D&R Headline News (February 2012)

Headlines for Wednesday Feb. 29, 2012

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Synopsys Introduces Industry's First 28-nm Multi-Gear MIPI Alliance M-PHY IP Supporting Six Standards for Mobile Applications

Synopsys today announced availability of a new DesignWare® MIPI M-PHY IP solution supporting multiple speed gears and a broad range of high-speed interfaces for mobile applications.

• SENSIO and Samsung Electronics reach a patent license agreement over SENSIO S2D Switch
• Alvand Technologies Offers Silicon Proven ADC / DAC IP in GLOBALFOUNDRIES 40nm Process
• Synopsys and Arteris Develop IP Solution to Reduce Mobile Phone Memory Costs
• Ramtron and Revere Security Join Forces to Enable Secure and Energy Efficient F-RAM Semiconductor Devices
• Arteris Unveils FlexLLI MIPI Alliance Low Latency Interface (MIPI LLI) IP to Reduce Mobile Phone Cost
• Lattice Semiconductor, Helion Demonstrate 3D Video Camera Based on LatticeECP3 FPGA
• Agnisys Offers Free Register Generator for UVM
• LSI Sampling Industry's First 28nm System-on-a-Chip to Accelerate Delivery of Higher-Capacity Hard Disk Drives
• Silicon Labs Launches Industry's Most Flexible and Developer-Friendly 32-Bit Mixed-Signal MCUs

Headlines for Tuesday Feb. 28, 2012

• GLOBALFOUNDRIES Adds New Chief Procurement Officer
• Lattice Announces Support For Recently Released MIPI BIF Standard
• MIPS Technologies and SAI Technologies Demonstrate Performance Benefits of Multi-Threading for LTE Systems
• Xilinx Unveils Linux OS-Based Asymmetric Multi-Processing Solution Supporting Zynq-7000 EPP at Embedded World 2012
• ARM Enables Energy-Aware Coding with the ARM Energy Probe and DS-5 Toolchain
• Cortus Announces FPS6 32 bit Floating Point Microcontroller IP Core for High Performance Control and Signal Processing Applications
• Harold Hughes to Retire as Rambus Chief Executive Officer
• ARM Extends CMSIS with RTOS API and System View Description
• Imagination Technologies: PowerVR graphics driving mass market smartphone graphics adoption

Headlines for Monday Feb. 27, 2012

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Synopsys Unveils Next-Generation Verification IP for Faster SoC Verification

Synopsys today unveiled its Discovery™ Verification IP (VIP) family based on the new VIPER architecture. Written entirely in SystemVerilog with native support for the UVM, VMM and OVM methodologies, Discovery VIP provides inherent performance, ease-of-use and extensibility to speed and simplify verification of the most complex system-on-chip (SoC) designs.

• Cadence Announces Production Release of Virtual Platform for Xilinx Zynq-7000 Extensible Processing Platform
• Altera Selects Symmetricom as its Synchronization Technology Partner
• Entropic Communications Selected to Acquire Trident Set-Top Box System-on-a-Chip Assets and Intellectual Property
• Silicon Image GameChanger 60 GHz WirelessHD Reference Designs for Mobile Products Now Available
• Calypto Delivers Bus Interface Libraries to Easily Connect High Level Synthesis Models to ARM Platform
• SpringSoft and Synopsys Link Debug Technologies to Speed Protocol Verification for SoC Designs
• SMIC and Brite Semiconductor Tape Out Low Leakage 40nm Test Chip Based on a Dual-Core ARM Cortex-A9 Processor
• Rockchip Licenses a Wide Range of ARM IP for Turnkey Solution Targeting Mass Market, Cost-Effective Android Tablets
• Spreadtrum Licenses CEVA-XC DSP for LTE Baseband
• RivieraWaves Adds 802.11n and 802.11ac Silicon IP to Portfolio
• Posedge Announces NVM Express Compliant Flash Controller IP Core
• Opera Mobile Comes to MIPS-Based Android Tablets
• Intel's Ivy Bridge delayed says senior executive
• Strong Industry Momentum Builds For AMBA 4 Coherency Extensions
• Tensilica HiFi Audio DSP Supports Dolby Digital Plus for Surround Sound on Mobile Devices
• Xilinx 7 Series FPGAs Highlight Industry 100G Technology Leadership in Optical and Wired OTN Solutions at OFC 2012
• Infineon's New ORIGA 2 Authentication Chip with MIPI BIF Standard Interface Protects Mobile Device Users Better Against Counterfeit Components
• Broadcom Introduces New Platforms Optimized for Android 'Ice Cream Sandwich' Smartphones
• eASIC Surpasses 3 Million Chips Shipped and is set to Double This in 2012
• Coupled VPU and GPU technologies ideal for next-gen mobile multimedia applications says Imagination
• Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium
• Xamarin Adding Support for MIPS Architecture to Popular Mono for Android Application Development Platform

