D&R Headline News (July 2014)

Headlines for Thursday Jul. 31, 2014

Top Story

TekStart and Pico Computing Partner to Deliver Hybrid Memory Cube (HMC) Intellectual Property (IP) Solutions for Networking, Computing, and Processing Markets

Pico Computing and TekStart today announced the availability of Hybrid Memory Cube (HMC) Controller Intellectual Property (IP). HMC technology brings greatly expanded bandwidth (up to 240GB/s) to image processing, packet processing, video processing, and other high-performance computing applications.

• eASIC Passes Milestone of Shipping It's Ten Millionth ASIC
• NxGn Data Emerges from Stealth Mode to provide a paradigm shift in enterprise storage solutions
• CEVA, Inc. Announces Second Quarter 2014 Financial Results
• Microchip partners with CSR to offer easy access to Bluetooth® Smart technology
• Red Hat Launches ARM Partner Early Access Program for Partner Ecosystem
• Inphi Announces Definitive Agreement to Acquire Cortina Systems, Inc.
• Airoha Technology Adopts Cadence RTL Synthesis and Test Solution, Reducing Power Consumption by 15 Percent
• Express Logic's X-Ware Eases IoT Development

Headlines for Wednesday Jul. 30, 2014

• Movidius Accelerates the Era of Computational Cameras With a New Vision Processor for Mobile, Wearable and Embedded Markets
• Tiny UWB modules to enable accurate location awareness for more secure connected devices
• eInfochips to Develop NVIDIA GPU-powered Solutions for Aerospace and Defense, Medical Imaging, HPC and Visual Computing

Headlines for Tuesday Jul. 29, 2014

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Cadence Achieves PCIe 3.0 Compliance for PHY and Controller IP

Cadence today announced that its PHY IP and Controller IP for PCI Express® (PCIe®) 3.0 have passed certification tests from PCI-SIG ®. The solutions were tested to their full potential and complied with the full speed of 8GT/s for PCIe 3.0 technology. The compliance assures designers that their system-on-chip (SoC) designs will operate as expected.

• CSRmesh Development Kit accelerates Internet of Things product development
• Michael Noonen and Rodrigo Liang join Kilopass Technology, Inc. Board of Directors
• Xilinx Showcases Smarter Solutions for Data Center Flash Storage and Application Acceleration at Flash Memory Summit 2014
• Silicon Image Appoints New Chief Financial Officer
• eMemory NeoEE SIP Expands Wireless Communication ICs Applications
• Globalfoundries Passes On IBM Chip Business, Says Report
• INSIDE Secure and Gemalto sign a new Single Wire Protocol (SWP) license agreement

Headlines for Monday Jul. 28, 2014

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Analog Unit Shipments Outpacing Growth of All IC Product Segments

The Mid-Year Update shows that between 2013 and 2018, analog unit shipments are forecast to grow at an average annual rate of 8.9%, faster than the 7.2% forecast for the total IC market and faster than all other major IC product categories

• Faraday Reported 2014 Second Quarter Consolidated Results
• ViaSat Gains High-Rate Modem and Design Technologies with Acquisition of Assets of Gray Labs
• Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
• Renesas Achieves 3X Reduction in Chip-Finishing Turnaround Time Using Cadence QuickView Signoff Data Analysis Environment
• IP Integration Challenges Rising
• eSOL's eT-Kernel Real-Time Operating System Evaluation Kit Now Available for Altera SoC

Headlines for Thursday Jul. 24, 2014

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Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0 IP Solution

Innovative Logic together with M31 Technology jointly announce certification completion of its USB 3.0 device controller IP. Inno-Logic’s USB3.0 Device controller along with PHY from M31 Technology successfully passed all compliance tests and received certification from USB-IF in June 2014.

• Ultra-low power 'Whisper' architecture raises the bar for connectivity IP in IoT, wearables and more
• Broadcom cuts 2,500 jobs to exit cellular market
• Cryptography Research and Entropic Sign License Agreement for DPA Countermeasures to Secure Next Generation Content
• eSOL's eT-Kernel RTOS Evaluation Kit Launched for Xilinx Zynq-7000 All Programmable SoC
• Allwinner's first 64-bit tablet processor to hit the market soon
• IP And FinFETs At Advanced Nodes - Part 2

Headlines for Wednesday Jul. 23, 2014

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ARM Mali Video and Display Technology to Power Next Generation of Atmel Devices

ARM announced today it has licensed processor and security IP to Atmel Corporation for use in a wide array of devices requiring image, video and display capabilities. Atmel plans to integrate the newly licensed ARM® technology into silicon targeted at wearable devices and automated factory tasks reliant on image processing such as the identification of faulty products.

