D&R Headline News (November 2014)

Headlines for Thursday Nov. 27, 2014

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Sercos IP Core Available for Altera Cyclone V FPGAs and SoCs

Sercos International, provider of the Sercos® automation bus, announced today the availability of the Sercos III IP Core for Altera's low-cost, low-power Cyclone® V devices. The IP core is available for Sercos III master and slave controllers (SERCON100M/S). It includes all hardware functions, such as timing, synchronization and processing of cyclic and non-cyclic data on the basis of two integrated Ethernet MACs

• MegaChips Joins Imec and Holst Centre's research and development program on Ultra-low Power Radio
• TVS VIPs accelerate adoption of latest MIPI standards

Headlines for Wednesday Nov. 26, 2014

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Bluink adds FIDO U2F Security Key Functionality to Injector with Elliptic Technologies' Cryptography

Bluink Ltd, the leading innovator in smartphone based digital identity management and strong authentication, today achieved FIDO Alliance Universal Second Factor (FIDO U2F) Ready sta-tus for its Injector mobile identity product, allowing Injector users to securely login to U2F supported online services.

Headlines for Tuesday Nov. 25, 2014

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NXP Semiconductors Acquires Wearable and Bluetooth Low Energy IC Business of Quintic

NXP Semiconductors today announced that it has entered into a definitive agreement with Quintic to acquire assets and IP related to its Wearable and Bluetooth Low Energy (BTLE) IC business.

• Altera FPGAs and IP with New Functional Safety Development Board and Reference Designs Reduce SIL 3 Development and Certification Costs for Industrial Designs
• Where have all the drivers gone?

Headlines for Monday Nov. 24, 2014

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Qualcomm Set To Enter Server Market

Speaking at a Qualcomm financial analysts' day held in New York Wednesday (Nov. 19) CEO Steve Mollenkopf said that the company would be leveraging its leading position as a supplier of chips for the high-end smartphone market to move into adjacent markets including servers in the data center.

• Rambus Cryptography Research Division Licenses Security Technologies to Cisco
• DELTA Microelectronics and Smartest GmbH cooperate in the Fabless market
• Dolphin Integration reveals the standard power kit library DELTA to ease the deployment of an optimal power management network into a SoC
• Allinea brings parallel debugging to 64-bit ARM platforms
• Moortec Semiconductor Sign Representative Agreement with Titus in South Korea
• Extendable Platform Kits for MIPS Released by Imperas
• North American Semiconductor Equipment Industry Posts October 2014 Book-to-Bill Ratio of 0.93

Headlines for Thursday Nov. 20, 2014

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Hybrid Memory Cube Consortium Advances Hybrid Memory Cube Performance and Industry Adoption With Release of New Specification

The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

• ARM HPC Ecosystem Continues to Build Momentum with Introduction of PathScale EKOPath Compiler
• Xilinx and NXP Collaborate to Reduce CapEx and OpEx Costs of Wireless Infrastructure Radios

Headlines for Wednesday Nov. 19, 2014

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PLDA Introduces XpressRICH4: The PCIe 4.0 Controller of Choice When Performance Matters

PLDA has introduced XpressRICH4, a highly configurable PCIe 4.0 interface soft IP designed for ASIC implementations and seamless FPGA prototyping implementations. Building on PLDA’s long history of numerous tape-outs in leading-edge process technologies, XpressRICH4 includes advanced features such as single root I/O virtualization (SR-IOV) and data-path protection.

