D&R Headline News (August 2012)
Headlines for Friday Aug. 31, 2012
Latest News- CSR Debuts aptX Low Latency Codec for Synchronised Audio and Video
- Arteris Joins Heterogeneous Systems Architecture (HSA) Foundation, Contributing NoC Interconnect Expertise
Headlines for Thursday Aug. 30, 2012
PLDA Announces XpressV7LP Low Profile PCIe FPGA Design Kit, Based on Xilinx Virtex-7 FPGA
The PLDA XpressV7-LP provides an FPGA-based low-profile PCI Express form factor card, incorporating 40Gb of Ethernet connectivity and 8 GBytes of DDR3 SDRAM. It is delivered with PLDA’s leading PCIe 3.0 IP and optional 10G UDP/TCP stack IP, specifically optimized for the Xilinx Virtex-7 FPGA.- Sonics Joins HSA Foundation to Help Drive Open Standard for Next-Generation Heterogeneous Computing
- SMIC Interim Results: Double-Digit Growth in First Two Quarters
- intoPIX announces the release of the World First JPEG 2000 UHDTV 4K & 8K codecs integrated in a single chip 28nm FPGA
- AMD Appoints eSilicon's Harding to board
Headlines for Wednesday Aug. 29, 2012
Evatronix and M31 Tech Introduce a USB-IF Certified Complete SuperSpeed USB 3.0 IP Solution
Evatronix and M31 Tech to offer a complete USB 3.0 solution with a digital IP controller, analog PHY and supporting software stacks and classes.- S3 Group Licenses DAC to Aptina
- Report: TSMC rebuffs Apple, Qualcomm
- Open-Silicon Announces Availability of Ethernet IP Co-developed with CoMira Solutions
- Denso Gains Significant Productivity and Quality-of-Results Advantages with Cadence Mixed-Signal, Low-Power Solutions
- Silicon Image Announces Approved Module Program for 60GHz WirelessHD Products Targeting Consumer Video Applications
- ItoM Successfully Concludes Patent Litigation With Qualcomm, Broadcom, and Others
Headlines for Tuesday Aug. 28, 2012
Latest News- ARM and Synopsys Expand Collaboration to Optimize Power and Performance, and Accelerate Design and Verification for ARM Technology-based SoCs
- IHS Downgrades Semiconductor Market Outlook - Revenue Decline Now Expected for 2012
- Altera Previews Productivity Benefits of OpenCL for FPGAs Through Early Access Program
- Xilinx Acquires Embedded Linux Solutions Provider PetaLogix
- Acacia Subsidiary Enters into Settlement Agreement with Fujitsu Semiconductor America, Inc. and Fujitsu Semiconductor Limited
- GLOBALFOUNDRIES Adds New Vice President of Product Marketing
- Tensilica HiFi Audio/Voice DSP Licensed to Renesas Electronics
- Recore Systems presents reliable data processor for space mission
- Agilent Technologies Introduces First Fully Integrated PCI Express 3.0 Receiver Test Software
Headlines for Monday Aug. 27, 2012
After Apple win, Droids should feel afraid
The Android community should be very afraid in the wake of Apple’s clear win Friday in its case against Samsung in San Jose’s federal court.- Lattice Announces Promotional Pricing For iCEblink40 Evaluation Kits
- Cosmic Circuits announces aggressive hiring plans
Headlines for Friday Aug. 24, 2012
Dolphin Integration breaks the 80251 speed records with 16-bit Tornado
The Flip80251 Tornado is accelerated 67 times from the i80C51 and by 5.3 times from the i80C251, running the Dhrystone V2.1 / 10,000 loops.Headlines for Thursday Aug. 23, 2012
Qualcomm Acquires Small Cell Pioneer DesignArt Networks
Qualcomm today announced it has acquired DesignArt Networks, a leader in small cell modem and system design for cellular base stations and high-speed wireless backhaul infrastructure.- European and Japanese Chip Suppliers Hit Hardest by Weak Q2 Semiconductor Market Growth