• Microsemi Acquires Mingoa
• Android Open-Source for ARMv8-A Starts 64-Bit Avalanche
• Algo-Logic Systems Launches Ultra-Low-Latency Highly Scalable Key/Value Search (KVS) Solution for Datacenters
• ASSET and SoftIron collaborate on rapid debugging for 64-bit ARM-based enterprise servers using AppliedMicro's X-Gene technology
• Mobile Uptick Ahead, Says ARM
• Xilinx Announces Q1 Fiscal 2015 Results; EPS $0.62
• Failed merger talks won't stop Dialog

Headlines for Tuesday Jul. 22, 2014

Top Story

Sonics Upgrades Flagship On-Chip Network to Improve Memory Subsystem Support and Quality of Service

Sonics today introduced a major upgrade of its SonicsGN™ on-chip network intellectual property (IP) that improves support for memory subsystems and provides higher performance with guaranteed bandwidth allocation across multiple system-on-chip (SoC) flows.

• IMAGIS chooses Cortus APS1 Processor for Touchscreen Solutions
• ARM Holdings plc Reports Results for the Second Quarter and Half Year Ended 30 June 2014
• North American Semiconductor Equipment Industry Posts June 2014 Book-to-Bill Ratio of 1.09
• Rambus Reports Second Quarter Financial Results
• 25G Ethernet on Tap at IEEE
• Cadence Reports Second Quarter 2014 Financial Results
• Silicon Image Announces New MHL 3.0 Design Win in nubia's Flagship nubia Z7 Smartphone
• Uniquify Offers DDR Memory IP Webinar Series
• I-TEN wins the Electron d'or Award 2014 for the start up of the year

Headlines for Monday Jul. 21, 2014

Top Story

XMOS adds Bosch, Huawei and Xilinx as strategic investors to complete $26M investment round

XMOS Ltd. the fabless semiconductor company and leader in intelligent multicore microcontrollers, has today announced the completion of a $26.2m Series-D investment round, adding Robert Bosch Venture Capital GmbH of Germany, Huawei Technologies, a leading global information and communications technology (ICT) solutions provider and Xilinx Inc. from the USA as strategic investors in the company

• Has Intel's Technological Lead Exhausted?
• Faraday Selects Silicon Creations PLL Silicon IP for SoC Design
• What Happened To 450mm?
• eASIC Appoints Richard Deranleau as Chief Financial Officer
• Altera Joins the Embedded Vision Alliance
• Sibridge Technologies Adds MIPI to its Verification IP portfolio
• SMIC Revises Up Second Quarter 2014 Gross Margin Guidance
• OFDM Baseband Processor by Noesis Technologies

Headlines for Friday Jul. 18, 2014

• Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification
• New style for Dolphin Integration website

Headlines for Thursday Jul. 17, 2014

Top Story

TSMC to Fall Behind Rivals in FinFET Market Share

Morris Chang, chairman of foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan), has told analysts that his company would likely fall behind a "major competitor" in foundry market share for 16nm/14nm FinFET node in 2015, but would then go on to be market leader at 16nm/14nm in 2016 and subsequent years.

• Nitero Introduces NT4600 - The First End-to-End IEEE 802.11ad Solution Built from the Ground up for Mobile Applications
• Renesas Electronics Intellectual Property for Capacitive Touch Sensing Delivers Industry-Leading Performance for Human Machine Interface Applications
• Mentor Graphics Launches Comprehensive Solution for Heterogeneous Multicore Embedded Software Development
• Asia-Pacific Forecast to Strengthen Its Grip on Global ASIC Marketshare

Headlines for Wednesday Jul. 16, 2014

Top Story

Imagination introduces industry's smallest Android GPU solution

Imagination Technologies (IMG.L) announces a new PowerVR graphics processor IP core that provides the industry’s smallest Android compatible GPU solution. This latest addition to the line-up at an incredibly small 0.55mm2 (250MHz in 28nm) silicon footprint features full OpenGL ES 2.0 capability, ultra-low power consumption, and Imagination’s advanced PVRTC texture compression technology.

