D&R Headline News (August 2013)

Headlines for Friday Aug. 30, 2013

• Algo-Logic Systems launches Full Order-Book running on a single-FPGA Platform
• Gartner Says Worldwide Server Shipments Grew 4 Percent While Revenue Decreased 3.8 Percent in the Second Quarter of 2013
• TI introduces Tiva C Series TM4C123G USB+CAN Development Kit for ARM Cortex-M4 microcontroller development
• Semiconductor market back to healthy growth

Headlines for Thursday Aug. 29, 2013

Top Story

TICO, the new disruptive light visually lossless compression technology will be officially released at IBC 2013

At IBC, intoPIX launches the new disruptive light visually lossless compression standard that will be known collectively as TICO (pronounced “Teeco”). Designed to have an extremely tiny footprint in FPGA/ASIC fabric, it is nevertheless also powerful in software applications for real-time operation.

• AlpCode Introduces Family of Efficient Cryptographic Hash Cores
• Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products
• Sidense OTP Helps Richtek Technology Give Customers Cost-Effective and Efficient Power Management Solutions
• IBM's Last Stand in CPUs?
• Imagination welcomes MediaTek's innovation in true Heterogeneous Multi-Processing with new SoC featuring PowerVR Series6 GPU
• Ineda unites range of low-power Imagination IP in platforms for wearables and other emerging applications
• Imagination Technologies releases second generation tools for mobile GPU compute developers
• Imagination and TSMC partner to drive industry-leading performance on GPUs

Headlines for Wednesday Aug. 28, 2013

Top Story

Qualcomm Opens DSP Core

The mobile chip vendor will invite third-party programmers to write apps for its Hexagon core and may license the part to other chip vendors

• Foundry Model Challenges Intel
• Atmel Ships New ARM Cortex M0+ Processor-based MCUs in Volume
• Lattice Just Made It Easier for OEMs to Introduce the Latest in MIPI Camera and Display Capabilities
• Ridgetop Group Partners with SiliconAid Solutions on IEEE P1687 and IEEE 1149.1-2013 Standards
• Moore's Law Dead by 2022, Expert Says
• Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip

Headlines for Tuesday Aug. 27, 2013

Top Story

ARM Acquires Sensinode Oy to Accelerate the Internet of Things and Support 30 Billion Connected Devices by 2020

ARM today announced that it has acquired Sensinode Oy, a provider of software technology for the Internet of things (IoT). The privately-held company has led the creation of the 6LoWPAN and CoAP standards for low cost low power devices, and has been a key contributor to the IETF, ZigBee IP, ETSI and OMA standardization efforts.

• Lone Japanese Semiconductor Supplier Ranked Among Top 10 in 1H13
• SMIC Announces 2013 Interim Results
• Imagination and Mentor extend partnership for open source, embedded tools support across all MIPS CPUs
• INSIDE Secure and Solacia Team Up to Bring TrustZone-ready DRM Technology to Telechips for Secure Set-Top Boxes
• Vivante Continues Mass Market Momentum with the Marvell ARMADA 1500-mini Design Win

Headlines for Monday Aug. 26, 2013

Top Story

Irida Labs Successfully Completes Investment Rounds

Irida Labs, a leading provider of technology and software for embedded vision applications, is pleased to announce that it recently completed two financing rounds for a total of $1.5M.

• Group Describes Specs for x86, ARM SoCs

Headlines for Friday Aug. 23, 2013

• Dolphin Integration enriches its line of 80251 with a new DMA for high density and robustness

Headlines for Thursday Aug. 22, 2013

• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2013

Headlines for Wednesday Aug. 21, 2013

Top Story

GlobalFoundries Rumored to Get a Bite of Apple Chip Business

Rumors are swirling about a deal with Apple for GlobalFoundaries. The already successful foundry may be poised for even bigger success.

• Realtek Licenses Cadence's Tensilica HiFi Audio/Voice DSP IP Core
• Arteris Makes Big Gains on Inc. 500 List of America's Fastest-Growing Private Companies
• North American Semiconductor Equipment Industry Posts July 2013 Book-to-Bill Ratio of 1.00

Headlines for Tuesday Aug. 20, 2013

Top Story

Memoir Systems' Renaissance 10x Brings Ultra High Performance to Embedded Memories

Renaissance 10X can generate memories with various read/write combinations for up to ten non-blocking active ports to achieve up to 10 billion memory operations per second (MOPS) in a 28nm process.

