D&R Headline News (October 2014)

Headlines for Thursday Oct. 30, 2014

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CEVA, Inc. Announces Third Quarter 2014 Financial Results

CEVA, Inc. today announced its financial results for the third quarter ended September 30, 2014. Total revenue for the third quarter of 2014 was $14.1 million, an increase of 41% compared to $10.0 million for the third quarter of 2013.

• Synopsys Announces Availability of DesignWare Non-Volatile Memory IP for TowerJazz 180-nm Process Technology
• Faraday Reported 2014 Third Quarter Consolidated Results
• Freescale CEO: 'IoT Isn't Just Buzz'
• UMC Takes Bigger Slice of 28nm Business
• ARM Launches Embedded Systems Education Kit to Make Students Work-ready
• Lattice Semiconductor, Fairchild Imaging and Helion Vision to Demonstrate new FPGA-Based Image Sensor Solution at VISION 2014

Headlines for Wednesday Oct. 29, 2014

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Synopsys' New DesignWare Sensor and Control IP Subsystem Delivers Ultra Low Power Sensor and Control Processing for SoCs

Synopsys today announced the new DesignWare® Sensor and Control IP Subsystem, a complete hardware and software solution optimized for a wide range of ultra-low power embedded sensor and control applications.

• Elliptic Technologies and CableLabs Server Reference Device Approved for DLNA's VidiPath Certification Program
• Peraso Closes Oversubscribed $20 Million Equity Financing Led by Roadmap Innovation Fund
• SiTime to be Acquired by MegaChips for $200M
• Ittiam's H.265 Software Solution Enables HEVC Support in Android's Lollipop Release
• AMD Hires Dell's Server Chief
• Windows-based ARM Servers a 'Very Real' Threat to Intel
• IBM leaves semiconductors - end of an era
• ARM Cortex-M7: Abundance of Memory or Not Enough?
• Reflex CES to Demonstrate Complex and High-Speed FPGA Boards Expertise at Electronica 2014

Headlines for Tuesday Oct. 28, 2014

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Synopsys' New USB 3.1 IP Solution Enables 10 Gbps Data Transfer Speeds for Storage, Digital Office and Mobile Applications

Synopsys today introduced the industry's first USB 3.1 IP solution, consisting of DesignWare® USB 3.1 Device Controller, an IP Virtual Development Kit (VDK) and verification IP (VIP) to accelerate the development of high-performance storage, digital office and mobile system-on-chip (SoC) applications.

• New entity Solid Sands B.V. in Amsterdam announces the acquisition of the SuperTest compiler test and validation suite operations from ACE Associated Compiler Experts bv
• Kili Technology Unveils First mPOS Solution-on-a-Chip
• UMC Enters Volume Production for Lantiq's Communication ICs
• Actions Semiconductor Debuts Its First 28nm OWL Series Chipset
• Everspin and GLOBALFOUNDRIES partner to supply fully processed 300mm CMOS wafers with Everspin's ST-MRAM technology
• MegaChips to Begin Sampling BlueChip Wireless Sub-GHz Band Wireless Communication LSI at the End of October
• TSMC, Kilopass Deliver NVM OTP IP for the 16FinFET Process Node
• ARM System-wide Approach Delivers Efficient, Rich Media Solution
• Synopsys IC Compiler II Delivers Five Fold Implementation Speed up, Enables Silicon Success

Headlines for Monday Oct. 27, 2014

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Cadence Announces Industry's First 25G Ethernet Verification IP

Cadence today announced the industry's first Verification IP (VIP) supporting the new 25-Gigabit (25G) Ethernet specification.

