D&R Headline News (July 2015)

Headlines for Thursday Jul. 30, 2015

Top Story

ARM Expands IoT Security Capability with Acquisition of Sansa Security

ARM has acquired Israel-based Sansa Security, a provider of hardware security IP and software for advanced system-on-chip components deployed in Internet of Things (IoT) and mobile devices. The company currently enables security in more than 150 million products a year and Sansa Security technology is deployed across a range of smart connected devices and enterprise systems.

• Arasan Announces Ethernet IP Solutions for Automobiles
• CEVA, Inc. Announces Second Quarter 2015 Financial Results

Headlines for Wednesday Jul. 29, 2015

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Arasan Chip Systems Introduces CAN FD Total IP Solution for Automotive

Arasan’s Controller Area Network for Flexible Data (CAN FD) Controller IP provides increased bandwidth for CAN networking solutions for the next generation of automobiles.

• Tsunami of M&A Deals Underway in the Semiconductor Industry in 2015
• Faraday Technology: Announcement of President Change
• Synopsys Achieves Certification from Multiple Standards Organizations for Portfolio of IP on TSMC 16-nm FinFET Plus Process
• UMC Cuts Expectations for 28nm Ramp on Weaker Demand
• PathPartner Technology Announces Availability of HEVC Encoder and Decoder Solutions on x86 Family Platforms

Headlines for Tuesday Jul. 28, 2015

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Synopsys Announces Industry's First USB Type-C IP Solutions

Synopsys, Inc. (Nasdaq:SNPS) today introduced the industry's first USB IP solutions that support the USB Type-C™ (USB-C™) connectivity specification as well as the USB 3.1, 3.0 and 2.0 specifications.

• Qualcomm Innovation Center becomes Core Member of Linaro
• Cadence Reports Second Quarter 2015 Financial Results

Headlines for Monday Jul. 27, 2015

• Tablet Processor Sales Fell in 1Q15
• MPEG LA Announces Call for Patents to Organize Joint License for MPEG-DASH (Dynamic Adaptive Streaming over HTTP)
• UltraSoC partners with Tortuga Pacific to advance global SoC debug and analytics market
• Qualcomm Layoffs Spawned by Letter
• Global University Partners Alliance Launched by ARM in China

Headlines for Thursday Jul. 23, 2015

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Creonic Releases 4G 1 Gbit/s Turbo Decoder IP Core for LTE and LTE Advanced

Creonic announced today the release of their off-the-shelf 4G LTE and LTE-A turbo decoder IP core for base station and mobile device markets. The IP core complements the company's comprehensive offer of forward error correction IP.

• Xilinx Announces Q1 Fiscal 2016 Results; 20nm Sales Exceed $10 Million
• Kilopass Appoints Jen-Tai Hsu Vice President of Engineering
• Qualcomm Plans 15% Layoffs

Headlines for Wednesday Jul. 22, 2015

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ARM Holdings Reports Results for the Second Quarter and Half Year Ended 30 June 2015

ARM Holdings plc [(LSE: ARM); (NASDAQ: ARMH)] announces its unaudited financial results for the second quarter and half year ended 30 June 2015

• Can Globalfoundries and Europe's chip firms unite?
• Imagination appoints industry veteran to lead its expanding China operations
• Imagination joins 5G Innovation Centre to drive development of next-generation mobile data networks
• North American Semiconductor Equipment Industry Posts June 2015 Book-to-Bill Ratio of 0.98

Headlines for Tuesday Jul. 21, 2015

• Xilinx Announces Vivado Design Suite Early Access Support for the 16nm UltraScale+ Portfolio
• Altera Showcases the Capabilities of Single-Chip Configurable Processors in Latest MAX 10 FPGA Kit
• Rambus Reports Second Quarter Financial Results
• Synopsys Completes Acquisition of Seeker from Quotium

Headlines for Monday Jul. 20, 2015

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Silver Spring Networks Adopts CEVA Technology for Internet-of-Things Communications Platform

CEVA today announced that Silver Spring Networks, a leading networking platform and solutions provider for smart energy and smart city networks, has integrated CEVA processor technology into its fifth generation critical infrastructure networking platform - Gen5.