• INSIDE Secure Acquires Rights to Trustonic TrustedShow Technology to Bolster DRM Lineup
• Using "Final Market Value", TSMC Became the Largest Semiconductor Supplier in the World in 2Q13
• Lattice Slashes Cost, Speeds Development of Mobile Devices With New Plug-In-&-Go USB iCEstick FPGA Evaluation Kit

Headlines for Monday Aug. 19, 2013

• TranSwitch Corporation Announces Voluntary Delisting From NASDAQ
• Majority of Leading China Semiconductor Companies Rely on Arteris Network-on-Chip Interconnect IP
• TranSwitch Corporation Announces Agreement To Raise $2.5 Million In Private Placement
• Digital Core Design Wins Stevie Award in 2013 International Business Awards

Headlines for Thursday Aug. 15, 2013

Top Story

ARM Preps Near-Threshold Processor for IoT

ARM Holdings plc is working on a processor core optimized for operation close to the threshold voltage of CMOS transistors and at clock frequencies of the order of tens of kilohertz.

• Construction of 450mm Fab 'Well Underway'
• Freescale Semiconductor Uses Cadence Encounter RTL-to-GDSII Flow to Tapeout a 28nm 1.8GHz Communications Processor

Headlines for Wednesday Aug. 14, 2013

Top Story

Intel Acquires Fujitsu Wireless

Intel Corp. confirmed that it acquired last month Fujitsu Semiconductor Wireless Products Inc. (FSWP), the Tempe, Ariz.-based subsidiary of Fujitsu that developed an advanced multimode LTE RF transceiver.

• Apple's Shift in Chip Manufacturing Strategy Boosts Semiconductor Foundry Business in 2013
• Micron Tells Story of Building DRAM Cube
• Ceva-ZTE Deal Hints Home-Grown ASIC Is Back

Headlines for Tuesday Aug. 13, 2013

Top Story

Mobiveil Announces the Availability of All Key IP Components and Subsystem for an Integrated NVM Express Based PCIe-SSD Solution

Mobiveil today announced the availability of all key IP components for an integrated NVM Express based Solid State Drive (SSD) solution.

• Uniquify, HashFast Ink Agreement to Produce ASICs to Increase Hashing Speed for Bitcoin Miners
• Tablet and Cellphone Processors Offset PC MPU Weakness
• ZTE Corporation Licenses CEVA-XC DSP for LTE TDD/FDD Base Station and Network Infrastructure
• Rambus Focuses on Products, Not Patents
• Allwinner Technology Licenses Arteris Interconnect Fabric IP for Tablet and Mobile Device Applications
• Coherent Logix And Intrinsic-ID Announce Availability Of An Advanced Secure Processor Enabling Fully Software Reprogrammable Wireless and Video Solutions for Software Defined Systems
• Adapteva Introduces Parallella University Program

Headlines for Monday Aug. 12, 2013

Top Story

Chips&Media Introduces CODA7-L for Low-cost Smartphones

Chips&Media has introduced its new CODA7-L video codec IP core that is designed for low-cost smartphones and tablets. CODA7-L build on the existing CODA7 series platform that is originally an HD multi-codec IP capable of HD(720p) encoding and full HD(1080p) decoding, was designed for silicon cost sensitive and power-constrained low-cost applications.

• How ARM licenses it's IP for production
• Synopsys Introduces Dolby MS11 Decoder for DesignWare ARC Audio Processors
• Proton Digital Systems Announces FlashPro Media Manager - Enabling Next Generation MLC and TLC Flash in Consumer, Client and Enterprise Applications
• SATA-IO Unveils Revision 3.2 Specification
• Avery Design Systems Announces eMMC 5.0 Verification IP Solution
• IntelliProp Announces High Performance SATA SSD Flash Controller
• TSMC July 2013 Revenue Report
• A long look at how ARM licenses chips
• Avery Design Systems Announces SATA Express AHCI Verification IP Solution

Headlines for Friday Aug. 09, 2013

• UMC Reports Sales for July 2013

Headlines for Thursday Aug. 08, 2013

Top Story

Google, IBM, Mellanox, NVIDIA, Tyan Announce Development Group for Data Centers

Google, IBM, Mellanox, NVIDIA and Tyan today announced plans to form the OpenPOWER Consortium – an open development alliance based on IBM's POWER microprocessor architecture.

