D&R Headline News (January 2016)

Headlines for Friday Jan. 29, 2016

• Why Opt For Chip Stack, FD-SOI in Image Sensors?

Headlines for Thursday Jan. 28, 2016

Top Story

Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Inno-Logic’s USB3.0 host controller along with PHY from M31 Technology again successfully passed all compliance tests and received certification from USB-IF in December 2015. Besides of USB 3.0 host controller, the USB 2.0 host controller also passed the certification test in November, 2015.

• Google and Movidius to Enhance Deep Learning Capabilities in Next-Gen Devices
• Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)
• Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs
• India Preps RISC-V Processors
• FDSOI carries on despite ST re-org, says COO
• VESA Updates Display Stream Compression Standard to Support New Applications and Richer Display Content
• New VESA DSC v1.2 IP Products Announced by Hardent
• ST Exits Set-Top Box Chip Biz, Plans Layoffs
• Baikal Electronics Reveals Product Roadmap
• UltraSoC forms strategic advisory board with four industry leaders

Headlines for Wednesday Jan. 27, 2016

Top Story

MorethanIP and OmniPHY Announce Sweeping Partnership on Integrated Ethernet Solutions

OmniPHY, the leading supplier of Ethernet PHY intellectual property (IP) for the consumer, automotive, and industrial markets, and MorethanIP, the leader in Ethernet silicon solutions, have announced a partnership that provides customers with ‘best-in-class’ MAC, PCS, and PHY solutions for a wide range of Ethernet protocol implementations.

• Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015, According to Gartner
• Linaro announces Software Reference Platform for ARM servers
• Synopsys Launches New IP Subsystem to Accelerate Data Fusion Processing in IoT Devices
• Silver Lining Systems to Bring the Calxeda Fabric to Hyper-scale Servers with AMD Opteron A1100 Processor
• North American Semiconductor Equipment Industry Posts December 2015 Book-to-Bill Ratio of 0.99
• Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process

Headlines for Tuesday Jan. 26, 2016

Top Story

Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP

Innovative Logic announced today the release of their USB3.1 dual role IP. After having great success in adoption of Inno-Logic’s USB3.0 device and host controller IP, this is a one big step to provide the upgrade to USB3.1 IP.

• Synopsys Introduces USB 3.1 Type-C IP with DisplayPort 1.3 and HDCP 2.2 for High-Bandwidth Data Transfer with Content Protection
• Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
• Videantis partners with Almalence for higher quality imaging
• More Downside than Upside Risk to IC Insights' 2016 IC Market Growth Forecast
• Rambus Reports Fourth Quarter and Fiscal Year 2015 Financial Results
• Rambus Acquires Secure Mobile Payment and Ticketing Solutions

Headlines for Monday Jan. 25, 2016

Top Story

Cypress Unveils the World's Most Flexible One-Chip ARM Cortex-M0 Solution

Cypress today introduced a new series from its PSoC® 4 programmable system-on-chip architecture. The new PSoC 4 L-Series is the industry's most integrated single-chip solution with a 32-bit ARM®-Cortex®-M0 core, adding up to 256KB flash memory, 98 general purpose I/Os, 33 programmable analog and digital blocks, a USB device controller, and a control area network (CAN) interface.

• Security Outlook Bleak, Improving
• Rumor: Imagination may sell Pure
• Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0
• AMD Extends Patent License Agreement with Rambus
• Altera PowerSoC DC-DC Step-down Converter Delivers Industry-leading Power Density, Performance and Reliability
• Western Digital And IBM Announce Patent Acquisition And Cross-License Agreements
• Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi
• Optimize the power of always-on logic with SESAME eLV library, a Dolphin Integration solution in TSMC 55 ULP / ULP-eF process
• Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016

Headlines for Friday Jan. 22, 2016

Top Story

Barco Silex validates interoperable VC-2 lightweight video compression solution for ASIC/FPGA - ready for UHD and 4K transport

Barco Silex has validated its hardware solution for lightweight, low-complexity video compression against the SMPTE 2042-3 reference. The low-footprint core is now ready to be integrated in both ASIC and FPGA designs without need for expensive footprint. This opens up new possibilities for equipment manufacturers as they get a low-cost, interoperable compression solution to upgrade video transport to high-definition formats such as UHD and 4K.

• Sony To Use FD-SOI in Stacked Image Sensors
• Rambus Cryptography Research CryptoMedia Platform to be Integrated into Kaleidescape Home Cinema Products
• JEDEC Announces Publication of GDDR5X Graphics Memory Standard
• Will Xilinx Join the M&A Party?
• Consolidation Redrawing Microcontroller Landscape

Headlines for Thursday Jan. 21, 2016

Top Story

Semiconductor R&D Growth Slows in 2015

Semiconductor industry spending on research and development grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the compound annual growth rate (CAGR) of 4.0% in R&D expenditures during the last 10 years.

