D&R Headline News (November 2012)

Headlines for Friday Nov. 30, 2012

Top Story

DRPIC166X MCU, low-cost mixed with high performance

The good old fashioned PIC microcontrollers are finding their way into new applications like smartphones, gaming peripherals, audio devices and embedded solutions for eg innovative medical devices. Moreover, because the DRPIC166X has upward compatible architecture, it preserves investment in code development. And if it’s not enough, let’s just mention that DCD’s IP Core offers 1.3GHz virtual clock frequency and consumes just 37uW/MHz.

• Serving busy OEMs pays off
• ST's conundrum: Break up or tweak?
• Aliathon & Helion Technology Announce Strategic Partnership Delivering OTN Encryption Solutions to the Communications Market
• Nantero Secures More than $10MM in Funding
• GLOBALFOUNDRIES CEO Ajit Manocha Elected Chairman of Semiconductor Industry Association

Headlines for Thursday Nov. 29, 2012

• ARM and National Instruments Launch Development Solution for Power Optimization
• New IEEE 1149.1-2012 JTAG standard, supporting re-usable IC test structures passes ballot
• Design & Reuse takes its unified IP data center vision to the next level in latest IP Enterprise Management Platform release

Headlines for Tuesday Nov. 27, 2012

Top Story

CAST Offers H.264 High-Profile Encoder IP Core for FPGAs and ASICs

An H.264 High Profile video encoder IP core is now available from semiconductor intellectual property provider CAST, Inc. Intended for demanding high-definition applications like HD broadcast, professional video cameras, and video storage, the new High Profile H.264/AVC Video Encoder Core offers exceptional video quality, competitive performance, and easy system integration.

• Arasan Chip Systems sees increasing demand for its complete USB solution
• Cadence Announces Availability of Industry's First Design IP and Verification IP for Ethernet-based Automotive Connectivity
• WSTS Forecasts Semiconductor Market to Recover in 2013 After Slight Decline in 2012
• World's first ITU-T G.729A compliant Voice Codec Hardware Accelerator by Noesis Technologies
• Renesas shareholders reportedly set to approve bailout deal
• Tensilica and mimoOn Partner to Provide the Only Comprehensive LTE and LTE-Advanced Hardware-Software PHY IP Solution
• Intilop presents at Server Design Summit, how their ultra high performance 10G full TCP Offload Technology increases the network bandwidth by up to 6 times
• Ericsson takes action for fair and reasonable patent licensing

Headlines for Monday Nov. 26, 2012

• Why the ARM architecture is shaped the way it is
• TSMC breaks ground for FinFET fab
• HDL Design House Announces MIPI DSI (Controller + D-PHY) IP Solutions
• Dolphin Integration introduces a new generation of SpRAM at 55 nm
• Xilinx Accelerates Productivity in Industrial Automation with Zynq-7000 All Programmable SoCs
• Cadence Synthesis Technology Speeds Time to Production for Renesas Micro Systems

Headlines for Friday Nov. 23, 2012

Top Story

Cosmic Circuits' announces silicon proven MIPI M-PHY in multiple 28nm flavors, provides complete offering for a mobile platform

Cosmic Circuits M-PHY solution supports both the HS-G1 (1.5Gbps) and HS-G2 (3Gbps) modes and is available in multiple process technologies ranging from 85nm to 28nm. Cosmic Circuits M-PHY offering in 28nm now includes solutions for integration in baseband modems that typically targets a low-leakage process and application processors that target the high-performance process.

• Amantys secures significant new financing from Moonray Investors

Headlines for Thursday Nov. 22, 2012

• TSMC next for New York fab?
• Creative to License Technology and Patents to Intel as part of a US$50 Million Deal
• ARM CEO Warren East on IoT, Nokia, platforms, Europe's future
• GloFo and the end of easy money

Headlines for Wednesday Nov. 21, 2012

Top Story

MIPS Technologies Announces Receipt of Unsolicited Proposal from CEVA, Inc.

MIPS Technologies today announced that it has received an unsolicited proposal from CEVA to acquire all of the outstanding MIPS shares, following the consummation of the proposed patent sale transaction with Bridge Crossing, LLC and the proposed recapitalization, for $75 million (U.S.) in cash.

• UMC Unveils 80nm SDDI Foundry Process Featuring the Industry's Most Competitive SRAM Bitcell
• Calxeda Hires Gopal Hegde as Chief Operating Officer
• 2013 Global GDP to Improve, Raising Electronic System and IC Markets
• Imagination Technologies Group plc - Acquisition of MIPS Technologies Inc.

