D&R Headline News (June 2015)
Headlines for Tuesday Jun. 30, 2015
Synopsys Expands Security Solutions with Acquisition of Elliptic Technologies
Synopsys today announced that it has acquired Elliptic Technologies, a leading provider of security IP cores and software solutions for mobile, automotive, digital home, Internet of Things (IoT) and cloud computing applications.- 8 FD-SOI Questions You're Afraid to Ask
- Ceva Makes Waves in Wearables
- Xilinx and China Mobile Research Institute Collaborate on Next Generation Fronthaul Interface Development for 5G Wireless Networks
- DAC Trip Report: Expanding EDA's Charter & Topical Hardware Emulation
- Imagination Technologies Group plc: Robust licensing and solid progress across all three IP families
- GLOBALFOUNDRIES Obtains U.S. Government Clearance for IBM Microelectronics Business Acquisition
- Synopsys Completes Acquisition of Software Security Company Codenomicon
Headlines for Monday Jun. 29, 2015
Altera FPGAs Enable Big Data Storage Security with Advanced Encryption Standard Rates of an Unprecedented 100-Gbps, Full Duplex
Altera today announced that network security pioneer Secturion Systems, Inc., has chosen Arria® 10 FPGAs for its DarkStor™ secure network storage appliance product lines.- Imagination announces first complete university teaching course on mobile graphics
- Toshiba Information Systems (Japan) Corp. and Magillem Design Services agree on technical support partnership of IP-XACT certified tool.
- Dolphin Integration reduces silicon area by 40 % on its new audio codecs targeting wireless devices
- INSIDE Secure Offers Industry First Solution to Meet Demands of Growing U.S. Federal Cybersecurity Market
Headlines for Friday Jun. 26, 2015
Xylon Celebrates 20 Years of FPGA Excellence
Xylon announced today that it is celebrating 20 year anniversary of the company’s founding. Since its establishment in 1995, when the FPGA IP market was in its early infancy, Xylon has been focused on the design of efficient graphic and video solutions optimized exclusively for the Xilinx® All Programmable SoC and FPGA devices.- Startup's Tech is Intel's Quark Neural Network
- Leti's FD-SOI Lesson: Build Ecosystems
- Hardware debugger for the world's fastest 8051 & 80251
- Socionext starts mass production of TV Chip with TITC frame buffer compression IPs
Headlines for Thursday Jun. 25, 2015
SMIC Receives "2014 Foundry Supplier of the Year" Award from Qualcomm
SMIC today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.- STMicroelectronics Begins STM32F7 Production, First to Market with Microcontrollers Featuring Advanced ARM Cortex-M7 Core
- SingMai Partner with Jiatao in China
Headlines for Wednesday Jun. 24, 2015
PCIe 16G May Take Until 2017
Engineers have 16 GTransfers/second up and running in the lab for PCI Express 4.0, aka Gen 4. The bad news is this is the last turn of the crank for a copper version of the interconnect and, despite progress, a final 1.0 version of the spec may not be ready until early 2017.- Leading Suppliers of Automotive ICs Deploy Synopsys Test Solution
- INVECAS and NetSpeed Systems collaborate to create powerful reference platforms
- GOEPEL electronics protects your Intellectual Property in Xilinx FPGAs
- GlobalFoundries' FD-SOI Revolution
Headlines for Tuesday Jun. 23, 2015
PLDA Announces New, PCIe-based Embedded Switch Design, Enhancing Embedded Platform Design and Efficiency
PLDA today announced an embedded switch design that addresses multiple challenges within embedded platforms. Embedded platforms typically include components from multiple vendors who employ PCIe as the main I/O protocol.- Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology
- Intrinsic-ID Wins Eurostars Funding for PATRIOT Project to Bring Benefits of Physical Unclonable Functions (PUFs) to Mass-Market Consumer Devices
- ZTE Chooses Lattice Semiconductor for Feature Differentiation and Integration on Star 2 Smartphone
- Sonics Improves NoC Concurrency Management for SoC Designs with Multi-Channel Memory Sub-systems, Addresses Place & Route Tool Restrictions
- SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company
Headlines for Monday Jun. 22, 2015