• Sidense Hires Industry Veteran Ken Wagner as Senior VP Engineering
• V-Nova Preps UHD/4K Silicon IP for Licensing
• Xilinx Announces Q3 Fiscal 2016 Results; Strong New Product Growth Drives 7% Sequential Sales Increase
• UltraSoC enhances universal SoC debug architecture with versatile serial communications
• MPEG LA Facilitating Development of Enhanced Voice Services Patent Pool License

Headlines for Wednesday Jan. 20, 2016

Top Story

ARM Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor

ARM has launched its highest performing and most power-efficient 4K-capable display processor to offer cost-effective, highly efficient and superior viewing experiences. The ARM® Mali™-DP650 display processor aims to drive new visual content and gaming experiences on mobile devices and act as a content passport for users as they move from a smaller mobile screen to a larger screen, such as a 4K smart television.

• Analog Bits' Half Power SERDES Demonstrated at DesignCon
• China's Chip Jackpot Teases
• HEVC Advance Begins Issuing Licenses
• Rambus Announces R+ 28G Serial Link PHY on Samsung 14nm LPP Process
• Credo Demonstrates 56G PAM-4, 56G NRZ and 28G NRZ SerDes Technology at DesignCon
• Synopsys Unveils SiliconSmart ADV Cell Library Characterization Solution

Headlines for Tuesday Jan. 19, 2016

Top Story

IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications.

intoPIX announced today the extension of its AES encryption IP core family to support higher bitrates applications from 10 to 100 Gbps and additional features.

• Microchip Technology To Acquire Atmel
• Samsung's 14 nm LPE FinFET Transistors
• Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things
• QuickPlay Redefines FPGA Design, Significantly Reducing Development Cost and Time-to-Market
• Arteris FlexNoC Interconnect IP is Licensed by ZTE
• WiLAN Subsidiary, North Star Innovations, Inc., Enters Into License Agreement With GLOBALFOUNDRIES
• CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group
• NXP Embraces 28nm FDSOI for MCUs
• sureCore Delivers FDSOI 28nm Memory Compiler

Headlines for Monday Jan. 18, 2016

Top Story

Has Samsung Snagged Qualcomm Business with New Process?

Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.

• HiSilicon Adopts Cadence Innovus Implementation System for Production DSP Designs
• Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China
• Allegro DVT Launches Industry's First HEVC Scalable Extension (SHVC) Compliance Streams
• Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power "Smart and Connected" Devices
• Microsemi Corporation Completes Acquisition of PMC-Sierra, Inc.

Headlines for Friday Jan. 15, 2016

Top Story

TSMC Boosts 2016 Capex to About $9.5 Billion

Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.

• Rambus Cryptography Research Launches CryptoMedia Platform to Provide Secure Access to Premium Digital Entertainment

Headlines for Thursday Jan. 14, 2016

Top Story

AMD and Key Industry Partners Welcome the AMD Opteron A1100 SoC to the 64-bit ARM Datacenter Arena

AMD (NASDAQ:AMD) marks a major step toward delivering choice and innovation in the datacenter with the launch of the AMD Opteron™ A1100 System-on-Chip (SoC), formerly codenamed “Seattle.” Jointly with its software and hardware partners, AMD is accelerating time-to-deployment of ARM®-based systems and driving forward ecosystem support for ARM in the datacenter.

• Silex Technology, Inc. Acquires embWiSe Technologies PVT, LTD.
• Faraday Delivers a Complete Set of Cell Libraries and Memory Compilers for UMC 28nm HPC Process
• eMemory's NeoFuse Technology: A Major Advance in Automotive Panel Driver IC
• Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology
• TSMC Reports Fourth Quarter EPS of NT$2.81
• Arrow Electronics and Cadence Collaborate to Accelerate the Development of Production-Ready Products for Hardware Engineers

Headlines for Wednesday Jan. 13, 2016

Top Story

Credo Delivers Industry's Lowest Power 100G MUX Device Based on 50Gbps SerDes Technology

Credo Semiconductor today announced it is entering the chip market with a sub 1 Watt multiplexer (MUX)/retimer device that leverages the company's unique SerDes architecture and low-cost analog technology to enable 100G optical modules with 50G per lambda throughput.

• IFI CLAIMS Announces 2015 U.S. Patent Rankings
• Visteon Signs Agreement to Acquire India-based Automotive Multimedia Systems Supplier, AllGo Systems
• Ittiam enables OpenCL based VP9 Encode for Mobile and Consumer Applications

Headlines for Tuesday Jan. 12, 2016

Top Story

Sonics signs first customer for ICE-Grain Power Architecture and closes 2015 with five new SonicsGN NoC licenses

Sonics today announced that it has signed an agreement with the first customer for the company’s ICE-Grain™ Power Architecture that was introduced in May 2015. The customer, a global player in the consumer electronics and semiconductor industries, will incorporate Sonics’ hardware-based power management and control technology into a high-volume mobile application.

• JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
• Arteris FlexNoC Physical Interconnect IP is Licensed by Renesas Electronics Europe for use in High-End SoCs
• DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
• S2C Expands Kintex UltraScale Prototyping Solutions for Consumer-based IoT and Other Small to Medium-Sized Designs

Headlines for Monday Jan. 11, 2016

Top Story

Gartner Says Worldwide Semiconductor Capital Spending to Decline 4.7 Percent in 2016

Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.. This is down from the 3.3 percent growth predicted in Gartner's previous quarter's forecast.

