D&R Headline News (March 2015)

Headlines for Tuesday Mar. 31, 2015

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Intilop delivers their Enhanced 16 Thousand TCP & UDP Session Hardware Accelerator on Altera and Xilinx FPGAs targeted towards all Hyper Performance Networking Systems

Intilop delivers their Enhanced 10G bit 16K concurrent-TCP-session Hardware Accelerator Pre-Ported and tested on Altera and Xilinx FPGAs. This subsystem with 10G TCP Accelerator (TCP Full Offload Engines) that implements16 Thousand Simultaneous TCP Connections, unlimited continuous connections and Bandwidth of more than 1.1 Gigabyte/sec per port regardless of number of simultaneous or active TCP Sessions.

• TVS offers one of the first AMBA 5 CHI VIP solutions in the market
• M31 Offers Low-Voltage and Low-Power Physical IP Solutions for TSMC 55ULP Technology Targeting IoT Applications
• Synopsys Joins the AVnu Alliance
• Neural Networks Take on Embedded Vision
• Analysts Cool on Intel/Altera Combo
• Imec and sureCore collaborate on SRAM Design IP

Headlines for Monday Mar. 30, 2015

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Synopsys Launches High-Performance Embedded Vision Processor IP

Synopsys today announced the availability of the first products in the new DesignWare® EV Family of vision processors. The EV52 and EV54 vision processors are fully programmable and configurable vision processor IP cores that combine the flexibility of software solutions with the low cost and low power consumption of dedicated hardware.

• Researchers Claim 44x Power Cuts
• AppliedMicro and Codethink Announce Partnership to Accelerate Adoption of ARMv8-A Architecture
• Dolphin Integration rolls-out a battery charger for low-capacity batteries
• Semtech Announces IP Collaboration with MorethanIP to Support Ethernet at Speeds of 25G, 50G, 100G and 400G
• World's Fastest 8051 IP Core from Digital Core Design is 29 times faster
• Andes and eMemory Announce New IC Security Solutions For IoT Security Applications
• How Will Deep Learning Change SoCs?
• Intel in Talks to Buy Altera
• Atmel Breaks Ultra-low Power Performance Barriers With World's Lowest Power ARM Cortex-M based Solution

Headlines for Friday Mar. 27, 2015

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Mobiveil's Smallest Footprint Low-Density Parity Check LDPC-Based Flash Reliability IP Provides Extended Durability for NVM Express-Based Solid-State Drives

Mobiveil today announced Low-Density Parity Check LDPC-based flash reliability IP that offers solid-state drive (SSD) System on Chip (SoC) and FPGA designers a silicon footprint half the size of other LDPC IP blocks currently on the market.

• NXP-Freescale Fusion Creates Automotive Semiconductor Powerhouse, IHS Says
• 2014 Automotive Semiconductors Supplier Rankings Adjusted Based on Further Analysis, IHS Says
• Imagination reports strong momentum behind its Ensigma connectivity technologies in key markets
• Micron and Intel Unveil New 3D NAND Flash Memory
• Sidense Exhibiting at TSMC 2015 North American Technology Symposiums

Headlines for Thursday Mar. 26, 2015

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Sidense Increases its Coverage of the Popular 28nm Node

Sidense today announced that the Company’s SHF 1T-OTP macros for GLOBALFOUNDRIES 28nm HPP and SLP processes have met all of GLOBALFOUNDRIES qualification requirements.

• Faraday Announces Its Silicon-proven MIPI Subsystem to Enable Faster Time-to-Market
• Growth of Constellations Continues: IPextreme Welcomes UltraSoC as Newest Star

Headlines for Wednesday Mar. 25, 2015

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New Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors by 5X

Synopsys today announced availability of its new ASIP Designer tool that speeds the design of application-specific instruction-set processors (ASIPs) and programmable accelerators.