• Huawei Selects eASIC for Transport Network Backhaul
• Synopsys and Gowin Semiconductor Ink Multi-Year OEM Agreement for FPGA Design Software
• SMIC and ASML Sign a Volume Purchase Agreement Worth 450 Million Euros
• Sckipio Licenses and Deploys CEVA-XC Communications DSP in World's First G.fast Chipsets
• Dolphin Integration reveal a cost effective solution to handle over-voltage operation in battery powered SoCs
• Silicon Space Technology (SST) Demonstrates ARM Cortex-M0-based Processor and SRAM Solutions Operating at 250C for 500 Hours
• SK Hynix Accelerates Memory Development with Productivity-Enhancing Debug Apps on Synopsys Verdi

Headlines for Friday Oct. 24, 2014

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Soft Machines Unveils VISC Microprocessor Architecture Breakthrough; Revives Performance-per-Watt Scaling

Soft Machines Inc., a Silicon Valley-based semiconductor startup company, today announced the Soft Machines VISC™ architecture. The VISC architecture is a breakthrough in microprocessor performance-per-watt scaling and will significantly improve performance and power for all segments of the computing ecosystem.

• Health Startups Are Unfit, Says MD
• Microsoft Eyes Expanding FPGA Role
• Cadence Lands Biggest Deal in Years

Headlines for Thursday Oct. 23, 2014

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China's VeriSilicon Files For IPO

VeriSilicon Holdings Co. Ltd. (Shanghai, China), a Chinese fabless chip company with a design service, IP licensing and chip delivery business model, has filed to raise $75 million from an initial public offering of shares on the NASDAQ market. This is despite the fact that the company made a net loss in the first half of 2014.

• Cadence Announces Broad Portfolio of 3D Memory Verification IP
• Why Must IBM Keep the Cost of Advanced Chip R&D?
• Videantis and VISCODA partner to showcase key automotive ADAS technology in Detroit
• SMIC and Maxscend collaborate on 55nm RF IP platform
• Discretix Technologies Ltd. Announces Company Name Change to Sansa Security, Inc.
• ARM Extends Scalability of CoreLink for Infrastructure Compute
• Intilop's 16K Concurrent TCP & UDP Session Accelerator Core - Xilinx Platform Now Available for Immediate Deployment in Data Center and High Performance Computing

Headlines for Wednesday Oct. 22, 2014

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Tamba Releases New Ultra-Low Latency Ethernet Cores for Xilinx UltraScale 20nm FPGA - Lowest Latency Achieved on an FPGA Device

Tamba Networks today announced the availability of version 2 of its Ethernet IP products for use on Xilinx, Inc. Virtex® UltraScale™ devices. This latest release delivers new performance enhancements that further increase the latency and size gap between existing IP available from other vendors.

• Muller-BBM Active Noise Control and Sound Design Now Optimized on Cadence Tensilica HiFi Audio/Voice Processors for Automotive Applications
• IoT cybersecurity: is EDA ready to deliver?
• IoT Core, ARM SoCs Debut
• New BA20 Processor IP Features "Zero-Stage Pipeline" for Energy and Performance Efficiency
• HMicro Closes $5.5M in Series B Funding
• Intel, IBM Dueling 14nm FinFETS
• Foundries Use Small Feature Sizes to Boost Revenue per Wafer
• Kilopass Vice President of Marketing to Participate in Panel on SoC Solutions for Wearable Applications During the SoC Conference
• Cadence Introduces Automotive Functional Safety Verification Solution, Reducing ISO 26262 Compliance Preparation Effort by up to 50 Percent
• Ambarella S3 IP Camera SoC Delivers Outstanding 4K Video Quality Using State-of-the-Art H.265/HEVC Encoding

Headlines for Tuesday Oct. 21, 2014

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eMemory NeoEE SIP Advances into Automotive Electronics Applications

Following the expansion of multiple-time programmable (MTP) silicon IP (SIP) NeoEE in wireless communication applications; eMemory, the global leader in embedded non-volatile memory (eNVM) announced today the specification upgrade of NeoEE from consumer electronics level (85℃/10 years) to 150℃/10 years, which meets the AEC-Q100 Grade 0 required by automotive electronics.

