D&R Headline News (December 2013)

Headlines for Tuesday Dec. 31, 2013

• Imagination Will Benefit From Intel, Broadcom Share Gains

Headlines for Monday Dec. 30, 2013

Top Story

GUC and M31 Technology Bundle USB 3.0 Peripheral Device Controller and PHY IP

GUC and M31 Technology today unveiled a combination USB 3.0 IP that bundles GUC’s Peripheral Device Controller IP and M31 Technology’s PHY IP that is now available on 65/55nm, 40nm, and 28nm process technologies.

• Morega Demonstrates World's First Ultra HD 4K Media Mobility Solution on the ViXS XCode 6400 SoC Platform
• eMemory and SMIC Expand Partnership in eNVM Technical Development
• EDA tools and IP are still design differentiators, says Synopsys
• Could Calxeda reboot after closure?

Headlines for Friday Dec. 27, 2013

• Kilopass Appoints Leslie Landers Vice President of Sales To Accelerate Kilopass' Rapid Expansion

Headlines for Thursday Dec. 26, 2013

Top Story

Sidense 1T-OTP Memory Macros meet JEDEC Accelerated Testing Qualifications at Two TSMC 28nm Process Nodes

Sidense today announced that its SHF Non-Volatile Memory (NVM) macros have met stringent JEDEC accelerated testing requirements for TSMC’s 28HPM and 28HPL process nodes.

Headlines for Tuesday Dec. 24, 2013

• Altera CEO Upbeat After Tough 2013
• Cadence Showcases IP for Mobile, Home Entertainment and Automotive Markets at CES 2014
• Lattice Begins Shipping MachXO3 FPGAs
• Tektronix Communications Completes Strategic Acquisition of Newfield Wireless

Headlines for Monday Dec. 23, 2013

Top Story

Intel Seeks Big Slice of Microservers

Chipmaker Intel is looking to become the market leader in the burgeoning microserver segment that has become very prominent thanks to cloud computing and Internet services. However, as the company pushes its Xeon and Atom based offerings, analysts see chinks in its armor that a handful of ARM-based SOCs will look to exploit in 2014.

• When Is Verification Done?
• T&VS gets ISO 9001:2008 accreditation
• Micron Q3 Revenue Soars After Elpida Deal Officially Closes

Headlines for Friday Dec. 20, 2013

Top Story

ARM server chip pioneer Calxeda shuts down

One of the first companies that announced an ARM server chip, Calxeda, has folded operations and is now pursuing ways to repurpose or sell its intellectual property.

• TowerJazz Signs Definitive Agreement Creating Joint Venture with Panasonic Corporation to Acquire its 3 Semiconductor Factories in Japan and to Manufacture Panasonic and Additional Products
• Smartphone Apps Processor Market Grew 31 Percent in Q3 2013
• CAST Partners with Silesia Devices for Superior 8051 Microcontroller IP Cores
• Semiconductor equipment back on track
• Cryptography Research and Riscure Certify Broadcom as First-Ever DPA-Resistant Set-top Box SoC
• North American Semiconductor Equipment Industry Posts November 2013 Book-to-Bill Ratio of 1.11

Headlines for Thursday Dec. 19, 2013

Top Story

Uniquify and HashFast Announce Working Silicon for Bitcoin Mining Chip at TSMC 28HPM Process Node

Uniquify and HashFast Technologies today confirmed that first silicon of HashFast’s Golden Nonce bitcoin mining application specific integrated circuit (ASIC) is working and exceeding expectations after completing TSMC fabrication at the leading-edge 28HPM process node.

• STMicroelectronics Joins ARM mbed Project
• Sequans adopts Imagination's MIPS Aptiv CPUs for next-generation LTE products
• Server Market Gets a Boost From New Microserver Segment
• Kyocera Document Solutions Selects Forte Design Systems SystemC-Based High-Level Synthesis, Replacing Competitive Tool Unable to Meet QoR, Performance, Other Metrics
• DTS-HD Decoder Now Available on Cadence Tensilica HiFi DSP Cores
• Fortemedia Launches Highly Integrated Voice Processor For Automotive Applications

Headlines for Wednesday Dec. 18, 2013

Top Story

videantis joins Khronos, targets OpenVX computer vision API

videantis today announced it has joined the Khronos Group to bring support for the OpenVX™ computer vision acceleration API to its low power, licensable v-MP4000HDX processor architecture.

• Faraday Technology -- Strengthening the ASIC Design Service Sales Network in The West Coast
• Mentor Graphics Acquires Oasys RealTime to Bring RTL Synthesis to its Digital Implementation Flow

Headlines for Tuesday Dec. 17, 2013

Top Story

Blu Wireless combines Imagination's MIPS Aptiv CPUs in groundbreaking 60GHz System IP for WiGig and backhaul markets

Imagination Technologies and Blu Wireless Technology are sharing details of Blu Wireless’ new HYDRA baseband technology for efficient multi-gigabit wireless processing. The ground-breaking technology leverages multiple MIPS Aptiv processors together with HYDRA vector DSP technology in a unique heterogeneous multiprocessing architecture targeting the burgeoning 60GHz space.

