D&R Headline News (May 2015)

Headlines for Friday May. 29, 2015

Top Story

A New Broadcom: The First Cuts

Avago Technologies bid $17 billion in cash and $20 billion in stock for Broadcom, creating the world’s sixth largest chip vendor in what’s being hailed as the semiconductor industry’s biggest proposed merger to date.

• Jumpstart your Hardware Validation with QuickPlay at DAC 2015
• Avago-Broadcom Deal: What's in It for You?
• Intel nears $15B deal to purchase Altera
• Synopsys to Acquire Quotium's IAST Product, Seeker
• Truechip announces first customer shipment of HDMI 2.0 Comprehensive Verification IP (CVIP)

Headlines for Thursday May. 28, 2015

Top Story

Avago, Broadcom Combo Praised

If Avago bids to buy Broadcom as reported it would be the largest of an escalating set of deals for the company and the consolidating semiconductor industry. The combination would have little product overlap, a few areas of synergy and would no doubt squeeze out plenty of savings in layoffs and spin-outs.

• Avago Technologies to Acquire Broadcom for $37 Billion
• Xilinx Collaborates with TSMC on 7nm for Fourth Consecutive Generation of All Programmable Technology Leadership and Multi-node Scaling Advantage
• Microsemi Achieves QML Class Q Qualification for RT ProASIC3 FPGAs
• Altera Announces Industry’s First 5G Algorithm Innovation Competition
• IoT Subsystems from CAST and SoC Solutions Reduce Time to Market for Connected Products
• Mentor Graphics Veloce Power Application Redefines Power Analysis Flow
• sureCore Limited Brings Its First Ultra-Low Power SRAM IP To Market
• OmniPhy to Present "Designing IPs For Automotive Applications," at DAC 2015 in San Francisco
• Kilopass to Be Featured Presenter at Design Automation Conference in ChipEstimate, ICScape, TSMC Booths
• Stars of IP Party Shines at DAC 2015 in San Francisco

Headlines for Wednesday May. 27, 2015

Top Story

Imagination reports MIPS Warrior P-class CPU at the heart of new communications processor from Baikal Electronics

Imagination Technologies (IMG.L) reports that a new multi-core processor from its customer Baikal Electronics, a Russian fabless IC company, integrates Imagination’s latest MIPS Warrior P-class P5600 CPU.

• Atmel Launches Innovative 5V Cortex-M0+ MCU Family With Integrated Peripheral Touch Controller
• Aldec HES-7 with Xilinx Virtex UltraScale Devices Enables True FPGA-based Verification
• Spreadtrum Guns for Intel's 14nm FinFET in 2016

Headlines for Tuesday May. 26, 2015

Top Story

Arteris FlexNoC Fabric IP Implemented in New Toshiba 4K Ultra HD Televisions

Arteris today announced that Toshiba has used Arteris FlexNoC IP as the backbone interconnect within their latest shipping digital TV systems-on-chip (SoCs). Toshiba’s use of Arteris FlexNoC allowed them to finish their project in record time, shortening their development time from project inception to tape-out.

• JEDEC Announces Support for NVDIMM Hybrid Memory Modules
• Synopsys Expands Virtualizer Development Kit for Renesas RH850 with Support for RH850/P1x Series
• New Release of the SDAccel Development Environment Accelerates Data Center Applications with Expanded Ecosystem of Platforms, Libraries, and Design Services
• M31 Technology Announces Low-power Focused Collaboration with Imagination Technologies
• UMC Unveils UMC Auto Platform to Enable Automotive IC Designs
• S2C Prodigy Cloud Cube Enables FPGA Prototyping of 1 Billion Gate Designs
• Fresco Logic Charges Ahead with USB Type-C Applications and Power Delivery

Headlines for Monday May. 25, 2015

Top Story

Dolphin Integration unveils a new generation of low-noise regulators for IoT at 55 nm

• Intel, Altera, Moore...and Drinks
• Digital Blocks Celebrates 18 Years of Offering 82xx Peripheral Replacements

Headlines for Friday May. 22, 2015

Top Story

IP-Maker's NVMe IP to pass the compliance test at the UNH-IOL

IP-Maker, the leading company in NVMe (NVM Express) technology has successfully passed de compliance test at the UNH-IOL (University of New Hampshire, InterOperability Laboratory).