• Sansa Security Announces Support for Microsoft PlayReady, Expands Commitment to Solving Deep Security Problems
• Elliptic Technologies Unveils Future-Proof Secure Hardware Root of Trust Technology
• Credo Tapes Out Industry-leading Serdes IP on 16-nm FinFET+ Process
• Synopsys Expands IP Accelerated Initiative with New DesignWare IP Prototyping Kits for 10 Interface Protocols
• Open-Silicon Announces Availability of World's First HMC 2.0 Memory Controller IP
• Report: Samsung Wins Back Apple Processor Business
• Intel Custom Foundry Demonstrates Industry-Leading 32 Gbps SerDes on 14nm Process
• Automotive IC Market to Display Strongest Growth Through 2018
• Rambus and Mobiveil Partner to Bring Pre-Validated Solution to Chip Makers, Delivering Memory Flexibility and Accelerated Time-to-Market
• eMemory Offers IP Industry-Leading Hybrid MTP SIP
• ZigBee 3.0 Creates Single Open, Global Wireless Standard for Devices

Headlines for Tuesday Nov. 18, 2014

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Chinese Dream for IC Powerhouse Is Coming True

China, which for nearly two decades has aimed to make semiconductor manufacturing one of its pillar industries, may realize the dream in the next 10 years, according to executives and analysts surveyed by EE Times.

• New Codescape tools from Imagination deliver comprehensive MIPS software life-cycle development environment
• NGCodec Raises Funds in New Financing Round
• Invionics Launches Platform that Speeds In-house EDA Tool Development, Solves Critical Design Flow Bottlenecks
• TVS' new US office represents continued global expansion and commitment to customers worldwide
• Oticon Standardizes on Synopsys' Design Compiler Graphical
• Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel Xeon Phi Product
• Marvell Launches Octa-Core 64-bit 5-Mode 4G LTE ARMADA Mobile PXA1936 System-on-Chip for High Performance Smartphones and Tablets Globally
• Marvell Launches Highly Integrated Quad-Core 64-bit ARMADA Mobile PXA1908 Platform for the Fast Growing 5-Mode 4G LTE Worldwide Mass Market

Headlines for Monday Nov. 17, 2014

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Altera and IBM Unveil FPGA-accelerated Systems Coherently Attached to POWER CPU

Altera and IBM today unveiled the industry’s first FPGA-based acceleration platform that coherently connects an FPGA to a POWER8 CPU leveraging IBM’s Coherent Accelerator Processor Interface (CAPI). The reconfigurable hardware accelerator features shared virtual memory between the FPGA and processor which significantly improves system performance, efficiency and flexibility in high-performance computing (HPC) and data center applications.

• POET Technologies Announces the Appointment of Ajit Manocha as Co-Chairman of the Board and the Search for a Permanent CEO
• Vidatronic Joins GLOBALFOUNDRIES' GLOBALSOLUTIONS Ecosystem as a Design Services Partner
• Rockchip Debuts Intel Jointly-Developed Game-Changing 3G Processor for Android Devices
• Synopsys' IC Validator Adopted by Plastic Logic for Physical Verification of Advanced Displays
• Xilinx Announces SDAccel Development Environment for OpenCL, C, and C++, Delivering Up to 25X Better Performance/Watt to the Data Center
• Dolphin Integration enables ASIC users to cut their costs with MyMACS services

Headlines for Friday Nov. 14, 2014

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Chelsio Launches Terminator Core IP

Chelsio Communications, a leading provider of 40Gb Ethernet (40GbE) Unified Wire Adapters and ASICs, announced today that it has launched a new product offering, the Terminator Core, a configurable kit for building high performance Converged Ethernet solutions.

• Apple, TSMC and the Seven Customers of 16FF+
• Nvidia jumps 13% from last quarter, Intel up 11.6%, AMD slips 7% Reports JPR
• CSR Launches World's First Integrated Bluetooth High Definition Audio Platform with Support for Ambient Noise Cancellation
• Vertu Licenses Assertive Display from Apical

Headlines for Thursday Nov. 13, 2014

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NVM Express Delivers 1.2 Specification with New Data Center and Client Features for PCI Express Solid-State Drives

NVM Express, Inc., the organization that developed the NVM Express specification for accessing solid-state drives (SSDs) on a PCI Express (PCIe) bus, today announced the release of its 1.2 specification. NVM Express (NVMe) 1.2 extends the specification to a new level of enterprise and client functionality.

