D&R Headline News (September 2014)

Headlines for Tuesday Sep. 30, 2014

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Kopin Introduces a Wearable Product with a Complete MIPI Solution from Mixel

Mixel announced today that Kopin® Corporation, a leading developer of innovative wearable computing technologies and solutions, has successfully incorporated Mixel’s complete MIPI® solution into its recently announced A914 product.

• ARM Extends OpenCL to the ARM Cortex-A Processor Family
• Arteris FlexNoC Resilience Package Enhances Redundancy, Fault Tolerance for Mission Critical Systems-on-Chip
• TSMC and ARM set new benchmarks for performance and power efficiency with first announced FinFET silicon with 64-bit ARM big.LITTLE technology
• TSMC and Synopsys Accelerate Custom Design Productivity for 16FF+ Process
• First ARM Cortex- A57-Based Hadoop Demonstration Achieved on AMD Opteron A-Series Platform
• SatixFy Integrates IP Cores for Advanced Satellite Modem SoC Using Sonics On-Chip Networks
• ARM Announces Debug Probe for High-Speed Serial Trace
• Smartphone Apps Processor Revenue Reached $5.2 Billion in Q2 2014 says Strategy Analytics
• MPEG LA Offers HEVC Patent Portfolio License
• Silicon-Proven Mixed Signal IP Products on 16nm FinFET
• Synopsys Announces New Additions to Liberty to Significantly Speed up Timing Closure
• IAR Systems dominates the tools market for ARM Cortex-M with leading code efficiency
• Xilinx Showcases All Programmable Solutions for 400GE Applications at WDM Dallas 2014
• Intel Rose to Number Two Position in Tablet Applications Processors in Q2 2014

Headlines for Monday Sep. 29, 2014

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HP Extends Benefits of ARM Architecture Into the Datacenter With New Servers

HP today announced two ARM®-based servers, including the first enterprise-class 64-bit ARM-based server, for customers that value choice in their compute strategy. Additionally, HP is making available a production-ready platform to enable software developers to develop, test and port applications to the 64-bit ARM-based server.

• ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC's Ultra-Low Power Technology Platform
• ARM and Synopsys Expand Collaboration to Improve Quality of Results and Time-to-Results for Leading-Edge ARMv8-A and ARMv7-A Cores
• Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform
• TSMC launches ultra-low power technology platform for IoT and wearable device applications
• S2C Announces AXI-4 Prototype Ready Quick Start Kit
• SMIC Gives 2014 "Best IP Partner Award" of the Year
• Lenovo Set to Close Acquisition of IBM's x86 Server Business
• Smartphone Connectivity Presents Both Opportunities and Challenges for Automotive Processor Chip Suppliers
• 4 Reasons for Intel's $1.5 Billion Bet in China
• Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
• Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET
• TVS to champion Requirements Driven Verification and Test at DVCon Europe

Headlines for Friday Sep. 26, 2014

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Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices

The purpose of the agreements is to expand the product offerings and adoption for Intel-based mobile devices in China and worldwide by jointly developing Intel® Architecture and communications-based solutions for mobile phones. Intel also has agreed to invest up to RMB 9 billion (about US$1.5 billion) for a minority stake of approximately 20 percent of the holding company under Tsinghua Unigroup which will own Spreadtrum Communications and RDA Microelectronics, subject to regulatory approvals and other closing conditions.

• SiTime Raises $25 Million
• Allegro DVT demonstrates its HEVC/H.265 Video Encoder IP and Compliance Streams at ARM TechCon 2014
• Leading-Edge IC Foundry Market Forecast to Increase 72% in 2014
• Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum

Headlines for Thursday Sep. 25, 2014

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Are you ready to conquer PCIe 4.0 challenge? PLDA is ready

PLDA has optimized its ASIC intellectual property (IP) cores for the next generation of the ubiquitous and general purpose PCI Express® I/O specification, 4.0. PLDA’s proven 3.0 architecture enables easy migration to PCIe 4.0, with no interface changes necessary, and preserves existing behavior for seamless integration.

• Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration
• TSMC delivers first fully functional 16FinFET networking processor
• iPhone 6 Plus: $100 Costlier for Consumers to Buy - Just $15.50 More Expensive for Apple to Make
• GUC Rolls Out New Low Power Solid State Drive IP Portfolio
• Codasip Appoints Coby Hanoch as VP of Worldwide Sales
• Xilinx Showcases All Programmable Solutions for Smarter Systems at ARM TechCon 2014
• Kilopass to Exhibit at ARM TechCon 2014

Headlines for Wednesday Sep. 24, 2014

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ARM Supercharges MCU Market with High Performance Cortex-M7 Processor

ARM has unveiled a new 32-bit Cortex-M processor that delivers double the compute and digital signal processing (DSP) capability of today's most powerful ARM-based MCUs.

• Freescale Plans Extreme Performance for Kinetis MCUs with ARM Cortex-M7 Core
• ChaoLogix Opening India Engineering Center To Meet Global Demand for ChaoSecure Technology That Boosts Semiconductor Chip Security
• Elliptic Technologies to Speak at the Chip-to-Cloud Security Forum
• PathPartner Technology Announces Industry's First Hybrid Hardware-Software HEVC Decoder Optimized for Programmable SoC Devices
• Algotronix and Adaptive Micro-Ware Announce Partnership
• STMicroelectronics Accelerates MCU-Developers' Pace of Innovation with World's First ARM Cortex-M7 Core-Based STM32 F7 Series MCU
• IAR Embedded Workbench delivers outstanding performance for new ARM Cortex-M7 core
• Uniquify Will Demonstrate Fastest DDR4 Memory IP at ARM TechCon

Headlines for Tuesday Sep. 23, 2014

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Coreworks develops audio IP core for integration in SoC and FPGA for 8K UHDTV encoding

Coreworks together with its representative in Japan, Spinnaker Systems Inc., announce that Coreworks has now completed the development of an audio encoding system to support multiple audio formats and multiple audio streams for the next generation of UHDTV, known as 8K UHDTV.

• Sibridge Technologies' USB 3.0 IP solution adopted by Tier-1 companies
• SD Association Expands iSDIO Specification, Adds High-Speed Contactless Data Transfer with TransferJet
• Synopsys Unveils Verification Continuum to Enable Next Wave of Industry Innovation in Software Bring-Up for Complex SoCs
• TVS joins MIPI Alliance, introduces MIPI Verification IP Suite
• Cadence's Rowen Forecasts Processor Design Split
• Sidense Exhibiting at TSMC Open Innovation Platform (OIP) Ecosystem Forum

Headlines for Monday Sep. 22, 2014

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Broadcom Enables Industry's First 20 nm 100G Coherent PHY

Broadcom today announced that its high performance 20 nanometer (nm) signal processing enhanced mixed signal technologies has enabled NTT Electronics' new NLD0640 100G coherent digital signal processor (DSP) — an industry first.

• Teardown.com Analysis: Apple iPhone 6 Plus
• Lattice Announces Production of MachXO3L in WLCSP Packages
• Users Cite 10 Percent Smaller Design Sizes with Latest Releases of Synopsys' Design Compiler
• VESA Brings DisplayPort to New USB Type-C Connector
• Altera and Baidu Collaborate on FPGA-based Acceleration for Cloud Data Centers
• Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
• Why UMC is Boosting Automotive Chip Business
• What Apple Stuffed Inside iPhone 6 Plus

Headlines for Friday Sep. 19, 2014

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AMD and Synopsys Expand IP Partnership

Synopsys and AMD today announced they have signed a multi-year agreement that gives AMD access to a range of Synopsys DesignWare® interface, memory compiler, logic library and analog IP on advanced 16/14-nm and 10-nm FinFET process technologies. Synopsys is also hiring approximately 150 AMD IP R&D engineers and gains access to AMD’s leading interface and foundation IP.

• Dell: 'If ARM works and costs less, we will use it'
• Microsemi Ships 22nm FinFET ASICs
• CoinTerra announces the world's first 16nm ASIC based Bitcoin Miner - the AIRE Miner
• North American Semiconductor Equipment Industry Posts August 2014 Book-to-Bill Ratio of 1.04
• 18 Views of the Silicon Horizon
• Ericsson discontinues development of modems - shifts part of investment into radio networks

Headlines for Thursday Sep. 18, 2014

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Cisco Announces Intent to Acquire Memoir Systems

Cisco’s intent to acquire privately held Memoir Systems, a company that develops semiconductor memory intellectual property (IP) and tools that enable ASIC vendors to build programmable network switches with increasing speeds. This acquisition will enable the proliferation of affordable, fast memory for existing Cisco switch ASICs and will help advance Cisco’s ASIC innovations necessary to meet next-generation IT requirements.