• Mindspeed Boosts Intel Baseband Play
• Achronix Demonstrates Embedded 100G Ethernet in Speedster22i 22nm FPGAs
• MagnaCom Demonstrates a 20 year Leap in Digital Communications
• New digital radio chip targets smart devices and global markets
• Xylon Releases the Reference logicBRICKS Graphics Processing Unit (GPU) Design for Xilinx Zynq-7000 AP SoC based inrevium Extension Microcontroller Card from Tokyo Electron Device, Ltd.
• eInfochips Announces Gemini Initiative to Accelerate Designs with ARM CPUs and GPUs by 2015
• WiLAN Enters into Patent Agreement with Panasonic
• Avago/LSI Points to Maturing Industry
• LPDDR4 Remains a Work In Progress
• Altium announces new release of TASKING C compiler for Power Architecture

Headlines for Monday Dec. 16, 2013

Top Story

Avago Technologies to Acquire LSI Corporation for $6.6 Billion in Cash

Avago Technologies and LSI Corporation today announced that they have entered into a definitive agreement under which Avago will acquire LSI for $11.15 per share in an all-cash transaction valued at $6.6 billion. The acquisition creates a highly diversified semiconductor market leader with approximately $5 billion in annual revenues by adding enterprise storage to Avago's existing wired infrastructure, wireless and industrial businesses.

• Synopsys Extends HAPS-70 Prototyping Family with New Solution Optimized for IP and Subsystems
• Google: Street Debates Possible ARM Push, Threat to Intel
• MagnaChip and eMemory to offer 0.18um EEPROM IP
• Fujitsu Semiconductor Successfully Embeds Flash Memory onto DDC Technology
• Dolphin Integration launches new AHB compliant Cache controller to meet growing demand for both energy efficient and faster SoC with NVM
• PCI-SIG Releases PCI Express M.2 Specification Revision 1.0
• Frontier Silicon and Imagination extend partnership to deliver integrated, single-chip solution for global digital radio
• Imagination and ST Microelectronics cooperate to deliver innovative digital radio receiver solution for automotive
• Is Micron a Ripe Acquisition Target?
• Silicon Image Introduces Industry's First MHL 3.0 4K Ultra HD Solution for Mobile Devices
• Mindspeed Announces Definitive Agreement to Sell Assets of Its Wireless Infrastructure Unit to Intel

Headlines for Friday Dec. 13, 2013

Top Story

ARM Acquires Geomerics

ARM today acquired Geomerics, the leader in lighting technology for the gaming and entertainment industries. The acquisition expands ARM’s position at the forefront of the visual computing and graphics industries. Additionally, the agreement enables Geomerics to build on their existing partnerships as well as accelerate their development in mobile.

• New technology consortium formed to develop innovative integrated Bluetooth Low Energy modules for SMEs
• Undo Software brings reversible debugging to ARM processors and Android Native

Headlines for Thursday Dec. 12, 2013

Top Story

Gartner Says the Internet of Things Installed Base Will Grow to 26 Billion Units By 2020

The Internet of Things (IoT), which excludes PCs, tablets and smartphones, will grow to 26 billion units installed in 2020 representing an almost 30-fold increase from 0.9 billion in 2009, according to Gartner, Inc.

• Yield And Reliability Issues With Integrating IP
• Can Intel Dethrone The Foundry Giants?
• High-Speed Wireless Devices to Surge in Shipments, Thanks to Multistream Wi-Fi, WiGig and Other Similar Technologies
• Brushless DC motor control solutions by Micronas now additionally powered by ARM Cortex-M3 Processor

Headlines for Wednesday Dec. 11, 2013

• Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband
• Europe is giving up on leading edge digital chip design
• Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
• Imagination Technologies - Interim Results for the six months to 31 October 2013
• DELTA Microelectronics Teams with RacyICs for 28nm ICs

Headlines for Tuesday Dec. 10, 2013

Top Story

Arasan Chip Systems Announces 64-bit Compatible Interface IP for Mobile Storage

Arasan announced today the availability of compatible mobile storage interfaces for 64-bit processors, using system host interfaces AHB, AXI or OCP. Compatible standards include: SD 3.0, SD 4.0, SDIO 3.0, SDIO 4.0, eMMC 4.51, eMMC 5.0, ONFI 3.2, and UFS 2.0.

