D&R Headline News (October 2015)

Headlines for Friday Oct. 30, 2015

• Hardent Joins the MIPI Alliance as a Contributor Member

Headlines for Thursday Oct. 29, 2015

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VISENGI Announces 8K30 capable H.264 Encoder on Zynq-7030

VISENGI unveiled on September 30th at Altera SoC Developer Forum in Santa Clara, California, the availability of the smallest 8K H.264 Encoder in the market, capable of delivering 8K 25 fps on the mid-range Altera Arria 10 FPGAs, and now an overwhelming 8K 30 fps on the small and low-cost Xilinx Zynq-7030 FPGA.

• EnSilica establishes new regional office and centralised design centre for analog and mixed-signal IC design in Bristol (UK)
• Agnisys automates development of ARM-based designs
• MIPI Alliance Introduces a Family of MIPI Gigabit Debug Interface Specifications for Mobile and Mobile-Influenced Designs
• UMC Meets Expectations on 28nm Ramp as Demand Slumps

Headlines for Wednesday Oct. 28, 2015

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Creonic to Provide Three LDPC Decoder IP Cores for DOCSIS 3.1

Creonic revealed today the availability of three IP cores for the new DOCSIS 3.1 standard. DOCSIS 3.1 technology consists of the newest and first-rate of digital communication technologies such as LDPC coding with very high modulation orders (up to 4096-QAM) and more than 1 GHz of usable spectrum.

• MIPS CPU architecture fully supported by Google's new Brillo OS for the IoT
• ACCO Semiconductor Announces World's Most Integrated Power Amplifier Module for 3G/LTE Smartphones
• VESA Rolls Out Production-Ready Embedded DisplayPort Standard 1.4 for Mobile Personal Computing Devices
• Aldec Introduces Hybrid Emulation with ARM Fast Model Support
• mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer

Headlines for Tuesday Oct. 27, 2015

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IDT to Acquire ZMDI for $310 Million

IDTI today announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash. The acquisition provides IDT with a highly regarded Automotive & Industrial business, and extends their technology leadership in high performance programmable power devices and timing & signal conditioning.

• Cadence Reports Third Quarter 2015 Financial Results
• Rambus Initiates Accelerated Share Repurchase Program
• New ARM CoreLink System IP Provides the Foundation for Next-Generation Heterogeneous SoCs
• AM3D and CEVA Partner to Provide Innovative Sound Enhancement Technology for Portable Devices
• Brite Semiconductor Acquires Architectural License to Uniquify's DDR Technology to Consolidate Core IP Technology

Headlines for Monday Oct. 26, 2015

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Flex Logix Secures $7.4 Million in VC Financing

Flex Logix Technologies today announced it has secured $7.4 million in equity financing. The company’s EFLX Arrays enable FPGAs (field programmable gate arrays) to be easily embedded into any SoC (system-on-chip), allowing key functions to be optimized or customized after the device is completely fabricated – even updating logic after a device is installed into a system in the field.

• Vivante to Highlight Cutting-Edge GraphiVisor Virtualization Technology at Virtualize Conference
• Chip Mergers, Impacts Still Ahead
• intoPIX showcases UHDTV Hybrid SDI/IP Interoperability using TICO lightweight compression at the SMPTE 2015 Annual Technical Conference and Exhibition.
• VATICS Chooses CEVA Imaging and Vision DSP for its Surveillance and Smart Camera SoCs
• Dolphin Integration launches a new Capless Regulator dedicated to low-power operation required by IoT applications
• OmniPhy Announces Automotive Ethernet Silicon IP
• Surpassing 100 Production Designs, Synopsys' IC Compiler II Achieves the Fastest Ramp-up in the Company's History
• Mentor Graphics Advances Nucleus RTOS for Internet of Things and Embedded Connected Devices

Headlines for Friday Oct. 23, 2015

• Altera Announces Third Quarter Results
• Altera Demonstrates Security and System Acceleration Solutions at MILCOM 2015
• Foundry Sales Defy IC Decline
• North American Semiconductor Equipment Industry Posts September 2015 Book-to-Bill Ratio of 1.07

Headlines for Thursday Oct. 22, 2015

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Socionext Licenses and Deploys CEVA Imaging and Vision DSP for Milbeaut Image Processors

CEVA today announced that Socionext has licensed and deployed the CEVA imaging and vision DSP to power its latest-generation Milbeaut™ image processing LSI chips targeting surveillance, digital SLR, drones, action and other camera-enabled devices.

