D&R Headline News (February 2015)

Headlines for Friday Feb. 27, 2015

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SmartDV Announces Addition of Six New Verification IPs to their Product Portfolio

SmartDV Technologies has added six new VIPs to an already extensive VIP portfolio. The new additions include USB-Power Delivery, MIPI-CPHY, MIPI-DBI, AMBA5 CHI, LPDDR4 and DDR4.

• T&VS and Blackpepper Technologies announce strategic partnership to provide turnkey end-to-end SoC implementation services
• Cypher Partners with CEVA to Offer Innovative Noise Reduction Solution for Mobile, Wearables and Voice-activated Devices
• INSIDE Secure - 2014 Annual Results
• Cortus and Oryx enable Internet of Things SoC applications with IP v6 stack running on the full range of Cortus processor cores
• SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista
• WiLAN Enters into Settlement and License Agreement with Texas Instruments
• New EEMBC CoreMark-Pro Benchmark Bumps Processor Benchmarking Capabilities
• Altera and Escape Communications Announce High-capacity Turn-key Modem Solution for E- and V-band Microwave Radios
• Credo Demonstrates Industry's First 56G NRZ Solutions at OFC 2015
• ARM Launches Intelligent Flexible Cloud Framework to Shape the Next-Generation Network
• Blunk Microsystems offers CrossStep IDE for Cortus Software Development
• ARM Unveils Advanced Technology to Accelerate Game Development at the Game Developers Conference (GDC) 2015
• Brite Semiconductor Improves Quality of Results and Reduces Time to Market for Four SoC Designs with Cadence Digital Implementation and Signoff Tools

Headlines for Thursday Feb. 26, 2015

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Synopsys' embARC Open Software Platform Accelerates Development of ARC-based Embedded Systems for the Internet of Things

Synopsys today launched the embARC Open Software Platform to help accelerate the development of DesignWare® ARC® processor-based embedded systems. The new embARC platform gives ARC software developers online access to a comprehensive suite of free and open-source software that eases the development of code for the IoT and other embedded applications.

• Cavium and ARM To Demonstrate Comprehensive Cloud RAN Application on 48 Core 64-bit ARMv8-A ThunderX SoC Processor at Mobile World Congress 2015
• Apple & Samsung No Longer Control Majority of Tablet Market
• Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs
• Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer
• INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015

Headlines for Wednesday Feb. 25, 2015

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CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems

CEVA today unveiled the CEVA-XM4, its fourth-generation imaging and vision processor IP. Building on the success of the CEVA-MM3101, the CEVA-XM4 is equipped with specific functionality required to solve the most critical challenges faced when implementing energy-efficient human-like vision and visual perception capabilities in embedded systems.

• Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT)
• Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process
• Blu Wireless to demonstrate HYDRA gigabit modem IP targeted at mmWave communication
• Xilinx and BEEcube Announce Highly Scalable Prototyping Platform for 5G Massive MIMO Antenna Systems
• Nabto offers its "Internet of Things" Communication Platform on Cortus-based Systems-on-Chips
• Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at GSA Memory+ Conference in Tokyo
• Dream Chip Technologies and Chips&Media partner to provide Premium Ultra HD (4k) video experience
• Tronics Expands its Business Model to Mobile and Wearable Applications with the Licensing of its Combo Sensors Based on Disruptive Magelan and M&NEMS Technologies
• Microsemi's Innovative TimeProvider 5000 System Supports Phase Synchronization Needed for LTE Advanced and Small Cell Deployments
• ARM at Mobile World Congress 2015 - Expanding the Connected Experience
• Microchip Licenses EtherCAT Technology

Headlines for Tuesday Feb. 24, 2015

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Silicon Vision and Mindtree Enable Next Generation IoT Devices with Bluetooth Smart 4.2

Silicon Vision Technologies Ltd. a low power wireless intellectual property (IP) company and Mindtree a global technology services company announced the availability of fully integrated Bluetooth Smart 4.2 solution that includes Silicon Vision’s silicon proven, Bluetooth SIG certified Radio Transceiver IP and Mindtree’s qualified Bluetooth Smart v4.2 link layer, protocol stack and profiles.

