D&R Headline News (July 2013)

Headlines for Wednesday Jul. 31, 2013

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Sidense Announces SHF 1T-OTP Non-Volatile Memory IP for Advanced Process Chip Designs

Sidense today announced its SHF (Sidense Hiper Fuse) one-time programmable (OTP) memory for ICs developed in advanced process at 40nm, 28nm, 20nm and smaller geometries.

• CEVA, Inc. Announces Second Quarter 2013 Financial Results
• What if Samsung Exynos Goes ARM Architectural?
• Is Moore's Law Dead? Does It Matter?

Headlines for Tuesday Jul. 30, 2013

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Cadence Enables Validation and Verification of PCIe 3.0 Designs with New SpeedBridge Adapter

The SpeedBridge Adapter for PCIe 3.0 reduces time to market and system risk for complex designs by providing high-speed interaction with real-world traffic in a pre-silicon environment running production-level software drivers and an OS.

• Synopsys Launches Ultra-Low Power IP Subsystem for Sensors
• Altera Demonstrates Interlaken Connectivity with Cavium OCTEON Multicore Processors
• MStar Licenses Tensilica IP Core From Cadence
• New Multicore Association Working Group Will Enable Tools to Optimize and Manage Multicore and Manycore Software
• Diablo Technologies Disrupts Latency and Performance Metrics for the Enterprise with Introduction of New Memory Channel Flash Solution
• MediaTek licences Trustonic Trusted Execution Environment
• IDC Forecasts Worldwide Semiconductor Revenue Will Grow 6.9% and Reach $320 Billion in 2013
• DINI Group Now Shipping Biggest, Fastest, ASIC Prototyping Platform
• STMicroelectronics, ARM and Cadence Improve Tool and Model Interoperability with Three Joint Contributions to Accellera Systems Initiative
• Xilinx Recognizes TSMC with Best Supplier Award

Headlines for Monday Jul. 29, 2013

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Altera Delivers Fully Verified EtherCAT Protocol IP Free of Upfront Licensing Fees

Altera today announced the availability of a fully verified EtherCAT protocol IP for Altera FPGAs. This announcement is the latest offering from the collaboration between Altera, EtherCAT Technology Group (ETG) and Softing Industrial Automation GmbH.

• MediaTek Introduces Industry Leading Tablet SoC, MT8135
• Algo-Logic Systems 3rd Generation TCP Endpoint Achieves Ultra-low-latency of 76-nanoseconds on Stratix V FPGA
• AltoBeam and UMC Successfully Demonstrate DVB-T2/T/C/S2/S Demodulator
• The Love Triangle: Do EDA Services, Tools & IP Mix?
• National Chip Implementation Center Allied with NEC Corporation in High-Level Synthesis

Headlines for Thursday Jul. 25, 2013

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ARM to bring the Internet of Things to life at its Cambridge Campus

ARM announces work is underway to transform its headquarters into a hub for its partners’ Internet of Things (IoT) technologies.

• Xilinx's 10GBASE-KR Solution Passes Full Electrical and Protocol Testing for Backplane Applications
• Cadence Reports Second Quarter 2013 Financial Results
• Oasys Announces New Funding Led by Intel Capital, Xilinx and former Cadence CEO Joe Costello

Headlines for Wednesday Jul. 24, 2013

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ARM Holdings plc Reports Results For The Second Quarter and Half Year Ended 30 June 2013

ARM Holdings plc announces its financial results for the second quarter and half year ended 30 June 2013. •Group revenues in US$ up 24% year-on-year (£ revenues up 26% year-on-year)

• Creonic First FEC IP Core Provider to Receive ISO 9001:2008 Certification
• CSR Licenses Arteris FlexNoC Interconnect Fabric IP
• Imagination's Design Optimisation Kits (DOKs) deliver substantial silicon PPA gains while reducing design cycle times
• Altera Announces Second Quarter Results
• Fab lite, Design lite
• Former ARM CEO Joins Micron
• Khronos Releases OpenCL 2.0
• Foreign IC Companies to Represent 70% of China's IC Production in 2017, Up From 58% in 2012

Headlines for Tuesday Jul. 23, 2013

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CEVA Extends SATA/SAS Portfolio With SAS-3 IP

CEVA today announced the availability of its 12Gbps Serial Attached SCSI (SAS-3) Controller IP for licensing. With advanced performance and reliability features, CEVA's SAS-3 IP can enable customers to design best-in-class next generation enterprise storage products in a timely and cost-effective manner.