• Freescale Announces the Industry's Most Power-Efficient 64-Bit ARM-Based Processor for the New Virtual Network
• Synopsys STAR Memory System Multi-Memory Bus Processor Enables 10 Percent Die Size Reduction for Marvell SoC
• SMIC Certifies Synopsys IC Validator for Signoff Physical Verification
• Sonics Eases SoC Design Flow Integration Using Magillem IP-XACT Checker Suite
• Blu Wireless Technology confirms new $3.7m investment
• ARM Holdings plc Reports Results For The Third Quarter and Nine Months Ended 30 September 2014
• SiliconAid Solutions evolves support of IEEE P1687 and IEEE 1149.1-2013 Standards through Partnership with Ridgetop Group
• PRO DESIGN Releases Embedded Processing Platform for FPGA based SoC and IP Prototyping
• Silicon Image Appoints Khurram Sheikh as New Chief Strategy and Technology Officer
• Rambus Reports Third Quarter Financial Results
• Cadence Reports Third Quarter 2014 Financial Results
• North American Semiconductor Equipment Industry Posts September 2014 Book-to-Bill Ratio of 0.94
• Khronos Finalizes and Releases OpenVX 1.0 Specification for Computer Vision Acceleration

Headlines for Monday Oct. 20, 2014

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GLOBALFOUNDRIES to Acquire IBM's Microelectronics Business

IBM and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews.

• Global Unichip Corporation Uses Cadence Encounter Digital Implementation System to Complete Its First Production Design on TSMC 16FF+ Process
• Synopsys Introduces Industry's First On-Chip Memory Test and Repair Solution for Embedded Flash
• VIA Technologies Cuts Silicon Test Time by 11X Using Synopsys' DFTMAX Ultra
• Altera Demonstrates Automotive Embedded System Solutions that Increase Design Productivity at SAE Convergence 2014
• Dolphin Integration introduce a new foundry sponsored low power memory for LCD Drivers and Touch Screen Controllers
• Inside Secure Introduces VAULTiTRUST to Lower Adoption Barrier to Best-in-Class Security for Internet of Things (IoT)

Headlines for Friday Oct. 17, 2014

• Sibridge Technologies announces Wireless Sensor Network Reference Design
• Xilinx Announces Q2 Fiscal 2015 Results; EPS $0.62

Headlines for Thursday Oct. 16, 2014

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TSMC Capex to Exceed $10B in FinFET Ramp-Up

TSMC said Thursday, Oct. 16, that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up to commercial production of 16 nm FinFET chips.

• Altera Expands Automotive-Grade Product Portfolio with Highly Integrated PowerSoCs
• Gartner Says Worldwide Semiconductor Capital Spending to Increase by More Than 11 Percent in 2014
• TSMC Names Silicon Creations Emerging IP Vendor for 2014
• TSMC Reports Third Quarter EPS of NT$2.94
• IC Industry Slowdown: True or False?
• Analysis: In $2.5B Deal, Qualcomm & CSR Mesh
• Cadence Announces Industry's First Multi-Protocol DDR4 and LPDDR4 IP Solution
• Samsung Invests Big to Maintain Leadership, Support New Markets

Headlines for Wednesday Oct. 15, 2014

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Qualcomm to Acquire CSR

Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition through which the entire issued and to be issued ordinary share capital of CSR will be acquired by Qualcomm Global Trading Pte. Ltd, an indirect wholly owned subsidiary of Qualcomm Incorporated.

• EEMBC Tackles Performance Benchmarks for Cloud and Big Data Workloads with New Working Group
• Total Analog Revenues for 2014 Expected to Reach over $43 Billion, Says Semico Research
• AMIQ EDA Introduces New Capabilities in Its Verissimo SystemVerilog Testbench Linter

Headlines for Tuesday Oct. 14, 2014

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New DesignWare ARC HS38 Processor Doubles Performance for Embedded Linux Applications

Synopsys today announced availability of the DesignWare® ARC® HS38 Processor, the latest addition to the ARC HS Family of high-speed processor IP cores. A single HS38 processor delivers up to 4200 DMIPS at speeds up to 2.2 GHz in typical 28-nanometer (nm) silicon, more than twice the performance of previous generation ARC 770D cores supporting Linux.

