D&R Headline News (April 2016)

Headlines for Thursday Apr. 28, 2016

Top Story

Cypress to Acquire Broadcom's Wireless Internet of Things Business

Cypress Semiconductor Corp. (Nasdaq: CY) and Broadcom Limited (Nasdaq: AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom's Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million.

• Xilinx Shares Decline After Light Forecast
• Cadence Completes Acquisition of Rocketick Technologies
• Microsemi and Mercury Systems Announce Scheduled Closing for Microsemi's Sale of its Embedded Security, RF and Microwave, and Custom Microelectronics Businesses to Mercury
• Xilinx Announces Fourth Quarter & Fiscal 2016 Results; Record 28nm & 20nm Sales, Dividend Raised For 11th Consecutive Year
• UMC Reports First Quarter 2016 Results

Headlines for Wednesday Apr. 27, 2016

• Pleora Brings High-Performance Imaging Expertise to NBASE-T Alliance
• UMC: Business to Bounce Back This Year
• Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
• Apple Drove Entire Foundry Sales Increase at TSMC in 2015

Headlines for Tuesday Apr. 26, 2016

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Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications

Synopsys today announced immediate availability of the industry's first MIPI® I3CSM controller IP to ease the integration of multiple sensors into applications such as mobile, automotive and the Internet of Things (IoT).

• RFEL launches new Fractional Rate Resampler IP core
• GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs)
• ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers
• Cadence Reports First Quarter 2016 Financial Results

Headlines for Monday Apr. 25, 2016

Top Story

Samsung Details Foundry Roadmap

Officials from Samsung Semiconductor Inc. (SSI) detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.

• China's Chip Patent Growth May Be Short Lived
• AMD Licenses x86 To China
• Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators
• North American Semiconductor Equipment Industry Posts March 2016 Book-to-Bill Ratio of 1.15
• MPEG LA Expands DisplayPort License Coverage
• Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design
• Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense
• Peraso Raises $20M Series C Financing Co-Led by Integrated Device Technology (IDT) and Roadmap Capital

Headlines for Thursday Apr. 21, 2016

• Alpha Data has partnered with Chevin Technology to support low latency 10G Ethernet and UDP offload IP on the ADM-PCIE-KU3 Accelerator board with Xilinx Kintex Ultrascale FPGA
• DENSO, eSOL, and NEC Communication Systems Form Joint Venture To Enhance Development of In-vehicle Electronic Systems Software

Headlines for Wednesday Apr. 20, 2016

Top Story

Comcores Announce Availability of CPRI v7.0

Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP) today announced the immediate availability of the Common Public Radio Interface (CPRI) v7.0 targeting FPGA and ASIC devices.

• Intel Reorg Shows Clouds Ahead
• Comcores provide Flexible Ethernet Switch IP Design Optimized for switching in C-RAN and Next-Generation LTE Advanced Networking Equipment
• ARM Holdings plc Reports Results For the First Quarter 2016
• Intel Cuts 12,000, 11% of Staff

Headlines for Tuesday Apr. 19, 2016

Top Story

14 IC Product Categories to Exceed Total IC Market Growth in 2016

Fourteen product categories—topped by Cellphone Application Processors and Signal Conversion (analog) devices—are expected to exceed the 2% growth rate forecast for the total IC market this year.

• Imagination, Microchip and Digilent deliver cutting-edge IoT curriculum for universities worldwide
• NetSpeed Systems Extends Global Footprint in Israel Through Sales Rep Agreement with Ipro
• Istuary Innovation Group Selects Arteris FlexNoC Interconnect IP For Development of Proprietary Enterprise Storage Controllers
• Xilinx Extends SmartConnect Technology to Deliver 20 -- 30% Breakthrough in Performance for 16nm UltraScale+ Devices
• Rambus Reports First Quarter Financial Results
• Blackmagic Design selects the TICO lightweight compression to move to Live video production over IP.
• Altera Demonstrates Ultra High Definition (UHD) Solutions at NAB; Offering a Path to Virtualized Studio Infrastructure
• Number of 300mm IC Wafer Fabs Expected to Reach 100 in 2016
• Cypress Semiconductor Corp utilizes Aceic Design Technologies for their BLE verification Requirements

Headlines for Monday Apr. 18, 2016

Top Story

FD-SOI Expands, But Is It Disruptive?

