D&R Headline News (October 2013)

Headlines for Thursday Oct. 31, 2013

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Qualcomm Buys Arteris Tech, Team

Can you maintain a business after your top customer buys your technology and the engineering team that developed it? That's the question Arteris will attempt to answer after Qualcomm decided it liked the FlexNoc network-on-chip so much it bought the company -- or most of it.

• Dolphin Integration PWM audio DAC at 55 nm densest ever for STB and wireless audio devices
• ARM Servers Face Long, Winding Road
• Programmable Interrupt Controller D8259 from Digital Core Design
• IAR Systems releases new version of leading development tools for ARM

Headlines for Wednesday Oct. 30, 2013

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ARM Announces Complete Suite of Graphics Processing Technology

ARM today unveiled new additions to its Mali™ GPU family, the industry’s most widely-licensed GPU IP, which scales the entire product stack from premium mobile devices to cost-optimized smartphones.

• videantis announces computer vision partner program
• Toumaz Licenses compact configuration of Barco Silex's Public Key IP (BA414E) in its ultra-low power wireless IC for its healthcare product
• Synopsys Extends Performance Exploration Solution for ARM AMBA 4 Interconnect-based Multicore SoCs
• Access Network Technology Leverages Arteris FlexNoC for New Mobile LTE Modem Chip
• Tata Elxsi and Algotochip announce partnership to provide rapid SoC solutions and services targeted at OEMs and custom chip makers
• CEVA, Inc. Announces Third Quarter 2013 Financial Results
• HP Preps 64-Bit ARM Server for 2014
• M31 Technology Corporation announces acquisition of ISO9001:2008 certification ensuring IP quality
• Silicon Image Announces Third Quarter 2013
• Kilopass Embedded Non Volatile Memory IP Has Passed Rigorous JEDEC Qualification on GLOBALFOUNDRIES 40nm LP Process in Time for Customer Production
• Vivante Selects Solution57 as a Platinum Technology Partner to Enhance IoT and Embedded Ecosystem Support
• Freescale Collaborates with ARM and Oracle to Add New Vertical Segment Support for "One Box" IoT Gateway Platform
• Peregrine and GLOBALFOUNDRIES Collaborate to Advance RF SOI Technology
• Qualcomm's Entry into Set-Top-Box Chip Market Poses Big Challenge to Incumbents

Headlines for Tuesday Oct. 29, 2013

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Renesas Electronics Releases HEVC/H.265 Video Codec Hardware IP as Part of Expansion of Licensing Business

Renesas Electronics today announced the development of video codec intellectual property (IP) technology supporting the latest video encoding standard, HEVC/H.265, which is expected to be adopted in a wide range of markets, including mobile devices, consumer devices, vehicle information systems, and industrial equipment.

• Avnet Electronics Marketing Unveils Xylon Touchscreen HMI Reference Design for the MicroZed Evaluation Kit
• Sidense Advanced Process Node 1T-OTP to be used in Sigma Designs DTV Products
• 75 percent of global business leaders are exploring the economic opportunities created by the Internet of Things
• Altera Announces Quad-Core 64-bit ARM Cortex-A53 for Stratix 10 SoCs
• Cadence Announces Availability of Interconnect Workbench for Performance Analysis and Verification of ARM-Based SoCs
• ARM Extends Its Flagship DS-5 Development Studio for RTOS Development
• ARM and Nordic Semiconductor Partner to Accelerate Development of Bluetooth Low Energy-Enabled Devices
• IC-LOGIC Debuts "First Time Right" Chip with Arteris FlexNoC and C2C Interconnect IP for Automotive and Industrial Applications
• eASIC and CST Reduce Multi-Level Package Design and Simulation Time by up to 5x
• Moortec Semiconductor Announces Industry Leading, High Accuracy On-Chip Temperature Sensor Range for Advanced Nodes
• Atmel Expands Lowest-Power Cortex-A5 Processor-based MPU Portfolio With New Device and Ecosystem Extensions
• Altium introduces TASKING Software Platform Builder for ARM Cortex-M
• Cavium's Thunder is First 64-bit ARMv8 Processor supported in Ubuntu Server 13.10
• TI introduces gateway to the cloud for connected products with Tiva C Series TM4C129x MCUs, industry's first ARM Cortex-M4 with Ethernet MAC+PHY

Headlines for Monday Oct. 28, 2013

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Arasan Chip Systems Introduces First eMMC v5.0 I/O PADs & PHY IP using TSMC 28nmHPM Process

Arasan announced today the availability of the most complete solution for the latest eMMC standard: Embedded MultiMediaCard (eMMC), Electrical Standard (5.0). Arasan’s new eMMC v5.0 solution uses TSMC’s 28HPM process to address the need for applications requiring high speed as well as low leakage power.

