D&R Headline News (September 2015)
Headlines for Wednesday Sep. 30, 2015
Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
Xilinx today announced first customer shipment of the industry's first 16nm multiprocessor SoC (MPSoC) a quarter ahead of schedule. The early release of the Zynq® UltraScale+™ MPSoC enables Xilinx customers to begin designing and delivering MPSoC-based systems today.- Mellanox Technologies, Ltd. Announces Definitive Agreement to Acquire EZchip
- Fuji Xerox Reduces Silicon Area by More than 50 Percent Using Synopsys ASIP Designer
- INSIDE Secure appoints Amedeo D'Angelo as President and Chief Executive Officer
- ARM Aligns With Microsoft Azure
- Digital Blocks I2C & SPI Controller IP Core Families Extend Lead in Sensor Interface to Host Processors with System-Level Features & Low Power
Headlines for Tuesday Sep. 29, 2015
Imagination's Ensigma communications IP receives Wi-Fi CERTIFIED ac certification and Bluetooth Smart qualification
Imagination Technologies (IMG.L) announces it has received certification for Wi-Fi CERTIFIED™ ac and qualification for Bluetooth® Smart for its high-performance Ensigma Explorer radio processing unit (RPU) communications IP.- Qualcomm Commits Up To $150 Million to Strategic Venture Fund in India
- Open-Silicon Announces Comprehensive High Bandwidth Memory (HBM) Gen2 IP Subsystem Solution
- Synopsys Announces Industry's First Security IP Solutions for New SHA-3 Cryptographic Hash Standard
- STMicroelectronics Adopts ARM's Latest Processor Technology for Automotive Applications
- Truechip announces first customer shipment of HBM Comprehensive Verification IP (CVIP)
- SMIC Best IP Partner Award of 2015
Headlines for Monday Sep. 28, 2015
Shikino Launches Still Image Codec IP Obtaining 16X Faster Image Processing
Shikino today announced that it has launched a new still image codec IP, “KJN-8EX”, and commenced sales on July 31, 2015. As a new product from the “KJN series” with the world’s top share in the still image compression/decompression technology, Shikino developed this still image codec IP which has the high-speed image processing performance, 16X speed (16 data/clock), in the JPEG compression/decompression with high bit depths (8-bit/10-bit/12-bit).- Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP
- EDA Consortium Reports EDA Industry Revenue Increase for Q2 2015
- Startup Goes Multi-Die to Customize MCUs
- M&A Activity Continues Through Uncertain Business Climate
- TSMC Recognizes Synopsys with Partner Awards for Interface IP and Joint Development of 10-nm FinFET Design Infrastructure
- Marvell Technology Group Ltd. Announces Significant Restructuring of Mobile Platform Business
- Benefit from Dolphin Integration's state-of-the-art compiler for 80251 CISC microcontrollers
- S2C Quad Kintex UltraScale Prodigy FPGA Prototyping Logic Module Addresses Designs with Massive Parallel DSP Algorithms
Headlines for Friday Sep. 25, 2015
Latest NewsHeadlines for Thursday Sep. 24, 2015
Moortec Semiconductor Limited Joins TSMC IP Alliance Program
Moortec Semiconductor, leading supplier of embedded monitoring and optimisation IP, are proud to announce its membership in TSMC’s Hard IP Alliance, a part of TSMC's Open Innovation Platform®.- Imagination Receives TSMC 2015 Graphics Partner of the Year Award
- TSMC's 2015 Forecast May Be Warning for Supply Chain
- SMIC Receives 'Hi-Tech Enterprise Achievement Award' for the Second Time
- Legend releases Memory QA Solutions for on-chip memory IP instances
Headlines for Wednesday Sep. 23, 2015
16 Insights on ICs
The semiconductor industry is poised for slow steady growth that will drive more consolidation, but big technology transitions are just two to three years away. That was the conclusion of the annual fall forecast that Bill McClean, president of IC Insights, delivered here.- TSMC Fourth Quarter and Full Year 2015 Revenue Outlook
- Kilopass to Exhibit at Leading-Edge Embedded NVM Workshop 2015, Demonstrating its Antifuse E-NVM Memory IP
- INSIDE Secure Increases Momentum in Financial Services with Three New Major Mobile Application Security Wins
- TSMC Honors ARM with Partner Award for Sixth Consecutive Year
Headlines for Tuesday Sep. 22, 2015
Synopsys Accelerates Development of IoT Designs with Industry's Most Comprehensive IP Portfolio
Synopsys today announced a comprehensive portfolio of IP optimized to address the security, wireless connectivity, energy-efficient and sensor processing requirements for a wide range of Internet of Things (IoT) applications such as wearables, smart appliances, metering and wireless sensor networks.- TSMC Discusses Next MEMS, Monolithic Mics