• Nufront and YYG, Both Pacific Rim Companies, Go to Production with Multiple Mixel MIPI Solutions
• UMC and SuVolta Announce Joint Development of 28nm Low-Power Process Technology
• Tilera's TILE-Gx72 Processor Sets World Record for Suricata IPS/IDS: Industry's Highest Performance
• SuVolta Announces Speed-Power Benefits of Transistor Technology Validated in ARM Processor
• Intel Tips Custom and 14nm Server Chips

Headlines for Monday Jul. 22, 2013

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ARM and Oracle Announce Plans to Optimize Java SE For Enterprise and Embedded Markets

ARM today announced it has entered into a multi-year agreement with Oracle to further optimize the existing Java Platform, Standard Edition (Java SE) for ARM® 32-bit platforms and to add Java SE support for ARMv8 64-bit platforms.

• Entropic Switches to ARM Mali for Superior Graphics Performance and Extends ARM Cortex Processor Licenses
• North American Semiconductor Equipment Industry Posts June 2013 Book-to-Bill Ratio of 1.10
• eInfochips Releases Verification IP for OTL (Optical Channel Transport Lane)
• IP Software Integration Left Out in the Cold

Headlines for Friday Jul. 19, 2013

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Allegro DVT improves its HEVC Decoder silicon IP with 10 bit support

Requirement of TV broadcasting for carrying 4K and ultra-high definition content is now driving the adoption of the HEVC (High Efficiency Video Coding) standard. This demand for devices supporting HEVC is growing fast, and Allegro DVT is ready with the industry’s first fully compliant HEVC decoding IP that supports both Main and Main10 profiles.

• How ARM's Cortex-A7 Beats the A15

Headlines for Thursday Jul. 18, 2013

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New low-power unified computer vision and video processing solution from videantis

The videantis processor is 100 times more powerful and consumes 1000 times less energy than host CPUs on video and vision applications

• Intilop delivers their enhanced Dual 10G iNICs with Ultra-low latency TCP and UDP Offload accelerators, benchmarking sub micro second wire-to-host latency and Ultra high data throughput
• Semtech Announces a New PHY IP Platform from its Snowbush IP Group that Supports JESD204B, CPRI and OBSAI
• RapidIO Nudges ARM Into Servers
• TSMC Reports Second Quarter EPS of NT$2.00
• The ARM Diaries, Part 2: Understanding the Cortex A12
• Xilinx Announces 2014 Fiscal Q1 Results; Sales Increase 9% Sequentially
• Cadence Incisive Platform Cuts Fujitsu Semiconductor’s Regression Verification Time By 3X

Headlines for Wednesday Jul. 17, 2013

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Synopsys Announces Availability of Complete 28-nm Data Converter IP Portfolio

Synopsys today announced the availability of its 28-nm data converter IP portfolio,which includes DesignWare® analog-to-digital converters (ADCs), digital-to-analog converters (DACs) and integrated PLLs.

• Noesis Technologies Announces Availability of CVSD Voice Codec
• OCP-IP Releases White Paper Profiling EEMBC MultiBench Programs in a 64 Core Machine
• Sequans powers HiveMotion LTE module for M2M devices in Korea
• Big Gains Forecast in Quarterly DRAM ASP

Headlines for Tuesday Jul. 16, 2013

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M-PCIe - Goin' mobile!

Like everything else in Silicon Valley, PCIe (peripheral component interconnect express) is goin’ mobile (cue up The Who). The big news at the June PCIe Special Interest Group Developers Conference was “mobile express,” M-PCIe.

• MoSys Joins Xilinx Alliance Program Supporting 100G and Beyond Networking Line Cards
• Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform
• UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node
• Xilinx's Zynq-7000 All Programmable SoCs Enable Mobilicom's Advanced Peer-to-Peer Software-Defined Radios
• Apple, Samsung Reportedly Ink 14-nm Foundry Deal
• What's inside Google Glass?

Headlines for Monday Jul. 15, 2013

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Why GlobalFoundries Should Appeal to Apple

There is speculation that negotiations around the supply of processors to Apple now include GlobalFoundries Inc.

• Mentor Graphics Questa Verification Platform Adds Software-Driven Verification for Multi-Core SoC Designs
• Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development
• Industry View: Doug Wong of Toshiba on the Future of Memory
• ARM Beats Intel With Revised AnTuTu Benchmark
• GEO Semi GW3300 integrates eWARP core, Tensilica CPU and Apical ISP

Headlines for Thursday Jul. 11, 2013

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Trusight Partners with Vivante to Deliver Streamlined OpenCL and OpenGL ES 3.0 Image Processing Solutions

Trusight announced that it has partnered with Vivante Corporation to deliver a streamlined OpenCL and OpenGL ES solution of Trusight’s patented video and CGI (computer generated imagery) processing technology.

• Scaleo chip and GLOBALFOUNDRIES partner to design and manufacture System on a Chip for automotive market.
• Aldec Verifies Compatibility of Northwest Logic's PCI Express Cores with HES-7 SoC/ASIC Prototyping Platform

Headlines for Wednesday Jul. 10, 2013

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Has Intel Really Beaten ARM?