• JEDEC Announces Publication of e.MMC Standard Update v5.1
• Hillcrest Labs' Freespace Always-On Sensing Software Available on Cadence Tensilica DSP
• Samsung Wants Moore's Law End, Analyst Says
• Cadence Announces Stratus High-Level Synthesis Platform
• TSMC to Start 10nm in 2017, Closing Gap with Intel
• ARM Adds Customized Remote Training to Education Portfolio
• Green Hills Software and Imagination Report Expanded Compiler and Tools Support for MIPS CPUs
• Altera Ships 20 nm SoCs
• S3 Group's Video Data Converter IP Selected by GEO Semiconductor
• eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design
• Xilinx and Xylon Announce New Industry Leading Automated Multi-Camera Image Stitching IP for 2D/3D Surround View Systems
• CAST Makes Evaluating 32-bit Processor IP Easier with Talos for BA20 Plus FreeRTOS
• Top Semiconductor R&D Leaders Ranked for 2014
• OneSpin Delivers First SystemC Assertion-Based Formal Verification Solution
• ARM Connects a New World of Intelligent Devices to the Cloud
• Freescale i.MX 6SoloX Takes Applications Processor Security to New Levels
• Express Logic's ThreadX To Bring Full RTOS to the ARM mbed Ecosystem
• Lattice Semiconductor Enables Faster IEC61508 Certification with FPGA Functional Safety Design Flow
• Atmel Launches Automotive Grade ARM Cortex-M0+-based MCUs With Capacitive Touch Hardware Support for HMI and LIN Applications
• Microsemi Extends its Leadership in Cyber Security for Automotive and IoT Applications with Escrypt Public Key Infrastructure
• Lattice Semiconductor Expedites & Simplifies USB Type-C Implementation in Consumer and Industrial Devices

Headlines for Monday Feb. 23, 2015

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New 80251 Microcontroller IP Core Available from CAST is the World's Fastest 8051-Compatible

A new 16-bit 80251 microcontroller IP core shipping now from CAST, Inc. runs 69.7 times faster than the original 8051 chip, making it the highest performance MCS®51 instruction set compatible IP core currently available.

• Smartphone and Automotive Display Revenue Swelled in 2014, as Demand for Other Small and Medium Display Categories Stalled, IHS Says
• Altera FPGAs Achieve Compelling Performance-per-Watt in Cloud Data Center Acceleration Using CNN Algorithms
• Flex Logix Technologies Introduces EFLX: an FPGA Core for Upgrading Silicon
• EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM Processor Optimized for High-Performance Networking Applications
• Fast Processor Models of MIPS Warrior Cores Released by Imperas and Open Virtual Platforms
• TVS announces new CPU Verification tool development
• Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-Processing SoC Technologies
• Altera Showcases Its Industry-leading SoC Solutions at Embedded World
• CEVA Announces Availability of Enhanced Voice Services (EVS) Codec for its Low Power Audio/Voice DSPs
• Logicircuit Offers First "Safe IP" Subscription Model
• Smart Power Metering: Dolphin Integration first Silicon IP provider to announce range 1/5,000 with 0.05 % accuracy for a complete solution
• Magillem partnering with Imperas: Enabling Internet of Things, using virtual platforms
• Videantis and gestigon bring gesture recognition and skeleton tracking to the automotive market
• North American Semiconductor Equipment Industry Posts January 2015 Book-to-Bill Ratio of 1.03
• Silicon Storage Technology and UMC Announce Availability of Qualified 55 nm Embedded SuperFlash Memory Platform and 40 nm License
• VESA to Showcase Latest DisplayPort Developments for Mobile Applications at Mobile World Congress
• eASIC Files Registration Statement for Proposed Initial Public Offering

Headlines for Thursday Feb. 19, 2015

• Multicore Association Provides Architecture Description Standard to Enhance Software Tool Support for Multicore and Manycore Processors
• NXP and Chinese Private Equity firm JianGuang Asset Management to Establish Semiconductor Joint Venture
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2015
• Microsemi Strengthens Leadership in Defense and Security with Category 1A Trusted Supplier Accreditation From DMEA