- UMC Enters High Volume Touch IC Production using Foundry Industry's First 0.11um eFlash Process
- Winbond to License DPA Countermeasures from Rambus Cryptography Research
Headlines for Monday Sep. 21, 2015
Dialog Semiconductor to acquire Atmel for $4.6 Billion
Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion. The acquisition creates a global leader in both Power Management (2) and Embedded Processing solutions.- Design Options for Next Billion IoT Devices
- Microcontroller Market Growth Tied to Rise in Internet of Things Applications, IHS Says
- ReFLEX CES Introduces Alaric Instant-DevKit Based on Altera’s Arria 10 SoC
- New performances specified by Dolphin Integration for minimizing Power Regulator Capacitances
- Arasan Announces Automotive Grade MIPI DPHY IP For 40nm
- AMD Loses Processor Veteran
- General Processor Technologies Joins HSA Board of Directors and Expands Licensing Geography
Headlines for Friday Sep. 18, 2015
TSMC Preps 10nm, Tunes 16nm
TSMC will start early production on a 10nm process this year and 7nm in 2017, executives said in a road map update here. In between, the foundry giant will release a cost-reduced version of its 16nm process next year and a broad portfolio of specialty processes for the Internet of Things, automotive and sensors.- North American Semiconductor Equipment Industry Posts August 2015 Book-to-Bill Ratio of 1.06
- Apple Seen Splitting 14/16nm Orders Among Foundries into 2016
- China Warms Up, Slowly, to FD-SOI
- M31 Technology Displays the "Roaming in the Cloud" IPs
Headlines for Thursday Sep. 17, 2015
Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 10-nm FinFET Process
Synopsys today announced the successful tape-out of a broad portfolio of DesignWare® Interface and Foundation IP on TSMC's 10-nanometer (nm) FinFET process, reducing risk for designers who want to take advantage of the power, area and performance improvements offered by the process.- TSMC Certifies Synopsys Design Tools for 10-nm FinFET Technology
- D32PRO, fully scalable & royalty-free 32-bit CPU from DCD
- Flex Logix Extends Embedded FPGA-in-SoC Architecture with New Block RAM and DSP Cores
- Mentor Graphics Acquires Calypto Design Systems
Headlines for Wednesday Sep. 16, 2015
Cadence Announces Broad IP Portfolio for TSMC 10nm FinFET Process
Cadence today announced a broad intellectual property (IP) portfolio for TSMC’s 10nm FinFET (N10) process. Cadence has already secured multiple design wins with this portfolio and is actively engaged with customers as adoption of TSMC’s leading-edge process grows.- Q&A with GloFo CEO: 'IoT Is No Mystical Animal'
- Imagination Technologies Group plc -- Interim update
- Synopsys' New HAPS-80 FPGA-Based Prototyping Solution Delivers Up to 100 MHz System Performance
- Mentor Graphics and AMD to Accelerate ARMv8-A Linux Development for Embedded Systems
- Analog Bits to present half-power, multi-protocol SERDES at TSMC Open Innovation Platform Ecosystem Forum
- SMIC, CICIIF and Qualcomm Intend to Invest into SJsemi
- A Multicore Platform for Energy and Throughput aware Applications
- AMD Forms Radeon Technologies Group To Enhance Focus on Graphics And Immersive Computing Under The Leadership of Raja Koduri
- TSMC Certifies Synopsys' IC Compiler II on 10-nanometer FinFET Process
- Cadence Digital, Custom/Analog and Signoff Tools Achieve TSMC Certification for 10nm FinFET Process
Headlines for Tuesday Sep. 15, 2015
eMemory Announces the First Verified NeoFuse OTP IP in 16nm FinFET Plus Process
eMemory announces its new technology breakthrough–the availability of its One-Time Programmable (OTP) NeoFuse technology in mainstream 16nm FinFET Plus process, as well as the development and verification of high-capacity (256k bit) and low-voltage (<0.8V) silicon IPs. It is the world’s first OTP technology verified in 16nm FinFET Plus process.- RFEL announces new version of award-winning ChannelCore Flex advanced Channeliser IP core
- Mentor Graphics Certified for TSMC 10nm FinFET Process Technology
- Crossbar Closes Series D Funding of $35 Million
- SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures; Billings US$9.4 Billion
- TSMC Wins All Apple's A10 Chip Business, Report Says
- GlobalFoundries Employee Buyout Result of Revenue Drop
- Rambus Reveals Smart Data Acceleration Research Program
- INSIDE Secure Introduces a Single Chip USB Solution for Software Licensing, Authentication and the Latest FIDO Standard
Headlines for Monday Sep. 14, 2015