• Leadcore Achieves First-Pass Silicon Success with DesignWare MIPI IP in Smartphone Application Processor SoC
• Constellations will "Unlock the Mystery of IP" at Silicon Valley IP Users Conference
• 2014 SMIC Technology Symposium Will Kick Off in Shanghai

Headlines for Wednesday Sep. 17, 2014

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Synopsys' New DesignWare MIPI D-PHY Cuts Area and Power by 50 Percent

Synopsys today announced that it has cut the area and power consumption of its DesignWare® MIPI® D-PHY™ by 50 percent compared to competitive solutions while increasing performance to 2.5 Gbps per lane, reducing system-on-chip (SoC) silicon cost and extending battery life for mobile, consumer and automotive applications.

• MIPI Alliance Introduces MIPI C-PHY Specification and Updates its D-PHY and M-PHY Specifications
• Synopsys' New MIPI C-PHY Verification IP Accelerates Adoption of MIPI Alliance's Physical Layer Specifications
• Xilinx Showcases 100G Solutions with Live Traffic over Optical Fiber and Backplane Demonstrations at ECOC 2014
• Cavium Standardizes on Synopsys' IC Compiler for High-performance Processor-based SoC Designs
• MegaChips to Acquire certain Smart Connectivity Products based on DisplayPort technology from STMicro
• Imagination Technologies:Interim Management Statement

Headlines for Tuesday Sep. 16, 2014

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Semtech Provides Ultra-High Speed ADC and DAC for Advanced Digital Microwave Systems

Semtech today announced that 64GSPS ADC and DAC cores are available utilizing IBM's 32nm SOI technology for integration in high performance Digital Microwave System on Chip (SoC) solutions.

• IP Subsystems in SoCs in Americas will grow to $340.5M by 2017, Says Semico Research
• Apple, Samsung in 20nm Race
• IEEE Forms Two New Working Groups to Standardize Software and System-Level Energy Management and Power Modeling for System-on-Chip Devices
• Entropic to Explore Strategic Alternatives
• Open-Silicon Speeds and Simplifies ASIC Development For 100G Networks
• Cavium and XPliant Introduce a Fully Programmable Switch Silicon Family Scaling to 3.2 Terabits per Second
• Entropic, ViXS Systems Settle All Litigation, Execute Cross-License

Headlines for Monday Sep. 15, 2014

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Altera FPGAs Enable Dolby Vision for Ultra-HD TVs

Altera today announced its Arria® V FPGAs are delivering the high performance needed for Dolby Laboratories’ innovative Dolby® Vision™ imaging technology for ultra-high definition (UHD) displays.

• MagnaChip to Offer 0.13um Embedded EEPROM IP
• Peraso Releases PRS4000 60 GHz 802.11ad Baseband Chip
• Xilinx and China Mobile Research Institute Collaborate on Virtualized 5G Wireless Networks Development
• Broadcom Announces Industry's Highest Performance, Lowest Power 100GbE Gearbox PHYs
• Xilinx and its Ecosystem Demonstrate All Programmable Solutions for Smarter Vision Systems at IBC 2014
• eASIC Joins Open NAND Flash Interface (ONFI) Working Group
• Elmos Selects Synopsys' Custom and Digital Design Solutions
• WaveIntegrity from CWS Used by STMicroelectronics for Early Noise Analysis in CMOS and FD-SOI SoCs

Headlines for Friday Sep. 12, 2014

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Creonic Shows Live Demo of DVB-S2X IP Cores at IBC

Creonic GmbH, member of the DVB project, exhibits the world's first off-the-shelf IP cores for the new DVB-S2X standard in a live demo at the IBC exhibition from 12th to 16th of September in Amsterdam, the Netherlands.