• Samsung Ramps 10nm in 2016
• Imagination and ELVEES collaborate on next-generation solutions for video analytics
• Real Intent Delivers Major Innovation in Clock Domain Crossing Sign-off of SoC Designs
• North American Semiconductor Equipment Industry Posts April 2015 Book-to-Bill Ratio of 1.04
• Kilopass Heads to Israel, Japan, Taiwan, The Netherlands for the TSMC 2015 Technology Symposia

Headlines for Thursday May. 21, 2015

Top Story

Synopsys Announces Industry's Lowest Power PCI Express 3.1 IP Solution for Mobile SoCs

Synopsys today announced the industry's lowest power controller and PHY IP solution for PCI Express® (PCIe®) 3.1 specification, significantly reducing both active and standby power consumption for mobile Systems-on-Chips (SoCs).

• Agnisys Unveils Software to Automate Register Verification Process for SoC, IP, FPGA Designs
• So-ADE Unveils Debugger for Use with Verific Design Automation's SystemVerilog, VHDL, UPF Parser Platforms
• STMicroelectronics and ARM Cultivate Future Engineering Talent in Chinese Electronics Industry
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2015
• Tortuga Logic Bolsters Emerging Design-for-Security Market With Toolkit to Transform Hardware/Systems Developers' Approach to Security
• Six Top 20 1Q15 Semiconductor Suppliers Show >20% Growth

Headlines for Wednesday May. 20, 2015

Top Story

Imagination's OmniShield enables next-generation SoC security

With OmniShield-ready hardware and software IP, Imagination is ensuring that customers’ SoCs and OEMs’ products are designed for security, reliability and dynamic software management, as use models and services evolve across a wide range of connected devices.

• IAR Systems boosts 8051 development targeting Internet of Things
• 2014 Was a Banner Year for the Global Industrial Semiconductor Market, IHS Says
• GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications
• Intel, Altera Resume Acquisition Talks
• S3 Group announces world's first fully integrated, single conversion radio to be used in devices, transceivers and modem operating off the Iridum network
• Kilopass to Demonstrate NVM IP at UMC Technology Forums in Japan, China
• Truechip to demonstrate next generation Comprehensive Verification IPs at DAC 2015

Headlines for Tuesday May. 19, 2015

Top Story

Ramon Chips Licenses CEVA-X DSP for High Performance Computing for Space Applications

CEVA today announced that Ramon Chips, Ltd., a fabless semiconductor company focused on developing unique Radiation Hardened ASIC solutions for space applications, has licensed the CEVA-X1643 for its RC64 64-core parallel processor, targeting high performance space computations.

• NetSpeed Named Finalist for the 2015 Red Herring Top 100 North America Award
• Invionics Offers Industry's First Development Platform for Custom Analog and Mixed-Signal EDA Tools
• Altera FPGAs Help Enable Deployment of Harris Corporation's Latest Falcon III Wideband Tactical Radio
• UltraSoC and Teledyne LeCroy Collaborate to Unify Debug and Validation for System Designers
• Latest version of Java SE 8 now available for MIPS
• First Quarter 2015 Silicon Wafer Shipments Reach Record Levels

Headlines for Monday May. 18, 2015

Top Story

Altera Speeds IEC 61508-compliant Designs with Certified 28 nm FPGAs, SoCs, and Toolflows

Altera today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs).

• Mentor Graphics Tessent Hierarchical ATPG Solution Selected by Mellanox Technologies for Giga-gate Designs
• Xiaomi Picks Leadcore to Go Vertical
• S2C Single VU440 Prodigy FPGA Prototyping Board for Xilinx Virtex UltraScale 440 FPGA Now Available
• World's smallest micro-camera promises to revolutionize smart sensors
• ARM and UMC Target New 55nm ULP Physical IP Solution for Energy-Efficient Applications

Headlines for Friday May. 15, 2015

Top Story

CAN FD Bus Controller IP Core with ISO and non-ISO Compliance Available Now from CAST

A new version of the CAN 2.0 and FD Bus Controller Core that supports both the current non-ISO and upcoming ISO specifications is now available from intellectual property provider CAST, Inc.