• Synopsys Enables Superior Verification Planning and Coverage Analysis with Verdi Coverage
• Xilinx and SAI Technology Announce Availability of First All Programmable Software Defined Radio Reference Design for LTE User Equipment
• eInfochips improves reliability for automotive components with CAN 2.0 Verification IP
• Windows 10 On ARM: 7 Observations
• S2C Announces Series C Financing to Advance Next Generation of Rapid Prototyping Systems
• IPrium releases PSK Demodulator
• DMP GPU IP core Adopted for Nintendo's portable game console "New Nintendo 3DS"
• Rambus to Integrate Arteris FlexNoC IP in Future Development Initiatives

Headlines for Monday Oct. 13, 2014

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eASIC and Comcores Announce Support for C-RAN with CPRI v6.0

eASIC and Comcores today announced immediate support for Common Public Radio Interface (CPRI) v.6.0 using eASIC’s Nextreme-3 28 nm devices enabling energy efficient and high-performance wireless C-RAN solutions.

• UltraSoC granted patent on USB based debug interface
• Dolphin Integration receives TSMC's Open Innovation Platform 2014 Partner of the Year Award for Specialty IP
• Synopsys Plans Appeal in Mentor v. EVE

Headlines for Friday Oct. 10, 2014

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Spin Transfer Technologies Raises $70 Million To Accelerate Commercial Development

Spin Transfer Technologies, Inc. (STT), a leading developer of breakthrough Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM™, today announced that it has successfully raised $70 million to accelerate commercial development.

• Mentor Graphics Wins Patent Infringement Case, Awarded Damages
• Cadence Wins Two TSMC Partner of the Year Awards for Soft IP and 16FF+ Solutions

Headlines for Thursday Oct. 09, 2014

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Cadence Offers Industry' First MIPI SoundWire Controller IP Solution

Cadence today announced the industry’s first MIPI® SoundWireSM Controller Intellectual Property (IP). SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it attractive to many mobile design applications.

• Maxim Preps Asynchronous MCU Core
• Microsemi Announces New Security Features to Deliver Industry the Most Secure FPGAs
• Gigabit Ethernet Seeks a Boost
• ARM Calls for 'Invisible' Technology
• MIPI Alliance Introduces MIPI SoundWire, a Comprehensive Audio Interface for Mobile and Mobile-Influenced Devices
• UMC Board Resolves to Enter a Joint Venture Agreement for a 12" Fab in China
• TSMC September 2014 Revenue Report
• UMC Reports Sales for September 2014
• ARM Holdings plc - Appointment of New Director

Headlines for Wednesday Oct. 08, 2014

• HiSilicon Chooses Synopsys' PrimeTime ADV for Faster Timing Closure
• TSMC Selects Synopsys as "2014 Partner of the Year" for Interface IP and Joint Development of 16-nanometer FinFET Plus Design Infrastructure
• The World's First G.fast Chipsets Announced by Sckipio
• Xilinx Accelerates Productivity for Zynq-7000 All Programmable SoCs with the Vivado Design Suite 2014.3, SDK, and New UltraFast Embedded Design Methodology Guide
• DRAM, China, and Leading-Edge Foundry Driving IC Industry in 2014
• Why Do Big Companies Make Their Own Sensors?
• Kili Technology Signs Sales and Distribution Agreement with ATD Electronique

Headlines for Tuesday Oct. 07, 2014

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Synopsys Releases Verification IP for Mobile PCIe Technology

Synopsys today announced the availability of verification IP (VIP) for the M-PCIe™ protocol, including built-in M-PHY® as defined by the MIPI® Alliance specification. Based on its native SystemVerilog VIP architecture, Synopsys' VIP for M-PCIe technology enables enhanced performance, ease of use and debug in SystemVerilog UVM environments.