• TSMC 28HPC Process in Volume Production
• Asia-Pacific Dominates IC Sales in Largest System Categories in 2014
• Rambus Expands Cryptography Research Division Leadership Team
• Ittiam Systems demonstrates its third generation H.265/HEVC products at IBC 2014
• Hollywood's Top-selling Camera Maker ARRI Chooses Altera
• Altera Demonstrates Advanced SMPTE Solutions for IP-Based UHD Infrastructure at IBC 2014
• Ittiam Systems Introduces 'Clove' - Second Generation Hardware Platform in neonCaster Family for Low-Power Multimedia Applications

Headlines for Thursday Sep. 11, 2014

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Elliptic Technologies and CableLabs Brings Secure Premium Content Protection to Any Device

Elliptic Technologies today announced their joint development with CableLabs to provide a reference implementation for DLNA’s CVP-2 (Commercial Video Profile - 2) specifications, now under the new brand of VidiPath Certification program, using Elliptic’s tVault™ for DTCP-IP content protection

• Intel Opens Door on 7nm, Foundry
• Authorized As the Distributor of ARM Keil Tools, Faraday Provides the Complete Family of ARM Development Tools
• Vivante GC3000 Powers Marvell ARMADA Pro 4K TV SoC
• Apple Could Be Driving TSMC's Record Sales
• Mobile Operators Want SIMs in Every IoT Sensor

Headlines for Wednesday Sep. 10, 2014

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Mobiveil Signs Letter of Intent to Acquire the IP assets of Proton Digital Corporation.

Mobiveil today announced that it entered into a letter of intent with Proton Digital Systems, a technology leader in Flash Reliability solutions to license and subsequently acquire their IP assets and merge their business interests.

• Wipro Accelerates SoC Verification with Synopsys Verification IP Portfolio
• NextG-Com announces LTE Protocol Stack license to Nufront for User Equipment devices
• TSMC August 2014 Revenue Report
• Altera and China Mobile Research Institute Announce Joint Efforts on Next Generation C-RAN Wireless Technologies
• Tabula Ships Family of 100G Development Systems
• Tabula and Intel Work Together to Enable Next-Generation Data Center
• JEDEC Publishes Wide I/O 2 Mobile DRAM Standard
• SMIC Introduces Independently Developed 38nm NAND Process Technology

Headlines for Tuesday Sep. 09, 2014

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Allegro DVT showcases its HEVC/H.265 Video Encoder IP at IBC 2014.

At IBC 2014, Allegro DVT will perform a live demonstration of its HEVC/H.265 encoder IP core. The demonstration will be conducted on a prototyping platform, demonstrating the features and video quality of our HEVC/H.265 encoder IP.

• USB 3.0 Promoter Group Announces Power and Device Class Specifications to Support Development of USB Type-C Ecosystem
• ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Silicon ASM1352R (USB3.1 to SATA6G with RAID) at Intel Developer Forum
• Kilopass Recruits Bruce Bateman for Development of the Next-Generation Memory
• Allegro DVT releases MV-HEVC and DVB HEVC compliance streams at IBC 2014.
• GUC Monthly Sales Report - August 2014
• UMC Reports Sales for August 2014
• How Secure Is Your USB?
• Credo Announces First 56G SerDes Technology Based on Conventional NRZ Modulation
• Lattice's New USB 3.1 Type-C Power Delivery Solution Speeds Development of Next-Generation USB Connectors
• QuickLogic and GLOBALFOUNDRIES Collaborate to Deliver Next-Generation Sensor Hub for Smartphones and Wearables
• Genesys Logic announced a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics
• Altera Demonstrating FPGA-based Data Center Solutions at Intel Developers Forum 2014
• Credo Semiconductor Appoints Jeff Twombly as Vice President of Sales and Business Development
• SEMI Reports Second Quarter 2014 Worldwide Semiconductor Equipment Figures; Billing US$ 9.6 Billion

Headlines for Monday Sep. 08, 2014

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Xilinx, Northwest Logic and Xylon Provide Low Cost FPGA-based MIPI Interfaces for Video Displays and Cameras

Xilinx and Northwest Logic and Xylon, Xilinx Premier Alliance Members, announce the availability of a low cost Xilinx FPGA-based MIPI interface IP that is optimized for cost sensitive video displays and cameras.