Headlines for Wednesday Feb. 18, 2015

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MIPI Alliance Updates its Widely Adopted CSI Specification to Bring High-Resolution Imaging, Richer Color and Video to Mobile and Mobile-Influenced Applications

MIPI®Alliance today introduced MIPI® CSI-2℠ v1.3, a comprehensive update to its Camera Serial Interface (CSI℠) specification. The new specification enables manufacturers to use the CSI-2 interface to bring higher-resolution imaging capabilities, natural color representation and advanced video capabilities to smartphones and other wireless connected devices.

• Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools
• CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs
• Mindtree Enables Next Generation Bluetooth Low Energy Chips at Cypress
• ARM Offers $10,000 in Prizes for Smart Product Design Competition
• eWBM Selects Elliptic's Secure Root of Trust Technology for Newest IoT Chipset
• Two Major Enterprise Solid State Disk (SSD) Vendors License Arteris FlexNoC Interconnect IP
• Semiconductor Unit Shipments To Exceed One Trillion Devices in 2017
• Embedded World 2015: ReFLEX CES Showcases Extended High-Speed FPGA Boards Portfolio.
• Imagination at Mobile World Congress 2015 - Driving the future of mobile innovation
• Imagination delivers next generation of embedded and IoT technologies at Embedded World 2015

Headlines for Tuesday Feb. 17, 2015

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Arteris and YOGITECH Announce Strategic Partnership Enabling ISO 26262 Compliant Advanced Automotive Systems-on-Chip

Arteris and YOGITECH today announced a strategic partnership to help semiconductor design teams develop automotive and industrial systems-on-chip (SoCs) more effectively.

• Epson Improves GPS Watch Battery Life with Cadence Tensilica Xtensa Processor
• Mortal Motorola
• Sunrise Micro Devices' Radio Technology Enables Internet Capable Bluetooth Smart IoT Devices
• Altera Announces Virtual Prototyping for Its Industry-leading SoC FPGA Portfolio Through Collaboration with Mentor Graphics
• Xilinx and BEEcube Deliver World's First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications
• Achronix Announces Production Availability of Speedster22i Product Family
• Apple, Ericsson Spar over LTE Patents
• State of Madhya Pradesh, Cricket Semiconductor and IESA working towards India's first specialty fab
• Truechip announces first customer shipment of LPDDR3 and LPDDR4 Comprehensive Verification IPs
• GLOBALFOUNDRIES Joins imec to Develop Innovative RF Solutions for Internet of Things Applications
• Enea Linux and System Management on the ARMv8-Based AMD Embedded R-Series Processor
• TVS to showcase advanced verification solutions at DVCon USA 2015
• Micrium and Cortus Announce new uC/OS-III Port to Cortus 32-bit Processor Cores

Headlines for Monday Feb. 16, 2015

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Samsung Announces Mass Production of Industry's First 14nm FinFET Mobile Application Processor

Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

• ARM and Green Hills Software Deliver Best in Class Automotive Performance
• LoPan, the complete platter at 55 nm uLP beyond sponsored libraries from Dolphin Integration

Headlines for Friday Feb. 13, 2015

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Ex-Motorola Unit Freescale Semiconductor in sale talks

Freescale Semiconductor, the $11 billion tech company spun out of Motorola in 2004, is in sale talks, The Post has learned.

Headlines for Thursday Feb. 12, 2015

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Arasan Chip Systems Announces New MIPI CSI-2 Total IP Solutions

Arasan Chip Systems, Inc. the leader in MIPI Camera and Imaging IP announces support for the latest version of CSI-2 v.1.3 and the first combination C-PHY + D-PHY supporting up to 17Gbps bandwidth.