- Digital Core Design announces new version of its on Chip Debugger
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2012
- Rambus Announces Restructuring
- UMC to shutter Japanese fab
Headlines for Wednesday Aug. 22, 2012
Intel Corporation Signs $20 Million Multi-Year License Agreement for Sonics System IP for SoC Platform Initiatives
Sonics today announced that Intel has licensed key IP components from Sonics portfolio of system IP for use in its SoC platforms -- which incorporate the Intel® Atom™ processor. Intel will work with Sonics to rapidly, intelligently and securely integrate a wide array of third party IP onto its SoC platform.- Adapteva Delivering on Vision of the Future of Parallel Computing
- Adapteva Announces Availability of OpenCL SDK for Epiphany Multicore Architecture
- SENSIO technologies, including award-winning SENSIO Hi Fi 3D, to be integrated in Hisense 3DTVs
- intoPIX JPEG2000 encoding technology integrated in the new CineMaster-Pro DCP creator produced by LEONIS Cinema
- Avery Design Systems Announces SCSI Express (SOP/PQI) Verification IP Solution
- Ambarella Files Registration Statement for Proposed Initial Public Offering
- Globalfoundries expected to pass UMC in foundry sales
- IDT Introduces Industry's First NVM Express Enterprise Flash Controller
- Tehuti Networks Selects Kilopass Non-Volatile Memory IP For its Newest TN4010 Single-Port 10GbE Controller
- EVE Will Continue to Defend Itself Against Mentor Graphics' Patent Infringement Suits
Headlines for Tuesday Aug. 21, 2012
Arasan Chip Systems Announces the Industry Fastest SD3.0 Compliant Hardware Validation Platform
Arasan announced today the availability of the industry fastest SD 3.0 compliant hardware validation platform for engineering and product development of SD 3.0 devices with UHS-I interface.- AuthenTec Unveils First Military-grade Encryption Offering for Data Stored on Android Devices and Removable Storage Media
- Teledyne Lecroy and IP-Maker to showcase NVM Express functionalities at Flash Memory Summit
Headlines for Monday Aug. 20, 2012
Codethink announces high-performance power-efficient ARM server, the Baserock Slab.
Codethink, a provider of software engineering services for mobile and embedded devices, announces its first generation high-performance power-efficient ARM server, the Baserock™ Slab.- Arteris Leaps onto Inc. 500 List of America's Fastest-Growing Private Companies
- Toumaz Limited Completes acquisition of Frontier Silicon
- Vivante Joins Heterogeneous System Architecture (HSA) Foundation to Transform Next Generation Mobile and Embedded Hybrid Compute Platforms
- Mentor Graphics Files Patent Infringement Suit against EVE
- Kilopass Plans to Appeal the Summary Judgment Ruling in its Patent Infringement Case Against Sidense
- Evatronix Releases the First Semiconductor-themed Android/iOS Game
Headlines for Friday Aug. 17, 2012
Sidense wins patent infringement case against Kilopass
Sidense announced today that the United States District Court for the Northern District of California granted Sidense’s motion for summary judgment of non-infringement of all three Kilopass patents asserted in the lawsuit. The Court determined that no reasonable jury could find that Sidense infringed any claim of Kilopass’ asserted patents. This is a resounding victory for Sidense and Kilopass will not be permitted to present its patent infringement claims to a jury.- IBM Plans to Acquire Texas Memory Systems