• UltraSoC and Cadence's Tensilica Division collaborate to deliver universal debug for heterogeneous multicore SoCs
• Taiwan Chipmakers Leery of M&A Wave
• Dolphin Integration unveils its ultra-low quiescent-current regulator for IoT Systems-on-Chip at 55 nm
• UMC Enters Volume Production for TSV Process Used to Enable AMD's High-Performance Radeon R9 Fury X GPU
• Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers

Headlines for Friday Jul. 17, 2015

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Synopsys Acquires Bluetooth Smart IP from Silicon Vision

Synopsys today announced that it has acquired the Bluetooth Smart IP from Silicon Vision, a leading provider of high-performance, ultra-low-power wireless IP solutions.

• High Customer Interest in FD-SOI, Globalfoundries Says
• TSMC Trims 2015 Outlook

Headlines for Thursday Jul. 16, 2015

• SUSE Launches Partner Program to Bring SUSE Linux Enterprise 12 to 64-bit ARM Processors
• Ex-IBMer Fired Up for Foundry
• TSMC Reports Second Quarter EPS of NT$3.06
• PC, Mobile Slump Hits Chips
• Wearable Systems Give Major Boost to Total IoT Sales in 2015
• Semtech Announces Global Reduction in Force
• Bluetooth SIG and FIDO Alliance Deliver Two-factor Authentication Via Bluetooth Smart
• Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT

Headlines for Wednesday Jul. 15, 2015

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Gartner Says Worldwide Semiconductor Capital Spending to Increase 2.5 Percent in 2015

Worldwide semiconductor capital spending is projected to grow 2.5 percent in 2015, to $66.1 billion, according to Gartner, Inc. This is a down from the 4.1 percent growth predicted in the previous quarter's forecast.

• Atmel Ships World’s Highest-Performing ARM Cortex-M7 based MCUs With Atmel | SMART SAM S/E Series Targeting IoT and Industrial Markets
• StreamDSP Announces latest v5.1 update to its VITA 17.1 sFPDP IP Core
• Thread Wireless Networking Protocol Now Available
• MPEG LA Expands AVC License Coverage

Headlines for Tuesday Jul. 14, 2015

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China Bids $23B for Micron

In a bold move to put China at the forefront of semiconductors, Tsinghua Unigroup bid $23 billion to buy Micron Technology. The deal would fill one of the biggest strategic holes in China’s chip industry but is expected to raise political issues all the way to the U.S. White House.

• Globalfoundries' CEO: Why FD-SOI and Why Now

Headlines for Monday Jul. 13, 2015

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GLOBALFOUNDRIES Launches Industry's First 22nm FD-SOI Technology Platform

The “22FDX™” platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, providing an optimal solution for the rapidly evolving mainstream mobile, Internet-of-Things (IoT), RF connectivity and networking markets.

• Itseez Open CV Library Now Available on Cadence Tensilica Image/Vision DSPs
• OVH.com Launches World's first ARMv8-Based Public Cloud Powered by Cavium's ThunderX Workload Optimized Processors
• Open Source Core Advances
• Allinea Announces ARM 64-Bit Development Tool Suite
• Palma Ceia SemiDesign to Partner With NEWRACOM in IP Development for Next-Generation WiFi Chipsets
• Indian Wafer Fab Will be Specialty Foundry
• Drop in Foundry Sales Sends a Warning Signal
• IP-Maker NVMe Compliant Solution for Software Defined Storage
• TSMC June 2015 Revenue Report
• Dolphin Integration accelerates its Mixed-Signal Front-End Design Solutions

Headlines for Friday Jul. 10, 2015

• Ambiq Micro appoints Dale Hancock as Vice President of Engineering

Headlines for Thursday Jul. 09, 2015

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IBM Research Alliance Produces Industr's First 7nm Node Test Chips

An alliance led by IBM Research today announced that it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything from smartphones to spacecraft.