• Truechip announces first customer shipment of NVM Express Comprehensive Verification IP (CVIP)
• Sidense Announces New Chief Financial Officer
• Overall GPU shipments dropped 13% in Q1’2015 from last quarter
• Imagination's ClearCall VoIP application now available for Cavium's OCTEON III multi-core processors
• TowerJazz and UCSD Demonstrate First 5G 256-Element 60 GHz Silicon Wafer-Scale Phased Array Transmitter

Headlines for Thursday May. 14, 2015

Top Story

Synopsys and Broadcom Expand Collaboration to Deploy ARC Processors in Multimedia and Networking Solutions

Synopsys today announced that Broadcom extended its license agreement providing access to Synopsys' DesignWare® ARC® Processors for an expanded range of advanced multimedia and networking system-on-chip (SoC) designs.

Headlines for Wednesday May. 13, 2015

Top Story

Altera licenses NetSpeed's Gemini - Configurable Cache Coherent Network-on-Chip IP

NetSpeed Systems announced today that Altera has licensed its Gemini cache coherent network-on-chip IP to offer its customers a highly configurable, latency optimized solution for today’s heterogeneous architecture designs.

• IDT Teams with Blu Wireless to Unite Wireless Charging and WiGig Data Transmission
• TI Strengthens Analog Marketshare; Skyworks Gains from Apple's Favor
• MIPI UniPro Interoperability Test Workshop Demonstrates Proven, Low Risk Interface Solutions for Wide Industry Adoption
• Synopsys' Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power
• Microsemi Announces Carrier Ethernet 2.0 Certification for its Turnkey Ethernet Access Switch Solution
• Andes Technology Forms New Internet of Things C.ommunity Knect.me to Provide Open-Source and Commercial IoT Solutions
• CogniVue Delivers Key Weapon in the Battle for ADAS Market Share: "Opus" Vision Processing Core Enables Critical Competitive Advantages
• Blue Danube Systems Raises $16 Million in Series B Funding
• Intel, eASIC Collaborate on Customized Intel-Based Solutions for the Cloud
• ARM Unveils New Quality Assurance Standard for mbed Enabled Devices

Headlines for Tuesday May. 12, 2015

Top Story

Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification

Cadence today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification

• Tracing Samsung's Road to 14nm
• New EEMBC Benchmark Targets Improved Performance of the "Things" on the Internet of Things
• Imagination upgrades Creator CI20 micro-computer
• Sonics Introduces Semiconductor IP Industry's First Power Management Solution Combining Fine-Grain Partitioning and Autonomous Control
• Andes Partners with eMemory to Provide Hardware Security Solution for the Internet of Things Market
• Mitsubishi Electric's Next-Generation MELSEC iQ-R Series C Controller Powered by Altera SoCs to Enable Smarter Factories
• Xilinx Achieves 28nm Milestone with Over $1B in Cumulative Revenues and 65 Percent Market Segment Share
• AAC Technologies Acquires WiSpry
• Shikino Launches Still Image Encoder IP Obtaining "World-class speed" 32X faster image processing

Headlines for Monday May. 11, 2015

Top Story

Microchip Technology To Acquire Micrel

Microchip and Micrel today announced that Microchip has signed a definitive agreement to acquire Micrel for $14.00 per share.

• Sercos IP Core for Xilinx 7 Series FPGAs and Zynq SoC Family Available
• Samsung Breaks Ground on $14 Billion Fab
• GigOptix Books $7.9 Million ASIC Order With Major Aerospace and Defense Contractor
• Khronos Releases SYCL 1.2 Final Specification
• Lattice Semiconductor Announces MachXO3LF Devices With On-Chip Flash Memory
• Altera Announces New Spectra-Q Engine for Industry-leading Quartus II Software to Accelerate FPGA and SoC Design
• NXP Secure Element Adopted by Samsung Galaxy S6 in World's Largest Smartphone Market
• TowerJazz and Dolphin Integration to offer Chip Developers a Complete Solution addressing the Low Power Requirements of the Fast Growing IoT Market
• SMIC Mum on 28nm Revenue Prospect in 2015
• Land Transport Authority of Singapore Selects Xilinx Automotive Zynq All Programmable SoCs for Intelligent Transport Systems

Headlines for Friday May. 08, 2015

• TSMC April 2015 Revenue Report
• UMC Reports Sales for April 2015
• prpl Foundation Strengthens Board with New Members from Broadcom, Lantiq, Qualcomm
• Altera Showcases System Design Solutions at RadarCon 2015