• sureCore Tapes-out Low Power SRAM IP Demonstrator Chip
• u-blox and ARM introduce cellular development kit for "Internet of Things"
• Calxeda Announces New Fabric-based Platform for Clouds
• Is ARM Adopting Microsoft Model?
• ASOCS and ARM Announce Cloud RAN Reference Design at ARM TechCon
• Synopsys Announces Availability of Discovery Verification IP for ARM AMBA 5 CHI Standard
• Combined Smartphone and Tablet Factory Revenue to Exceed Entire Consumer Electronics Market This Year
• Reflex CES' Aurora-Like 64B/66B IP Core Enables Mixed Vendor FPGA Designs
• Aliathon Announcing NEC as a Communications Segment Client
• Inside Secure Introduces EasyPlug Cryptographic Middleware for Secure Microcontrollers

Headlines for Friday Oct. 25, 2013

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IBM licenses new ARM technology for custom chips aimed at networking, communications

IBM today announced that it has licensed a broad range of ARM® Cortex® processors from ARM Holdings. IBM plans to offer the new microprocessors to its custom-chip clients; leading companies that build network routers, switches and the cellular base stations that enable pervasive wired and wireless communications across the globe.

• Dolphin Integration announces even denser 6-Track standard cells to decrease power consumption at 180/130 nm
• XMOS and Silicon Labs join forces to deliver the next wave in programmable SoCs
• XMOS creates the next wave in programmable system-on-chip products
• Dolphin Integration Reports a 17 % Growth Rate of their Yearly Turnover on September 30, 2013 to 14.7 M Euros
• Mentor Graphics Hypervisor Delivers High Performance and Security for Multicore Processors and Enables Multi-OS Consolidation

Headlines for Thursday Oct. 24, 2013

• Aldec delivers Global Project Management for Complex FPGA Designs with the latest release of Active-HDL
• Cadence Reports Third Quarter 2013 Financial Results
• Spreadtrum Selects ARM Artisan Physical IP and POP IP for 28nm SoC Development

Headlines for Wednesday Oct. 23, 2013

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ARM reveals realtime roadmap: Now, with applications!

ARM's current processor portfolio consists of three profiles: M (Microcontroller), R (Realtime), and A (Application). In fact, complex SoCs sometimes contain multiple ARM cores, possibly from the different profiles, sometimes from the same.

• VESA Begins Development of micro-DisplayPort Connector Standard
• ARM Targets Automotive and Industrial Control Markets with New Architecture
• Vivado Design Suite 2013.3 Accelerates Productivity with Design Methodology, Next Generation Plug-and-Play IP, and Partial Reconfiguration
• Xilinx Introduces UltraFast Design Methodology for Vivado Design Suite
• ARM Snags New Customers in Record Quarter
• Rocketick Secures Strategic Investment from Intel Capital and NVIDIA
• Altera Announces Third Quarter Results
• Broadcom to Cut Up to 1,150 Jobs
• Elliptic Technologies' CTO Joins Prominent Speaker Line-up at the Global Platform TEE Conference & AMD Developer Summit this Fall

Headlines for Tuesday Oct. 22, 2013

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Synopsys Extends DesignWare IP Portfolio for Data Center SoCs with Enterprise 40G Ethernet Controller IP

Synopsys today announced the availability of the DesignWare Enterprise 40G Ethernet MAC and PCS Controller IP as part of Synopsys' complete Enterprise 40G IP solution.

