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Intilop delivers their Enhanced 10G bit 16K concurrent-TCP-session Hardware Accelerator Pre-Ported and tested on Altera and Xilinx FPGAs. This subsystem with 10G TCP Accelerator (TCP Full Offload Engines) that implements16 Thousand Simultaneous TCP Connections, unlimited continuous connections and Bandwidth of more than 1.1 Gigabyte/sec per port regardless of number of simultaneous or active TCP Sessions.
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Synopsys today announced the availability of the first products in the new DesignWare® EV Family of vision processors. The EV52 and EV54 vision processors are fully programmable and configurable vision processor IP cores that combine the flexibility of software solutions with the low cost and low power consumption of dedicated hardware.
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Mobiveil today announced Low-Density Parity Check LDPC-based flash reliability IP that offers solid-state drive (SSD) System on Chip (SoC) and FPGA designers a silicon footprint half the size of other LDPC IP blocks currently on the market.
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Sidense today announced that the Company’s SHF 1T-OTP macros for GLOBALFOUNDRIES 28nm HPP and SLP processes have met all of GLOBALFOUNDRIES qualification requirements.
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Synopsys today announced availability of its new ASIP Designer tool that speeds the design of application-specific instruction-set processors (ASIPs) and programmable accelerators.
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Chips&Media, Inc. today announces that RDA Microelectronics has integrated the Chips&Media’s HD multi-standard codec core into its new family of SoC designs, which is available on the market.
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Mark Liu, Co-Chief Executive Officer and Co-President at Taiwan Semiconductor Manufacturing Company (TSMC) gave a speech under the topic “Growth Beyond Mobile” on March 18, referring to Internet of Things (IoT) will be the main growth driver of semiconductor industry, he further forecast that the 10nm will occupy 55 percent of revenue in 2020.
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In a sign that the rash of M&As among chip vendors has yet to subside, Microsemi Corp. announced Wednesday (March 18) its acquisition of Vitesse Semiconductor Corp. for $389 million.
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Microsemi and Vitesse Semiconductor jointly announced today that Microsemi has entered into a definitive agreement to acquire Vitesse for $5.28 per share through a cash tender offer, representing a premium of 32 percent based on the average closing price of Vitesse's shares of common stock during the 30 trading days ended March 17, 2015
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Cadence and Intel Corporation today announced that the two companies have delivered a 14nm (nanometer) library characterization reference flow for customers of Intel Custom Foundry, continuing their collaboration on enabling digital and custom/analog flows for the Intel 14nm platform.
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Sidense today announced that U.S. District Judge Susan Illston has ordered Kilopass Technology to pay Sidense $5.5 million for its “objectively baseless” patent infringement lawsuit initiated against Sidense in May of 2010. The fee recovery represents attorneys’ fees and associated costs.
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MIPI Alliance today announced an updated version of its MIPI RF Front-End Control Interface for mobile devices: MIPI® Alliance Specification for RF Front-End Control Interface (RFFE℠), Version 2.0.
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Elliptic Technologies today announced that one of the world's largest and most innovative PC and mobile internet device manufacturers, Lenovo, has selected Elliptic Technologies for high performance security solutions to be deployed into the latest Lenovo internet mobile payment products.
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Lattice today announced the close of its acquisition of Silicon Image and the results of the related tender offer. For the first time in the semiconductor industry, a single company now combines the design flexibility and time to market benefits of FPGAs, with the highly integrated, function and cost optimization benefits of ASSPs.
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Alma Technologies today announced the immediate availability of a new very high performance JPEG Encoder IP Core, initiating a new product line of scalable parallel processing Ultra High Throughput Image and Video Compression IPs.
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Imagination Technologies identifies six trends driving industry momentum and related technologies at the recent Mobile World Congress 2015 (MWC) focused on security, IoT interoperability, wearables, computer vision, communications infrastructure, and ultra-low power connectivity.
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SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today the release of its JESD204B SERDES PHY and Controller. SilabTech has already delivered this JESD204B SERDES and Controller to its early licensees including a top tier semiconductor company. These products SERDES has been validated in the TSMC 28nm HPM process, while the controller is a soft IP designed to support a wide range of process technology nodes.
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Arasan’s Soundwire Demonstration will showcase the different components of its Total IP Solution seamlessly working together. The Total MIPI SoundWire IP Solution from Arasan enables early adopters the fastest path to adoption of this new standard by offering a comprehensive IP package that includes the Verilog RTL source code for Master & Slave fully validated for compliance with the standard, a comprehensive test environment with a compliance suite for verification of the IP package, a SoundWire Hardware Development Kit (“HDK”) for FPGA prototyping, a SoundWire protocol analyzer and a complete SoundWire software stack.
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Vivante welcomes today's Khronos Group's announcement at GDC of the new Vulkan open standard API—an innovative, ground-up design that will unleash the newest innovations inside Vivante's latest GPU hardware.
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NXP Semiconductors N.V. (NASDAQ: NXPI) and Freescale Semiconductor, Ltd. (NYSE: FSL) today announced that they have entered into a definitive agreement under which NXP will merge with Freescale in a transaction which values the combined enterprise at just over $40 billion.