There has been a considerable amount of press around recent AnTuTu benchmark results and a recent ABI Research report claiming, "Intel apps processor [the Atom Z2580] outperforms Nvidia, Qualcomm, and Samsung."

• Fujitsu Semiconductor joins Linaro
• Memory and Foundry Account For More Than Half of Worldwide IC Capacity
• Mobile Computational Imaging Chip Maker Movidius Raises $16 Million in Series D Funding
• Imagination Technologies to highlight new advancements in ray tracing graphics and mobile tech at SIGGRAPH 2013
• TSMC June 2013 Sales Report
• UMC Reports Sales for June 2013
• ASSET InterTech and Arium join forces to increase visibility into complex system development

Headlines for Tuesday Jul. 09, 2013

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Complete FPGA-Based MIPI Video Demonstration System Now Available

Altima Corporation, Northwest Logic, and Meticom announce the immediate availability of a complete MIPI video demonstration system using Altera’s Cyclone IV and V FPGAs. This demonstration system takes an HDMI video stream, processes it in an Altera FPGA and then streams it to a MIPI-compatible display.

• Fujitsu Laboratories Implements Custom Processor for 3G/LTE Modem with Synopsys' Processor Designer
• Cadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip Corporation
• SEMI Sees 21% Increase in Chip Equipment Spending for 2014
• Xilinx Tapes-Out First 20nm All Programmable Device with First UltraScale ASIC-class Programmable Architecture
• CEVA licenses Flagship DSP to Renesas Electronics for Next-Generation Intelligent Transport Systems

Headlines for Monday Jul. 08, 2013

Top Story

ARM's Lead Engineer Discusses Inexact Processing

Richard Grisenthwaite, lead processor architect with ARM, has said the company has thought about creating an inexact processor -- a processor that curtails precision to save power. The technique has echoes of fuzzy logic and probabilistic processing and uses reduced accuracy of multiplication and addition but manages the probability of errors building up.

• Autotalks achieves market leading vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) security powered by Athena's high performance security technology
• Reflex CES Signs Global Distribution Agreement with Curtiss-Wright Controls for Recording Solutions in France
• TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform
• Sydaap develops World’s First 64 Bit Floating Point FFT/IFFT Hardware Accelerator for N = 4096
• GUC Monthly Sales Report - June 2013

Headlines for Thursday Jul. 04, 2013

Top Story

Alpha Data releases deployable Zynq SoC board

Alpha Data announces the launch of the ADM-XRC-7Z1, the first in a new class of products featuring the Xilinx® Zynq System-on-Chip (SoC).

• Altis Semiconductor Introduces an Innovative Secure Product

Headlines for Wednesday Jul. 03, 2013

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Installed Capacity for 300mm Wafer Processing Forecast to Rise to 70% of Total Capacity by 2017

Since 2008, the majority of integrated circuit production has taken place on 300mm wafers. In terms of surface area shipped (i.e., on a normalized 200mm-equivalent wafer basis), 300mm wafers represented 56% of worldwide installed capacity in December 2012

• Will Your UHDTV Chip Decode Every HEVC Bit Stream?
• India Fab Infected by Delay Bug
• MontaVista Software Extends Support for ARM Architecture Targeting Telecom and Networking Markets

Headlines for Tuesday Jul. 02, 2013

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Fujitsu Semiconductor Licenses ARM big.LITTLE and Mali-T624 Technologies to Support a Wide Range of Consumer and Industrial Devices

Fujitsu Semiconductor combines leading-edge ARM® Cortex® and Mali™ processors to meet the needs of the visual computing space at advanced levels of energy efficiency

• Silicon Labs Completes Acquisition of Energy Micro
• Tabula Announces Availability of Stylus Compiler Version 2.7
• Tabula and Algo-Logic Collaborate to Release Second Generation Ternary Search Engine

Headlines for Monday Jul. 01, 2013

Top Story

VeriSilicon Introduces Hantro G2 Video Decoder IP with HEVC and VP9 Support

VeriSilicon announced today the availability of Hantro G2 multi-format video decoder IP to support ultra HD 4K video decoding for HEVC (High Efficiency Video Coding, aka H.265) video coding standard.

• Global Semiconductor Sales Jump by Largest Margin in Over Three Years
• ARM vs. Imagination Goes to Video
• Dolphin Integration announces a million of circuits sold over the last two years
• Intel and ARM Entering a Price War?
• Altair Semiconductor Raises $25 Million Financing Round
• Intrinsic-ID, License Contract With Panasonic System LSI
• Sital Integrates Wiring Testing Capabilities into Mil-Std-1553 IP Cores and Boards