• Altera Nios II Processor Model Delivered By Imperas
• Memoir Systems Introduces Renaissance for Datacom Memory IP Enabling Terabit Computing
• North American Semiconductor Equipment Industry Posts September 2013 Book-to-Bill Ratio of 0.97
• SMIC Announces Formation of Center for Vision, Sensors and 3DIC
• Alizem Embedded Motor Control Software IP reaches a new milestone of performance
• ARM Holdings PLC Reports Results For The Third Quarter And Nine Months Ended 30 September 2013
• Microsemi Corporation to Acquire Symmetricom, Inc.
• Imperas Delivers QuantumLeap Simulation Synchronization - Industry's First Parallel Virtual Platform Simulator
• HDL Design House Seminar: The Verification Challenge

Headlines for Monday Oct. 21, 2013

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OmniPhy Introduces HDMI 2.0 TX/RX Controller+PHY IP, Driving 6 Gb/s Over Wirebond Packages

OmniPhy today announced that it's Video Display IP Group will ship a new Silicon Intellectual Property (SiIP) platform supporting HDMI 2.0 TX and RX standards up to 6 Gb/s for deployment in system-on-a-chip (SoC) solutions for the ultra-high-definition (UHD) market.

• Approaching IP Quality From Many Angles
• TSMC Sees Fast Ramp for 20-nm
• Chang to Remain 'Ultimate Authority' at TSMC
• Altera DC-DC Power Converter Solutions Improve System Power Efficiency by up to 35 Percent while Reducing Board Area by up to 50 Percent
• VIA Technologies Licenses Cadence Tensilica HiFi Audio/Voice DSP
• Xilinx and TSMC Reach Volume Production on all 28nm CoWoS-based All Programmable 3D IC Families
• SaberTek Announced the Availability of a Complete Family of Wi-Fi RF Intellectual Properties fully compliant with IEEE 802.11 a/b/g/n/ac Specifications
• Altera to Demonstrate 4K Upscaling and HEVC Encoding for Broadcast Systems at SMPTE 2013
• Gartner Says Worldwide PC, Tablet and Mobile Phone Shipments to Grow 4.5 Percent in 2013 as Lower-Priced Devices Drive Growth
• Margins on the Upswing, DRAM Profitability Hits New Heights
• HEVC/H.265 4K decoder IP & compliance streams, by Allegro DVT, at ARM TechCon'13
• Cortus opens Office in Silicon Valley

Headlines for Friday Oct. 18, 2013

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EDA Consortium Reports Revenue Increase for Q2 2013

EDA Consortium today announced that the Electronic Design Automation (EDA) industry revenue increased 3.8 percent for Q2 2013 to $1653.4 million, compared to $1593.0 million in Q2 2012.

• Dolphin Integration offers first standard cell library to enable a leakage reduction of 1/350 at 65 and 55 nm
• Mentor Graphics Nucleus RTOS Improves System Reliability and Performance for Safety-Critical Systems
• InterDigital Announces Formation of Signal Trust

Headlines for Thursday Oct. 17, 2013

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Smartphone Apps Processor Revenue Jumped an Impressive 44 Percent in Q2 2013

The global smartphone applications processor market continued to show strength and grew 44 percent year-on-year to reach $4.4 billion in Q2 2013, according to the Strategy Analytics Handset Component Technologies service report

• Xilinx Announces 2014 Fiscal Q2 Sales Increase 3% Sequentially; New Products Drive Growth
• TSMC Reports Third Quarter EPS of NT$2.00
• MediaTek, Marvell and Qualcomm Made Progress in Tablet Apps Processors in Q2 2013

Headlines for Wednesday Oct. 16, 2013

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CEVA Introduces the CEVA-XC4500, the World's First Vector Floating-Point DSP for Wireless Infrastructure Solutions

CEVA today introduced the CEVA-XC4500 DSP - the world's first vector floating-point DSP specifically designed for advanced wireless infrastructure solutions.

