D&R Headline News (December 2015)

Headlines for Thursday Dec. 31, 2015

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2016: Expect Unexpected Innovation in IP Development

We know what to expect from the global electronics innovation cycles—more of everything: density, chips, standards, IP blocks, on and on. But is that it? In 2016, we should expect the unexpected.

Headlines for Wednesday Dec. 30, 2015

• WiLAN Subsidiary Enters into License Agreement with Toshiba

Headlines for Tuesday Dec. 29, 2015

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Sidense Qualifies 1T-OTP Memory IP at GLOBALFOUNDRIES 55nm Low-Power Process Node

Sidense today announced that it has fully qualified its SiPROM one-time programmable (OTP) non-volatile memory (NVM) embedded memory products on GLOBALFOUNDRIES’ production-proven 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform.

• Rambus Renews Patent License Agreement With Toshiba

Headlines for Monday Dec. 28, 2015

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Intel Completes Acquisition of Altera

Intel today announced that it has completed the acquisition of Altera. The acquisition complements Intel’s leading-edge product portfolio and enables new classes of products in the high-growth data center and Internet of Things (IoT) market segments.

• Google, HP, Oracle Join RISC-V
• CEVA Releases ISO 26262 Compliant Safety Design Package for ADAS Vision Processor
• Mn_nH release AXI chip-to-chip interface IP and HEVC encoding expand up to 8K 30fps
• Mergers in Memory Abundant in 2015

Headlines for Thursday Dec. 24, 2015

• Samsung Running 28nm FDSOI Chip Process

Headlines for Wednesday Dec. 23, 2015

• WiLAN and NEC Enter Wireless License

Headlines for Tuesday Dec. 22, 2015

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Xylon Expands Its Portfolio of Computer Vision IP Cores for Advanced Driver Assistance (ADAS) with the Driver Drowsiness Detector

The new logiDROWSINE Driver Drowsiness Detector IP core detects driver drowsiness and distraction based on facial movements monitored through a camera placed in a vehicle cabin. The

• Apple Finds Home At Former Q'comm Display Lab
• PsiKick Raises $16.5M Series B Round to Power a Batteryless Revolution in the "Internet of Things"

Headlines for Monday Dec. 21, 2015

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Intellitech Granted US Patent for Pay-per-Instance IP core Licensing

Intellitech® Corporation, the technology leader in solutions for IEEE 1149.1-2013 Silicon Instrument development, has announced it has been granted US patent 9,152,749 entitled "Management system, method and apparatus for licensed delivery and accounting of electronic circuits".

• Rambus Explores Future Memory Systems
• Ericsson and Apple sign global patent license agreement, settle litigation
• Peraso Releases WiGig Chipset to Production
• Startup Preps Big Data Processor
• Leti Strains to Improve FDSOI
• Synopsys Bolsters Software Integrity Platform with Acquisition of Static Code Analysis Vendor Goanna Software
• North American Semiconductor Equipment Industry Posts November 2015 Book-to-Bill Ratio of 0.96
• HEVC Advance Announces Revised Licensing Structure

Headlines for Thursday Dec. 17, 2015

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Arasan announces the Industry's First MIPI DSI V1.3 Controller IP Cores

Arasan Chip Systems announces support for MIPI DSI v1.3 with support for Display Stream Compression, Sub links, Deskew, and Checksum for Test Mode.

• iCatch Technology Selects Synopsys' DesignWare IP Portfolio for Digital Video and Image SoCs
• ARM has re-invented itself as a systems company
• Internet of Things Market to Nearly Double by 2019
• Fairchild Semiconductor Announces Further Developments in Connection with an Unsolicited Proposal
• Cadence to Showcase Tensilica Audio, Imaging/Vision, and IoT DSPs and USB Type-C IP at CES 2016
• Mentor Graphics Veloce Emulation Platform Used by Imagination for Verification of PowerVR Wizard Ray-Tracing GPU

Headlines for Wednesday Dec. 16, 2015

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Boost Valley Announces the 1st version of their MIPI C-PHY Verification IP

Today, Boost Valley has announced the release of the 1st version of its MIPI C-PHY Verification IP. The C-PHY is a part of MIPI portfolio of PHYs, it reduces the interface signaling rate to enable a wide range of high-performance and cost-optimized applications, such as very low-cost, low-resolution image sensors; sensors offering up to 60 megapixels; and even 4K display panels.

• prpl Foundation Launches prpl.works to Mobilize Open Source Developers
• Microsemi Corporation Commences Exchange Offer to Acquire PMC-Sierra, Inc.

Headlines for Tuesday Dec. 15, 2015

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Think Silicon Launches NEMA|PICO The World Smallest, Most Ultra-Low Power and Cost Efficient 2D GPU at CES 2016

Think Silicon announced today the release and immediate availability of NEMA|p(PICO) the world smallest (0.07mm2 die-area, two times smaller than the competition) and most power efficient (0.05 mW leakage) 2D Graphics Processor Unit (GPU).

• CyweeMotion's Sensor Fusion Hub Software Now Available on Cadence Tensilica Fusion DSP
• Imagination Technologies - Half Year Results Statement 2015
• Imagination Expands the Scope of Its University Program With Groundbreaking EUROPRACTICE Partnership
• TSMC Work on 5nm Process Leaves EUV Undecided
• Semiconductor Equipment Sales Forecast: $37 Billion in 2015 and $38 Billion in 2016

Headlines for Monday Dec. 14, 2015

• Analogix and Pinecone Collaborate on USB-C Technology
• Axell Switches to Synopsys' Design Compiler RTL Synthesis Solution for Graphics IC Designs
• intoPIX Honored With The Prestigious IABM Peter Wayne Award
• InvenSense Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms And Huawei Smartphones
• Dolphin Integration helps reducing BoM cost of IoT circuits thanks to a Panoply of Over Voltage regulators

Headlines for Thursday Dec. 10, 2015

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Cortus Launches Low-Power Floating Point Processor for Intelligent Connected Devices

Cortus, a technology leader in low power, silicon efficient, 32-bit processor IP, announced the release of the FPS26 single precision floating point IP core today, the third in a family of products based on the Cortus v2 instruction set. The core is aimed at embedded systems requiring good floating point computational performance while also delivering small silicon area and low power dissipation.