- TSMC Unveils Foundry's First 100MHz Access Speed Embedded Flash IP
- Sonics Announces New Webinar, Making Mobile SoC Device Design Easier With System IP
- Spectra7 Microsystems Closes $11 Million Oversubscribed Financing Round
- Asia-Pacific-Based OEMs Dominate Chip Spending Growth on Home Turf
- North American Semiconductor Equipment Industry Posts July 2012 Book-to-Bill Ratio of 0.87
Headlines for Thursday Aug. 16, 2012
Toshiba cancels ARM-based computer
Toshiba Corp. has cancelled plans to sell computers that run the Windows RT operating system from Microsoft Corp. and that are based on an ARM-based processor, due to delays in getting adequate supplies of components, according to reports.- Rambus Receives Federal Circuit Decision in Patent Reexamination
- IntelliProp, Inc. Announces New SATA Bridge with NCQ
- New IPC Study on North American PCB Industry Forecasts Production Growth to Resume
- Evatronix NAND Flash Controller now available with SafeFTL from HCC Embedded
- Ubiquisys Raises $19M Investment to Meet Demand for 3G/LTE/WiFi Public Small Cell Hotspots
- S3 Group Licenses Comcast Reference Design Kit, Continues to Broaden Its Portfolio to Meet the Needs of Global Operators
- Ridgetop Group Awarded DOE Contracts for High Performance Radiation-Hard Analog-to-Digital Converters (ADCs)
- MIPS Technologies Reports Fourth Quarter and Fiscal 2012 Financial Results
- IC Insights Revises U.S. Economic Outlook
- CSR Debuts First SiRFstarV Chip Optimised for Mobile Devices - Selected by LG Electronics for New Flagship Smartphone
Headlines for Tuesday Aug. 14, 2012
Creonic Announces DVB-RCS2 Turbo Decoder IP Core
Creonic today announced the availability of the world's first high-efficiency turbo decoder IP core for DVB-RCS2 for the fourth quarter of 2012. After DVB-RCS, DVB-RCS2 is the second generation DVB standard for interactive satellite systems.- Increase in Second Quarter 2012 Silicon Wafer Shipments
- TSMC Board of Directors Meeting Resolutions
- Novatek in Volume Production with Three New Home Entertainment SOCs Using Tensilica HiFi Audio DSP
Headlines for Monday Aug. 13, 2012
Xelic Announces 40G I.4/I.7 EFEC Core
Xelic announces the availability of their XCO23EFEC47 core. This core provides 40G or 4 x 10G Enhanced Forward Error Correction (EFEC) capability that is compatible with ITU-T G.975.1 Appendix I.4 and I.7 and is interoperable with other industry standard EFEC implementations.- Xilinx Board of Directors Authorizes A Repurchase Of Up To $750 Million Of The Company's Outstanding Common Stock
- Google cutting 20% of jobs at Motorola Mobility
- ARM and GLOBALFOUNDRIES Collaborate to Enable Next-Generation Devices on 20nm and FinFET Process Technologies
- Qualcomm Now Has Intel Inside
- Tower shortlisted to run Indian fab
Headlines for Friday Aug. 10, 2012
Novocell Semiconductor Announces Completion of Mil-Spec and Automotive Qualifications and Rad-Hard Tolerance for Embedded Non-Volatile Memory
Novocell Semiconductor has responded to the demands of their growing number of military, aerospace, and automotive industry customers, announcing today that their Smartbit™-based antifuse OTP memory designs have completed the rigorous exposure to long term high temperature exposure required for Military and Automotive applications, as well as survived extended exposure to radioactive Cobalt-60 necessary to establishing Rad-Hard (radiation hardened) status.- ARM continues Synopsys EDA support
- TSMC July 2012 Sales Report
- Long-Term Semiconductor Growth Rates Forecast to Improve.