• Xilinx Doubles Industry's Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead
• Synopsys Demonstrates Industry's First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer
• DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP
• Xilinx 20nm All Programmable UltraScale Portfolio Now Available with ASIC-class Architecture and ASIC-strength Design Solution
• Qualcomm Technologies Introduces Snapdragon 410 Chipset with Integrated 4G LTE World Mode for High-Volume Smartphones
• SEMI Reports Third Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings $7.65 Billion
• UMC Reports Sales for November 2013
• Rambus and Micron Sign License Agreement
• TSMC November 2013 Revenue Report
• Arrow Devices announces PDA, a revolutionary new debugging tool

Headlines for Monday Dec. 09, 2013

Top Story

Abilis Systems Achieves First-Pass Silicon Success with DesignWare ARC Processors, Interface IP and Synopsys Professional Services

Synopsys today announced that Abilis Systems has achieved first-pass silicon success with its TB100 8-channel broadcast-to-IP secure media processor using a broad set of Synopsys design solutions including DesignWare® ARC® Processors, Interface IP, Embedded Memories with integrated test and repair, Lynx Design System and Professional Services.

• KALRAY launches MPPA BOARD EMB01, its first MPPA-based embedded board
• Tabula Announces Availability of Stylus Compiler Version 2.8.1

Headlines for Friday Dec. 06, 2013

Top Story

Kilopass XPM Non Volatile Memory IP Validated on IBM 45nm SOI Process Successfully Passing JEDEC 47 Testing to Assure 10-Year Operating Life

Kilopass today announced that its anti-fuse XPM (eXtra Permanent Memory) NVM IP has been validated “Ready for IBM Technology” in the IBM 45nm SOI (Silicon on Insulator) process. By successfully completing JEDEC 47 standard qualification on the IBM 45nm SOI process with no failures, Kilopass XPM NVM IP assures system on chip (SoC) designers of at least 10 years of operating life.

• 2014 Will Be The Year That ARM Breaks The x86 Monoculture
• GUC Monthly Sales Report - November 2013
• BittWare and PLDA Partner to Deliver 10G Low Latency TCP Offload, UDP and PCIe IP Cores on Altera Stratix-based Hardware

Headlines for Thursday Dec. 05, 2013

Top Story

Bridge Crossing LLC Announces Sale of Patents Purchased From MIPS Technologies

Allied Security Trust (AST) announced today that Bridge Crossing LLC, a company affiliated with AST, will sell the patents and patent applications it purchased on February 7, 2013 from MIPS Technologies, Inc.

• Imagination Technologies and Express Logic partner to expand already broad ThreadX RTOS support for MIPS CPUs
• Heterogeneous computing also includes DSP
• Cellphones Pass PCs as Biggest Systems Market and IC User
• CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC Design
• Updated Bluetooth 4.1 Extends the Foundation of Bluetooth Technology for the Internet of Things
• Broadcom Announces Bluetooth Smart SoC with Wireless Charging Support for Growing Wearable Market
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2013
• Global Semiconductor Sales Increase in October; Industry on Track for Highest-Ever Annual Sales in 2013

Headlines for Wednesday Dec. 04, 2013

Top Story

Next Generation USB Connection Definition Underway

The USB 3.0 Promoter Group today announced that the development of the next generation of USB connector has begun. The new USB Type-C connector, built initially on existing USB 3.1 and USB 2.0 technologies, is being developed to help enable thinner and sleeker product designs, enhance usability and provide a growth path for performance enhancements for future versions of USB.

• Elliptic Technologies Announces Hardware Enforced End-to-End Content Protection for Microsoft PlayReady
• XMOS plans expansion on the back of strong revenue growth and new funding
• Gartner Says Worldwide Semiconductor Revenue Grew 5.2 Percent in 2013
• Bluetooth Smart radio with record battery lifetime
• Semiconductor Sales Recover in 2013; Micron Surges to Fourth Place in Global Chip Market

Headlines for Tuesday Dec. 03, 2013

Top Story

ARM Accelerates Time to Market for Safety Certified Applications

ARM® today announced the ARM Compiler Qualification Kit, a documentation package specifically designed to help developers achieve certification against safety standards such as IEC 61508 and ISO 26262.

• Rockchip and Analogix Team Up on SlimPort Mobile Development Platforms
• Sequans and Huawei Collaborate to Advance LTE Broadcast Technology
• 2013 Semiconductor Equipment Sales Forecast $32 Billion; Strong Growth Forecast for 2014

Headlines for Monday Dec. 02, 2013

Top Story

DCD's HDLC/SDLC controller aims telecommunication

Digital Core Design has introduced its latest soft IP Core, the DHDLC. It’s been designed to control HDLC/SDLC transmission frame and optimized for great variety of 8, 16 and 32-bit MCUs.

• If Intel Bought MediaTek, ARM Would Be a Short
• NXP Semiconductors and Datang Telecom to Establish First True Chinese Automotive Semiconductor Company
• Altera Enables Immediate 20 nm Design Starts with Quartus II Software Arria 10 Edition
• Real Intent Delivers Next Release of Meridian Constraints for Advanced Sign-off of SoC Designs