• Kili Technology and DeviceFidelity Merge to Create World Mobile Payment Solutions Company
• Cavendish Kinetics Secures Funding to Accelerate the Growth of RF MEMS Market
• Veriest and DA-Integrated Announce Strategic Partnership Creating a Unique Semiconductor Services Model
• ARM(R)64 + GPU + IB is Now Ready: E4 Computer Engineering and Applied Micro Circuits Corporation Will Showcase the ARKA Server RK003, a Unique and Innovative Low-Power Platform for HPC
• Uniquify Appoints Dale Olstinske Senior Vice President of Worldwide Sales
• Spansion Licenses ARM's High-Performance Cortex-M7 Processor
• GUC Opens New Japan Design Center
• HDL Design House New Verification Seminar in Switzerland: Maximizing Verification Efficiency

Headlines for Wednesday Nov. 12, 2014

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Xilinx Announces Industry's First Low Latency 25G Ethernet IP for FPGAs to Address Throughput Challenges in Data Center Applications

Xilinx today announced the industry's first low latency 25G Ethernet IP for FPGAs to address throughput challenges in data center applications. The low latency 25G Ethernet MAC and PCS LogiCORE™ IP solution helps to reduce data center CapEx by providing a migration path from 10G to 25G links and delivers a drastic increase in performance by more than doubling the front panel bandwidth between top of rack switches and servers (10G to 25G).

• Sonics, Inc. Appoints Randy Smith as Vice President of Marketing
• CyweeMotion Partners with CEVA to Offer Complete Sensor Fusion Solution for Mobile and Wearables
• Slight Increase in Third Quarter 2014 Silicon Wafer Shipments
• Ambiq Micro Announces $15 Million Funding Round Led by Kleiner Perkins Caufield & Byers
• TSMC 16FinFET Plus Process Achieves Risk Production Milestone
• NTLab announces highly linear GPS/GLONASS/Galileo/BeiDou RF front-end with reduced power consumption
• Sidense Announces New Executive Appointments
• Altair Semiconductor Selects Kilopass XPM One-Time Programmable Non-Volatile Memory for High-Volume LTE Chip

Headlines for Tuesday Nov. 11, 2014

• Ineda Systems Secures Additional Series B Funding
• Nitero Achieves First-Pass Silicon Success for Industry's First Mobile 60GHz SoC Using Synopsys DesignWare IP for PCI Express and Tools

Headlines for Monday Nov. 10, 2014

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Scalable PowerVR Series7 GPUs target applications from wearables to servers, reaching teraflop performance

Imagination Technologies introduces PowerVR Series7, the latest generation of the PowerVR Rogue GPU architecture and an entire line-up of GPUs which scale from 16 to 512 arithmetic logic unit (ALU) cores, providing unprecedented scalability, efficiency and performance.

• TSMC Predicts Next Big Thing
• Renesas Electronics Kickstarts Maker and Emerging Application Design with the First ARM Cortex-A Processor-Based mbed Microprocessor Board
• Sonics Adopts Cadence JasperGold Apps Formal Verification for On-Chip Network IP Development
• PowerVR Guns for AMD, Nvidia
• Semiconductor Market Continues Record Setting Pace in Third Quarter of 2014
• Aliathon Announcing Compass-EOS as a Communications Segment Client
• TSMC October 2014 Revenue Report
• IRIDA Labs Partners with CEVA to Offer Advanced Computer Vision Algorithms for Ultra Low Power Devices Using CEVA-MM3101 Imaging & Vision DSP
• UMC Reports Sales for October 2014
• Dolphin Integration dedicated features for shortening and easing the Industrial Test of Audio converters

Headlines for Friday Nov. 07, 2014

• Nine of the Top 20 Semiconductor Suppliers are Forecast to Register Double-Digit Growth in 2014!
• EZchip Completes Acquisition of Tilera, a Leader in High-Performance Multi-Core Processors
• GLOBALFOUNDRIES and INVECAS Introduce New Dedicated Design Service Partner for Leading-Edge Technologies

Headlines for Thursday Nov. 06, 2014

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Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions

Kandou Bus has announced the Glasswing™ family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced Chord™ Signaling in February 2014 and outlined how signals can be correlated across more than two wires to achieve higher bandwidth and lower power with excellent signal integrity and low latency.