Headlines for Tuesday Nov. 20, 2012

• Sonics Participates in TSMC's Soft IP Kit 2.0 Beta Program
• CSR Bluetooth Smart Technology Powers New LG One Key Wireless Remote
• ItoM Successfully Concludes Patent Litigation With Texas Instruments and Honeywell
• CEVA Joins Heterogeneous System Architecture (HSA) Foundation, Contributing World-Class DSP Technologies for Imaging and Vision Enabled Embedded Platforms
• Intel's 14-nm process delay
• Intel's CEO search begins, and the nominees are...
• Kilopass XPM IP Provides Non Volatile Memory in IBM 65nm LPE Process For Portable Devices That Demand Lower Leakage Than Bulk CMOS Provides

Headlines for Monday Nov. 19, 2012

Top Story

PLDA Announces Integration of its PCIe 2.0 controller with advanced AMBA AXI interface in Microsemi's new SmartFusion2 SoC FPGA

PLDA today announced incorporation of its PCIe‐AXI bridge IP into Microsemi Corporation’s recently announced SmartFusion®2 SoC FPGA.

• Intel CEO Paul Otellini to Retire in May
• CEVA, DiMAGIC Corporation Ltd. Partner to Integrate Adaptive Beam-forming Using Microphone Array Technology with CEVA-TeakLite Family of DSPs
• Altera Quartus II Software Version 12.1 Accelerates System Development with Enhanced High-Level Design Flows
• Posedge joins Wi-Fi Alliance to Provide Wi-Fi IP Solutions
• UMC Restructures Executive Team
• Decrease in Third Quarter 2012 Silicon Wafer Shipments
• INSIDE Secure to acquire Embedded Security Solutions (ESS), a security specialist in the mobile and networking markets
• Liquid Design Systems Represents DCT in Japan, Distributing High-definition Embedded Software to Connect Smartphone/tablet PCs with Large Screens
• ISSCC: Samsung big.little, but no Intel, Nvidia CPUs
• Sprint and ARM Collaborate to Drive Innovation around Internet of Things (IoT)
• Xilinx Demonstrates Zynq-7000 All Programmable SoCs for Industrial Automation Applications at SPS/IPC/DRIVES 2012
• Fraunhofer IIS Makes Full-HD Voice Available for VoIP Apps

Headlines for Friday Nov. 16, 2012

• Globalfoundries eyes IPO as ATIC sets expectations
• North American Semiconductor Equipment Industry Posts October 2012 Book-to-Bill Ratio of 0.75

Headlines for Thursday Nov. 15, 2012

Top Story

Think Silicon GPUs power latest Dialog Semiconductor VOIP chipsets

Think Silicon , today announced that Dialog Semiconductor uses ThinkVG in it's new series of products. ThinkVG is integrated in the recently announced Green VoIP™ “SC14453” multicore SoC along with ThinkLCD Display Processor.

• Semiconductors negative in 2012, may grow 9% in 2013
• Apple A6X uncovered
• RFEL leverages award winning expertise in DSP to launch family of Video Processing cores
• TI to reduce costs in Wireless business; OMAP processors and wireless connectivity solutions will focus on embedded markets
• Huawei, Altera mix FPGA, memory in 2.5-D device
• STMicroelectronics Comments on Today's Speculations
• Apple, HTC patent deal may not open Android door
• Sharp said to be in talks with Intel, Qualcomm
• AMD says it's not for sale
• Mentor Graphics Nucleus Innovate Program Boosts Embedded Development for Start-up Companies

Headlines for Wednesday Nov. 14, 2012

Top Story

Imagination extends PowerVR Series6 family with G6630 6-cluster GPU

Imagination Technologies announces the latest six-cluster PowerVR GPU IP core in its ground-breaking PowerVR Series6 family.

• Imagination announces the Meta LTP210 microcontroller IP core
• Nevion integrates intoPIX JPEG 2000 technology into its VS902 universal access IP platform
• ASACA Corporation releases a new range of Broadcast servers based on intoPIX HD JPEG2000 technology
• Synopsys and TSMC Enable Lithography Compliance Checking for 20nm
• Creonic Joins Aldec UNITE Partner Programme and Accelerates the Development of its IP Cores with Aldec Linting and Advanced Verification Tools
• Imagination announces latest Rich Communications Suite and HelloSoft V.VoIP mobile and embedded SDK
• Gartner Says Worldwide Sales of Mobile Phones Declined 3 Percent in Third Quarter of 2012; Smartphone Sales Increased 47 Percent

Headlines for Tuesday Nov. 13, 2012

Top Story

Altera and Northwest Logic Develop RLDRAM 3 Memory Interface Solution

Altera and Northwest Logic today announced the immediate availability of a hardware-proven 1,600 Mbps Reduced Latency DRAM (RLDRAM®) 3 memory interface solution for use in its high-end 28 nm Stratix® V FPGAs.