• Can China Buy Its Way Into Global IC Industry?
• Intel Launches the Intel Core M Processor
• INSIDE Secure and Digisoft.tv make set-top-box Digital Rights Management easy, with the launch of a PlayReady Encrypted Media Extension implementation

Headlines for Friday Sep. 05, 2014

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KnCMiner announces finalized Series A investment round

KnCMiner announces the completion of our USD14m Series A investment round. After expanding operations from hardware design into software, app and cloud services, the Series A investment round will enable KnCMiner to accelerate in all areas of business.

• Total PC Shipments Seen Rising Despite Declines in Desktops, Notebooks
• Digigram and KALRAY Partner to Create High-Quality, Low-Power, Real-Time HEVC Video Encoder Solutions
• Synopsys Showcases DesignWare IP Solutions for USB 3.1 and PCI Express 4.0 at Intel Developer Forum 2014
• prpl Foundation Announces 'Quick EMUlator' (QEMU) Support for Imagination's New 64-bit MIPS Processors

Headlines for Thursday Sep. 04, 2014

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Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

• Soft (Hardware) and Software IP Rule the IoT
• Inside Secure to Demonstrate Trusted Over-the-Top (OTT) Solutions at IBC 2014
• Intilop Releases Altera's Stratix IV/V FPGA platform with their 16K Concurrent-TCP-Session Hardware Accelerator
• Toshiba licenses Barco Silex's JPEG 2000 cores for video equipment
• Recore Systems' IP in the first European multi-core space processor
• Global Semiconductor Market Maintains Broad, Consistent Growth in July
• Mentor Graphics Announces Embedded Hypervisor Product With New Configuration, Debugging and Hardware Support

Headlines for Wednesday Sep. 03, 2014

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Kilopass' XPM Antifuse Embedded Non-Volatile Memory IP Successfully Completes TSMC9000 Qualification for TSMC 55nm HV Process

Kilopass today announced successful TSMC9000 qualification of its XPM one-time programmable (OTP) antifuse eNVM IP core.

• Uniquify's DDR Memory IP Cracks Broadband, Cellular Communications, DSL, HDTV, Image Processing, Networking, Test and Measurement, Video Equipment Markets
• TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization
• Hisense Licenses Arteris IP Fabric for Digital TVs
• Andes Ready to Rumble in CPU War
• MIPS Moves Multicore Battle to Clustering
• Imagination makes ARM's high end CPU goals less of a sure thing
• Anatomy of an ARM Server Chip
• Why FPGAs are a Good Fit for Automotive Driver Assistance Systems
• SPL Vitalizer In-Car Audio Software Now Available on Cadence Tensilica HiFi Audio/Voice DSP Family
• NJR Analog ICs Manufactured at UMC Adopted by Major Japanese Auto OEM
• Xilinx Showcases Smarter Solutions for Data Center Efficiency at Intel Developers Forum 2014

Headlines for Tuesday Sep. 02, 2014

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64-bit MIPS Warrior core will change the game for CPUs from mobile devices to datacenter servers

Imagination Technologies (IMG.L) announces the highly-efficient MIPS I-class I6400 CPU family, the first IP cores to combine a 64-bit architecture and hardware virtualization with scalable performance through multi-threading, multi-core and multi-cluster coherent processing.

• Discretix to Showcase Preintegrated Security Solutions on the Snapdragon Platform at Qualcomm's 3G/LTE Summit
• HDL Design House Successful AAE Exam Completion
• Andes Technology Unveils New Low-Power Platform IP Ideal for Internet-of-Things, Wearable Devices
• Fuji Xerox Recognizes Altera with 2014 Premier Partner Award

Headlines for Monday Sep. 01, 2014

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Semiconductor Market Setting Sales Records through the First Half of 2014

As SIA reported earlier this month, worldwide sales of semiconductors reached $82.7 billion during the second quarter of 2014, marking the industry’s highest-ever second quarter sales total. In fact, there were other “highest ever” sales levels achieved with the release of the June 2014 data, including highest monthly sales ever and highest first half sales ever.

• Xylon announces Free designs for Xilinx Vivado Design Suite
• A rethought PIC IP Core - the DRPIC1655X
• Momentum Builds For the Next Generation of ARM Processors