Alma Technologies Announces Availability of a New Ultra High Throughput JPEG Decoder IP Core
Alma Technologies today announced the immediate availability of a new Ultra High Throughput JPEG decoder IP Core, completing its UHT™ JPEG compression family of IPs. This new UHT JPEG decoder IP, paired with Alma Technologies UHT JPEG encoder, offers massive pixel rates with very low end-to-end latency in video transmission systems using constrained bandwidth channels.- MediaTek Selects Sansa Security for its Next-Generation Mobile Processors
- Freescale Unveils i.MX 7 Series with Industry's Most Power Efficient ARM Cortex-A7 GHz-Class Applications Processors
- Test and Verification Solutions opens third Indian office in Hyderabad
- Synopsys PCI Express IP Adds System-Level Data Protection Features for High-Performance Cloud Computing SoCs
- SESAME BIV standard cell library: Dolphin Integration's ultra low-power solution for always-on blocks
- Kalray’s newest acceleration boards to provide big leap forward for cloud-computing and networking and storage applications
- UMC Collaborates with ARM to Validate UMC 14nm FinFET Process
- Synopsys and UMC Expand 14-nm FinFET Collaboration to Include DesignWare Embedded Memory and Test Solutions
- Synopsys Collaborates with NTU, NCKU, NTHU, and NCTU to Establish Joint Design Labs for IoT Applications
Headlines for Friday Jun. 19, 2015
ASICs for the IoT Cross the Horizon
The recent burst of activity in the EDA, foundry, and contract chip design industries indicates that they have joined the scramble to stake out territory in the Internet of Things (IoT) market.- EnSilica Announce WeGoes as New Sales Partner in Korea
- IBM Demos III-V FinFETs on Silicon
- North American Semiconductor Equipment Industry Posts May 2015 Book-to-Bill Ratio of 0.99
- Rambus and SK Hynix Extend License Agreement
Headlines for Thursday Jun. 18, 2015
Latest News- Microsemi's SmartFusion2 Secure Boot Solution Addresses Side Channel Analysis Vulnerabilities in Competitors' FPGAs Requiring External Configuration
- Silicon Nanowire Remains Favorite to Replace FinFET
Headlines for Wednesday Jun. 17, 2015
Greenliant Systems Selects PLDA's Solution for its Next-Generation PCIe SSD Controller
PLDA today announced that Greenliant Systems has selected PLDA’s IP for its next-generation PCIe SSD controller. Greenliant, a leader in energy-efficient, highly secure and reliable solid state storage, controller and flash memory products, joins a growing number of companies using PLDA solutions.- Algo-Logic Systems Launches 40Gbps TCP Endpoint on BittWare S5-PCIe-HQ FPGA Board
- mCube Unveils Its First Ultra-Low Power Accelerometer Family Optimized for Wearables and the "Internet of Moving Things"
- Chips&Media releases CFrame30, its groundbreaking hardware design for Lossy Frame Buffer Compression
- IC Manufacturers Close or Repurpose 83 Wafer Fabs from 2009-2014
Headlines for Tuesday Jun. 16, 2015
Crocus Technology attracts $21M (19M Euros) in financing
Crocus Technology, the supplier of magnetic sensors and embedded memory solutions designed with Magnetic Logic Unit™ (MLU) technology, today announces it has secured $21M (€19M) in funding.- JEDEC to update Solid State Drive Standard
- eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design for Next-Generation LTE Advanced and 5G Networking Equipment
- Omnitek shows high speed Xilinx technology with 12G-SDI Development Kit and RTVE 3.1 at InfoComm15
- Software Development: Not Written Here Is New Norm
- Lufthansa Technik and Panasonic Avionics Joint Venture, IDAIR GmbH, Selects INSIDE Secure's DRM Fusion Solution for Its In-Flight Movie Service
- INSIDE Secure Appoints Executive Vice President of Marketing to Accelerate Growth
Headlines for Monday Jun. 15, 2015
10nm Chips Promise Lower Costs
The challenges in the supply chain logistics for semiconductors continue to increase, but the 10nm node will give one more opportunity to gain large benefits from technology scaling.- Chip, PC Demand Continues Decline
- Altera Arria 10 FPGAs Chosen to Support Real-Time High-Speed Airborne Ethernet Interconnection Technology in Demanding Environments
- Does Hardware Even Matter Anymore?