The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to FinFETs for the Internet of Things (IoT) and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescence around the technology.

• Argon Design launches real-time video stitching IP
• Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board
• Via Licensing Announces Extended High Efficiency AAC Patent Pool
• Atmel and Rockchip Join ARM Global University Program Alliance
• Rambus Cryptography Research Unveils Latest Release of DPA Workstation Analysis Platform
• Server and Cloud Leaders Collaborate to Create China-based Green Computing Consortium
• State of On-Shoring: Problem of China
• Intel Reportedly Readies Mass Layoff
• NGCodec and Xilinx Demonstrate H.265/HEVC Video Encoder IP at NAB 2016
• Qualcomm Signs 3G/4G Chinese Patent License Agreement with Yulong
• Open Source: Licensing Pitfalls May Outweigh Benefits
• HEVC Advance Expands License Agreement

Headlines for Friday Apr. 15, 2016

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CAN FD Plug Fest Shows Robust Operation of Controller IP Core by CAST and Fraunhofer IPMS

The CAN Bus Controller offered by intellectual property provider CAST, Inc. has successfully undergone a second round of real-world-like testing at the CAN Plug Fest run by the CAN in Automation association at Ford’s facility in Detroit.

• Data Centers Hit the Accelerator
• UMC Standardizes on Industry-Leading ARM Artisan Platform for Physical IP

Headlines for Thursday Apr. 14, 2016

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Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership

In this phase of the agreement, Kilopass will port its OTP NVM Intellectual property (IP) to MIFS’s 40-nanometer (nm) low-power (40LP) process. Designers using the MIFS 40LP process will be able to integrate Kilopass’ XPM 128kbit to optimize power efficiency and performance of their designs.

• TSMC Expects to Rise from Industry Falloff in 2H
• TSMC Reports First Quarter EPS of NT$2.50
• USB 3.0 Promoter Group Defines Authentication Protocol for USB Type-C

Headlines for Wednesday Apr. 13, 2016

Top Story

Brite Semiconductor Releases "YOU" Brand IP Portfolio and Silicon Platform Solution

Based on more than 8 years successful experience of design service and IP development on the cutting-edge processes, Brite provides “YouIP” which means “IP belongs to YOU” portfolio solution and silicon platform to assist customer to win emerging markets like IoT, wearable devices, mobile, consumer electronics and so on, combining with comprehensive ASIC design service solution and trusted manufacturing partner SMIC. YouIP is an IP and platform family attributing to not only Brite, but also our customer-YOU.

• Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power
• Synopsys Delivers Industry's First Verification IP for USB Power Delivery 3.0
• Gartner Says Worldwide Semiconductor Revenue Expected to Decline 0.6 Percent in 2016
• Mystery Buyer for IDT?
• UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPCU Process
• Worldwide Semiconductor Foundry Market Grew 4.4 Percent in 2015, According to Final Results by Gartner
• Sayonara, Japan Semiconductor Inc.

Headlines for Tuesday Apr. 12, 2016

Top Story

Barco Silex announces VC-2 HQ RTP mapping ready for broadcast video production over IP

Barco Silex, leading provider of video compression solution in the broadcast market, announces the availability of RTP (Real-time Transport Protocol) mapping for VC-2 encoded video stream. This is an essential building block for the broadcast market moving away from SDI to IP based production flow and will further enable the adoption of the open VC-2 codec standard in this context.

Headlines for Monday Apr. 11, 2016

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Cadence to Acquire Rocketick, Delivering Revolutionary Parallel Logic Simulation Speed-up

Cadence today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd., an Israel based pioneer and leading provider of multicore parallel simulation.

• NXP Unit Reportedly Attracts Chinese Suitors
• IBM Neurocomputer Detailed
• TSMC to Sell 5.1% of Xintec Inc.
• HDL Design House Joins PCI-SIG
• China Facing Long-Term Memory Gap
• TSMC March 2016 Revenue Report
• JT-SingMai will be showing their innovative video IP cores at Secutech, Taiwan
• UMC Reports Sales for March 2016

Headlines for Thursday Apr. 07, 2016

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Arastu Systems announces DFI 4.0 compatible and validated LPDDR4 DRAM Memory Controller

Arastu Systems today announced its LPDDR4 DRAM Memory Controller to cater the increasing demand for high performance and low power memories. The design IP supports popular industry standard AHB/AXI, but gives customers the flexibility to customize the design as per their needs.

