D&R Headline News (June 2014)

Headlines for Monday Jun. 30, 2014

Top Story

Crossbar Unveils Major Technical Innovation Behind Terabyte Storage-on-a-Chip

Crossbar, Inc., a start-up company pioneering 3D Resistive RAM (RRAM) technology, today disclosed further details behind its revolutionary non-volatile RRAM technology. The company announced it has demonstrated pre-production 1MB arrays using its patented “1TnR” (1 Transistor driving n Resistive memory cells) selectivity for read/write operations, representing a critical milestone toward commercializing terabyte scale memory arrays on a postage stamp size chip.

• Silicon Highway Narrows, Twists
• Altera SDK for OpenCL Development Flow Delivers Prototypes in Minutes
• Arteris Announces Marvell has Licensed FlexNoC Interconnect Fabric IP
• Andes Technology and M31 Technology Cooperate in Building UP Optimized CPU Solution
• Electronics growth positive around the world

Headlines for Friday Jun. 27, 2014

• Actions Semiconductor Licenses ARM Cortex-A50 Processor Family to Target 64-bit Tablet Market

Headlines for Thursday Jun. 26, 2014

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Arasan Chip Systems Announces Availability of MIPI M-PHY 3.0 Gear 3 IP in UMC40LP

-PHY 3.0 Gear 3 on UMC40LP joins the list of process node options, available from Arasan for customers designing UFS 2.0. The PHY has achieved 5.85Gbps performance, with BER smaller than 1E-10.

• Imagination Reports Increased Traction for Ensigma 802.11ac Wi-Fi IP Cores as More Companies Bring Connectivity On-Chip
• R&D Crisis Ahead?
• Dialog Semiconductor AMS Statement Regarding Possible Merger of Equals of Dialog Semiconductor and AMS
• PLDA and KAYA Instruments announce a tested high performance CoaXPress system based on PCIe Kintex-7 FPGA Board.
• mCube Closes $37M Series C Financing Round
• Synapse Design tapes out 33 SOCs in 12 months
• Corelis Introduces Semiconductor Validation Tool to Help Identify Counterfeit Components
• INSIDE Secure to deliver advanced DRM technology for protection of premium content on Intel-based mobile devices running Android
• Mentor Graphics Veloce Emulation Platform Allows Inuitive to Achieve First-Pass Silicon Success

Headlines for Wednesday Jun. 25, 2014

Top Story

IC Manufacturers Close or Repurpose 72 Wafer Fabs from 2009-2013

Semiconductor manufacturers closed 72 wafer fabs between 2009-2013 and another nine fabs are slated to close in 2014, according to data recently compiled, updated, and now available in IC Insights’ Strategic Reviews online database and the Global Wafer Capacity 2014 report.

• Intel Follows Qualcomm Down Neural Network Path
• MOSCAD Design & Automation Releases Ultra low-power Voltage regulator cell in 55nm

Headlines for Tuesday Jun. 24, 2014

Top Story

Synopsys Announces Immediate Availability of Broad Portfolio of IP for TSMC 28HPC Process

The DesignWare IP portfolio for the TSMC 28HPC process delivers high performance with low leakage and active power in a compact footprint, giving designers the ability to optimize their mobile and internet-of-things (IoT) SoC designs for energy efficiency, area and speed.

• LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor
• ARM and Sensor Platforms Deliver an Open Source Framework for Sensor Devices
• Accellera Systems Initiative Releases UVM 1.2
• Avago Technologies Limited to Acquire PLX Technology, Inc. for $6.50 per Share in Cash
• Samsung licenses Apical's Assertive Display for next-generation Exynos processors
• Xilinx Virtex-7 FPGA Solution to be Deployed in NEC's iPASOLINK Millimeter Wave Communication Systems
• Spreadtrum Launches Highly Integrated Quad-core Smart Phone Platform Using 28nm Process
• SMIC Establishes the First 12 inch CIS Supply Chain in China
• Ultra-low Latency HFT Options Trading System Goes Live
• Full Year Results Statement FY2013-14 - Imagination Technologies

Headlines for Monday Jun. 23, 2014

Top Story

AppliedMicro Announces Readiness of 64-bit ARM-Based Server SoC for High Performance Computing

AppliedMicro today announced the readiness of the X-GeneTM Server on a Chip™ based on the 64-bit ARMv8-A architecture for High Performance Computing (HPC) workloads.

• Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
• Intel to Package FPGA with Xeon Processor
• NVIDIA GPUs Open the Door to ARM64 Entry Into High Performance Computing
• Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes
• Russian government telegraphs move to ARM
• Altera and Cavium Deliver Pre-Verified Packet Classification Solution for Networking Appliances
• Medella Health Selects DELTA's RFID Chip for Wearable Device
• DMP Joins Altera's Design Services Network Program
• Xilinx and Pico Computing Announce Industry's First 15Gb/s Hybrid Memory Cube Interface
• KALRAY announces world's most efficient manycore PCI Express board for intensive computing application at ISC 2014

Headlines for Friday Jun. 20, 2014

• SoftIron Announces the World's First Production 64-bit ARM-Based Enterprise Server Motherboard Using X-Gene Technology

Headlines for Thursday Jun. 19, 2014

Top Story

Barco Silex announces new AES-GCM core supporting up to 100 Gbps with optimized area

Barco Silex announced today the new AES-GCM (BA415) IP core for 10 to 100 Gbps applications. The AES-GCM (Galois Counter Mode) is an authenticated encryption algorithm which combines the AES counter mode for encryption and the Galois field multiplier for the authentication.

• Why MIPS? Imagination Makes Its Case
• GigOptix, Inc. to Acquire Tahoe RF Semiconductor, Inc.
• North American Semiconductor Equipment Industry Posts May 2014 Book-to-Bill Ratio of 1.00
• Qualcomm for ARM? Intel for MediaTek? Pondering Chip M&A
• EEMBC Tames the Wild, Wild World of Android Benchmarking

Headlines for Wednesday Jun. 18, 2014

Top Story

New High Performance, Low-Power ADC Designs from Teledyne DALSA's IC Design Group

Since integrating with the Teledyne DALSA family, our IC group (formerly Axiom IC) in Enschede, The Netherlands, has been hard at work creating new high performance mixed circuits and systems. We are pleased to announce the availability of our latest advances: low power high-resolution sigma-delta analog-to-digital converters for mobile applications.

Headlines for Tuesday Jun. 17, 2014

Top Story

Altera Programmable Logic is Critical DNA in Software Defined Data Centers

Altera announced today that its FPGAs are central to software defined data center (SSDC) development, and that Altera is working with Microsoft Research and Bing to accelerate portions of the web search engine.

• Better, Faster, Cheaper... What's Next for Embedded NVM?
• Digital Blocks Extends its I2C Controller IP Core Family with More Enhanced Capabilities & System-Level Features

Headlines for Monday Jun. 16, 2014

Top Story

ARM University Program and Partners Launch DSP 'Lab-in-a-Box' for Audio Systems

ARM® and its Partners will start shipping a digital signal processing (DSP) 'Lab-in-a-Box' (LiB) to universities worldwide to help boost practical skills development and the creation of new ARM-based audio systems. This will include products such as high definition home media and voice-controlled home automation systems. The LiB kits contain ARM Cortex®-M4-based microcontroller boards by STMicroelectronics and audio cards from Wolfson Microelectronics and Farnell element14.