• SEMI Reports Third Quarter 2015 Worldwide Semiconductor Equipment Figures; Billings $9.6 Billion
• Xilinx Announces Publicly Available Tools and Documentation for 16nm UltraScale+ Devices
• Why TSMC Wants to Build a 12-inch Wafer Fab in China
• Chinese Group Bids for Fairchild
• Allegro DVT AnnounceS the Adoption of its HEVC System Compliance Streams by TPV.
• 93% of Semiconductor Leaders Expect Rapid M&A Pace to Continue
• VeriSilicon and NextG-Com Announce Joint Partnership for Developing Next Generation Cat-0/Cat-M Reference Platform
• SMIC and M31 Introduce Differentiated IP Solutions for Various Storage Controller Applications
• TSMC November 2015 Revenue Report
• SKY5000 Dual Card Reader Chip from Synic Solution is based on Cortus APS23

Headlines for Wednesday Dec. 09, 2015

• UMC Reports Sales for November 2015
• Fab Equipment Spending: Look for Upward Swing into 2016

Headlines for Tuesday Dec. 08, 2015

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ARM Sizes Up Moore's Law

It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, according to a keynote at the annual International Electron Devices Meeting (IEDM) in Washington D.C. this week.

• Cadence Tensilica HiFi DSPs Now Support Dynamic Speaker Management Software from Maxim Integrated
• ARM has plan to make $1 Cortex-M processors secure
• Scope, Not Scale, Drives Freescale/NXP Nuptials
• TLi goes to Silicon with Arasan UFS IP
• Sonics Adds Three New NoC Licensees in China
• Artosyn Licenses SonicsGN On-Chip Network to Integrate Drone SoC
• OmniPhy Announces Silicon-Proven Ethernet PHY IP Adoption in China
• INSIDE Secure Dominates Emerging MACsec Market whose Growth is Driven by Rising Cloud Adoption and Growing Datacenter Market

Headlines for Monday Dec. 07, 2015

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NXP and Freescale Announce Completion of Merger

NXP Semiconductors N.V. (NASDAQ: NXPI) and Freescale Semiconductor, Ltd. (NYSE: FSL) today announced the completion of the merger pursuant to the terms of the previously announced merger agreement from March 2015.

• eASIC Reports Continued Revenue Growth and Record Profitability
• Faraday Monthly Consolidated Sales Report -November 2015
• Global Semiconductor Sales Increase in October; Slight Growth Projected for Next Three Years
• What Freescale-NXP Merger Can Teach Us
• GUC Monthly Sales Report - November 2015
• TSMC Applies for 12-inch Wafer Fab and Design Service Center in China
• Dream Chip and DELTA Microelectronics Partner for Industry 4.0 Chip

Headlines for Thursday Dec. 03, 2015

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Sidense Qualifies 1T-OTP Memory IP at SMIC 130nm and 110nm Processes

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it has fully qualified its SiPROM one-time programmable (OTP) non-volatile memory (NVM) embedded memory products at SMIC's (Semiconductor Manufacturing International Corporation) 130nm and 110nm G processes.

• IDMs Could Top Fabless Semiconductor Company Growth for Only the Second Time in History
• Microsemi and Intrinsic-ID Team Up to Deliver Secure Boot Solution for Electronic Systems in the Government, Aerospace and Defense Markets
• Kandou Delivers One Terabit Per Second of Chip-to-Chip Bandwidth at Less Than One Watt
• IC Merger Mania Hits Fever Pitch
• Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers' Design Cycle by Up to 12 Weeks
• EnSilica and Express Logic collaborate to bring popular ThreadX RTOS to eSi-RISC processor cores
• ReFLEX CES celebrates its 15 Year Anniversary with an "open door" technology day focused on FPGA solutions for HPC, Video, Defense

Headlines for Wednesday Dec. 02, 2015

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Credo Delivers Industry's Lowest Power 16nmFF+ 28G LR-Compliant SerDes IP With Comprehensive Development Platform

Credo Semiconductor today announced the commercial availability of a complete development platform for its advanced 28G SerDes IP on the TSMC 16nmFF+ process node.

• Chinese Game Developer Perfect World Licenses ARM Enlighten Global Illumination

Headlines for Tuesday Dec. 01, 2015

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Seamless Devices Introduces New Analog Signal Processing Solutions That Aim to Enhance the Effectiveness of LTE, WiFi and Microwave Applications

Seamless Devices, Inc. is pleased to introduce a set of analog front-end (AFE) solutions that aim to make it easier for architects of signal processing systems to address the tradeoff between performance quality and power usage in electronic devices.

• Flex Logix Appoints Abhijit Abhyankar as VP Silicon Engineering
• Cadence Unveils Virtuoso Advanced-Node Platform for 10nm Processes
• Vulkan on Think Silicon's NEMA-GPU Series
• Xilinx Launches Vivado Design Suite HLx Editions, Bringing Ultra High Productivity to Mainstream System & Platform Designers
• UltraSoC Announces Bare Metal Security
• LG Electronics (LGE) Licenses Rambus Cryptography Research's CryptoManager Security Platform