Headlines for Thursday May. 07, 2015

Top Story

DQ80251 from Digital Core Design is the World's Fastest 8051 CPU

The DQ80251 mastered by Digital Core Design runs more than 75 times faster than the original 8051 chip, being the same the highest performance MCS51 instruction set compatible IP Core currently available. This fully configurable 80251 Microcontroller Core executes the MCS-51 and MCS-251 instruction sets and is delivered with great variety of integrated peripherals like USB, Ethernet, I2C, SPI, UART, CAN, LIN, HDLC and Smart Card.

• RFEL licences ChannelCore Flex for Novator's new NC-10 Channeliser and the NCR-2000 Channeliser server
• SMIC Reports 2015 First Quarter Results
• Atmel and MXCHIP Collaborate to Bring Ultra-low Power Wi-Fi Platform With Secure Cloud Access for Internet of Things Applications
• Why chip design gets relevant for carmakers
• Mentor Graphics Enables Internet of Things Embedded Device Connectivity
• Why Intel and Qualcomm Can't Agree on IoT Framework
• Nvidia Exits LTE Modems

Headlines for Wednesday May. 06, 2015

Top Story

Credo First to Demonstrate 28G SerDes on 16FinFET Plus Technology

Credo Semiconductor today announced it is the first company to deliver silicon-proven 28G NRZ SerDes IP on the TSMC 16-nanometer FinFET Plus (16FF+) process, and will demonstrate its high-performance, low power characteristics at the TSMC Symposium this week in Shanghai, China.

• Aims Technology releases Aims Himalia, NoC explorer tool to provide complete on-chip interconnect solutions
• Conexant AudioSmart Voice and Speech Processing Software Now Optimized for Cadence Tensilica HiFi DSPs
• Semi IP licensing growth slows, vendor ranking stabilizes
• GUC Monthly Sales Report - April 2015
• ARM, Applied Micro and Netzyn Collaborate on New NFV Platform to Reduce Operator Costs
• ARM and Enea Enable Diverse Silicon Support for Efficient OPNFV
• Sercos III Open Source Soft-Master Core Announced
• Defacto Announces a Unified Design Flow to Ensure Coherency Between RTL, UPF, IPXACT and SDC

Headlines for Tuesday May. 05, 2015

Top Story

Arasan Chip Systems Completes a Decade of Total Ethernet IP Solutions

Arasan introduced the 10/100 Ethernet MAC IP in 2006. The family now includes a complete spectrum of Ethernet MAC IP from “Fast” 10/100 Mbps to “XGMAC” 10Gbps, with options for IEEE 1588, and AVB.

• NXP and Qualcomm Collaborate to Accelerate Adoption of NFC and Security in Mobile, Wearable and Internet of Things Devices
• Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology
• M31 Announces Partnership with AST Aiming for Israel’s Semiconductor Industry
• eMemory NeoFuse Technology Is Verified in 16nm FinFET Process
• TSMC Aims for 7nm in 2017
• Lattice Semiconductor Reports First Quarter 2015 Results

Headlines for Monday May. 04, 2015

Top Story

Archband Introduces Low Power 100dB Audio & Voice CODEC IP

Archband today has announced its new generation low power, high performance, flexible and highly integrated stereo audio/voice CODEC IP "AR82S021". This silicon-proven IP delivers 100dB signal-to-noise (SNR) benchmark performance with compact silicon area in 40nmll logic process.

• Dolphin Integration enables to get the most competitive Power Management Network
• First Quarter Semiconductor Sales Up 6 Percent Compared to Last Year
• Northwest Logic and S2C Deliver Validated MIPI Solution
• CEVA, Inc. Announces First Quarter 2015 Financial Results
• Xilinx Accelerates System Verification with Vivado Design Suite 2015.1
• NXP CEO on China, Apple Pay, IoT & V2V
• Google ATAP joins Linaro Mobile Group to extend collaboration in Project Ara
• Lattice Deal: Harbinger of FPGA & ASSP Union
• China Advantage Wanes for OEMs

Headlines for Friday May. 01, 2015

• OmniVision to be Acquired by Hua Capital Management, CITIC Capital and GoldStone Investment for $29.75 per share in Cash