SilabTech announces the release of its USB 3.1 Gen 2 Compliant 10 Gbps SERDES IP Core
SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today the release of its USB 3.1 Gen 2 SERDES IP Core. SilabTech has already delivered the 1st generation of USB 3.0 SERDES, also known as USB SuperSpeed Gen 1 ( 5 Gbps) to customers and now announced the 2nd Generation, USB 3.1 SuperSpeed Gen 2 with Data Transfer Speed of 10 Gbps.- Open-Silicon Joins Synopsys ARC Access Program
- intoPIX to Showcase New TICO Compression Performances on FPGAs and CPU for UHD/4K and HFR
- Companies Maximize 300mm, 200mm Wafers; Slow Progress on 450mm
- Open Interconnect Consortium Unveils Cloud-Native Support for Internet of Things
- Atmel Delivers Industry's Lowest Power ARM Cortex-A5-based MPU with Leading Security Features for Industrial IoT and Wearable Applications
Headlines for Friday Sep. 11, 2015
Freescale Accelerates Its Solutions for Crashless and Autonomous Vehicles with the Acquisition of CogniVue
To solidify its strong position in solutions for the autonomous vehicles/advanced driver assistance systems (ADAS) market, Freescale Semiconductor (NYSE: FSL) today announced the acquisition of Ottawa, Canada-based CogniVue Corporation, a leading developer of image cognition IP for automotive and consumer applications.Headlines for Thursday Sep. 10, 2015
New DesignWare ARC EM Processors Deliver Up to 3X Higher DSP Performance
Synopsys today announced availability of the DesignWare® ARC® EM9D and EM11D Processors. The EM9D and EM11D cores implement an enhanced version of the ARCv2DSP instruction set architecture (ISA), combining RISC and DSP processing with support for an XY memory system to boost digital signal processing performance while minimizing power consumption.- IP hot spot forms in Egypt
- Grass Valley Selects intoPIX's TICO Compression for 4K/UHD and IP Connectivity
- eSilicon, Northwest Logic and SK Hynix create high-bandwidth memory (HBM) hardware demonstration
- RFEL announces updates to its flagship "Video Fusion" high definition video processing IP core
- CAST and Boost Valley Partner for Better Verification of IP Cores
- Equipment Spending Slows but Still Positive in 2015 and 2016
- TSMC August 2015 Revenue Report
- Apple Unveils New Chips For Mobile
- MStar, Intertrust and Rambus to Showcase an Integrated, End-to-end Security Solution for 4K UHD TVs at IBC 2015
- MStar Semiconductor, Inc. Integrates INSIDE Secure Technology to Protect Premium Content on its New 4K Ultra HD Platform
- Athena CTO to Speak at 2015 Xilinx Security Working Group
- Freescale advances IoT development to expand the ARM mbed OS ecosystem
- Altera Demos Motor Control and Battery Management Solutions at Electric & Hybrid Technology Expo 2015
Headlines for Wednesday Sep. 09, 2015
Barco Silex releases new patent-free and lightweight VC-2 LD video codec at IBC 2015
At IBC 2015 Show in Amsterdam, Barco Silex, the leading provider of video compression IP cores for ASIC and FPGA, announced that the new VC-2 Low Delay codec is now available for licensing to broadcast equipment manufacturers.- Menta Delivers Off-the-Shelf Embedded FPGA IP Cores that Enable a New Level of Flexibility to be built into Complex SOCs
- Linaro and Microsoft collaborate on secure media solutions for ARM-based SoCs
- Microsemi Aims to Solve Most Challenging Cyber Security Issues with Formation of a Security Center of Excellence
- Imperas Releases Second Generation of Open Virtual Platforms APIs and Adds to Free Model Libraries
- Intellitech iJTAGServer Brings IEEE 1149.1-2013 IP Block Verification to Synopsys VCS
- Moortec to Exhibit at TSMC’s 2015 Open Innovation Platform Ecosystem Forum
- With Ultimate Craftsmanship, M31 Develops IP Solutions for IoT
- Cadence, Mentor Graphics and Breker Announce Collaborative Technology Contribution to Accellera Portable Stimulus Working Group
- UMC Reports Sales for August 2015
- INSIDE Secure Announces the First DRM Solutions on an ARM Reference Platform to Meet HD/UHD Content Protection Demands of Hollywood Studios
- Synopsys' Design Compiler Graphical Adopted by Renesas for Automotive ICs
- Korusys Launch 4Kp60 & HDR capable, H.265 Contribution decoder at IBC2015
- PathPartner Technology Showcases Exclusive HEVC Solutions on Multiple Embedded and Server Platforms at IBC 2015
- Mentor Graphics Drives Next-Generation, Low-Power Verification with UPF Successive Refinement Methodology
- UltraSoC adds deadlock detection to SoC analysis, debug and profiling tools
Headlines for Tuesday Sep. 08, 2015
Open-Silicon Partners With Silicon Catalyst