• Novatek Adopts CEVA-MM3101 Imaging and Vision DSP for Its Next-Generation SoCs
• KYOCERA Document Solutions Uses Synopsys' Application-Specific Instruction-Set Processor Tool to Accelerate Design of High-Performance Image Processing DSP
• GUC Monthly Sales Report - October 2014
• TechInsights - The much anticipated Intel 14 nm is finally here!
• Instruction Smart Trace - really smart & non-intrusive?

Headlines for Wednesday Nov. 05, 2014

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MIPI Alliance Introduces Sensor Interface Specification for Mobile, Mobile-Influenced and Embedded-Systems Applications

MIPI®Alliance today introduced a sensor interface specification for mobile, mobile-influenced and embedded-systems applications. The new specification, named MIPI I3C℠ (or MIPI i3c℠), was developed with the participation of vendors from across the sensor and mobile ecosystems.

• PathPartner Technology joins HDCP licensee group
• SMIC Reports 2014 Third Quarter Results
• Fabless Pipsqueaks Grow Up
• Altera and MathWorks Deliver Unified Model-Based Design Workflow for Altera SoCs
• Digital Blocks DB9000 TFT LCD Controller IP Core Family Achieves Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, and Cinema Applications
• Open Source Implementation Available for Multicore Association Task Management API
• NetSpeed Systems Accelerates SoC Innovation with Funding from Top-Tier Investors

Headlines for Tuesday Nov. 04, 2014

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Recore Systems announces FlexaWare at electronica 2014 in Munich

During electronica 2014 in Munich next week, Recore Systems announces FlexaWare®, an easy programmable, flexible many-core embedded platform. The FlexaWare® platform consists of hardware, a runtime and a software development environment. It is designed from the ground up to offer the flexibility and scalability needed to cater to a range of applications from clear cut to compute intensive and massively parallel.

• Arteris Adds Seven New Customers in 2014
• STMicroelectronics and Autotalks Ignite Cooperation to Deliver Vehicle-to-Vehicle/Infrastructure Communication for Safer, Cleaner Motoring
• TVS wins avionics verification project in China to DO-254 standard
• Xilinx Expands 20 nm Kintex UltraScale Portfolio for the Most Demanding Data Center Acceleration, Video and Signal Processing Applications
• Global Semiconductor Industry Posts Highest-Ever Quarterly Sales
• SGA Innovations Partners with CEVA to offer a DSP-based Wireline and Wireless Communication Solution for the IoT Market

Headlines for Monday Nov. 03, 2014

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Imagination Takes On Nvidia

Imagination Technologies is looking to develop technology that would combine its latest multicore MIPS processors with large arrays of its PowerVR graphics processors (GPUs).

• Actions Semiconductor Debuts 28nm Quad-Core Processor for Mainstream Android Tablets
• Marvell's Total Cloud Platform Solution Powers the World's First Dedicated ARM-Based High Density Cloud Server from Online.net Labs
• The new platform "MyDolphin" for free evaluation kits of Dolphin Integration's libraries
• Gartner Says the Processing, Sensing and Communications Semiconductor Device Portion of the IoT Is Set for Rapid Growth
• TSMC Honors ARM with Partner Award for Fifth Consecutive Year
• Silicon Image Announces Third Quarter Fiscal 2014 Earnings
• Atmel Unveils Innovative Solutions Powering the Internet of Things at Electronica 2014