• Mobiveil Joins eASIC eZ-IP Alliance Program
• Cadence Completes Acquisition of Jasper Design Automation
• Altera and Lime Microsystems Team Up to Accelerate and Simplify the Development of Wireless Networks
• Crossbar, Inc. Names Ron Richter VP of Sales
• Elbit Systems deploys Aldec DO-254/CTS and Passes EASA Verification Audit for Level A System
• INSIDE Secure closes agreement with Intel on new NFC technology and IP license

Headlines for Friday Jun. 13, 2014

Top Story

Comcores Delivers Ultra-fast Common Public Radio Interface (CPRI) v.6.0 Intellectual Property enabling the next generation of silicon devices for LTE-Advanced

Comcores today announced the immediate availability of a low-size and low-power Common Public Radio Interface (CPRI) v6.0 IP solution targeting both Radio Equipment (RE) and Radio Equipment Controller (REC) modules

• Intilop releases a Series of 10G bit TCP & UDP Accelerators with 16K Concurrent Sessions and with unlimited rolling Sessions

Headlines for Thursday Jun. 12, 2014

• PLDA and GUC Announce a tested and reliable PCIe Controller and PHY combination, optimized for storage applications
• Tela Resolves Patent Dispute with Google and Pantech

Headlines for Wednesday Jun. 11, 2014

Top Story

Rambus Cryptography Research Division Unveils CryptoManager Secure Feature Management Platform

Rambus today announced the CryptoManager™ platform, a feature management solution developed by the Rambus Cryptography Research (CRI) division. The CryptoManager platform consists of both a Security Engine and an Infrastructure suite that can dramatically improve efficiency and security during the manufacturing process.

• Qualcomm Licenses Rambus CryptoManager Key and Feature Management Security Solution
• Rambus Signs Comprehensive License Agreement with Qualcomm
• Qualcomm Introduces High-Performance, Cost-Effective Small Cell System-on-Chip for SMB and Neighborhood Access Points for Expanding Network Capacity and Coverage
• Is the DRAM Average Selling Price Surge Over?
• Rambus Updates Second Quarter Guidance

Headlines for Tuesday Jun. 10, 2014

Top Story

Semtech Announces Hybrid Memory Cube Compliant PHY IP

Semtech today announced the company has successfully completed electrical compliance testing of its Snowbush® 28nm Platform Physical Layer IP, in support of the Hybrid Memory Cube (HMC) specification for ultra fast, next-generation memory.

• SEMI Reports First Quarter 2014 Worldwide Semiconductor Equipment Figures; Billings US$10.15 Billion
• TSMC May 2014 Revenue Report
• ON Semiconductor to Acquire Aptina Imaging

Headlines for Monday Jun. 09, 2014

• UMC Reports Sales for May 2014

Headlines for Friday Jun. 06, 2014

• Industry veteran Tony Picard joins videantis as sales VP
• GUC Monthly Sales Report - May 2014
• Digital Blocks Releases 2nd Generation DB9200 Graphics Engine Verilog IP Core Targeting Hardware Accelerated Graphics Display Applications

Headlines for Thursday Jun. 05, 2014

Top Story

PCIe Preps for Internet of Things

The PCI Special Interest Group is exploring ways it can expand use of its interconnect in the Internet of Things and SoCs. Meanwhile, the PCI-SIG is moving ahead with its 16 GTransfer/s PCI Express Gen 4 and other specifications driving the link's current use primarily in servers.

• SmartDV Opens US Office, Demonstrates Verification IP Portfolio at 2014 Design Automation Conference
• Chips&Media and Realtek Expand Collaboration on Industry's First Hardwired Ultra High Definition HEVC SoC
• SMIC and Brite Creates New Network Platform SMIC-ASIC.com
• Turning Intel Inside Out-Big Changes Reshape MPU Giant
• Kyma Systems Selects Imperas Virtual Platform Tools for Hypervisor Development
• Global Semiconductor Sales Increase in April; Sustained Growth Projected for 2014 and 2015

Headlines for Wednesday Jun. 04, 2014

Top Story

Semtech Adds New Ultra-low Power, Ultra-low Latency PCI Express 3.0 PHY to Snowbush IP Platform for Expanding Storage and Server Markets

Semtech today announced the addition of a new PCI Express® (PCIe®) 3.0 PHY IP Platform offering, part of the Snowbush® IP family, optimized for low power and low latency. Building on 14 successful PCIe 3.0 specification customer product tape-outs at 40nm, and six PCIe 3.0 specification customers on TSMC 28nm process, this new offering provides customers with lowest power and lowest latency, while meeting the reach requirements of compliance for PCI Express channels.

