D&R Headline News (March 2013)

Headlines for Thursday Mar. 28, 2013

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Next ARM CEO's 10 toughest tasks

On July 1, Simon Segars is set to become the third CEO in the history of processor licensing vendor ARM Holdings plc. Segars' job is no walk in the park. Despite ARM's success in recent years, the company is fighting high-stakes battles on many fronts.

• Elliptic Technologies to Present Embedded Networking Security Solutions at Ethernet Technology Summit 2013
• Michael Noonen Appointed New Chair of Socle Technology to Expand Advanced Market
• Pure-Play Foundries and Fabless Suppliers are Star Performers in Top 25 2012 Semiconductor Supplier Ranking

Headlines for Wednesday Mar. 27, 2013

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Intel and Samsung Forecast to Represent 42% of Semiconductor Capital Spending in 2013

For 2013, the top-10 capital spenders are forecast to increase their spending by 5% as compared to 2012, which would be 13 points better than the results expected from the non-top-10 companies (-8%).

• Algo-Logic Systems Launches 2nd Generation Ternary Search Engine (TSE2) Solutions for the new Tabula ABAX2 P-Series of 3PLD
• 3-D integration takes spotlight at ISPD
• Global Consumer Electronics Industry Revenue Fell by 2 percent in 2012
• Synopsys bullish despite rising chip complexity
• OCP-IP Releases OCP Debug Socket Specification 2.0

Headlines for Tuesday Mar. 26, 2013

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Tabula Sets New Industry Benchmarks with a Suite of 100G Programmable Solutions Based on the Company's ABAX2 P-Series of 3PLDs

Tabula today announced a comprehensive suite of high-performance packet processing solutions. The suite solves the most challenging problems posed by the transition from 10 to 40G and 100G: specifically, routing of high-performance buses, on-chip RAM throughput, and timing closure for the ultra-high-performance functions required by these systems.

• Kilopass Appoints Tatsuya Yamazaki Vice President of Business Development Asia-Pacific To Accelerate International Expansion
• Tabula Releases Groundbreaking EDA Technologies in Support of its Suite of High-Performance Packet Processing Solutions
• Renesas Electronics Announces R-Car H2, Offering Highest CPU and Graphics Performance for the Automotive Infotainment Market
• eSilicon elevates Rob Cadman to vice president of sales, North America and EMEA

Headlines for Monday Mar. 25, 2013

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Microsemi Integrates Inicore Enhanced Reliability CAN IP into SmartFusion2 SoC FPGA

Inicore Inc. announced today that its CAN controller IP core CANmodule-IIIx has been incorporated into Microsemi Corporation’s recently released SmartFusion®2 SoC FPGAs.

• Sidense Qualifies 1T-OTP Non-Volatile Memory for MagnaChip 180nm Mixed-Signal and HV CMOS Process
• Xilinx Extends Leadership in Avionics with Certifiable, All Programmable Design Solutions and Dedicated Support
• Exar Corporation Acquires Altior Inc. to Provide Additional Growth in Data Compression
• Imagination and TSMC Strengthen Technology Collaboration
• Algotochip Becomes Tensilica Design Center Partner
• Truechip Partners with Avant Technology to Market Verification IP Products in Asia
• Imagination delivers latest version of leading tools for game development at GDC 2013
• INRIA and KALRAY strengthen their scientific collaboration on the MPPA MANYCORE processor and parallel computing

Headlines for Friday Mar. 22, 2013

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Noesis Technologies Announces ComLab Platform, a New Paradigm Towards Communication Systems Hardware Emulation

Noesis Technologies announced today the immediate availability of ComLab™, a cost efficient highly integrated development environment (IDE) that enables a system designer to rapidly build, configure and evaluate in real-time the performance of complex telecommunication systems.

• North American Semiconductor Equipment Industry Posts February 2013 Book-to-Bill Ratio of 1.10
• SMIC's CEO makes utilization first focus
• DELTA Microelectronics to Expand Global Activities Through New Joint Alliance with ChipStart

Headlines for Thursday Mar. 21, 2013

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MorethanIP Releases the Industry First IP for 100GBase-CR4 and 100GBase-KR4 Applications

MorethanIP today announced the immediate availability of the industry first IP (Intellectual Property) solution for 100GBase-CR4 and 100GBase-KR4. The Core is compliant with the IEEE802.3bj latest Draft 1.3 specification and is optimized for ASIC technologies.