• Altera and Lime Microsystems Demonstrate Completely Programmable RF- and FPGA-Based Solutions for Military Communications
• Arteris Helps Sckipio Deliver the World's First G.fast Modems
• Cortus Launches Optimized Low-Power Processor for Multi-Core Implementations in Connected Devices
• Lantiq Licenses Sofics on-chip ESD Solutions
• TSMC Overtakes Samsung in FinFET
• Xilinx and Aquantia Extend Capabilities of Existing Copper Cabling Infrastructure for Data Center, Mobile, Enterprise and Video Applications
• Cortus Targets Sensors, Wearables and other IoT Applications With New Low Power Embedded 32-bit Processor Core
• Broadcom Introduces Industry's First 40GbE Quad Port Gearbox PHY
• MaxLinear to Acquire Physpeed Co., Ltd.

Headlines for Monday Oct. 06, 2014

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Global Semiconductor Sales Continue to Climb in August

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014, an increase of 9.4 percent from the August 2013 total of $26 billion and an uptick of 1.3 percent over the July 2014 total of $28.1 billion.

• Aquantia Unveils Game-Changing Enterprise Technology to Break Mobile Infrastructure Bottleneck and Deliver Unprecedented Throughput
• EDA Consortium Reports Revenue Increase For Q2 2014
• RFEL adds new Wideband DDC to its signal processing range
• Inphi Completes Acquisition of Cortina Systems
• Enverv chooses Dolphin Integration's Library for their Smart metering applications
• GUC Monthly Sales Report - September 2014
• ARM Servers Want a Tune Up

Headlines for Friday Oct. 03, 2014

• intoPIX has been nominated for the Deloitte Technology Fast50
• Altera and Its Ecosystem Partners to Demonstrate FPGA Technologies and System Solutions at MILCOM 2014

Headlines for Thursday Oct. 02, 2014

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ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

ARM® and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimised for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET.

• ARM Partners Explore M7 Horizon
• Samsung Shows 14nm Chip
• Gartner Says Worldwide Semiconductor Sales on Pace to Total $338 Billion in 2014, a 7.2 Percent Increase From 2013
• U-Next Selects INSIDE Secure Downloadable DRM Fusion to Protect Premium Content Running on Android and iOS Devices
• ARM Announces Device Platform and Free OS to Accelerate Internet of Things Deployment
• AppliedMicro Launches 64-Bit ARM-Based Custom Cores for High End Embedded

Headlines for Wednesday Oct. 01, 2014

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Altera and ARM Expand Strategic Partnership for SoC Development Tools

Altera and ARM today announced a long-term agreement to expand their strategic partnership for best-in-class embedded software development tools for SoC FPGAs

• New ARM Implementation Solutions Reduce Time to Market for FinFET Designs
• Synopsys' Galaxy Design Platform Delivers Over 30% Leakage Power Reduction for Fujitsu Semiconductor's ARM-Powered Multi-Core
• Atmel Announces ARM Cortex-A5-based MPUs Optimized for 720p Video Playback and Advanced Security Functions
• AMD Demonstrates First Network Function Virtualization Solution on 64-bit AMD and ARM Technology
• Semiconductor double digit growth in 2014 & 2015
• Tabula Revolutionizes Chip and System Design with the Introduction of DesignInsight Technology
• ARM Enhances Safety-Related Tools Offering with TUV Certification for the ARM Compiler
• D68HC11K with applications notes, development board & tools from Digital Core Design
• Rambus Cryptography Research Division Launches Suite of DPA Resistant Cores Addressing the Continuing Rise in Data Theft
• Altera Announces Immediate Availability of Next-generation, Non-volatile MAX 10 FPGAs and Evaluation Kits
• ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models