- IBM, Microsoft, ARM, BAE Systems, Shazam, Patent Properties, Conversant, and Finjan Back ORoPO - the Open Register of Patent Ownership Launched Today
- MegaChips is First to Bridge DisplayPort with HDMI2.0a in a Single Chip
- Dolphin Integration celebrates its 30th anniversary... A new wind is blowing on the enterprise ushering it to success over the next 30 years!
Headlines for Friday Jun. 12, 2015
Has FD-SOI Hit Its Tipping Point?
As a reporter, I sometimes come across a thread — often consisting of offhand comments, random facts, tweets, tradeshow panels or p.r. propaganda — that actually, eventually, helps me connect the dots.- Using Wi-Fi to Power IoT
- Engineering Shortage Persists
- Patent Office Grants Mentor Graphics Petition to Rule Synopsys Emulation Patent Claims Unpatentable
- Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT
Headlines for Thursday Jun. 11, 2015
CEVA Unveils Wi-Fi IP Platforms to Enable a Broad Range of Connected Devices
CEVA today unveiled its RivieraWaves Wi-Fi IP platforms addressing the growing need to integrate Wi-Fi 802.11a/b/g/n/ac into a new class of System-on-Chips (SoCs) targeting a broad range of connected devices that comprise the Internet of Things (IoT).- Xilinx Demonstrates 'Any Media over Any Network' Solutions for the Pro A/V Industry at InfoComm 2015
- Catena Partners with CEVA for Complete Wi-Fi and Bluetooth Solutions for Mobile, Wearable and IoT Devices
- Beken Adopts CEVA DSP and Connectivity IPs for its Wireless Audio SoC Roadmap
- INSIDE Secure and Synopsys to Present Secure Solutions for the Internet of Things (IoT) at Linley IoT Conference 2015
- Intel Memo on Layoffs Reported
- Algo-Logic Systems Launches Industry-First 40Gbps TCP Endpoint on Altera Stratix V for Datacenter Acceleration
Headlines for Wednesday Jun. 10, 2015
ISSI Agrees to Merger Terms with Cypress Semiconductor
Integrated Silicon Solution today announced that it has finalized a definitive agreement to be acquired by Cypress for $20.25 per share in cash. With respect to the previously announced issue regarding antitrust approvals, Cypress has agreed to use its reasonable best efforts and take all reasonable actions to obtain such approvals, including fully divesting all of ISSI's SRAM business, if required.- 64-bit MIPS architecture provides low-power, high-throughput processing for Cavium's new OCTEON III processors
- TSMC May 2015 Revenue Report
- Microsemi Introduces Automotive-grade SoC FPGAs and FPGAs
Headlines for Tuesday Jun. 09, 2015
8051 MCUs get In-System Programming Benefits Through CAST and SMH Technologies Partnership
FlashRunner™ In-System Programmer (ISP) line from SMH Technologies supports 8051s from CAST; Live 8051 programming demo running in CAST’s DAC booth- eASIC Licenses Mobiveil's Universal Multiport Memory Controller IP
- Synopsys Continues Innovation Momentum with Latest IC Compiler II Release
- Open-Silicon Expands Management Team
- GUC Monthly Sales Report - May 2015
- Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications
- AMIQ EDA Introduces Duplicate Code Detection in Its Verissimo SystemVerilog Testbench Linter
- SILICONGATE Presents the 3rd Gen Flagship DC/DC at the 52nd DAC
Headlines for Monday Jun. 08, 2015
Mixel Achieves First-Time Silicon Success with MIPI D-PHY RX+ Configuration
Mixel announced today that its RX+ D-PHYSM IP is silicon-proven in both 40nm and 28nm process nodes and is going into high-volume production in customer’s product. The MIPI® D-PHY RX+ is a Mixel proprietary implementation of the Camera Serial Interface (CSISM) and Display Serial Interface (DSISM) D-PHY Receiver optimized for reduced area and power, while achieving full-speed production and in-system testing, and higher performance compared to traditional receiver configurations.- Avery Design Systems Takes Focus on MIPI CSI and DSI VIP Solutions
- Avery Design Systems Unveils DDR4 3DS LRDIMM VIP Solution
- Imagination and TSMC collaborate on advanced IoT IP platforms
- Cadence Announces Next-Generation JasperGold Formal Verification Platform
- ANSYS, Inc. Signs Definitive Agreement To Acquire Gear Design Solutions, Inc.