Headlines for Friday Feb. 24, 2012

• MoSys Appoints John Monson as Vice President of Marketing
• Arkamys Audio Enhancement Software and Services Being Ported To Tensilica's HiFi Audio DSPs
• Renesas Mobile Partners with NVIDIA to Deliver Next-Generation LTE Ultraphones
• North American Semiconductor Equipment Industry Posts January 2012 Book-to-Bill Ratio of 0.95

Headlines for Thursday Feb. 23, 2012

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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

VeriSilicon announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles.

• First 28nm ARM Cortex-A9 Processor Optimization Pack now Available for GLOBALFOUNDRIES 28nm-SLP HKMG Process
• Movea Launches Industry's First Motion Processing IP Cores designed for mobile devices
• MediaTek and ARM Extend Relationship with Access Agreement for a Broad Range of the Latest ARM IP
• Magma's Madhavan won't join Synopsys
• Will Nvidia have more success with Windows 8 than Android?
• MPEG LA Offers MVC Patent Portfolio License
• Chips&Media shows Next Generation of Video Processing Technologies at MWC 2012
• InterDigital and Sierra Wireless Expand Worldwide Patent License Agreement to Cover 4G Standards
• Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers
• Digital Core Design: World's fastest 80C51 CPU @ CeBIT
• Sensory and Tensilica Partner to Offer Complete Speech Recognition Subsystem

Headlines for Wednesday Feb. 22, 2012

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Altera Demonstrates First FPGAs to Interoperate with 100-Gbps Optical Module

Altera today announced it has successfully demonstrated interoperability with a 100-Gbps optical module using its 28-nm Stratix V GT FPGAs.

• Synopsys Completes Acquisition of Magma Design Automation
• Altair Semiconductor to Bring its Leading LTE Chipset to MIPS-Based Android 4.0 "Ice Cream Sandwich" Tablets from Ingenic
• Samsung positions its fab to take on TSMC
• Agilent Technologies Completes Acquisition of Accelicon Technologies' Solutions for Semiconductor Device Modeling
• TES announces the availability of the D/AVE HD Graphics Processor for Embedded Systems
• K-micro to Sample IEEE 1901 Compliant, Single Chip HD-PLC for 240Mbps High-Speed Power Line Communications
• AuthenTec Extends Content Protection Offerings with Solution Suite for HDCP
• Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products
• Accellera Systems Initiative Announces IEEE 1666 SystemC Language Standard for Electronic System-Level Design Is Available for Download at No Charge
• Tensilica's Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012

Headlines for Tuesday Feb. 21, 2012

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CEVA Unveils the CEVA-XC4000 - A Low-Power DSP Architecture Framework for the Widest Array of Advanced Wireless Standards

CEVA-XC4000 offers unparalleled, scalable performance capabilities and innovative power management to address the most demanding communication standards, including LTE-Advanced, 802.11ac and DVB-T2, on a single architecture

