertions and Coverage Properties
• Avery Design Systems Performs RTL At-Speed DFT Testability Analysis
• Huawei Files Lawsuit Against Motorola for IP Infringement
• Ensphere Solutions Announced the Availability of a New 10G Transceiver and Low Power Laser Diode Shunt Driver ICs Targeting 10G Optical Modules

Headlines for Friday Jan. 21, 2011

• Five IC makers join $3B 'capex club'
• Gartner Says Top 10 Original Equipment Manufacturers Accounted for $104.3 Billion of Semiconductor Demand in 2010
• Presto Engineering Receives Funding To Fuel Growth To Service the Worldwide Semiconductor Industry
• Novocell Semiconductor, Inc,. set to exhibit at DesignCon February 1-2, 2011.
• Elliptic Launches Security Processing Engine For 4G Wireless Markets
• Sankalp Semiconductor Pvt. Ltd. Gets a New State-of-the-art HQ

Headlines for Thursday Jan. 20, 2011

Top Story

Analyst: TSMC to boost capex

Don't look now, but Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is expected to boost its capital spending for 2011.

• UMC Produces Customer CMOS-MEMS Sensor Products
• Broadcom and WiLAN Reach Agreement to End Litigations
• Xilinx Announces Third Quarter Fiscal 2011 Results
• Atheros and WiLAN Reach Agreement to End Litigations

Headlines for Tuesday Jan. 18, 2011

Top Story

IBM and ARM to Collaborate on Advanced Semiconductor Technology for Mobile Electronics

ARM and IBM today announced an agreement between the two companies to extend their collaboration on advanced semiconductor technologies. The resulting technology will provide a suite of optimized physical and processor IP by ARM tuned to IBM’s advanced manufacturing process down to 14nm.

• Sidense Memory IP Qualified at Three GLOBALFOUNDRIES Processes
• Realtek Semiconductor Licenses Wide Range of Processors from MIPS Technologies
• Elliptic Technologies To Exhibit With Freescale At RSA Conference
• Mentor Graphics Completes Test Chip with IC Implementation Flow for Common Platform 32/28nm Technology
• Cadence Introduces 32/28-Nanometer Low-Power RTL-to-GDSII Silicon Realization Reference Flow for Common Platform Alliance

Headlines for Monday Jan. 17, 2011

Top Story

Cosmic Circuits announces portfolio of Analog-to-Digital Converter IP-cores for Monitoring Applications across multiple process nodes

Cosmic Circuits today announced its portfolio of over 30 Analog to Digital Converters for Monitoring applications. The Analog to Digital Converter cores typically used for Monitoring Applications are available at 8 - 12 bits of resolutions and speeds from 200KSPS to 20MSPS.

• Synopsys Announces Production-Ready Lynx Design System Optimized for Common Platform 28-nm High-K Metal Gate Technology
• First IP provider to deliver PLL products on new 28nm low power Common Platform process
• x86 and MIPS Applications Processors to Challenge ARM’s Smartphone Market Share, According to ABI Research
• Despite skeptics, Intel keeps rolling
• Intel and WiLAN Reach Agreement to End Litigations
• Alvand Technologies announced that it has appointed John Patterson as Director of Sales & Marketing
• Magma Delivers Hierarchical Reference Flow for the Common Platform Alliance's 32/28-nm Low-Power Process Technology

Headlines for Friday Jan. 14, 2011

• Dolphin Integration announce availability of their 6-Track Standard Cell Library SESAME HD for the 65 nm LP process
• NVIDIA and TSMC Ship One-Billionth GeForce Graphics Processor
• Kaben Wireless Silicon Celebrates its 10 Year Anniversary
• TSMC First Pure-Play Foundry to Join Top-10 R&D Spenders

Headlines for Thursday Jan. 13, 2011

• Seven growth opportunities for the chip industry during market upturn
• Analyst: Intel missed mobile boat
• IBM and Samsung Announce Joint Research into New Semiconductor Technology
• Renesas Electronics Introduces New SoC that Enables Industry-Leading 16-Megapixel Still Image and High-Speed Continuous Shooting for Mobile Phones
• MPEG LA Announces Call for Patents Essential to Multiview Video Codec (MVC)
• GLOBALFOUNDRIES Unveils Industry's First 28nm Signoff-Ready Digital Design Flows
• Praesum Communications Introduces Serial RapidIO 2.1 Endpoint IP
• Icera Secures $12 Million Debt Facility With Silicon Valley Bank

Headlines for Wednesday Jan. 12, 2011

Top Story

CEVA's New DSP Core Delivers Highest Audio Performance, User Flexibility, and Broad Codec Support

CEVA today announced the latest addition to its CEVA-TeakLite-III DSP architecture. The CEVA-TL3211 is an advanced DSP targeting the growing needs of low cost smartphones and high-definition (HD) audio features within digital televisions (DTV), set-top-boxes (STB), and Blu-ray Disc players.