• SMIC Reports 2013 Second Quarter Results
• EDA Consortium Reports Revenue Increase for Q1 2013
• HDL Design House Introduces JESD204B PCS Rx IP Core

Headlines for Wednesday Aug. 07, 2013

Top Story

EEMBC Launches Embedded Industry's First Floating-Point Benchmark Suite Targeting Microcontrollers to High-End Multicore Processors

EEMBC today announced FPMark™, a new benchmark suite that tracks the performance of embedded processors with floating-point hardware units (FPU), an increasingly popular and necessary feature to support graphics, audio, motor control, and many other high-end processing tasks.

• After 43 Years, DRAM Market Finally Reaches Maturity
• Increase in Second Quarter 2013 Silicon Wafer Shipments
• ARM Benchmarks Flavors of Big-Little Multiprocessing
• Custom Hardware Design Is Dead

Headlines for Tuesday Aug. 06, 2013

Top Story

Cadence Announces New Verification IP Models For Latest Memory Standards

At MemCon 2013 today, Cadence, announced the immediate availability of new verification IP (VIP) models for the latest memory standards--LPDDR4, Wide I/O 2, eMMC 5.0, HMC and DDR4 LRDIMM.

• GUC Monthly Sales Report - July 2013
• eMemory's NeoEE Technology Advanced into BCD Process Platform, Augment P-Gamma Silicon Intellectual Property Product Range and Accelerate the Integration Power Management ICs
• IP-Maker to exhibit at Flash Memory Summit 2013, Booth #218

Headlines for Monday Aug. 05, 2013

Top Story

eASIC Announces Strategic Investment by Seagate

eASIC today announced a strategic investment by Seagate Technology.

• Crossbar Emerges from Stealth-Mode; Unveils Crossbar RRAM Non-Volatile Memory Technology
• Synopsys and Lattice Semiconductor Extend Multi-Year FPGA Synthesis OEM Agreement
• Ericsson and STMicroelectronics Complete Transaction to split up ST-Ericsson
• Quarterly Semiconductor Sales Increase 6 Percent, Outperform Industry Forecast
• CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices
• CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms

Headlines for Friday Aug. 02, 2013

Top Story

Imagination and Hardkernel partner to deliver high-performance GPU capabilities on low-cost ODROID-XU development board

Imagination Technologies announced today that Hardkernel, a hardware supplier specialized in affordable open development platforms, has released the high-performance, low-cost ODROID-XU development board.

• IC Insights Reveals Big Changes to 1H13 Top 20 Semiconductor Supplier Ranking
• Exar CEO Talks Analog, China, IoT
• Xilinx Real-Time Video Engine features OmniTek Multi-channel Video Processor IP and OmniTek Zynq-based Video Development Platform
• Tabula Announces Availability of Stylus Compiler Version 2.7.1
• Splitting Sony Won't Restore Its Future
• Lawsuits Drive Patent Market

Headlines for Thursday Aug. 01, 2013

Top Story

SuperSpeed USB 10 Gbps - Ready for Development

The USB 3.0 Promoter Group today announced the completion of the USB 3.1 Specification which adds enhancements to enable SuperSpeed USB to operate at up to 10 Gbps.

• Logicircuit Offers Comprehensive Portfolio of DO-254 Certifiable IP
• Blu Wireless Technology Closes $3.1m Funding Round For 60GHz Wireless IP
• Digital Core Design Introduces 80390 CPU
• Chips&Media Delivers its First AVS+ Core to Address the Growing Digital Set-top box Market in China
• INSIDE Secure Joins ARM TrustZone Ready Program
• OEM Chip Spending to Climb 4 Percent This Year after Flat 2012