• Sidense 1T-OTP Helps Calibrate Aptina's Advanced Imaging Products
• Intel confirmed as foundry for second FPGA startup
• Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors
• Cadence Expands Proven Ethernet IP Offering With 40/100 Gigabit Ethernet Solution
• Cyclos Semiconductor Announces First Commercial Implementation of Resonant Clock Mesh Technology
• CEVA and Antcor Announce Low Power, Wi-Fi 802.11ac Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
• Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less than 200mW
• Cortus announces Processor IP Roadmap for Embedded System on Chip (SoC) Applications
• CEVA Introduces Low Power, Multi-Mode LTE-Advanced Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
• MIPS Technologies and Intrinsic-ID Team to add Top-level Security to Mobile Platforms
• First Tegra-Powered Smartphone Announced With NVIDIA's Icera Modem Technology
• Magillem and Green Hills Software to build a bridge and help software teams debug with MULTI IDE based on accurate automatically updated IEEE1685 compliant hardware description

Headlines for Monday Feb. 20, 2012

• Moortec Semiconductor Sign Representative Agreement with Red Shift Sales in Silicon Valley, US
• Intilop TCP Offload Engine Delivers Full TCP Offload in Less than 100 nanoseconds Using Altera's Stratix IV FPGA

Headlines for Friday Feb. 17, 2012

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PLDA Introduces QuickPCIe - PCI Express Interface IP With Enhanced DMA

PLDA today announced QuickPCIe - the industry's most advanced PCI Express interface IP solution featuring a high performance configurable DMA. QuickPCIe is a revolutionary breakthrough in IP integration, standardizing on the AMBA(R) AXI open interconnect protocol to provide a unified and scalable interface to user logic.

• Silicon Image Opens New Research & Development Center in Hyderabad, India
• Reports of Counterfeit Parts Quadruple Since 2009, Challenging US Defense Industry and National Security
• Faraday Reported 2011 Fourth Quarter Results
• Tower bids to build 300-mm wafer fab in India
• Black Sand closes $10M Series C Funding
• Magma Enables ZiiLABS to Double the Performance, Cut Power by Half on 100-Core ZMS-40 Processor

Headlines for Thursday Feb. 16, 2012

• STMicro causes financial analyst concerns
• Elliptic Extends Leadership In Security IP With DVB CSA3 Descrambler For Digital TV Broadcasting
• The new battleground for mobile processors
• IC Companies Close 49 Wafer Fabs from 2009-2011
• Gennum Reports Year End Results and Announces Dividend
• Sital's Multi-Standard PMC and cPCI HyperBoard Available for Mil-Std-1553, WB-194, H009, ARINC-429 and Other Protocols
• PTC and Tech-Clarity Unveil New Research on Developing Software-Intensive Products

Headlines for Wednesday Feb. 15, 2012

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MoSys Demonstrates Bandwidth Engine IC Interoperability with LSI SerDes

MoSys has successfully demonstrated interoperability of its Bandwidth Engine® IC with the SerDes characterization and evaluation board from LSI Corporation.

• Spin Transfer Technologies Raises $36 Million Led by Allied Minds and Invesco
• Synopsys and Arteris Enable Earlier Multicore SoC Architecture Optimization with Faster Turnaround Times
• CEVA, Dirac Partner to Offer Speaker Correction Audio Post-processing Technology for the CEVA-TeakLite-III Architecture
• MediaTek Launches MT6575 Android Platform
• VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design
• Xilinx Reaches Industry Milestone with Record-Fast 28nm Product Rollout: $1B in Design Wins, Thousands of Device Shipments in First Year of Introduction
• Renesas Mobile Introduces First Integrated LTE Triple-Mode Platform Optimised for Full-Featured, High Volume Smartphones
• Lattice Features New Products And Technologies For Embedded Design Applications
• Lattice Features Latest Mobile FPGA Platforms At Mobile World Congress

Headlines for Tuesday Feb. 14, 2012

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Synopsys Announces Industry's First HDMI 1.4 PHY IP in 28-nanometer Processes for Multiple Foundries

Synopsys today announced the immediate availability of DesignWare® HDMI (High-Definition Multimedia Interface) 1.4 PHY IP in advanced 28-nanometer (nm) processes for multiple leading foundries.