• Algo-Logic Systems Launches 40Gbps TCP Endpoint on ReFLEX XpressGX5-LP FPGA Board
• Intilop releases their 7 Gen. 1024 Full TCP & UDP Session Hardware Accelerator that requires no external memory on Altera & Xilinx FPGAs for all Hyper Performance Networking Systems
• Gartner Says Worldwide Semiconductor Sales Expected to Reach $348 Billion in 2015, a 2.2 Percent Increase From 2014
• IoT Opportunity Drives IP Grab
• UMC Reports Sales for June 2015
• UltraSoC appoints Gadge Panesar as CTO

Headlines for Wednesday Jul. 08, 2015

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Krivi announces availability of 28nm UMC IO Pad library platform

Krivi Semiconductor has announced availability of its Alcor IO pad library platform for UMC’s 28nm technology. This IO platform supports a wide variety of interface standards such as DDR, LVDS, and Memory card super combo IO libraries.

• SmartDV's USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor
• Rambus and Renesas Electronics Renew License Agreement
• Peregrine Semiconductor Introduces First RF SOI 300 mm Technology Platform

Headlines for Tuesday Jul. 07, 2015

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Sequans Licenses Arteris FlexNoC Interconnect IP for Low Power LTE IoT SoC

Arteris today announced that Sequans Communications, maker of single-mode LTE chipsets for the Internet of Things, has licensed Arteris FlexNoC IP for use in its next generation of IoT chipsets.

• Cyberon Optimizes CSpotter Voice Recognition Software for Cadence Tensilica Fusion and HiFi DSPs
• EDA Consortium Reports EDA Industry Revenue Increase For Q1 2015
• Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms
• Imagination Technologies: Board change
• ARM's Wish List for IoT

Headlines for Monday Jul. 06, 2015

Top Story

FinFETs + FD-SOI Proposition: May Save Power

Ron Martino, vice president of application processors and advanced technology for Freescale's MCUs says there is room both both FinFETs, FD-SOI and combinations of the two.

• TSMC overtakes Intel in chip capex ranking
• Dolphin Integration's innovative power island construction kit optimizes Low-Power Management
• Global Semiconductor Sales Increase Five Percent in May
• Key ASIC Deploys Synopsys' Design Compiler Graphical to Accelerate System-on-Chip Design
• Will Globalfoundries be More Successful than IBM with Its Foundry Business?
• Could India's Analog Wafer Fab be Moving South?
• EnSilica announce new sales partnership with Beyond Electronics, Israel
• eMemory Offers Logic NVM Solutions to Enhance IC Performance for Camera Modules
• GUC Monthly Sales Report - June 2015
• Intel Announces Leadership Changes

Headlines for Thursday Jul. 02, 2015

• AHA Demonstrates Complete DVB-S2X Modem in SDR Platform
• INSIDE Secure finalizes its partnership agreement with Presto Engineering
• Altera Joins OPNFV Open Source Platform to Bring the Value of FPGAs to Network Function Virtualization

Headlines for Wednesday Jul. 01, 2015

Top Story

GLOBALFOUNDRIES Completes Acquisition of IBM Microelectronics Business

GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business. With the acquisition, GLOBALFOUNDRIES gains differentiated technologies to enhance its product offerings in key growth markets, from mobility and Internet of Things (IoT) to Big Data and high-performance computing.

• Altera FPGA-Based Storage Reference Design Doubles Life of NAND Flash
• Xilinx Tapes-Out Industry's First All Programmable Multi-Processor SoC Using TSMC's 16nm FF+ for Embedded Vision, ADAS, I-IoT, and 5G Systems
• Ericsson: Implementation of cost and efficiency program in Sweden
• RISC vs CISC: What's the Difference?