• The Automotive Infotainment segment is mirroring the smartphone ecosystem: Guru Ganesan, Managing Director, ARM India
• EDA Consortium Reports Revenue Increase For Q1 2014
• TSMC Reports Second Quarter EPS of NT$2.30
• Tablet Apps Processor Revenue Grew 30 Percent in Q1 2014 says Strategy Analytics
• Ricoh Cuts Parasitic Extraction Design Closure Time in Half Using Cadence Quantus QRC Extraction Solution
• IBM Preps for Post-Silicon Era

Headlines for Tuesday Jul. 15, 2014

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VeriSilicon Introduces Hantro H2 HEVC Encoder Semiconductor IP

VeriSilicon today announced its next-generation Hantro H2 HEVC video encoder IP. Hantro H2 builds on the success of VeriSilicon’s Hantro H1 encoder IP, bringing ultra-high definition (UHD) and 4K resolution video encoding capability to the HEVC video format.

• Intel's Mobile Losses Mount
• Introducing Thread: A New Wireless Networking Protocol for the Home
• Dolphin Integration announce the availability of new ROM TITAN and ultra low leakage standard cell library SESAME BIV at TSMC 55 nm LP eFlash
• IP-Maker targets FPGA-based data center storage applications
• Emulex Accelerates Verification Closure with Synopsys Verification IP for Ethernet
• MediaTek Launches 64-bit True Octa-core LTE Smartphone SoC with World's First 2K Display Support
• Ridgetop Group to Provide High Resolution ADC IP to ON Semiconductor
• Kilopass Appoints Pioneer NVM Developer Christophe Chevallier Vice President of Engineering to Drive Kilopass NVM Memory Enablement
• Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET
• Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy

Headlines for Monday Jul. 14, 2014

Top Story

Apple begins receiving shipments of A-series processors from TSMC - report

Following years of rumors, chipmaker Taiwan Semiconductor Manufacturing Co. has begun production of Apple's A-series processors and the chips are now making their way to assembly plants, according to a Thursday morning report from Hong Kong

• After Moore's Law: More With Less
• Former NetLogic CEO and Broadcom Executive, Ron Jankov, Joins eASIC Board of Directors
• Can Samsung Get Qualcomm in LTE Market?
• Cypress Licenses 55-Nanometer Embedded Flash IP to UMC
• Smartphone Apps Processor Revenue Reached $4.7 Billion in Q1 2014 says Strategy Analytics

Headlines for Friday Jul. 11, 2014

Top Story

TSMC Said to Ship Apple SoCs

Taiwan Semiconductor Manufacturing Co. (TSMC) began shipping mobile processors to Apple during the second quarter of this year and will continue through 2015, the Wall Street Journal reported.

• Vanguard Video Announces the Release of Its Next Generation Professional H.265/HEVC Codec SDK
• Qualcomm Snaps Up CSR's Imaging Team

Headlines for Thursday Jul. 10, 2014

Top Story

IP And FinFETs At Advanced Nodes

Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Bernard Murphy, CTO of Atrenta; Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics. What follows are excerpts of that conversation.

• Startup Preps Neural Network Visual Processor for Mobiles
• TSMC June 2014 Revenue Report
• Gartner Says Worldwide Semiconductor Sales on Pace to Total $336 Billion in 2014, a 6.7 Percent Increase from 2014
• Imagination Technologies Group plc - Retirement of Chairman
• Industry Leaders to Establish Open Interconnect Consortium to Advance Interoperability for Internet of Things

Headlines for Wednesday Jul. 09, 2014

Top Story

CEVA Acquires RivieraWaves, Expands IP Offering with Connectivity for Smartphones, Tablets, Small Cells and the Internet of Things

CEVA today announced that it has acquired RivieraWaves, a privately held company and a leading provider of wireless connectivity IP for Wi-Fi® and Bluetooth® technologies.