• Will Apple Drive Analog ICs?
• Semtech and MultiPhy Enter into a Strategic Agreement to Bring to Market a Complete Chipset for 100G Single Wavelength Optical Module Solutions
• Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership
• WiLAN Subsidiary Enters Into License Agreement With GLOBALFOUNDRIES
• Microsemi Corporation Provides Acquisition and Business Updates; Announces the Expiration of the HSR Waiting Period
• Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception
• Dolphin Integration joins the international Design & IP Partner Program of imec IC-link's
• Tech Tour of Metal Gate I/O Transistors
• NeuroSky Uses ARM Mobile Tech to Enable Secure Remote Patient Monitoring
• prpl Foundation Reveals Vision for a Secure Internet of Things
• Xilinx Demonstrates 16nm Heterogeneous Multi-Processing SoC Solutions for ADAS Applications at CAR-ELE Japan 2016
• DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard CMOS Process

Headlines for Friday Jan. 08, 2016

Top Story

ARM Exec's Straight Car Talk at CES

Ian Drew, ARM’s executive vice president of marketing and business development, posed five questions that the automotive industry — or the tech industry in general — would rather not hear.

• TSMC December 2015 Revenue Report
• UMC Reports Sales for December 2015
• Faraday Monthly Consolidated Sales Report - December 2015

Headlines for Thursday Jan. 07, 2016

Top Story

Moortec Announces New PVT Controller - Complete PVT Sub-System Solution

Moortec Semiconductor Limited, provider of embedded die monitoring IP solutions for advanced nodes, announces its new PVT Controller. The PVT Controller provides a single standard interface to Moortec’s embedded Process, Voltage and Temperature (PVT) sensing Sub-System used to increase System on Chip performance and reliability.

• Free Core, Some Assembly Required
• Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015
• Samsung, TSMC Remain Tops in Available Wafer Fab Capacity
• Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions
• INSIDE Secure Collaborates with Microsoft to Address Hollywood Studios' Security Requirements for 4K/UHD and HDR Content
• INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System
• VeriSilicon Completes Acquisition of Vivante

Headlines for Wednesday Jan. 06, 2016

Top Story

New PowerVR GPUs from Imagination combine advanced graphics with optimizations for vision and computational photography

Imagination Technologies introduces two new PowerVR Rogue GPU IP cores designed to enable customers to create advanced high definition graphics with a superior experience for vision and computational photography-based applications in their next-generation devices.

• Imagination announces new fabric collaboration with NetSpeed
• EDA Consortium Reports EDA Industry Revenue Increase For Q3 2015
• Synopsys DesignWare IP Enables First-Pass Silicon Success for SK Hynix Universal Flash Storage Device
• Cadence Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS12 Multistream Decoder
• DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs
• Chips&Media Inc. releases its new ultra small size and low power HEVC/H.265 codec IP
• Arteris FlexNoC Interconnect IP is Licensed for use in Select Samsung SUHD TV Models
• PowerVR GPUs from Imagination pass OpenVX conformance with Khronos
• Imagination announces that 2016 will be "the year of MIPS"
• Imagination showcases its leadership in the automotive market at CES 2016

Headlines for Tuesday Jan. 05, 2016

Top Story

AMD Demonstrates Revolutionary 14nm FinFET Polaris GPU Architecture

AMD provided customers with a glimpse of its upcoming 2016 Polaris GPU architecture, highlighting a wide range of significant architectural improvements including HDR monitor support, and industry-leading performance-per-watt. AMD expects shipments of Polaris architecture-based GPUs to begin in mid-2016.

• Codasip Joins RISC-V Foundation and Announces Availability of RISC-V Compliant Codix Processor IP
• Global Semiconductor Sales Dip Slightly in November
• GUC Monthly Sales Report - December 2015
• Wi-Fi Alliance introduces low power, long range Wi-Fi HaLow
• SiBEAM Introduces USB 3.0 802.11ad Reference Design Delivering Wireless Connectivity at Multi-Gigabit Speeds
• Flex Logix Appoints Andy Jaros as VP Sales
• RFaxis Expands Portfolio of CMOS RF Front-End ICs for Internet of Things (IoT)

Headlines for Monday Jan. 04, 2016

Top Story

CEVA Announces Certification of RivieraWaves Surf Wi-Fi 802.11ac IP Platform

CEVA, Inc. today announced that its RivieraWaves Surf IP platform has achieved Wi-Fi CERTIFIED™ ac status from the Wi-Fi Alliance®.

• dbx-tv Total Technology Now Available on Cadence Tensilica HiFi Audio/Voice Processors
• Dolphin Integration unveils extremely dense audio CODECs for application processors at 28 nm and 16 nm
• Celeno Adopts CEVA DSP for High Performance 802.11ac Wave 2 4x4 Products
• Broadcom Announces Industry's First 64Bit Quad-core Router Processor
• Car as a Commodity: From Hummers to Ho-Hum
• STMicroelectronics and ClevX Offer World's First Wireless User-Authentication Technology Platform for IoT-Device Security
• 8 Predictions for 2016