Headlines for Thursday Aug. 09, 2012
Vivante Shipping GPU Cores Designed to Support the Latest OpenGL ES 3.0 Specification
Vivante announces another technology breakthrough – first GPU IP to pass OpenCL 1.1 Conformance (CTS) and now, first GPU IP vendor to ship products designed for OpenGL ES 3.0- AuthenTec Reports Second Quarter 2012 Financial Results
- ARM and Cadence Collaborate to Optimize ARM POP Solutions with Cadence Encounter Digital Platform
Headlines for Wednesday Aug. 08, 2012
Xilinx Takes its Zynq-7000 All Programmable SoC to 1 GHz
Xilinx today announced it has increased the peak processing performance of the Zynq™-7000 All Programmable SoC family to 1 GHz, and is also providing smaller form factor packaging to enable higher system performance and programmable systems integration.- SMIC Reports 2012 Second Quarter Results
- HDL Design House announces the US representative - AJTechnology
- Smartphone Applications Processor Revenue Soared 55 Percent in Q1 2012
- Reports: Wafer discounts, rush orders from MediaTek, Nvidia
- Trust in the Semico IPI: 2012 Forecasts Up 7.7%
- Mentor Embedded Extends Support for 42 Embedded Development Boards from Leading Microprocessor Companies
- UMC Reports Sales for July 2012
- Mobile DRAM Market Expands as Usage Increases in Smartphones and Tablets
- Synopsys Launches Industry's First Technical Community Site Dedicated to Users of Verification IP
Headlines for Tuesday Aug. 07, 2012
Latest News- Nitero Demonstrates First Multi-Gigabit Ultra-Low Power 60GHz Wi-Fi Solution for Mobile Devices
- DMP SMAPH-S Products to Support OpenGL ES 3.0 API Standard
- Inband Software Offers DSP Development Services for Tensilica Customers
- Evatronix to Demonstrate the Future of Video Streaming at the Flash Memory Summit
Headlines for Monday Aug. 06, 2012
Does Samsung deal leave CSR out in the cold?
The recently announced CSR-Samsung deal, under which Samsung Electronics will acquire CSR’s handset connectivity/location development operations and its technology, was an easy sell to the financial community. Everyone loved it.- Kilopass Expands XPM Non-Volatile Memory IP Enablement On Two 180nm Dongbu HiTek BCD Process to Serve Increased Customer Demand
- ARM Launches Second Generation of MALI-T600 Graphics Processors Driving Improved User Experience for Tablets, Smartphones and Smart-TVs
- Samsung plans ARM-based CPU for servers, says report
- Khronos Releases OpenGL 4.3 Specification with Major Enhancements
- MIPS Technologies Announces Preliminary Fourth Quarter and Fiscal 2012 Revenue; Reschedules Earnings Call
- Microchip closes SMSC deal, discusses integration plans
- Global Semiconductor Sales Remain Steady in June
- Xelic Announces China Sales Representative
- Shipments of total OpenGL ES enabled GPUs to hit 1 billion units per year by 2014, says Imagination
- GUC Monthly Sales Report - July 2012
- Analog Bits Expands Engineering Facilities
- TSMC and ASML Reach Agreement to Develop Next Generation Lithography Technologies as an Extension of Long-Term Partnership
- Imagination announces Caustic Visualizer interactive ray traced viewport plug-in for Autodesk Maya
Headlines for Friday Aug. 03, 2012
Synopsys to Acquire SpringSoft
Acquisition Will Complement Synopsys' Technology Portfolio and Help Accelerate Delivery of SoC Debug and Custom Implementation Tools to Customers- Is Synopsys helping chip making return to its roots?
- Foundries Soar While Most Japanese Companies Crash in 2Q12 Ranking
- ARM Leads GPU Computing Trend, Improving Systems Performance and Energy-Efficiency
Headlines for Thursday Aug. 02, 2012
Aspex Semiconductor sold to Ericsson
Chip company Aspex Semiconductor has been sold to Ericsson, with proceeds of the sale to be distributed to shareholders of Aspex.- Report: Lenovo not interested in buying Nokia
- Xylon Unveils 2D and 3D Graphics/HMI logicBRICKS Reference Designs for Xilinx Zynq-7000 ZC702 Evaluation Board
- Avalanche Technology Secures $30 Million to productize a new class of non-volatile magnetic memory and product solutions
- FPGA vendors squabble over 28-nm market share
- InterDigital Prevails in Appeal of Adverse U.S. International Trade Commission Decision in Dispute with Nokia
- ARM and Cavium Extend Relationship with ARMv8 Architecture License
- Movea Secures 6.5 Million Euros in Series C Funding Led by Intel Capital
Headlines for Wednesday Aug. 01, 2012
Latest News- ITC Issues Notice of Final Determination in Rambus Matter
- Rambus Appoints Charles Kissner to its Board of Directors
- Synopsys Collaborates with Renesas to Advance Software Development Solutions for Automotive Applications
- AMD recruits Apple processor guru as chief chip architect