• Trillium Certainly Can Encrypt CAN Bus
• IC Insights Lowers its Worldwide 2015 IC Market Forecast from +1% to -1%
• The IP companies creep toward an SoC

Headlines for Wednesday Oct. 21, 2015

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CEVA Announces Silicon-based Platform to Streamline Development of Low-Power 'Smart and Connected' Devices

Highly integrated CEVA-TeakLite-4 DSP platform combines multiple sensing, processing and connectivity technologies enabling rapid system prototyping for mobile, wearable and smarthome SoC designs

• Anapass Achieves First-Time Success with Mixel's Complete MIPI Solution
• Sequans Selects VeriSilicon ZSP Digital Signal Processor for LTE Cat0/Cat1 IoT and M2M Chipsets
• Synopsys Demonstrates Industry's First MIPI D-PHY IP Operating at 2.5 Gbps per Lane on TSMC 16-nm FinFET Plus Process
• SEMI Announces Continued Annual Growth for Silicon Shipment Volumes
• Andes Technology and INVECAS Enter Into a High Value Collaboration to Win Designs for GLOBALFOUNDRIES 22FDSOI and 14LPP Processes
• ARM Holdings PLC Reports Results For The Third Quarter And Nine Months Ended 30 September 2015
• ARM Launches IoT Education Kit in China at Opening of Peking University’s New Smart Device Lab

Headlines for Tuesday Oct. 20, 2015

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ARM Mali-470 GPU Offers Improved Efficiency and Experiences on Wearable and IoT Devices

ARM has released a new highly-efficient graphics processing unit (GPU) to enable smartphone-quality visuals on wearable and Internet of Things (IoT) devices. The ARM® Mali™-470 GPU delivers an enhanced user interface for power-constrained products, including smart watches, home gateways and appliances, industrial control panels and healthcare monitors. It is available for immediate licensing, with the first Mali-470 enabled devices expected in late 2016.

• Cadence Announces the First IP Subsystem with Integrated USB Type-C, USB Power Delivery and DisplayPort Alternate Mode Support
• Server Benchmark Debuts at ARM Event
• iPhone 7: Will It Have Intel Inside?
• ARM to Offer Cycle-Accurate Virtual Prototyping for Complex SoCs Through an Asset Acquisition from Carbon Design Systems
• Innovasic and OmniPhy Announce Collaboration on Automotive Ethernet Solutions
• Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
• AXSEM AG is now a part of ON Semiconductor
• New Release of Synopsys Synplify Software Delivers Up to 3X Faster Runtime with Higher FPGA Performance
• Rambus Reports Third Quarter Financial Results

Headlines for Monday Oct. 19, 2015

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Microsemi Corporation Announces Superior Proposal to Acquire PMC-Sierra, Inc. for $11.50 Per Share With Intent to Close in December 2015

Microsemi today announced that it submitted an offer to acquire PMC-Sierra, Inc (Nasdaq: PMCS) in a cash and stock transaction.

• Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs
• Shanghai Seeks 'More-than-Moore' in Silicon Valley
• Dolphin Integration receives TSMC's Open Innovation Platform 2015 Partner of the Year Award for Specialty IP
• TSMC Slashes 2015 Capex by over 25% to $8 Billion
• Apple Gives a Foundry Lesson

Headlines for Friday Oct. 16, 2015

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Sensory TrulySecure Face Authentication Software Now Available on Cadence Tensilica Imaging/Vision DSPs

Cadence and Sensory, Inc. today announced that Sensory's TrulySecure™ face authentication software is now available on the Cadence® Tensilica® Vision P5 digital signal processor (DSP).

Headlines for Thursday Oct. 15, 2015

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Will Intel, with CDMA, Gun for iPhones?

A strategy of what might be called a protective — or pre-emptive — investment in the latest modem technology is Intel Corporation’s apparent key to survival in the mobile business.