- Cadence Announces Collaboration with TSMC on IoT IP Subsystem
- Sonics Upgrades Designer Productivity and Power Analysis Capabilities in Next-Generation SoC Development Environment
- Synopsys Accelerates Automotive SoC Development with Broad Portfolio of Silicon-Proven IP
- Synopsys and TSMC Collaborate to Develop Integrated IoT Platform for TSMC 40-nm Ultra-Low-Power Process
- Altera Reveals Stratix 10 Innovations Enabling the Industry’s Fastest and Highest Capacity FPGAs and SoCs
- Avago/Broadcom Create Patent Powerhouse
- PLDA Announces New Partner Ecosystem, Providing True Freedom of Choice for Complete PCIe Controller and PHY Integrated IP Solutions
- S3 Group Launches the Industry’s Smallest, Most Efficient 320MS/s ADC
- IBM Introduces Industry's First Enterprise-Class Cloud Service for Designing Electronic Systems for Mobile Phones and Wearable Devices
- ARM Is in Talks to Buy Israeli Mobile Security Company Sansa
- The i8051 legacy extended by Dolphin Integration with 32-bit RISC microcontrollers
- True Circuits Attends Design Automation Conference, Showcases State-of-the-art Ultra PLL and Revolutionary DDR 4/3 PHY
- Cypress Fails to Finalize Merger Agreement with ISSI
- Synopsys to Acquire Atrenta
- TSMC Certifies Synopsys' IC Compiler II for its Latest 16-nm Production FinFET Plus Process
- Zentera and Runtime Design Automation Team Up to Demonstrate Secure EDA in the Cloud with the Zentera Cloud Overlay Network Infrastructure
- TSMC Certifies Cadence Innovus Implementation System on 16-nanometer FinFET Plus Process
- UMC Reports Sales for May 2015
- Synopsys' CustomSim Delivers 2X Circuit Simulation Speed-up
- Menta Enhances eFPGA Technology, Improving Performance by 20%
- Fast Processor Models of #ARM Cores Released by Imperas with Changes to OVP ARM Core Model Licensing Terms
Headlines for Friday Jun. 05, 2015
eMemory Launches Ultra-Low Power MTP Silicon IP for IoT Applications
eMemory Technology announced today its newly developed ultra-low power Multiple-Time Programmable (MTP) silicon IP offers superior features including 3μW low power consumption, 0.7V low operation voltage, over 100,000 times endurance, compact size, and excellent cost advantages.- Faraday Monthly Consolidated Sales Report - May 2015
- Open-Silicon Shows Breadth of ASIC Solutions at DAC 2015
- Mentor Graphics Enterprise Verification Platform Delivers New Levels of Performance and Low Power Verification Productivity
- Allegro DVT Announces Mass Shipment of its WiGig WDE Silicon IP.
Headlines for Thursday Jun. 04, 2015
EnSilica launches eSi-32X0MP scalable, asymmetric multicore processor
EnSilica, a leading independent provider of semiconductor IP and services, has added to its family of eSi-RISC processor cores with the launch of the eSI-32X0MP scalable, asymmetric multicore processor.- Intel Custom Foundry Certifies Synopsys Implementation Tools for 14-nm FinFET Production
- Think Silicon Launches Industry's Smallest Ultra-Low Power 3D GPU
- ARM and Samsung Sign Long-Term Agreement to Take Customers' Visual Experiences to a New Level
- Cadence Implementation and Signoff Tools Certified on Intel Custom Foundry 14nm Process
- NetSpeed Systems continues global expansion, expands presence in China
- Sankalp Semiconductor Announces FD-SOI Services and IP Partnership With STMicroelectronics
- OneSpin Solutions Adds Formal Fault Qualification Analysis to Safety Critical Apps Portfolio; Will Demonstrate OneSpin 360 Qualify at DAC
Headlines for Wednesday Jun. 03, 2015
Cadence Introduces Genus Synthesis Solution, Delivering Up to 10X Improvement in RTL Design Productivity
Cadence today unveiled the Cadence® Genus™ Synthesis Solution, its next-generation register-transfer level (RTL) synthesis and physical synthesis engine, to address the productivity challenges faced by RTL designers.- Cadence Collaborates with Imagination Technologies to Significantly Improve Designer Productivity on PowerVR Graphics Cores Using Genus Synthesis Solution
- Toshiba Standardizes on PrimeRail for Rail Signoff
- Think Silicon Ltd. and Tortuga Pacific Announce a Sales Partnership
- New ARM IP Tooling Suite Reduces SoC Integration Time from Months to Days
- Nantero Closes $30M+ Series E Round; its Next-Generation Memory NRAM Now Installed in Multiple Production Fabs Around the World
- Development Platform released for Cortus APS Processor IP Cores
- How will Intel's purchase of Altera affect embedded space?