• Subramaniam Hariharan joins eSilicon executive team to head global manufacturing operations
• ARM and Synopsys Collaborate to Deliver Optimized Reference Implementations for ARM Processors
• MIPS multi-threaded CPUs from Imagination push performance to new levels for Altair's new LTE chipsets
• How ST and Renesas blew it on mobile
• Bluespec Introduces High-Speed Verification and Hybrid Prototyping Solution for RTL IP

Headlines for Wednesday Mar. 20, 2013

• Accellera Systems Initiative completes SystemC AMS 2.0 standard for mixed-signal design of electronic systems
• China, India outspending U.S. in semiconductors
• Nvidia's road map drives graphics, ARM into enterprise
• ARM's Segars is safe CEO choice

Headlines for Tuesday Mar. 19, 2013

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ARM Holdings plc Announces CEO Succession

ARM Holdings announces today that Chief Executive Officer Warren East has decided to retire from the company, effective 1 July 2013, after nearly twelve years as CEO and nineteen outstanding years at the company. Simon Segars, currently President of ARM, will become the company's new CEO.

• Kilopass Appoints Industry Veteran Dana Reyes Vice President of Finance To Scale Business Expansion
• Lattice Semiconductor Updates 1Q13 Guidance
• Xilinx Stays a Generation Ahead in All Programmable SoCs for Smarter Wireless, Broadcast, Medical and Military Systems
• Beken License CEVA Bluetooth 2.1+EDR and 4.0 IP for Low Power Bluetooth Product Families
• GUC Unveils New 28nm Data Converter IP Family
• Tensilica Joins HSA Foundation to Help Establish Standards for Embedded Heterogeneous Computing

Headlines for Monday Mar. 18, 2013

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Chips&Media Extends CODA9 Series With AVS+ Chinese New Video Standard

Chips&Media today unveils the latest addition to its comprehensive multi-codec CODA9 family, the CODA966 video codec IP, including support for Chinese new AVS+ video standards.

• Arasan Chip Systems Announces New Channel Partner in India
• Altera Cyclone V GT FPGA Is Industry's First Low-Power FPGA to Achieve Compliance for PCIe Gen2 at 5 Gbps
• ST-Ericsson announces global workforce review
• Ericsson and STMicroelectronics agree on strategic way forward for ST-Ericsson
• SingMai Electronics and Cadeka Microcircuits have announced a partnership to jointly promote aCVi
• Tektronix Demonstrates MIPI Alliance M-PHY Test Solution with Synopsys Silicon-Proven HS-Gear3 M-PHY IP
• Sierraware Introduces ARM TrustZone-based Malware Protection and Integrity Management

Headlines for Friday Mar. 15, 2013

• ALTIS Semiconductor Selected as Long Term Foundry Partner for IBM Microelectronics SOI Technology

Headlines for Thursday Mar. 14, 2013

• Imagination preps cores for vision processor market
• Andes Technology to Bring Energy Efficient Processor Cores to the U.S. Market
• Ittiam Systems Announces Availability and Software Licensing of HEVC (H.265) Video Encoder and Decoder for Professional, Enterprise and Consumer Digital Media Markets
• Intel Leads Unexpectedly Large Decline in Semiconductor Market Inventory in Q4
• IC Design Consultancy Sondrel completes 3rd successful 28nm tape out this year - more to follow

Headlines for Wednesday Mar. 13, 2013

Top Story

A look inside Cadence's IP core strategy

Analysts are giving Cadence's bid for Tensilica a cautious thumbs up as it moves into what it claims is a future of more integrated IP and tools for EDA.

• PowerVR confirmed in Samung's 'Octa'
• SEMI Reports 2012 Global Semiconductor Equipment Sales of $36.9 Billion

Headlines for Tuesday Mar. 12, 2013

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Cadence to Acquire Tensilica

Cadence today announced that it has entered into a definitive agreement to acquire Tensilica, Inc., a leader in dataplane processing IP, for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.