• NXP Releases World's First Dual Supply Voltage ARM Cortex-M0 Microcontrollers
• Synopsys Announces DesignWare Embedded Memories and Logic Libraries for TSMC 28-nanometer Processes
• NXP Semiconductors Announces New Refinancing
• mimoOn and Tensilica Offer Complete LTE PHY Reference Platform for User Equipment and eNodeB PHY at Mobile World Congress 2012

Headlines for Monday Feb. 13, 2012

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VeriSilicon Licenses ZSP G3 Cores to Marvell

VeriSilicon announced a licensing agreement for ZSP G3 cores with Marvell . The agreement includes the Dual-MAC ZSP800M and ZSP880M synthesizable DSP cores which are area and power optimized for efficient mobile application and digital entertainment platform solutions.

• Lattice Ships More Than 20 Million Programmable Mixed Signal Products
• Icom License CEVA DSP for Wireless Baseband Applications
• Acoustic Technologies Noise Reduction and Echo Cancellation Software Now Available on Maxim's MAX98095 Based on Tensilica's HiFi Audio/Voice DSPs
• Apple claims Motorola misusing Qualcomm license
• Imagination technologies to see big royalty uptick
• Japanese Ministry of Economy, Trade and Industry has Approved Grants to TowerJazz for its Cap-Ex Investment Plan

Headlines for Friday Feb. 10, 2012

• TSMC January 2012 Sales Report
• Latest Linaro GCC Toolchain Release Supports Full Range of ARM Cortex-A Processors
• Analyst: UMC 28-nm roll out beating expectations
• Microsoft: Windows 8 on ARM to be 'no-compromise' experience

Headlines for Thursday Feb. 09, 2012

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Evatronix Strengthens its Multimedia IP Portfolio with a Complete Series of MIPI SLIMbus Products

Evatronix SA introduced today the complete series of Mobile Industry Processor Interface (MIPI) Alliance SLIMbus IP cores that implement next-gen serial interface for low power multimedia applications, especially mobile. The design is already proven to seamlessly operate as a key component within the SLIMbus to I2S bridge from LnK.

• Next-gen video codec hits milestone
• Mobile Communications Revenue to Rise by Double-Digit Margin in 2012
• Aliathon Ltd. Announces the immediate availability of their 100G OTN Transponder Reference Design For XILINX FPGAs.
• GUC Monthly Sales Report - January 2012
• SMIC Reports Results for the Three Months Ended December 31, 2011
• UMC to boost 2012 capex to $2 billion
• UMC Reports Sales for January 2012
• Chips&Media Partners with Solomon Systech to Build Leadership Position in Projector Market
• Intilop's CTO, K. Masood to Present "How TCP Offload Engines scale up the TCP traffic bandwidth by up to 8x on existing Ethernet Networks", at the Ethernet Summit
• ON Semiconductor Standardizes on ClioSoft SOS Hardware Configuration Management Platform Enterprise-wide
• CSR Selects Synopsys for Advanced-Node SoC Design

Headlines for Wednesday Feb. 08, 2012

• Semiconductor Industry Posts Record-Breaking Revenues Despite 2011 Challenges
• MoSys, Inc. Reports Fourth Quarter and 2011 Financial Results
• Rambus and NVIDIA Sign Patent License Agreement
• Methodics Announces Support for Latest Release of Subversion Version Control System to Enable More Efficient IC Design
• Elliptic Technologies Partners With ADSTEC Corporation To Offer Embedded Security Solutions To The Japanese Market

Headlines for Tuesday Feb. 07, 2012

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Elliptic Unveils Innovative tVault Security Architecture For Trusted Execution Environments

Elliptic Technologies has introduced the tVault™ Security Architecture - a flagship technology that enables end-to-end security in connected devices. tVault provides robust security inside Trusted Execution Environments (TEEs) and enforces the protection of sensitive information to ensure that it is stored, processed and accessed only by authorized applications.