• Foundry capacity glut seen in '11
• Synopsys Announces Android Operating System Support for DesignWare ARC Processor Cores
• CEVA Announces Availability of Dolby HD Audio Codec Suite for the CEVA-TeakLite-III DSP
• CEVA-TeakLite-III DSP Receives DTS-HD Master Audio Logo Certification

Headlines for Tuesday Jan. 11, 2011

Top Story

MoSys Announces First Shipment and Sample Availability of its Bandwidth Engine IC

MoSys today announced sample availability and the shipment of its first Bandwidth Engine® integrated circuit (IC) devices in December 2010.

• Ittiam introduces Android-based HD video conferencing on Texas Instruments OMAP 4 platform
• Global System-On-a-Chip (SoC) Market to Reach US$39.4 Billion by 2015, According to New Report by Global Industry Analysts, Inc.
• Legend Design Technology, Inc. will Represent IP Cores, Inc. in Taiwan
• Faraday Announces High-Performance IQ ADC/DAC IP Solutions for Wireless Communications in 55nm
• Mazda Adopts Synopsys' Virtual Prototyping Solution for Electronic Control Unit Verification
• Arteris Is a Finalist for the 2010 Red Herring 100 Global Award
• Trident Microsystems Licenses to MSTAR Semiconductors Certain MEMC Patents

Headlines for Monday Jan. 10, 2011

Top Story

SMSC to Acquire Conexant Systems, Inc.

SMSC and Conexant Systems today announced the signing of a definitive agreement under which SMSC will purchase all of the outstanding shares of Conexant in a stock and cash transaction valued at approximately $284 million including the assumption of Conexant's net debt.

• Intel to Pay NVIDIA Technology Licensing Fees of $1.5 Billion
• AMD Appoints Thomas Seifert as Interim CEO; Dirk Meyer Resigns in Mutual Agreement with Board of Directors
• 7 New Pre-Engineered Prototype Ready Accessories Released for S2C's Rapid SoC Prototyping Solution
• Synopsys Speeds Equivalence Checking by 2X at Nuvoton
• Cadence Boosts Verification Productivity for Complex FPGA/ASIC Design
• EVE Grows Revenue Over 50%, Sees Double-Digit Profits, Increases Market Share in 2010
• WSTS cuts $1 billion in chips sales, says Cowan
• TSMC December 2010 Sales Report
• SpringSoft's Certitude Functional Qualification System Deployed by Fujitsu Semiconductor to Further Improve Verification Quality of Automotive Microcontroller
• Analyst: Intel to break ARM

Headlines for Friday Jan. 07, 2011

Top Story

Windows on ARM: It's a whole new ballgame

Mark January 5, 2011 as the date of the big PC earthquake. That's when Steve Ballmer said the next version of Windows will run on ARM and Jen-Hsun Huang made Nvidia the first chip maker to say it will deliver a soup-to-nuts family of ARM chips for computing.

• Kaben Wireless Silicon appoints Ian Roane as CEO
• Walden International Chairman & Founder Lip-Bu Tan joins the Cosmic Circuits Board of Directors
• Gennum Aligns Organization to Capitalize on Significant Growth Opportunities Created for High Speed Signal Integrity Products

Headlines for Thursday Jan. 06, 2011

Top Story

Microsoft Announces Support of System on a Chip Architectures From Intel, AMD, and ARM for Next Version of Windows

Microsoft Corp. today announced at 2011 International CES that the next version of Windows will support System on a Chip (SoC) architectures, including ARM-based systems from partners NVIDIA Corp., Qualcomm Inc. and Texas Instruments Inc.