• Google Preps for IBM, ARM Shift
• Arasan Announces Ultra Low Gate count, Ultra Low Latency Soundwire IP Core
• Freescale Takeover Makes NXP Largest Automotive Chip Vendor
• Faraday Monthly Consolidated Sales Report - March 2016
• eMemory Launches Enhanced NeoFuse IP for IoT Applications

Headlines for Wednesday Apr. 06, 2016

Top Story

Chips&Media's Video IP powered SoCs reached 140 Million shipments in 2015

Chips&Media Inc., the world’s leading company in video IP technology announced that SoCs embedded with their video core had been shipped over 140 million units in 2015. Chips&Media Inc. dominated the market rapidly since start of their business 10 years ago by introducing best performance video IPs and advanced technology every year and became a competitive video IP provider.

• Xilinx and IBM to Enable FPGA-Based Acceleration within SuperVessel OpenPOWER Development Cloud
• The Alliance for Open Media Welcomes New Members and Announces Availability of Open Source Video Codec Project
• INSIDE Secure and VisualOn Partner to Secure Over-The-Top Content Delivery and Playback Across Multiple Platforms
• Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM
• Intel Acquires Yogitech for IoT Functional Safety
• Hua Hong Semiconductor's 90nm eFlash Process Platform Successfully Achieved Mass Production
• GUC Monthly Sales Report - March 2016
• OmniVision's OV2718 Brings 1080p High Definition Imaging to HiSilicon's System-on-Chip IP Camera Solution

Headlines for Tuesday Apr. 05, 2016

Top Story

Synopsys Extends Verification IP Portfolio for Automotive Applications

Synopsys today announced the expansion of its VC Verification IP (VIP) portfolio with CAN 2.0/FD/TT (ISO 16845 compliant), LIN, FlexRay™, and Ethernet Audio Video Bridging (AVB) protocols for the verification of automotive applications.

• Cadence Unveils Next-Generation Virtuoso Platform Featuring Advanced Analog Verification Technologies and 10X Performance Improvements Across Platform
• Intel Mobile Chief's Hard Monday
• Intel Plans A Future of CMOS
• China's Interest in FD-SOI: Is It for Real?
• Worldwide Semiconductor Revenue Declined 2.3 Percent in 2015, According to Final Results by Gartner
• U.S. Companies Continue to Capture Bulk of IDM and Fabless IC Sales
• Hua Hong Semiconductor Cooperates with MindMotion to Develop IP Platform Targeting IoT Smart Hardware

Headlines for Monday Apr. 04, 2016

Top Story

Global Semiconductor Market Slumps in 2015, IHS Says

Global semiconductor revenues fell by 2 percent in 2015. Sequential quarterly growth was weak throughout every quarter of 2015, especially in the first quarter when the market declined 8.9 percent over the previous quarter -- the deepest sequential quarterly decline since the semiconductor market collapsed in the fourth quarter of 2008 and first quarter of 2009.

• JEDEC Updates Universal Flash Storage and Related Standards
• Via Licensing and Pegatron Settle Patent License Dispute Concerning AAC Essential Patents
• GigOptix, Inc. to Acquire Magnum Semiconductor, Inc.
• Global Semiconductor Sales Dip Slightly in February
• Last ASIC Vendor Standing in Japan
• InterDigital and NEC Corporation Extend and Expand Patent License Agreement
• France Brevets licenses NFC Patents to Sony
• EDA Consortium Becomes Electronic System Design Alliance
• iPhone SE is Three iPhone Generations Rolled into One, IHS Teardown Reveals

Headlines for Friday Apr. 01, 2016

Top Story

CEO Interview: Andes' Cores For IoT Suit Europe

EE Times Europe interviewed Frankwell Jyh-Ming Lin, CEO of Andes Technology Corp. (Hsinchu, Taiwan), a licensor of a range of 32bit processor cores as intellectual property (IP), and asked how the company is planning to address the European market.

• WiLAN Subsidiary Reaches Agreement to License and Sell Patents to TSMC
• FinFET's Father Forecasts Future
• Gartner Says Global Smartphone Sales to Only Grow 7 Per Cent in 2016
• Swiss Open-Source Processor Core Ready For IoT