• Ingenic Licenses Arteris Chip-to-Chip (C2C) IP Solution for Mobile Application Processors
• Ultra High-Performance MIPS64 Architecture Powers Cavium's New Multi-Core Processors
• eSilicon Expands SerDes IP Licensing Agreement with Avago Technologies
• Kilopass XPM Non Volatile Memory IP Qualified on TowerJazz 130nm CMOS
• Zaltys ISDB-T Demodulator Core brings Digital Broadcast BER Testing Capability to Anritsu Spectrum Master and Cell Master Handheld Analyzers
• A cloudy future for AMD
• Silicon Wafer Revenues Up in 2011
• Juniper Networks Adopts Jasper Formal Technology to Mitigate Design and Verification Risk
• CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012

Headlines for Monday Feb. 06, 2012

Top Story

ARM Mulls Non-Volatile Memory IP acquisition

ARM CEO Warren East (shown) says the U.K. processor IP vendor would consider acquiring non-volatile memory IP as a way to bolster its physical IP division.

• AMD Strategy Transformation Brings Agile Delivery of Industry-Leading IP to the Market
• Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design
• Rambus Acquires Unity Semiconductor
• Sequans Communications Selects S3 Group's Power Management Solution for WiMAX / LTE System on Chip
• INSIDE Secure chosen by leading Smartphone manufacturer To Power NFC Services with a major open operating system platform

Headlines for Friday Feb. 03, 2012

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eoSemi secures $2.3 million second tranche of funding

eoSemi, the all-silicon oscillator company, has confirmed that it has secured a $2.3million (£1.5milion) second tranche of funding. All of the company’s existing investors, including NESTA Investments, Capital-E, and EV, participated in the latest round of financing.

• Nethra Imaging Introduces Ultra-Low-Power High Definition 1080p60 Visual and Computing Platform System-on-Chip
• TranSwitch Corporation Announces Fourth Quarter 2011 Financial Results
• IPextreme's Warren Savage to speak at GSA IP Summit
• Silicon Image Announces Fourth Quarter and Fiscal Year 2011 Earnings

Headlines for Thursday Feb. 02, 2012

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Sonics and Tensilica Team to Increase IP Integration, SoC Efficiencies

Sonics today announced that its advanced on-chip networks will support Tensilica’s processor interface (PIF) to maximize customers’ IP integration and SoC efficiencies.

• Keil MDK-ARM support for Freescale MQX software provides greater choice and improved flexibility for designers using Kinetis microcontrollers based on the ARM Cortex-M4 processor
• TSMC plans 3-D IC assembly launch early in 2013
• Express Logic Brings High Performance to Cortex-M4 with ThreadX RTOS and NetX Duo TCP/IP Stack
• Mali graphics to lead in smart TVs, says ARM's East
• Think Silicon GPUs get JPEG decoding from Alma Technologies
• Triad Semi Introduces Three New Via Configurable ASIC Arrays
• Qualcomm Chipset Powers First Successful VoIP-Over-LTE Call With Single Radio Voice Call Continuity
• Cadence Reports Fourth Quarter and Fiscal Year 2011 Financial Results

Headlines for Wednesday Feb. 01, 2012

Top Story

Sonics Responds to Arteris Complaint

Sonics continues to move forward with its patent infringement lawsuit filed against Arteris on November 1, 2011. Sonics has been careful, diligent and deliberate as we developed our technology and products, and we intend to remain factual and accurate in our communications with partners and customers.

• Kilopass Announces Record Revenue for the Third Straight Year
• ARM Leading Intel In Process, Architecture And Design
• ARM tips 'gods and giants' roadmap
• CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems
• Faraday and UMC Strengthen IP Alliance for Advanced Nodes
• New Integration Between SpaceStudio Hardware Software Co-design and European Space Agency’s TASTE Tool Set