• Cavium and ARM Strengthen Partnership to Develop Next Generation Multi-Core SoCs for Consumer and Broadband Networking Applications
• NVIDIA Announces "Project Denver" to Build Custom CPU Cores Based on ARM Architecture, Targeting Personal Computers to Supercomputers
• Synopsys' New DesignWare Sonic Focus IP Solutions Deliver Exceptional Sound Through Standard Speakers
• D2 Technologies Collaborates with Freescale on Android-based Reference Design with HD Video Call Capability
• Xilinx Consumer Video Kit Drives Innovation for 3DTV and Other Digital Displays with More Bandwidth and Standards Support
• RivieraWaves licensed Bluetooth low energy IP to Renesas Electronics
• Genesys Logic Showcases USB 3.0 Family of Products at CES 2011
• SMSC Introduces Industry's Most Complete Digital Wireless Audio Processor With Tri-Band Support and Embedded Multi-Channel USB 2.0 Audio Controller
• CriticalBlue releases optimized support within Prism for the 2nd generation Intel Core processor family

Headlines for Wednesday Jan. 05, 2011

Top Story

MIPS Technologies Continues Digital Home Leadership with New SmartCE Platform

MIPS Technologies today unveiled the new SmartCE (Connected Entertainment) platform. The SmartCE platform integrates Android, Adobe® Flash® Platform for TV, Skype, the Home Jinni ConnecTV application, social media and other key technologies to provide a truly connected consumer experience on home entertainment devices such as digital televisions, set-top boxes and Blu-ray players.

• Qualcomm to Acquire Atheros, Leader in Connectivity & Networking Solutions
• TranSwitch to Demonstrate the Industry's Most Advanced IP Core Solutions for High Definition Video at 2011 International CES
• Leading DTV IC Supplier MStar Semiconductor Licenses New Processor Cores from MIPS Technologies
• NDS Partners with ARM to Enable OTT Delivery on Connected TVs
• Wolfson licenses Oxford Digital's TinyCore DSP
• Semico's Analysts Make Predictions on 2011
• Vivante Opens Second R&D Facility in China
• Arasan Chip Systems Demonstrates USB 3.0 IP at CES
• Tensilica's Dominant Market Share in Audio DSP IP Cores in Evidence at CES 2011 in Las Vegas

Headlines for Tuesday Jan. 04, 2011

Top Story

ITC backs Rambus with 34-company probe

The United States International Trade Commission has announced that it will launch an investigation into various chips and memory controllers and products that contain them, including PC motherboards, modems, routers and computers, following a complaint filed by Rambus Inc.

• Altera's Stratix IV GT FPGA Successfully Passes Ethernet Alliance's HSE Interoperability Test Targeting 100-Gigabit Ethernet Systems
• Broadcom Delivers Nine New 40nm Set-Top Box Solutions for the Full Resolution 3DTV Internet Connected Home
• DOVADO Integrates Tuxera NTFS Into its 3G/4G Routers
• SoftJin announces Universal TV Encoder IP
• Ingenic Semiconductor Licenses MIPS32 Architecture for Mobile Devices
• First MIPS-Based Smartphones and Tablets Debut
• N-trig attains success in mass production using custom ASIC from Cosmic Circuits
• Powerchip Standardizes on SpringSoft's Laker Custom IC Layout for Design of High-Density Memory Chips
• 1,000 processors on a Xilinx FPGA
• WiSpry Announces Support for MIPI Alliance Newly Released RFFE 1.0 Standard for Front-End Control
• Silicon Hive Introduces Next Generation Scalable Solution for High-Performance Multi-Format Video Decoding
• Jungo announces USBware support for USB 3.0

Headlines for Monday Jan. 03, 2011

Top Story

Trilinear Technologies Expands IP Core Portfolio With DisplayPort Transmitter and Receiver Link Controllers

Trilinear Technologies, Inc., announced the addition of two new DisplayPort link controller cores to its product portfolio. The Trilinear VF-111T DisplayPort Transmitter core and VF-117R DisplayPort Receiver core support the Video Electronic Standards Association (VESA) DisplayPort 1.1a standard and are available for implementation in FPGA or ASIC devices.

• Sigma Designs Launches First Studio-Grade Set Top Box SoC
• Blackfire Research & Cavium Networks Partner to Deliver SuperStreamHD Solutions for Next Generation Networked Media Systems
• Tower to Receive NIS 150 Million Non-Refundable Cash Grants from the Israeli Investment Center, a Governmental Agency
• Leading IPTV provider Free deploys Movea's MotionIC in next generation remote controls