• UHD Video Processing and PCI Express DMA IP-cores for real world applications
• Texas Instruments introduces 32-bit MSP432 microcontrollers (MCUs): Ultra-low-power at its best, performance at its core
• NetSpeed Systems mames Industry Veteran Scott Seaton as VP Worldwide Sales
• GUC Relocates North America

Headlines for Tuesday Mar. 24, 2015

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RDA Selects Chips&Media's HD video technology for Mobile AP and DTV Platforms

Chips&Media, Inc. today announces that RDA Microelectronics has integrated the Chips&Media’s HD multi-standard codec core into its new family of SoC designs, which is available on the market.

• Apple A9 Orders Pivot to TSMC
• Digital Blocks Announces 2nd Gen Audio/Video & Data Hardware Protocol Stacks Supporting MPEG2 Transport Stream (TS), RTP, and UDP/IP Protocols
• NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology
• Xilinx SDAccel and SDNet Software Defined Development Environments Earn Lightwave Innovation Award Distinctions
• Altera and Eutecus Single-chip, FPGA-Based Solutions "See" and Provide Intelligent Vision for Smart Cities
• Semiconductors off to slow start in 2015
• Rambus Licenses Patents and Technology Solutions to IBM
• Multicore Microcontrollers Enable Gigabit Ethernet Internet of Things for Under $5

Headlines for Monday Mar. 23, 2015

• Omnitek's video IP-cores prove a hit with Xilinx customers
• Microsemi and OneSpin Solutions Target High-reliability Design Verification with Formal-based FPGA Equivalency Checking Solution
• Research Project "Power Control" Aims for the Increase of Energy Efficiency in Industrial Facilities
• Xilinx Enables Any Media over Any Network with Comprehensive Suite of All Programmable Professional Video Solutions
• Compelling OTN Solutions for 200G and 400G to be Demonstrated by Altera on its Arria 10 FPGAs at OFC 2015
• eInfochips improves reliability for avionics systems with new ARINC 429 Verification IP

Headlines for Friday Mar. 20, 2015

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In 2020, 10nm Will Occupy 55% of Revenue: TSMC

Mark Liu, Co-Chief Executive Officer and Co-President at Taiwan Semiconductor Manufacturing Company (TSMC) gave a speech under the topic “Growth Beyond Mobile” on March 18, referring to Internet of Things (IoT) will be the main growth driver of semiconductor industry, he further forecast that the 10nm will occupy 55 percent of revenue in 2020.

• North American Semiconductor Equipment Industry Posts February 2015 Book-to-Bill Ratio of 1.02
• MPEG LA Expands HEVC License Coverage

Headlines for Thursday Mar. 19, 2015

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Industrial IoT Drives Microsemi-Vitesse Merger

In a sign that the rash of M&As among chip vendors has yet to subside, Microsemi Corp. announced Wednesday (March 18) its acquisition of Vitesse Semiconductor Corp. for $389 million.

• Argon Design licenses Argon Streams VP9 to Chips&Media
• Small Powerful Systems Give Rise to Medical Semiconductor Sales

Headlines for Wednesday Mar. 18, 2015

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Microsemi Corporation to Acquire Vitesse Semiconductor Corporation

Microsemi and Vitesse Semiconductor jointly announced today that Microsemi has entered into a definitive agreement to acquire Vitesse for $5.28 per share through a cash tender offer, representing a premium of 32 percent based on the average closing price of Vitesse's shares of common stock during the 30 trading days ended March 17, 2015

• Valens Selects Silicon Creations' SerDes IP for the Colligo Chipsets
• Cadence and ARM Announce Strategic IP Interoperability Agreement
• Hycon Technology Selects Andes N8 CPU Core for Next Generation High-End 24-bit Analog-to-Digital Converter
• Broadcom v ASICs, Part 2
• Xilinx Announces Availability of 100G RS-FEC IP for Data Center, Service Provider, and Enterprise Applications
• Chukong Technologies and Imagination collaborate on the latest version of the Cocos2d-x game engine
• Imagination Technologies: Interim update
• prpl Foundation Announces Formation of Security Working Group to Define Open Framework Addressing Next Generation Security Requirements of Future Connected Devices
• SEMI Reports 2014 Global Semiconductor Equipment Sales of $37.5 Billion
• Rockchip Licenses Arteris FlexNoC Fabric IP for RK Series SoCs