• Kilopass Appoints Emerson Hsiao Vice President of Marketing As Company Gears Up for Roadmap Expansion
• CAST's 200th 8051 IP Core License Goes to Ensphere Solutions
• Cadence guns for Synopsys with Tensilica buy
• HDL Design House Announces PCS IP Core
• New DINI Two Chip Virtex-7 Board for High-Speed, Low-Cost, ASIC Prototyping
• Imagination Technologies Group pl - Interim Management Statement
• GSA Announces 2013 Board of Director Election Results

Headlines for Monday Mar. 11, 2013

• Lattice Announces World's Smallest FPGA for Miniature Systems
• Toshiba Adds New Platform SoC To Its Custom SoC/ASIC Product Line
• STMicroelectronics Announces Resignation of Didier Lamouche
• ST-Ericsson announces change in executive management
• Xilinx Showcases 400G Applications for Optical and Wired OTN Markets at OFC 2013

Headlines for Friday Mar. 08, 2013

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Cadence Announces First Commercially Available Design IP and Verification IP for Mobile PCI Express

Cadence today introduced the first commercially available design IP (IP) and verification IP (VIP) supporting the new Mobile PCI Express® (M-PCIe™) specification.

• Google and MPEG LA Announce Agreement Covering VP8 Video Format
• Digital Core Design Announces DuART, tiny UART IP Core
• TSMC February 2013 Sales Report
• UMC Reports Sales for February 2013

Headlines for Thursday Mar. 07, 2013

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Moortec Semiconductor Announce Technology for Robust 4G LTE Mobile Communications

Moortec announces it's intention to transform the robustness of mobile communications with its novel signal processing receiver architecture. The technology targets the creators of 3G and 4G receive-chain solutions for mobile devices and supports WCDMA, LTE (FDD and TDD) and TDSCMDA standards.

• January DRAM, NAND Flash Sales Point to Promising Year
• Renesas Electronics Develops and Supplies Multi-Format Video Codec Hardware IP that Supports Low-Delay Processing
• Imagination reports enthusiastic response to latest PowerVR Series6 GPUs and MIPS CPUs at MWC 2013

Headlines for Wednesday Mar. 06, 2013

Top Story

How Conexant ended up filing for Chapter 11

Both Broadcom Corp. and Conexant Systems Inc. deployed aggressive acquisition strategies in similar market segments starting in the late 1990’s—each company betting the farm on the burgeoning broadband market. In the end, they achieved spectacularly different results.

• GUC Monthly Sales Report - February 2013
• Chips&Media Partners Ship Over 120 Million Video Devices To-Date
• Fab Equipment Spending: Flat in 2013; Up 24% in 2014
• Jasper Signs Up Cavium for its Next Generation Modeling App
• eMemory's eNVM SIPs Reach 5 Million Wafer Production Record
• Design & Reuse's IP Management Enterprise Platform adds IP-centric revision control front end for targeting IP under development

Headlines for Tuesday Mar. 05, 2013

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Kilopass Receives $8 Million Funding to Expand Technology Roadmap

Kilopass announced today that it has received an $8 million funding from a major consumer electronics licensee who wishes to remain anonymous until its own product launch.

• Evatronix Joins the Series of Live Workshops on MIPI SLIMbus organized by LnK
• Dongbu HiTek and Cortus to develop joint Platform Solution for the Microcontroller (MCU) Market
• ARM Launches Keil MDK-ARM Version 5

Headlines for Monday Mar. 04, 2013

Top Story

Xilinx Solutions Target Growing ASIC and ASSP Gaps for Next-Generation Smarter Networks and Data Centers

Xilinx today announced solutions for significant and growing gaps in ASIC and ASSP offerings targeting next-generation smarter networks and data centers. In order to fill these gaps, Xilinx has been acquiring and developing a SmartCORE™ IP portfolio and a critical mass of application specialists and services that leverage Xilinx's All Programmable FPGAs, SoCs, and 3D ICs.

• Global Semiconductor Sales Increase in January Year-over-Year
• Dolphin Integration announces the availability of the new generation of Foundry Sponsored SpRAM generator at 55 nm
• MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration
• Spansion and UMC Announce Joint Technology Development and Licensing Agreement
• Recore Educational Webinar, March 14: Why use the Xentium DSP IP core ?

Headlines for Friday Mar. 01, 2013

• Mobiveil announces the availability of Freescale P3041 AMC board for embedded and networking applications
• Avant Technology Inc to represent Recore Systems' IP products in Asia
• ARM announces mbed version 2.0 and releases open source SDK and development board HDK
• ARM Mali GPUs Submitted for OpenGL ES 3.0 Conformance