• Xilinx 20nm All Programmable Portfolio Builds on 28nm Breakthroughs to Stay a Generation Ahead
• A better way to cloud: TI's new KeyStone multicore SoCs revitalize cloud applications, enabling new capabilities and a quantum leap in performance at significantly reduced power consumption
• New OMAP 5 processor-based modules spur easier, faster industrial designs
• Apple, HTC patent deal seen as first of many
• HTC and Apple Settle Patent Dispute

Headlines for Monday Nov. 12, 2012

Top Story

RivieraWaves and CSEM team up to provide the world's lowest power Bluetooth Smart integrated solution

An integrated Bluetooth Smart solution comprising an ultra-low power RF transceiver with flexible and fully Bluetooth Smart qualified low power baseband, stack and profiles is now available for licensing.

• Everspin debuts first Spin-Torque MRAM for high performance storage systems
• Altera Simplifies Industrial Ethernet Design for Factory Automation Systems
• Altera Motor Control Development Framework Delivers Unprecedented System Integration, Scalable Performance and Flexibility
• Lattice and Acamar to Announce SDI Camera at China Security Expo 2012
• New FPGA-Based Prototyping Solution Delivers Up To 3x System Performance Improvement
• ARM CEO talks about IoT, platforms
• Media Links Launches New High-Density 3G-SDI / 3D / DVB-ASI IP Transmission Card Solutions Powered by intoPIX JPEG2000 Technology
• Silicon Image MHL Solution Deployed in Roku Streaming Stick
• Imagination announces its new high bandwidth Ensigma Series4 Radio Processing Units (RPU) supporting 802.11ac, 4x4 MIMO and beyond
• Qualcomm overtakes Intel in market capitalization
• Teardown: Apple iPad 4
• System Fabric Works Announces Two New Products based on the Calxeda EnergyCore SOC
• Oracle Corporation Purchases MMP Portfolio License
• Over 1 billion units shipped by Imagination partners
• VESA Experiences Acceleration of MyDP Standard Adoption in Mobile Devices

Headlines for Friday Nov. 09, 2012

• TSMC October 2012 Sales Report
• Diablo Technologies Closes $28 Million Equity Investment
• Dialog Semiconductor announces most powerful integrated power management IC for ARM quad-core application processors
• Intilop and Altera to present a live demo of 10G Ultra Low latency UDP Offload core using Altera's OpenCL at the SC-12 Conference in Salt Lake city, Utah.
• Audio Codec IP - 40 nm: Dolphin Integration passed TSMC IP9000 Level 4 qualification at Low Power process

Headlines for Thursday Nov. 08, 2012

Top Story

Stellamar, partners announce All Digital ADC first pass rad hard silicon success

Stellamar, a leading provider of analog replacement IP solutions, announces first pass silicon validation of its All Digital ADC technology in Honeywell HX-­5 Structured Array process for SEAKR Engineering.

• UMC Reports Sales for October 2012
• Most OEMs Plan to Reduce Number of Contract Manufacturers, IHS iSuppli Survey Reveals
• HP and the vanishing systems engineer
• Top 20 Semiconductor Suppliers' Sales Growth Rates Forecast to Range from Great (+31%) to Terrible (-17%) in 2012.
• eSOL's eCROS Real-Time OS-Based Software Platform Extends CPU Support to ARM Cortex-R Series
• Alizem releases its new COTS Motor Control Software IP for Servo-Drives applications on Altera FPGAs

Headlines for Wednesday Nov. 07, 2012

Top Story

Imagination won't kill MIPS

Things could hardly turned out better for MIPS Technologies in the latest patent acquisition deal in which ARM and Imagination Technologies are carving up the company.