• Report: Analog Devices, Maxim in merger talks
• More-than-Moore Will Lead, Argues GloFo's Wijburg
• Researchers Demonstrate Single-Ended Die-to-Die Transceiver
• Gartner Says Worldwide Semiconductor Capital Spending to Decrease by One Percent in 2015
• Apple loses patent lawsuit to University of Wisconsin, faces hefty damages
• TSMC Reports Third Quarter EPS of NT$2.91
• Xilinx Announces Q2 Fiscal 2016 Results; Strong Profitability And New Product Growth
• Phison Electronics Improves Time to Market by 40 Percent with Cadence Voltus-Fi Custom Power Integrity Solution
• Kilopass' CEO Charlie Cheng to Keynote Chinese American Semiconductor Professional Association

Headlines for Wednesday Oct. 14, 2015

• Exostiv Labs announces the availability of its 'EXOSTIV' solution for FPGA debug.

Headlines for Tuesday Oct. 13, 2015

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VeriSilicon to Acquire Vivante Corporation in All-Stock Transaction

VeriSilicon Holdings Co., Ltd. and Vivante Corporation today announced a definitive merger agreement under which the companies will be combined in an all-stock transaction. The combined company, to be called VeriSilicon Holdings Co., Ltd., will offer robust IP-centric, platform-based custom silicon solutions and end-to-end semiconductor turnkey services.

• Wave Semiconductor Licenses SonicsGN On-Chip Network
• Analysis: VeriSilicon to Acquire Vivante
• Microsemi and Athena Announce FPGA Cores with Strong DPA Countermeasures for Cryptography Users
• ARM Offers Free Access to Cortex-M0 Processor IP to Streamline Embedded SoC Design

Headlines for Monday Oct. 12, 2015

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Imagination rolls out complete Ensigma connectivity IP solutions from baseband to RF

Imagination Technologies announces that it is offering complete Ensigma connectivity IP system solutions including Wi-Fi/Bluetooth software, media access control (MAC) layer, baseband, analog front end (AFE) and RF, through a range of flexible licensing and support models.

• Cadence Announces the Industry's First Memory Model for LPDDR5
• IDT and Altera Simplify SyncE Compliance for Ethernet Node Designs
• Analyzing Apple's Statement on TSMC and Samsung A9 SoCs
• Altera Partners with Intrinsic-ID to Develop World's Most Secure High-end FPGA
• Gartner Says Worldwide Semiconductor Sales Expected to Decline 0.8 Percent in 2015; First Revenue Decline Since 2012
• SMIC to Report Tunnel-FET Extension to CMOS
• Sony Acquires Belgian Innovator of Range Image Sensor Technology, Softkinetic Systems S.A., in its Push Toward Next-Generation Range Image Sensors and Solutions
• Qualcomm Technologies announces new specs for ARM-based data-center SoC
• Intilop releases a Full TCP & UDP Host-Side Application interface for Altera and Xilinx FPGAs for Software's use that is implemented in Low latency hardware

Headlines for Friday Oct. 09, 2015

Top Story

Leading Edge Leads the Way in Pure-Play Foundry Growth

The total pure-play foundry market is forecast to grow 6.1% to $44.9 billion in 2015. The entire increase in pure-play foundry sales is forecast to be due to sales of devices built using leading edge (<40nm) feature sizes. The <40nm pure-play foundry market is expected to increase 24% to $16.1 billion in 2015 compared to $13.0 billion in 2014.

• Qualcomm and Xilinx Collaborate to Deliver Industry-Leading Heterogeneous Computing Solutions for Data Centers with New Levels of Efficiency and Performance
• ON Semiconductor, GainSpan & GEO Semiconductor Announce Strategic Partnership to Address Emerging Opportunities in IoT Space
• Altera DOCSIS 3.1 Remote PHY Design Enables Distributed Cable Networks

Headlines for Thursday Oct. 08, 2015

Top Story

Soft Machines Unveils VISC Processor and SoC Roadmap

The world’s first VISC processor, Shasta, will deliver unprecedented performance efficiency levels. Soft Machines also disclosed the highly scalable Mojave VISC SoC platform, which can be customized for smart mobile to server applications. Both Shasta and Mojave will be released in 2016.