• SMIC Receives Investment from China Integrated Circuit Industry Investment Fund
• Uniquify Joins GLOBALSOLUTIONS Ecosystem Program as Worldwide IP and ASIC Supplier
• Synopsys Expands VDK for Renesas RH850 Ethernet AVB and CAN-FD for Automotive System Software Development
• OmniPhy Announces Silicon-Proven Extreme-Ethernet IP
• Inside Secure Chosen by Leading French Telecom Operator SFR for Mobile Device Content Protection
• Moore's Law Chips Confidence
• Shikino High-Tech to Exhibit at Embedded World 2015

Headlines for Wednesday Feb. 11, 2015

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Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution

Mobiveil and Semtech Collaboration Reduces Time to Market by Providing a Complete Solution for PCI Express 3.0 With SR-IOV and ARI Support

• Accellera Systems Initiative Forms Portable Stimulus Working Group
• Silicon Vision at Mobile World Congress 2015 - Barcelona 2-5 March 2015
• Synopsys' New DesignWare DDR Explorer Tool Delivers Up to 20 Percent Improvement in DDR Memory Subsystem Efficiency
• Xilinx and Over 30 Alliance Program Members to Showcase Zynq All Programmable SoC Solutions at Embedded World 2015
• ReFLEX CES takes over PLDA Group's hardware business
• ARM Holdings plc Reports Results for the Fourth Quarter and Full Year 2014
• Rambus Develops R+ DDR4/3 PHY on Samsung 28nm LPP Process
• Cadence Elects Mark W. Adams to Board of Directors

Headlines for Tuesday Feb. 10, 2015

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INSIDE Secure Shortens Time to Certification with World's First FIPS 140-2-Certified IP Component

INSIDE Secure’s VaultIP delivers best in class security at the heart of smartphone and IoT devices to help silicon platform providers comply with stringent US government security standards while avoiding high costs and go-to-market delays of certification

• IoT Security: The Road Ahead
• Market Dynamics, Technology Hurdles Reduce DRAM Bit Volume Growth
• Apple HomeKit acceleration now supported by Barco Silex Crypto Public Key
• Kilopass Relocates Corporate Headquarters to San Jose to Accommodate Growth into New Market Segments
• Silicon Wafer Shipments Reach Record Levels in 2014
• TSMC January 2015 Revenue Report
• VESA Publishes Embedded DisplayPort (eDP) Standard Version 1.4a
• MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC
• GUC Unveils Industry's Most Complete Data Converter IP Product Line
• Sansa Security Joins the Industrial Internet Consortium

Headlines for Monday Feb. 09, 2015

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ARM buys Leading IoT Security Company Offspark as it Expands its mbed Platform

ARM has signaled the importance of security in IoT with the acquisition of Offspark, the IoT's leading security software company. Offspark, a Dutch company, specializes in IoT communications security and its PolarSSL technology is already deployed in a wide variety of devices including sensor modules, communication modules and smartphones.

• Dolphin Integration unveils the new generation of PWM audio DAC for Set-Top-Boxes at 28 nm and 40 nm
• Linaro announces Marvell as a founding member of the Linaro Community Boards Group
• TSMC Plans to Invest $16 Billion More in Taiwan Site
• Lattice Semiconductor and Helion Demonstrate New FPGA-Based Camera Design Solutions
• Open-Silicon: "No Software Runs Without Hardware"
• SMIC Reports 2014 Fourth Quarter Results
• Linaro announces 96Boards initiative to accelerate ARM software development
• Northwest Logic Offers MRAM Controller IP compatible with Everspin's ST-MRAM
• UMC Reports Sales for January 2015
• Imagination Technologies: Bert Nordberg to succeed Geoff Shingles as Chairman
• Aldec Announces HES-7, the Largest Off-The-Shelf Xilinx Virtex-7 FPGA Prototyping System at up to 288 Million ASIC Gates Capacity

Headlines for Friday Feb. 06, 2015

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TSMC Sues Over Trade-Secret Leak to Samsung

Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, is suing a former R&D employee on the suspicion that he leaked secrets including but not limited to 28 nm process technology to Samsung. South Korea’s largest company is a growing competitor in the foundry business.