• Synopsys, STMicroelectronics and Samsung Collaborate to Accelerate Adoption of 28-nm FD-SOI Technology for SoC Design
• Cadence and Intel Collaborate to Enable a 14nm Tri-gate design Platform for Customers of Intel Custom Foundry
• Argon Streams licensed to Imagination Technologies
• Scaleo chip and GLOBALFOUNDRIES Announce First Automotive MCU Manufactured Using 55nm Automotive-Specific Semiconductor Platform
• Aviacomm adopts M31 MIPI M-PHY IP for 4G-LTE RF transceiver solutions for mobile devices

Headlines for Tuesday Jun. 03, 2014

Top Story

Broadcom to Explore Strategic Alternatives for Cellular Baseband Business

Broadcom today announced it is exploring strategic alternatives for its cellular baseband business, including a potential sale or wind-down. The company has engaged investment bank JP Morgan in connection with its efforts.

• Synopsys Expands Verification IP Portfolio with Memory Models
• Synopsys Bridges Design and Verification with Next-Generation Static and Formal Technology for Verification Compiler
• Mentor Graphics Tools Fully Enabled on Intel's 14nm Processes for Customers of Intel Custom Foundry
• VESA Releases DockPort Standard
• Cavium Introduces ThunderX: A 2.5 GHz, 48 Core Family of Workload Optimized Processors for Next Generation Data Center and Cloud Applications
• InterDigital Announces Patent License Agreement With Samsung
• Synopsys and Intel Collaborate to Enable 14-nm Tri-Gate Design Platform for Use by Customers of Intel Custom Foundry
• Truechip Announces First Customer Shipment of USB 3.1 Verification IP Supporting Hardware Emulation Platforms
• Truechip Announces First Customer Shipment of MIPI Unipro Lite for Project ARA members

Headlines for Monday Jun. 02, 2014

Top Story

Synopsys Redefines the IP Supplier Paradigm with New IP Accelerated Initiative

Synopsys today announced the IP Accelerated initiative to help designers significantly reduce the time and effort of integrating IP into their system-on-chips (SoCs). This initiative augments Synopsys' established broad portfolio of silicon-proven DesignWare® IP with the addition of new IP Prototyping Kits, IP Virtual Development Kits and customized IP subsystems to accelerate prototyping, software development and integration of IP into SoCs.

• Mobiveil Targets Altera's Arria V SoCs for Its NVMStor Enterprise SSD Storage Platform
• Silicon Motion Licenses Mobiveil's UNEX NVM Express Controller to Accelerate SoC Design
• Vivante Intros World's First Complete Line of GPUs for Wearables and IoT Starting at 0.3 mm2 (28nm)
• Memoir Systems' Renaissance Memory IP Available on TSMC 16nm FinFET
• Full-Hardware Real-Time H.265 HEVC Video Decoder Core Coming from CAST
• Beken Chooses BA22 Processor to Satisfy Tight Constraints in New Mobile Bluetooth Audio Chip
• How chip makers can regain control of their value chain
• Executive Insight: Grant Pierce
• D16950 - ask for more from UART
• Executive Insight: Hossein Yassaie
• ARM Establishes World-Class CPU Design Center in Taiwan
• Executive Insight: Charles Janac
• Argon Streams Licensed to World Leading Chip Developer
• Samsung and Synopsys Deliver Design Tools and IP for 14-nm FinFET Process
• Samsung's 14nm FinFET Process Technology Ecosystem Solidly in Place for Mobile Consumer and IT Infrastructure SoC Applications
• Deeper Dive - Is IP reuse good or bad?
• Analog Bits Introduces Design Kits for 16nm FinFET Enabling next generation devices with SERDES, Sensors and PLLs