Open-Silicon announced today a partnership with Silicon Catalyst, the world’s first incubator for semiconductor solution start-ups. Open-Silicon has joined forces with Silicon Catalyst to enable semiconductor start-ups to increase silicon innovation rates and pursue big ideas.- New Tracealyzer brings streaming trace to FreeRTOS
- STMicroelectronics Unveils World's First Set-Top-Box SoC with Integrated Wi-Fi and Support for High Dynamic Range
- Qualcomm Sketches Out Kyro Core
- Synopsys, Customers and Partners Present the Latest Technologies and Trends on Embedded Processor Solutions at the ARC Processor Summit in Silicon Valley
Headlines for Monday Sep. 07, 2015
ARM and Thundersoft Open First IoT Ecosystem Accelerator in China
ARM has partnered with Thundersoft, a world leader in smart device platforms, to establish the ARM Innovation Ecosystem Accelerator. The collaboration creates an Internet of Things (IoT) one-stop shop for startups and established OEMs, providing integrated hardware and software expertise as well as resources from the ARM® ecosystem.- MediaTek Announces Tender Offer for Richtek
- Faraday Monthly Consolidated Sales Report - August 2015
- GUC Monthly Sales Report - August 2015
- TICO Alliance Moves Forward with SMPTE for Transporting UHD-4K over IP and SDI, Adds New Members and Shows Live 4K Demos at IBC 2015
- Dolphin Integration reveals advanced low-power solutions at the TSMC 2015 OIP Forum
- Toshiba ApP Lite IoT Processor Incorporates Support for Bluetooth v4.1 Functions
Headlines for Friday Sep. 04, 2015
SmartDV's AMBA Verification IPs Deployed Worldwide by KYOCERA Document Solutions
KYOCERA Document Solutions Inc., a subsidiary of KYOCERA Corporation and one of the world's leading document solutions companies, has purchased a suite of AMBA verification IPs from SmartDV Technologies, the verification intellectual property (VIP) company.- IoT Security Foundation formed
- Asia-Pacific to Dominate IC Sales Across System Categories in 2015
- Global Semiconductor Sales Down Slightly in July
- GLOBALFOUNDRIES and Catena Partner to Provide Next-Generation RF Connectivity Solutions for Growing Wireless Markets
- QEOS and GLOBALFOUNDRIES to Offer Industry's First CMOS Platform for MillimeterWave Markets
Headlines for Thursday Sep. 03, 2015
Arasan Chip Systems Announces Availability of ONFI 4.0 Compliant NAND Flash Controller IP & PHY Solution
NAND flash memory applications are ever evolving, placing demands on the designers to continuously push the envelope on performance and power consumption. Arasan addresses these challenges by offering its Arasan ONFI 4.0 Compliant NAND Flash Controller IP solution that provides a performance boost by increasing data transfer rates to 800 MT/s – or 800MB/s for an 8 bit interface – and reduces power consumption by more than 50%.- Boost Valley Announces HDMI 2.0 Verification IP
- Ultra low-power semiconductor leader, Ambiq Micro, appoints Vince Murdica, VP of Global Sales and Business Development
- Alliance for Open Media Established to Deliver Next-Generation Open Media Formats
- Does a Chinese Bid for Globalfoundries Make Sense?
- IBM and ARM Collaborate to Accelerate Delivery of Internet of Things
- TowerJazz and TPSCo Announce Breakthrough RF Technology for Next-Generation 4G LTE Enabled Smartphones and IoT Applications
Headlines for Wednesday Sep. 02, 2015
Analog Devices is Sand 9 buyer
Piezoelectric MEMS resonator startup Sand 9 Inc. (Cambridge, Mass.) was acquired by Analog Devices Inc. (Norwood, Mass.) in June 2015, according to a technology consultant who works for companies on timing circuits. Several sources also emailed EE Times Europe to say that Analog Devices had bought Sand 9.- MightyWorks Ports Single- and Multi-Microphone Processing Technologies to Cadence Tensilica HiFi DSPs
- China Server Upstart Hits Spotlight
- Microsemi's Industry-leading Space Products Support Pluto New Horizons Space Exploration Mission
- The Secure Content Storage Association (SCSA) Selects Rambus Cryptography Research To Help Secure Next-Generation Digital Video Content
- Cadence to Demonstrate 10nm FinFET Design Solutions at TSMC 2015 OIP Ecosystem Forum
- Altair Semiconductor Adopts Cadence Palladium XP Platform for Advanced IoT SoC Development
Headlines for Tuesday Sep. 01, 2015
Synopsys Announces Availability of Logic Library and Embedded Memory IP for Mie Fujitsu Semiconductor 40-nm Low-Power Process
Synopsys, Inc. (Nasdaq:SNPS) today announced the availability of DesignWare® Logic Library and Embedded Memory IP for the Mie Fujitsu Semiconductor 40-nanometer low-power (40LP) process.