• Spansion and XMC Expand Partnership to Jointly Develop 3D NAND
• GUC Monthly Sales Report - January 2015

Headlines for Thursday Feb. 05, 2015

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eInfochips announces eMMC 5.0 Verification IP

eInfochips has announced the availability of the eMMC 5.0 Verification IP (VIP). Companies designing the next generation embedded flash memory systems can improve the reliability and performance of their products using the eInfochips eMMC 5.0 VIP.

• T-Mobile launches a Mobile TV platform with Allegro DVT's transcoding solution
• Nantero Secures more than $30mm in Funding
• Cadence Reports Fourth Quarter and Fiscal Year 2014 Financial Results
• MStar to Use Cryptography Research DPA Countermeasures to Ward Off Attacks in Set-Top Box Solutions

Headlines for Wednesday Feb. 04, 2015

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ARM Sets New Standard for the Premium Mobile Experience

ARM today announced a suite of IP that will enable a new standard for premium experiences on 2016 mobile devices. At the heart of this suite is the ARM Cortex-A72 processor, which is the highest performing CPU technology available for developing mobile SoCs today.

• M31 Technology Adopts Cadence Verification IP to Achieve 2.5X Faster Verification
• ARM Cores Take on PC Processors
• ARM Pumps Mali in Mobile Graphics
• Who Gains the Most from ARM's New IP?
• ARM and Synopsys Collaboration Enables Optimized Implementation of ARM Cortex-A72 Processor-based SoCs with IC Compiler II
• Cadence Offers Complete Development Environment for ARM Premium Mobile IP Suite
• Silicon Labs Acquires Bluegiga, a Leader in Bluetooth and Wi-Fi Connectivity Solutions
• MaxLinear to Acquire Entropic, Reaffirms Its Fourth Quarter 2014 Guidance and Provides Outlook for First Quarter 2015
• IXYS Announces the Acquisition of RadioPulse

Headlines for Tuesday Feb. 03, 2015

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Mobiveil Inc. to Provide IP Licensing and Support for Spansion's High-Performance HyperBus Controller

Mobiveil today announced it will provide IP licensing and support for Spansion's HyperBus™ controller. Mobilveil is licensing Spansion's HyperBus™ intellectual property that is integrated into microcontrollers, allowing these products to interface with Spansion's HyperFlash™ memories.

• KnCMiner raises $15M led by Accel Partners and completes 16nm tape-out with TSMC
• Microcontroller Sales Regain Momentum After Slump
• Synopsys' New 25G/50G Ethernet Verification IP Enables Next-Generation Gigabit Designs
• CEVA, Inc. Announces Fourth Quarter and 2014 Financial Results
• ARM and Cadence Provide Energy-Efficient, Comprehensive Media Components for Mobile Market

Headlines for Monday Feb. 02, 2015

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Arasan Announces Industry's First Total eMMC 5.1 IP Solution

Arasan announces a complete single vendor eMMC 5.1 IP solution consisting of the eMMC Host controller IP with a matching eMMC HS400 PHY IP, the eMMC Device Controller IP with matching eMMC I/O Pads for dual voltage designs at 28nm and below and a comprehensive OVM based Verification IP for the controllers and PHY

• Ceva Has Vision For Neural Network Processing
• Complete USB Human Interface Design Platform
• Global Semiconductor Industry Posts Record Sales in 2014
• MagnaChip to Offer Enhanced 0.13 Micron Embedded EEPROM Process Technology
• PragmatIC Secures Major Investment from Cambridge Innovation Capital and ARM
• Intel to Acquire Lantiq; Advancing the Connected Home
• TVS adds Design for Testability to services portfolio, enabling customers to reduce time to market
• Fingerprint Application Opens up Market Demands for eMemory's Logic NVM IP Solutions
• WinterLogic Announces Z01X 2.9 with YOGITECH Safety Verification flow integration and the Inspect Schematic Viewer
• Sony Joins FDSOI Club
• S2C Expands Its World-Class Library of Over 80 Prototype Ready Interfaces
• Tablet Shipments Slow Down Dramatically