• Altera's Functional Safety Data Package for Industrial Applications Accelerates Design Time and Reduces Certification Risks
• Shane Robison Joins Altera Board of Directors
• Global Semiconductor Sales Up Slightly in September
• China fabless: Nufront ventures beyond tablet chips
• Synopsys Introduces Memory Test and Repair Solution for Designs at 20 Nanometers and Below
• Amantys expands executive team to help target new markets and consolidate growth
• Qualcomm, MediaTek and Intel Together Held Three-Fourths of Cellular Baseband Revenue Share in 1H 2012
• eMemory Receives TSMC IP Partner Award Three Years Straight
• Fujitsu Semiconductor Widely Expands Lineup of 32-bit General Purpose Microcontrollers with the Release of Products Adopting 2 New ARM Cores
• Mentor Graphics New Tessent IJTAG Product Automates IP Test and Debug Integration in Large SoC Designs

Headlines for Tuesday Nov. 06, 2012

Top Story

MIPS Technologies Agrees to Sale of Patent Properties to AST and Acquisition by Imagination Technologies

MIPS today announced it has entered into separate definitive agreements with Bridge Crossing, an acquisition vehicle of Allied Security Trust ("AST"), and Imagination Technologies with net proceeds of approximately $7.31 per share in cash to each holder of MIPS common stock.

• GUC Monthly Sales Report - October 2012
• Cadence Encounter Technologies Enable Open-Silicon to Reach 2.2 GHz Performance on 28nm ARM Dual-Core Cortex-A9 Processor
• Imagination acquires operating business, certain patent properties and license rights to other patent properties of MIPS Technologies Inc., a leading provider of CPU architectures and cores, for US$60 million
• ARM Announces Participation in a Consortium to Acquire Rights to MIPS Technologies' (MIPS) Portfolio of Patents
• Evatronix SA Selects MunEDA Tool Suite WiCkeD
• Apple mulls switch away from Intel chips
• DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS PEN Lite E-PL5.OLYMPUS PEN mini E-PM2
• X-FAB and Anvo-Systems Dresden Cooperate to Provide High-Speed Non-Volatile Memory Solutions

Headlines for Monday Nov. 05, 2012

Top Story

Arasan Chip Systems extends UFS leadership with UFS, UniPro, and M-PHY IP

Arasan announced today it has strengthened its leading position in the UFS market with major new contracts giving Arasan the largest market share in the rapidly developing UFS market

• Altera Announces Industry's First FPGA Support for OpenCL - Eases the Adoption of FPGAs for Accelerating Heterogeneous Systems
• StreamDSP Announces Another Update to its Popular sFPDP IP Core, Adding Support for 28nm Devices from Xilinx and Altera including Kintex-7, Virtex-7, and Stratix-V FPGAs
• Big.little test results show promise, ARM reports
• SMIC Reports 2012 Third Quarter Results
• Synopsys Announces Adoption of its TetraMAX ATPG and Yield Explorer Tools by STMicroelectronics as Essential Enablers of Rapid Yield Ramp
• Android Marks Fourth Anniversary Since Launch with 75.0% Market Share in Third Quarter, According to IDC
• ARM's expansion challenge
• ARM's East cites power as key IC design driver
• VLSI Plus offers Multiple Pixel per Clock in all its MIPI CSI2 Receiver IP cores

Headlines for Friday Nov. 02, 2012

Top Story

Standards Group formed to enable Internet of Things growth

Weightless, the global organisation responsible for delivering royalty-free open standards to enable the Internet of Things, today announced a new Special Interest Group (SIG) to accelerate the adoption of “Weightless” as a wireless wide area global standard for machine to machine (M2M) short to mid-range communications.

• Esencia Technologies Announces Floating Point support for EScala Design Platform
• Microprocessor server benchmarks seen as irrelevant
• Industry Leaders Collaborate to Accelerate Software Ecosystem for ARM Servers, and Join Linaro

Headlines for Thursday Nov. 01, 2012

Top Story

Slideshow: ARM A57 core revealed

ARM provided the first peak at its Cortex A57 high-end 64-bit core at ARM Tech Con here Wednesday (Oct. 31). The A57 aims to provide maximum performance in a mobile power envelope, extending ARM’s reach into networking and server systems.

• Mentor Graphics Delivers Emulation Solutions for the Verification of PCI Express Gen3 Products
• eSilicon Corporation and ARM Sign Multi-Year IP Agreement
• CEVA, Inc. Announces Third Quarter 2012 Financial Results
• Newly-Formed Japanese Joint Venture Licenses Arteris Chip-to-Chip (C2C) Interconnect IP
• Coolpad Americas and Imagination Technologies announce completion of VoLTE for Coolpad series of Smartphones
• Altera Introduces Serial RapidIO IP Cores to Ensure Interoperability in Next-Generation Communications Infrastructure