Headlines for Tuesday Mar. 17, 2015

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Cadence and Intel Collaborate to Release 14nm Library Characterization Reference Flow for Customers of Intel Custom Foundry

Cadence and Intel Corporation today announced that the two companies have delivered a 14nm (nanometer) library characterization reference flow for customers of Intel Custom Foundry, continuing their collaboration on enabling digital and custom/analog flows for the Intel 14nm platform.

• Synopsys Enables Continuous Debug Innovation with More Than 200 VC Apps Now Available on the Verdi Platform
• NXP-Freescale Merger to Result in World’s Eighth-Largest Chipmaker and Pose Threat to Other Players, IHS Says
• Cavium Adds Support for NVIDIA GPU Accelerators in 64-bit ARMv8-A ThunderX Processor Family
• Ericsson acquires telecom IT services business in China
• HSA Foundation Launches New Era of Pervasive, Energy-Efficient Computing with HSA 1.0 Specification Release
• Kilopass Focuses on Market and Roadmap Expansion After Sidense Patent Litigation
• Kilopass to Exhibit at GOMACTech-15
• ISSI Enters Into A Definitive Merger Agreement To Be Acquired By Consortium For $19.25 Per Share

Headlines for Monday Mar. 16, 2015

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Judge Orders Kilopass to Pay Sidense $5.5 Million in Legal Fees and Costs for Baseless Patent Infringement Lawsuit

Sidense today announced that U.S. District Judge Susan Illston has ordered Kilopass Technology to pay Sidense $5.5 million for its “objectively baseless” patent infringement lawsuit initiated against Sidense in May of 2010. The fee recovery represents attorneys’ fees and associated costs.

• MulticoreWare Brings Unprecedented Performance and Productivity to New Processor Platforms
• DataCentred World First: OpenStack Public Cloud on 64-bit ARM Servers
• Baikal Electronics Selects Synopsys Solutions to Accelerate the Design and Verification of Their Advanced SoCs
• Latest Synopsys Virtualizer Release Accelerates VDK Performance by Up to 5X for Early Software Development
• T&VS and ESS announce strategic partnership to provide a complete security solution
• Silicon Image Introduces World's First superMHL/HDMI 2.0 Port Processor for Next Generation Home Theater Devices
• Altera FPGAs Drive Low-Bandwidth, High-Efficiency Videoconferencing for Avaya
• SHA 256-bit hash generator by Noesis Technologies
• Layoffs Hit 1,600 in Cypress Deal
• Open-Silicon Appoints Margie Evashenk to Its Board of Directors
• Guidelines to identify your optimal power management solution depending on your application challenges

Headlines for Friday Mar. 13, 2015

• Cypress and Spansion Complete $5 Billion All-Stock Merger
• 11 IC Product Categories to Exceed Total IC Market Growth in 2015
• Mentor Graphics Wins Injunction In Patent Suit With Synopsys
• Kilopass to Present "SoC for IoT: Antifuse NVM for Security and Low Power" at IIC China Spring Smart Devices Conference

Headlines for Thursday Mar. 12, 2015

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MIPI Alliance Updates its MIPI RFFE Interface for Mobile Device RF Front-End Architectures

MIPI Alliance today announced an updated version of its MIPI RF Front-End Control Interface for mobile devices: MIPI® Alliance Specification for RF Front-End Control Interface (RFFE℠), Version 2.0.