• Freescale Debuts ARM-based QorIQ LS Series Communications Processors
• IPextreme Brings New ColdFire V1 Platform to Market
• IPextreme Extends Reach Through Mentor Graphics
• Texas Instruments drives customer applications one lane closer to an autonomous driving experience and reduction in collisions
• Imagination Takes On ARM's big.LITTLE With Its Warrior Core
• Jasper Launches Security Path Verification App - Industry's First Formal Solution for Detecting Security Vulnerabilities in SoC Designs
• Altera SDK for OpenCL is First in Industry to Achieve Khronos Conformance for FPGAs
• Fortemedia and Cadence to Bring Exceptional Voice Processing Capability to Mobile Handsets, Tablets and Ultrabooks
• TSMC Honors ARM with Partner Award for Fourth Straight Year

Headlines for Tuesday Oct. 15, 2013

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Broadcom Announces Server-Class ARMv8-A Multi-Core Processor Architecture

Broadcom today announced the architecture for a new generation of multicore processors, featuring the industry's highest performance 64-bit ARM® core.

• Accellera Systems Initiative Acquires Open Core Protocol Standard and Infrastructure to Strengthen Interoperability in Electronic Standards Development
• Should Microsoft Be Broken Up?
• Synopsys Introduces DesignWare ARC EM SEP Processor for Safety-Compliant Automotive Systems
• InvenSense To Acquire MEMS Microphone Business Line From Analog Devices, Incorporated
• SMIC Offers Differentiated 0.13um Low-Leakage Embedded Flash Manufacturing Process
• Global Silicon Demand to Slow Down as Year Finishes
• Breker Verification Systems Unifies SoC Verification Across Simulation, Acceleration, In-Circuit Emulation, FPGA Prototyping, Silicon Validation

Headlines for Monday Oct. 14, 2013

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Imagination reveals first MIPS "Warrior P-class" CPU core

The new MIPS P5600 core delivers industry-leading 32-bit performance together with class-leading low power characteristics in a silicon footprint up to 30% smaller than comparable CPU cores, making it ideal for a wide range of mobile, consumer and embedded applications.

• TSMC Awards Synopsys "Partner of the Year 2013" for Joint Development of 16-nm FinFET Design Infrastructure
• Altera Extends Low-Cost Portfolio with Development Kits Starting at $49
• LTE and TD-SCDMA Drive Cellular Baseband Growth in Q2 2013
• Nintendo 2DS Adopts DMP's graphics IP core
• Silicon Motion Introduces the SM3267 Ultra High-Performance, Cost-Effective USB 3.0 Controller
• New DINI Two Chip Altera Stratix V Board for High-Speed, Low-Cost, ASIC Prototyping

Headlines for Friday Oct. 11, 2013

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Mobile IC Vendors to Alter Automotive SoC Market

Many automotive IC companies -- from newcomers Broadcom, Qualcomm, and Nvidia, to incumbents like Renesas, STMicroelectronics, Infineon, and Freescale -- are racing to dominate the fast-growing segment of in-vehicle infotainment SoCs.

• Shikino Initiative to Commence Licensing of New High-speed JPEG Codec IP to Obtain Ultra-high Definition Images
• Changing SoC Landscape Goes Further up the Supply Chain
• Kay Chai Ang Appointed Socle's New Chairperson

Headlines for Thursday Oct. 10, 2013

Top Story

CAST Introduces H.264 Video Over IP Subsystem to Simplify Video Streaming Product Development

The new H264OIP-HDE Subsystem integrates three IP cores available from CAST: the H.264 High Profile Video Encoder (H264-HP-E) core for high-quality video compression, and the RTP and UDP/IP hardware stacks for encapsulating video for Internet Protocol transmission.

• ARM Opens New Design Center in Noida, India
• Cadence Introduces New Family of Silicon-Proven High Performance Data Converter IP for Advanced 28nm Node
• Cadence Offers Industry’s First Licensable Audio DSP IP Supporting Dolby Digital Plus with DS1
• Cadence Offers Industry's First IP Core Solution Supporting DTS Neural Surround
• Silicon Labs Launches the World's Most Energy-Friendly MCUs Based on the ARM Cortex-M0+ Core
• Mentor Graphics Delivers Emulation Solutions for the Verification of HDMI 2.0 Products
• Constellations Organizes New Technical Track at Semico IMPACT Conference: Focus on the IP Ecosystem

Headlines for Wednesday Oct. 09, 2013

• TSMC September 2013 Revenue Report
• Cadence Introduces Spectre XPS, A New FastSPICE Simulator Delivering Up To 10X Faster Throughput
• UMC Reports Sales for September 2013
• Imperas Provides Comprehensive ARM TrustZone Modeling Kit For OVP-Based Virtual Platforms
• Alizem signs with the Canadian Space Agency to offer new embedded Motor Control Software IP

Headlines for Tuesday Oct. 08, 2013

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Avery Design Systems Announces UFS Host Controller UFSHCI Verification Solution

Avery Design Systems today announced availability of its UFS Host Controller Interface (JESD223 UFSHCI) verification solution supporting the latest embedded mobile storage solutions comprised of MIPI UniPro and M-PHY, and JEDEC UFS specifications.