- Global Semiconductor Sales Increase in April; Steady Growth Projected for Next Three Years
- On China's List: Memory, Market Share, M&A
- Samsung Licenses WiLAN Semiconductor Technology
- Nationz Accelerates Design Closure with PrimeRail Signoff Solution
Headlines for Tuesday Jun. 02, 2015
Allegro DVT adds VP9 support to its multi-format hardware encoder IP
Allegro DVT announces the immediate availability of its multi-format hardware video encoder IP with H.264/AVC, H.265/HEVC and VP9 support.- GLOBALFOUNDRIES Solidifies 14nm FinFET Design Infrastructure for Next-Generation Chip Designs
- Microsemi and Sibridge Technologies Collaborate to Develop Portfolio of High-speed Protocol IPs for SmartFusion2 and IGLOO2 FPGAs
- WiLAN Acquires Qimonda Patent Portfolio from Infineon
- Mentor Graphics Announces EZ-VIP Package for Enhanced Testbench Productivity
- PRiME Welcomes Moortec Semiconductor as Programme Associate Partner
- PLDA and ARM to deliver PCI Express-enabled ARM Juno development platform
- Brite Semiconductor, CEVA and SMIC collaborate on IoT ASIC platform
- Intel, Altera: Math in Question
- Socionext Adopts Defacto Solution for RTL and Gate-level Design Analysis and Building
- FlexTiles Adaptive Multicore SoC Virtual Platform Now Available from Imperas
- Codasip and Partners Launch ASIP Design Network to Take Application-Specific Processors Mainstream
- VESA Updates Multiple Projection Common Data Interchange (MPCDI) Standard to Include New Color Correction Parameters
- Growth of IP Industry Collective Continues as SoC Solutions Joins IPextreme's Constellations
Headlines for Monday Jun. 01, 2015
Intel to Acquire Altera
Intel and Altera today announced a definitive agreement under which Intel would acquire Altera for $54 per share in an all-cash transaction valued at approximately $16.7 billion.- MediaTek to Stay with TSMC for Finer-Node Chips
- Vivante Introduces Industry's First Vision IP with OpenVX and OpenCL
- Dolphin Integration's memories silicon proven at TSMC 90 nm eFlash
- Synopsys' IC Compiler II Used to Tape Out 28-nm-FD-SOI SoC
- ReFLEX CES Attila Arria 10 FPGA FMC Instant-DevKit added to Arrow Electronics Line Card
- Intel/Qualcomm: The Last Big Move
- Apple Buys into Augmented Reality -- for Cars?
- ASMedia Technologies Achieves Industry's First SuperSpeed USB 10 Gbps (USB 3.1 Gen 2) Certified Silicon (PCIe to USB 3.1 Gen 2)
- Genesys Logic Announces Industry's First USB Type-C Integrated USB 3.1 Gen 1 Hub Controller - GL3523S
- ARM De-risks Design Cycle for IoT Chips
- Digital Blocks DB9000 TFT LCD Controller IP Core Family Achieves Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, Wearables, and Cinema Applications
- SMIC Adds Reliability Checks to IP Certification Program Based on Mentor Graphics Calibre PERC Platform
- Docea Power Reveals Aceplorer 4.0 and Thermal Profiler 4.0 to Speed Up Power and Thermal Management Policies Development and Validation at DAC52