• Synopsys Continues to Sell, Ship and Support ZeBu Emulation Systems Worldwide
• WiLAN Enters Into Settlement and License Agreement With Texas Instruments
• Silicon Labs and ARM Collaborate to Drive the Future of Low-Power ARM mbed IoT Device Platforms
• Silicon Line GmbH Closes an Investment Round of 6.3 Million Euro
• Synopsys and Hardent Provide Interoperable Display IP Solutions to Reduce Data Transmission Bandwidth for Ultra High-Definition Mobile Devices
• Synopsys' New Verification IP for MIPI SoundWire Enables Audio and Control Interfaces in Low Power Designs
• SystemC-based UVM testing from TVS streamlines IP for Blu Wireless Technology
• Microsemi and Marvell Collaborate to Simplify Synchronous Ethernet Designs for Packet Switched Networks
• Aims Technology Joins ARM Connected Community
• Integre Technologies Announces Low Cost, High Performance x1 HyperLink DSP Interface FPGA Core
• UMC Broadens its 55nm eFlash Platform with Faraday's Silicon-proven IP
• Worldwide Semiconductor Market reported to be US$336 billion in 2014, up 9.9% from 2013.
• Square Acquires Kili Technology
• OpenPOWER Summit Showcases Altera FPGA Acceleration Technology
• NXP Acquires Athena SCS
• Xilinx to Participate in the Inaugural OpenPOWER Summit 2015 to Further Enable Collaborative Innovation for Next-Generation Data Centers

Headlines for Wednesday Mar. 11, 2015

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Lenovo Selects Elliptic Technologies for Embedded Hardware Security Solutions

Elliptic Technologies today announced that one of the world's largest and most innovative PC and mobile internet device manufacturers, Lenovo, has selected Elliptic Technologies for high performance security solutions to be deployed into the latest Lenovo internet mobile payment products.

• Toshiba Expands Line-up of ARM Cortex-M3-based Microcontroller for Smart Meters
• Freescale Speeds SoC Implementation Time by 7X with Cadence Innovus Implementation System
• Microsemi Announces High Performance SmartFusion2 SoC FPGA Dual-axis Motor Control Kit
• Altera Announces 30-Amp Integrated Digital DC-DC Converter For Generation 10 FPGAs
• FinFETs Race Toward Silicon
• Strong Fab Equipment Spending Expected in 2015; Slowing but Positive 2016
• Cadence Introduces Innovus Implementation System, Delivering Best-in-Class Results with Up to 10X Reduction in Turnaround Time

Headlines for Tuesday Mar. 10, 2015

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Lattice Semiconductor Closes Acquisition of Silicon Image

Lattice today announced the close of its acquisition of Silicon Image and the results of the related tender offer. For the first time in the semiconductor industry, a single company now combines the design flexibility and time to market benefits of FPGAs, with the highly integrated, function and cost optimization benefits of ASSPs.

• Wi-Charge Ushers in New Era of Wireless Device Charging
• IAR Systems shortens build times in leading development toolchain for ARM-based devices
• Synopsys Galaxy Design Platform Enables 90 Percent of Volume-Production FinFET Designs
• Synopsys Galaxy Design Platform Deployed by HiSilicon Technologies for Implementation of FinFET Designs
• Nufront Selects Uniquify DDR Subsystem IP to Support Advanced 28nm SoC Project
• eInfochips shortens verification cycles and improves reliability for ASIC and SoC designs with Verification IPs
• SiliconIndia selects OmniPhy for "20 Most Promising US Semiconductor Solution Providers"
• Arrow and eInfochips Team to Offer Consulting and Hardware/Software Design Services
• TSMC February 2015 Revenue Report

Headlines for Monday Mar. 09, 2015

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Alma Technologies Announces Availability of a New Ultra High Throughput JPEG Encoder IP Core

Alma Technologies today announced the immediate availability of a new very high performance JPEG Encoder IP Core, initiating a new product line of scalable parallel processing Ultra High Throughput Image and Video Compression IPs.