• Bank Card IC Products Adopting SMIC eEEPROM Platform Certified by China Union Pay
• New Xilinx Virtex-7 FPGA VC709 Connectivity Kit Accelerates Design Productivity for High-Bandwidth Applications
• MIPI Alliance Introduces Enhanced UniPro and M-PHY Specifications
• Mediatek Extends Partnership with ARM to Drive Next-Generation Mobile and Consumer Technology
• EnSilica and Kili Technology collaboration delivers FIPS-compliant secure processor IC

Headlines for Monday Oct. 07, 2013

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Arasan Chip Systems Announces Industry First M-PHY 3.0 Total IP Solution

Arasan today announced the availability of the industry’s first MIPI® M-PHY® 3.0-compliant IP supporting multiple speed gears and a broad range of high-speed interfaces for mobile applications.

• Intel Tackles SoC With Quark
• Imagination and Rightware enter multi-year strategic partnership
• Vivante Unveils Less than 1 mm2 OpenGL ES 2.0 GPU for Wearables and Internet of Things (IoT) Devices
• Altera Supports China Mobile Research Institute in Developing Next-Generation Wireless Networks
• Standards-Essential Patents Under Fire
• GUC Monthly Sales Report -- September 2013
• Digital Core Design Announces SPI master slave enhanced with detectors

Headlines for Friday Oct. 04, 2013

• Global Semiconductor Sales Increase for Sixth Straight Month in August
• SMIC IP R&D Center Applies EDA Solution of Beijing Empyrean
• DINI Group Now Shipping HDMI Video Processing Platform for ASIC Prototyping
• Analog Drives Processor Architecture
• Digital Blocks Announces the AMBA Multi-Channel DMA Controller IP Core

Headlines for Thursday Oct. 03, 2013

Top Story

Pure-Play Foundries Spending Big on Capital Equipment

Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

• KnCMiner Announces Word's first 28nm Bitcoin mining machine
• CEVA, Inc. Announces Preliminary Third Quarter 2013 Revenues
• Faraday Announces the Expansion of its Manufacturer Representative Network for Eastern and Central US and Canada
• SEMI Announces Silicon Wafer Shipment Forecast

Headlines for Wednesday Oct. 02, 2013

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3rd Party Semiconductor IP CAGR to Exceed 19% from 2013 to 2017

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.

• JEDEC Announces Publication of e.MMC Standard Update v5.0
• TSMC Shows Path to 16nm, Beyond
• Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions
• Synopsys Selected as TSMC's 2013 "Interface IP Partner of the Year" for Fourth Consecutive Year

Headlines for Tuesday Oct. 01, 2013

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PLDA announces enhanced SR-IOV support in their XpressRICH3 PCI Express Gen3 IP Solution, providing up to 512 virtual functions on a single PCIe instance

PLDA announced enhanced support of SR-IOV (single root I/O virtualization) within their XpressRICH3 PCI Express Gen3 IP solution, enabling customers to deploy virtualized applications more quickly and efficiently directly from within the PCI Express interface.

• GEO Deploys Mixel MIPI solution in its Geometric Processing IC for Ultra-Wide Angle Cameras
• Latest Synopsys Virtualizer Release Accelerates Creation and Deployment of VDKs for Software Development
• New automated online multi-project wafer quote system delivers instant pricing
• Andes Leads The Industry by Reducing Power Consumption for New Embedded Devices
• Analog Bits Announces New Family of Secure IP Subsystems
• The Growing Need for On-Chip PVT Die Monitoring Solutions
• ARM Servers Aim Higher Despite Currrent Miniscule Market
• Broadcom Completes Acquisition of LTE-Related Assets from Affiliates of Renesas Electronics Corporation