• Mentor Graphics Delivers Veloce Emulation Solutions for the Verification of High-Performance Memory Products
• Gartner Says Worldwide Semiconductor Capital Equipment Spending to Increase 15 Percent in 2014
• UMC Reports Sales for June 2014
• Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)
• Atmel to Acquire Newport Media - Strengthening its Leadership Position in the IoT Market

Headlines for Tuesday Jul. 08, 2014

Top Story

Synopsys Cuts Area of DesignWare NVM IP for Automotive Grade 0 Applications by 75 Percent

Synopsys today announced the availability of the DesignWare AEON Trim NVM IP for high-voltage processes. The new IP is up to 75 percent smaller than alternative NVM IP solutions, helping to reduce the size and cost of automotive ICs.

• Silicon Image Updates Second Quarter Revenue Outlook
• Synopsys Expands Verification IP Portfolio with Compliance Test Suites
• Shanghai InfoTM Microelectronics Licenses Arteris FlexNoC Fabric for Tablets and Other High-End Consumer Electronics
• Silicon Vision Delivers Silicon Proven Bluetooth Smart RF IP on HHGrace's 0.11um Technology Platform
• InvenSense To Acquire Movea, A Leading Provider Of Ultra-Low Power Motion And Data Fusion Software Platforms And Trusted Positioning, Inc., A Leader In Indoor/Outdoor Location Technology
• SEMI Forecasts Back-to-Back Years of Double-Digit Growth in Chip Equipment Spending
• Intel's Custom Foundry Will Manufacture Future Panasonic System-on-Chips Using Intel's 14nm Low-Power Process
• Audience to Acquire Sensor Platforms

Headlines for Monday Jul. 07, 2014

• Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month
• Global Semiconductor Sales Increase Across All Regions in May
• Gartner Says Worldwide Traditional PC, Tablet, Ultramobile and Mobile Phone Shipments to Grow 4.2 Percent in 2014
• Audio Converter IP - Dolphin Integration exceed STB audio standards with 106 dB of SNR measured on PWM DAC qualifier
• eMemory's eNVM SIP NeoFuse Contributes to Revenue Growth Momentum
• GUC Monthly Sales Report - June 2014
• ARM's Mali Midgard Architecture Explored
• FinScale's Quantum FinFET Aims to Revive Moore's Law

Headlines for Friday Jul. 04, 2014

Top Story

China's SMIC-Qualcomm 28-nm Deal: Why Now?

China's largest foundry, Semiconductor Manufacturing International Corp. (SMIC), and Qualcomm, the world's most dominant baseband cellular processor company, revealed Thursday, July 3 that they are collaborating on 28-nm wafer production in China.

• World's first MPHY 3.1 Verification IP Launched by Arrow Devices

Headlines for Thursday Jul. 03, 2014

• Qualcomm Bolsters Wi-Fi Leadership with 60 GHz Wireless for Mobile, Computing and Networking
• Cortex-M0 Gets Nearer to Near Threshold
• SMIC and Qualcomm Collaborate on 28nm Wafer Production in China
• Linaro announces Android Open Source Project port for ARMv8-A Architecture is ready and running on a 64-bit multi-core SoC

Headlines for Wednesday Jul. 02, 2014

Top Story

Sonics Announces Patent Non-Assert Agreement with Qualcomm

Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it has entered into a patent non-assert agreement with Qualcomm.

• Intilop releases 16K Concurrent TCP & UDP Session Hardware Accelerator ported to Xilinx VC 707 development board
• S2C ProtoBridge AXI Expands FPGA-Based Prototype Usage
• China, Not Apple, Is Way to Go, Says mCube CEO
• IC Suppliers Shift Strategies to Counter Decline in Digital Still Cameras
• Open Industry Consortium to Bring 25 and 50 Gigabit Ethernet to Cloud-Scale Networks

Headlines for Tuesday Jul. 01, 2014

Top Story

Consumer Electronics Application Processor Hits the Performance Cost Reduction Sweet Spot

Global Unichip recently began manufacturing a consumer electronic applications processor ASIC featuring a DDR2/3 interface that squeezed a leading 2.0GHz megabits per second (Mbps) speed from its 40nm low power (LP) process. Equally astonishing is the fact that it set this milestone on a cost-reducing PCB that could be as few as four layers and a four layer package substrate.

• EZchip to Acquire Tilera, a Leader in High-Performance Multi-Core Processors
• MegaChips Adopts Cadence RTL-to-Signoff Solution, Cuts Tapeout Schedule in Half