• Intel Packs Power, Intelligence of Xeon Processor Into System-on-Chip Offering to Target New, Growing Network Opportunities
• Xilinx Announces SDSoC Development Environment for All Programmable SoCs and MPSoCs
• Dolphin Integration innovates for detection practices on voice activity with WhisperTrigger
• Comparing Market Sizes and Forecasted Growth Rates for Systems, ICs
• UMC Reports Sales for February 2015
• Synopsys' IC Compiler II Enables Toshiba's Tapeout of Complex 40-nm SoC, Proves out Game-Changing Capabilities
• Altera Demonstrates its Comprehensive FPGA, SoC and Power Solutions at APEC 2015 Offering Greater Efficiencies in Electronic Design

Headlines for Friday Mar. 06, 2015

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Imagination identifies six key trends at MWC 2015

Imagination Technologies identifies six trends driving industry momentum and related technologies at the recent Mobile World Congress 2015 (MWC) focused on security, IoT interoperability, wearables, computer vision, communications infrastructure, and ultra-low power connectivity.

• NXP + Freescale Merger Set To Create Leading Vendor of Automotive Semiconductors in 2015; Renesas Was The Largest Vendor in 2014
• Dr. Zixue Zhou Appointed as Chairman of SMIC
• GUC Monthly Sales Report - February 2015
• MPEG LA Introduces License for DisplayPort

Headlines for Thursday Mar. 05, 2015

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SilabTech announces the release of its JESD204B Compliant 12.5Gbps SERDES PHY and Controller

SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today the release of its JESD204B SERDES PHY and Controller. SilabTech has already delivered this JESD204B SERDES and Controller to its early licensees including a top tier semiconductor company. These products SERDES has been validated in the TSMC 28nm HPM process, while the controller is a soft IP designed to support a wide range of process technology nodes.

• Synopsys Announces VDK for Freescale S32V200 MCU Family for Advanced Driver Assistance Systems Development
• eASIC Passes Milestone of Shipping Twenty Million Custom ICs
• Semtech Announces Acquisition of Triune Systems

Headlines for Wednesday Mar. 04, 2015

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Arasan Reinforces MIPI Leadership with Industry First Soundwire Demonstration

Arasan’s Soundwire Demonstration will showcase the different components of its Total IP Solution seamlessly working together. The Total MIPI SoundWire IP Solution from Arasan enables early adopters the fastest path to adoption of this new standard by offering a comprehensive IP package that includes the Verilog RTL source code for Master & Slave fully validated for compliance with the standard, a comprehensive test environment with a compliance suite for verification of the IP package, a SoundWire Hardware Development Kit (“HDK”) for FPGA prototyping, a SoundWire protocol analyzer and a complete SoundWire software stack.

• Global Unichip Corporation Utilizes Cadence Analog IP to Implement WiGig-Enabled SoC on 28nm Process
• Digital Core Design introduces DI2CM targeting I2C design needs
• Gartner Says Worldwide Server Market Grew 4.8 Percent in Shipments, While Revenue Increased 2.2 Percent in Fourth Quarter of 2014
• Linaro Enables Wider Portability of High Speed Networking Applications with Release of OpenDataPlane v1.0
• MediaTek Allocates US$300m to Invest in New Business Opportunities
• NXP CEO: 'Security, IoT, Cars' Drove Freescale Deal
• ARM and Tencent Games Collaborate to Advance Mobile Gaming
• Enlighten 3 with Forge puts Greater Control of Dynamic Lighting in the Hands of Artists

Headlines for Tuesday Mar. 03, 2015

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Vivante Announces Support for Vulkan GPU Rendering and Compute Standards

Vivante­ welcomes today's Khronos Group's announcement at GDC of the new Vulkan open standard API—an innovative, ground-up design that will unleash the newest innovations inside Vivante's latest GPU hardware.

