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Cadence today announced production-proven verification IP (VIP) for the new USB SuperSpeed Inter-Chip (SSIC) specification, enabling customers to thoroughly verify designs deploying the latest extension of the USB 3.0 protocol.
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Kilopass Secure NVM IP Qualified for 10-Year Life in Mobile Phone and Consumer Electronics SoCs on SMIC 65/55/40nm Low-Leakage CMOS Logic Processes
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Optimized for long backplane interfaces in server blade chassis, switches, routers and other high-performance computing and networking systems, the 28-nanometer (nm) Enterprise 10G PHY supports multiple interface standards, including PCI Express® (PCIe®) 3.0 and 10GBASE-KR, for a flexible interconnect solution.
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Intel is making progress with its development of LTE modems since but does not expect to have an integrated LTE modem and application processor until 2014, according to CEO Paul Otellini.
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intoPIX launches its customizable reference applications for JPEG 2000 targeting the smallest 28nm FPGA devices from Altera and Xilinx at ISE 2013.
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Semico recently released our Quarterly Wafer Demand Summary and Data, and as usual, there is good news and bad news. The good news is, manufacturing yields on 28nm have improved so for the time being, capacity is no longer a constraint in the supply chain.
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KALRAY today announces that it has successfully completed the Prometheus project with 8 other partners, an achievement that allows KALRAY to secure a new funding round of 5 M€.
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Arteris today announced that Open-Silicon implemented the Arteris ® FlexNoC™ interconnect IP as the backbone SoC interconnect in a high-performance ARM®-based networking SoC design.
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In the early days of digital electronics a good architectural idea could be implemented and the advantage it granted could be expected to apply for all foreseeable manufacturing generations. But now the complexity and pace of change of chip manufacturing is such that ideas and techniques sometimes struggle to last without significant re-invention.
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Arasan announced today the availability of the most complete solution of ONFI 3.1 NAND Controller IP & PHY, including ONFI 3.1 compatible NV-DDR2 I/O pads. Arasan has ported its ONFI 3.1 NV-DDR2 I/O pads in to advanced process running at 400 MT/s with 200 Mhz clock.
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Intel Corp.’s introduction of a new Atom processor platform designed to target the fast-growing market for low-end smartphones in emerging economies represents a shrewd strategy that could allow the company to expand its currently minimal market share in the industry, according to the IHS iSuppli/Screen Digest Mobile & Wireless Service at IHS
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In 2012, Samsung almost doubled its foundry sales and surpassed UMC to become the third-largest IC foundry in the world. Moreover, IC Insights believes that the company will challenge GlobalFoundries for the number two spot in the ranking in 2013.
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Although overall semiconductor industry growth was nearly flat in 2012, sales of mobile semiconductors reached $31 billion in 2012 according to The Linley Group, an increase of 18 percent over the previous year.
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ARM CEO Warren East sat down with EE Times during the Consumer Electronics Show this week to discuss the radically changing landscape for TVs, the slowly unfolding "Internet of Things" and whether the world's largest processor IP vendor should offer RF IP modules to get IoT off the ground.
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Contrary to some opinions, the fabless/foundry business model shows no signs of "collapsing". The report shows that the fabless IC suppliers grew by 6% in 2012, 10 points better than the 4% decline registered by the IDMs and eight points better than the 2% decline shown by the total IC market last year.
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Vivante today announced it has joined the GENIVI Alliance, an automotive and consumer electronics industry association driving the development and adoption of an open in-vehicle infotainment (IVI) reference platform.
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Fabless semiconductor companies as a group outperformed chip makers with their own fabs again in 2012, according to the latest numbers from the upcoming McClean Report 2013.
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Semiconductor revenues worldwide will see nominal growth this year at less than 1% reaching $304 billion according to the year-end 2012 update of the International Data Corporation (IDC) Semiconductor Applications Forecaster (SAF).
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InterDigital today announced that its patent holding subsidiaries have entered into an agreement which extends the term of their worldwide, non-exclusive, royalty-bearing patent license agreement with Research In Motion Limited.