• Arasan Chip Systems Announces the Industry's First UFS 2.1 IP Solutions
• TSMC September 2015 Revenue Report
• UMC Reports Sales for September 2015
• Silicon on Insulator Penetrates Apple/Intel/IBM

Headlines for Wednesday Oct. 07, 2015

Top Story

CEVA Introduces Deep Neural Network Framework to Accelerate Machine Learning Deployment in Low-Power Embedded Systems

CEVA has today introduced the CEVA Deep Neural Network (CDNN), a real-time neural network software framework, to streamline machine learning deployment in low-power embedded systems.

• Vivante Vision Image Processor to Power Mass Market Surveillance Camera and Automotive Applications
• Leti Joins GLOBALFOUNDRIES' Eco-System Partners With Focus on Supporting 22FDX Platform
• Imec and Cadence Complete Tapeout of First 5nm Test Chip
• Faraday Monthly Consolidated Sales Report - September 2015
• Marvell Introduces Industry's First Hyper-Scale Quad ARM Cortex-A72 and Dual Cortex-A53 Based Chips on Marvell's Revolutionary MoChi and FLC Architecture
• Sony Semiconductor Solutions Corporation to be Established
• Altera Stockholders Approve Merger with Intel
• Dolphin Integration as European Foundry portal for ASIC and SoC users

Headlines for Tuesday Oct. 06, 2015

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NetSpeed Introduces the industry's first fully configurable cache-coherent network-on-chip

NetSpeed Systems Inc., the supplier of on-chip network IP that is streamlining SoC design, announced the release of its Gemini 2.0 product, the industry’s first fully configurable cache-coherent network-on-chip IP.

• New Cadence Tensilica Vision P5 DSP Enables 4K Mobile Imaging with 13X Performance Boost and 5X Lower Energy
• Xilinx Vivado Design Suite 2015.3 Takes Design to New Heights with IP Sub-Systems
• Skyworks to Acquire PMC-Sierra for $2 Billion in Cash
• Xilinx System Generator Simplifies Wireless Design
• Lip-Bu Tan Joins Aquantia Board of Directors
• GUC Monthly Sales Report - September 2015
• GLOBALFOUNDRIES Names Bami Bastani as Senior Vice President of its RF Business Unit
• INSIDE Secure and EZchip Partner to Provide Best of Breed Internet Data Security for Cloud Computing, Digital Video, and Advanced Networking Applications
• S2C Shipping Prodigy Virtex UltraScale and Kintex UltraScale FPGA Prototyping Boards to Customers Worldwide
• Open Interconnect Consortium and EnOcean Alliance Announce New Liaison Agreement for the Internet of Things
• Andes Technology Corporation First Vendor to Use Official EEMBC Certified CoreMark Results to Reveal the Performance for Its Entire CPU Product Line

Headlines for Monday Oct. 05, 2015

Top Story

Vivante Announces Expansion of Automotive Market Embedded GPU Leadership

Vivante Corporation announces milestones that prove its combination of high performance graphics technology and vision capabilities make for a perfect IP choice for leading automotive semiconductor suppliers.

• Aquantia Raises $37 Million in Growth Capital Targeting the Billion Ethernet Port Opportunity in Data Center & Enterprise
• Global Semiconductor Sales Decrease Slightly in August
• Synopsys Unveils New ATPG Technology Delivering 10X Faster Test Pattern Generation
• CEVA, Inc. Announces All-Time High Revenues for the Third Quarter and Schedules Third Quarter 2015 Earnings Release and Conference Call
• Alizem releases its new Internet-of-Things (IoT) software interface

Headlines for Friday Oct. 02, 2015

Top Story

AMD Cuts 5% of Global Employees

Advanced Micro Devices has joined the list of large semiconductor companies handing out pink slips. A recently adopted restructuring plan to help improve poor fiscal results calls for a 5% reduction in the company’s global workforce.

• VIA Telecom Completes Sale of Part of Assets to Intel Corporation
• eMemory Receives TSMC IP Partner Award

Headlines for Thursday Oct. 01, 2015

Top Story

iPhone 6S: A9 May Be Dual Sourced

In several areas, most notably the application processor, Chipworks reckons Apple is dual sourcing. So, as expected both Samsung and TSMC are providing versions of the Apple A9.

• Upgraded Components in iPhone 6S Plus Costs Apple an Extra $16 Per Device
• Xylon Multimedia Demo for the ZedBoard
• Intellitech iJTAGServer leverages Cadence Incisive Enterprise Simulator for IEEE 1149.1-2013 Silicon Instrument Verification