• ViaSat Expands High-Speed Networking Security Portfolio with Acquisition of EAI Design Services
• Mentor Graphics Acquires Tanner EDA
• Brite Semiconductor Secures Series C Round of Finance from Norwest Venture Partners, Gobi Partners and China-based Foundry SMIC
• Sibridge Technologies announces customer adoption of USB 3.1 Verification IP
• Xilinx All Programmable Devices Enabling ZTE Pre5G 3D/Massive MIMO Base Station
• New AXI4 VIP Suite to improve FPGA and SoC reliability for ARM-based designs
• TVS releases one of the first C-PHY VIP solutions in the market
• Embedded Job Market Expands, But Boomers Feel the Squeeze
• Freescale-NXP Merger Leaves Fewer Viable Alternatives in Chip Market
• Global Semiconductor Industry Posts Highest-Ever January Sales
• DTS Headphone:X Optimized for Cadence Tensilica HiFi Audio DSPs
• Khronos Releases OpenCL 2.1 Provisional Specification for Public Review
• AMIQ EDA Releases the DVT Debugger Add-On Module for the e language, SystemVerilog, Verilog, and VHDL
• Khronos Reveals Vulkan API for High-efficiency Graphics and Compute on GPUs
• Mellanox and Synopsys Demonstrate Industry's First PCIe 4.0 Interoperability

Headlines for Monday Mar. 02, 2015

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NXP and Freescale Announce $40 Billion Merger

NXP Semiconductors N.V. (NASDAQ: NXPI) and Freescale Semiconductor, Ltd. (NYSE: FSL) today announced that they have entered into a definitive agreement under which NXP will merge with Freescale in a transaction which values the combined enterprise at just over $40 billion.

• Accellera Systems Initiative UVM 1.2 Proceeds to IEEE Standardization
• Waves MaxxVoice Technology Now Available for Cadence Tensilica HiFi Audio DSPs
• NXP, Freescale: Bigger Not Better
• PLDA and Avery Design Systems Cooperate on PCI Express
• eASIC and Comcores Announce Availability of CPRI v6.1
• Synopsys and Hillcrest Labs Announce Ultra-Low Power Sensor Processing Solution for Always-On Applications
• Synopsys and Sensory, Inc. Deliver Ultra-Low Power Voice Control Solution for Mobile, Automotive and Consumer Applications
• Waves Partners with CEVA to Offer the latest Sonic Enhancement Technologies for the Mobile Market
• Imagination packs high-quality PowerVR Rogue graphics into a tiny footprint
• New PowerVR video IP family from Imagination combines highest quality H.265/H.264 encoding with optimized low latency streaming
• VeriSilicon Introduces Hantro G2v2 Multi-format Decoder IP with VP9 Profile 2 to Support 10-bit Premium Internet Content
• PLDA and Analog Bits Partner to Provide a Silicon-proven PCIe 3.0 Solution for leading 28nm low power process
• Freescale, Cisco, Ciena Give Nod to FD-SOI
• Shikino Launches Still Image Decoder IP Obtaining "World-class speed" 16X faster image processing
• Altera and China Mobile Demonstrate Virtualized C-RAN Platform for 5G at Mobile World Congress 2015
• Kilopass Hires Michel Courtoy as Vice President of Marketing and Business Development
• Imagination's MIPS CPUs power Sequans' newest Colibri and Calliope LTE chipset platforms for IoT and M2M
• Imagination and Altair report growing traction for Altair's LTE devices with MIPS CPUs
• PRO DESIGN Unveils New Virtex UltraScale 440 FPGA Based Prototyping Solution
• Rambus Launches Partners-in-Open-Development Program to Accelerate Adoption of Lensless Smart Sensor Technology
• MWC 2015, Inside is Driving Security Innovation to Meet Demands of New Mobile and Internet Age
• How to meet the challenges of Set-Top-Boxes on Internet? Thanks to Dolphin Integration's Engineering Support team!