D&R Headline News (May 2016)

Headlines for Tuesday May. 31, 2016

Top Story

Chips&Media unveils its first Image Signal Processing (ISP) IP solution

Chips&Media Inc. a leading multimedia SoC IP provider, today announced launch of first Image Signal Processing (ISP) solution, CS series, the move to widening its solution portfolio to cope with continuing demand on image processing and camera related solution.

• Heterogeneous Systems Architecture Foundation Launches HSA 1.1 Specification with Multi-Vendor Architecture Support
• Toshiba Announces Immediate IP Subsystem Availability of PCI Express and DDR3 for Custom LSI Platforms
• Marvell Releases New ARMADA Hyperscale Virtual SoC Families Featuring the ARM Cortex-A72 CPU with Advanced Networking and I/O Support
• Despite Economic Headwinds in China, Industrial Semiconductor Revenues Rose in 2015, IHS Says
• Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Dream Chip Technologies for ADAS SoC
• Fast Processor Model of Renesas RL78 CPU Released by Imperas for Open Virtual Platforms
• GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing
• Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
• Barco Silex at InfoComm, demonstrating professional OEM boards for HDMI transport over IP
• Cavium Announces ThunderX2, the second generation of workload optimized ARM server SoCs
• Design Verification Challenges in Modern SoCs - HDL Design House Webinar
• IEEE Standards Association Announces IEEE 802.3 Projects to Meet Industry Demands for Higher Ethernet Speeds

Headlines for Monday May. 30, 2016

Top Story

Latest ARM Premium Mobile Technology to Drive Immersive Experiences

ARM has announced a suite of premium mobile processor technologies to redefine flagship devices from 2017. The ARM Cortex-A73 processor and the ARM Mali-G71 graphics processor offer sustained performance and efficiency gains that will lead to new products with enhanced contextual and visual capabilities. This will allow devices to run high resolution content for longer periods while staying within strict mobile power budgets.

• France Brevets licenses NFC Patents to Samsung
• FDSOI Driving ST's Automotive Biz
• Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU
• INSIDE Secure and Rambus Collaborate to Protect Delivery of 4K and Ultra HD Premium Content
• Early Adopters of ARM Cortex-A73 CPU and Mali-G71 GPU Successfully Tape-out Using Synopsys' IC Compiler II
• Digital Blocks DB9000 TFT LCD Display Controller IP Core Family Achieves Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, Wearables, and Cinema Applications

Headlines for Thursday May. 26, 2016

Top Story

PLDA Achieves PCI Express 3.0 Compliance for XpressSWITCH IP, Adding to its List of PCI Express Compliant Products

PLDA today announced another addition to the PCI-SIG® Integrators List, XpressSWITCH™ IP, adding to the company’s suite of tested and certified products. In the past years, PLDA has achieved PCI Express (PCIe®) compliance for eight of its PCIe interconnect IP products, underscoring a commitment to rigorously tested and easy-to-integrate products.

• Silicon Creations Taps Silvaco's Custom Design Flow for 10nm FinFET Designs
• Faraday Exhibits 28HPCU SoC Design Service and IP Solutions at DAC 2016
• Communications and Computer Systems Drive IC Sales Across All Regions
• Gartner Identifies Think Silicon a "Cool Vendor" in Novel Semiconductors for Neural Networks

Headlines for Wednesday May. 25, 2016

Top Story

Optimised cryptographic solution for home automation on Cortus APS3RP core

Oberon’s highly efficient cryptographic code, a key component of its OberonHAP product, has been ported to and optimised for the Cortus APS3RP 32-bit IP core. The combination of the tiny software memory footprint and minimalist processor core is well suited to secure ASICs in battery-powered home automation devices.

• Globalfoundries Working on Next-Gen FDSOI Process
• Arteris Ncore Cache Coherent Interconnect IP Enabled by ARM's Cycle Models
• Synopsys Accelerates Software Development for Automotive Systems with New Models for Bosch Timer and In-Car Communication IP
• Imec, Holst Centre and Barco Silex Collaborate on Data Security for Wearables and Internet of Things Networks
• Rambus Chief Financial Officer Satish Rishi to Retire in August
• North American Semiconductor Equipment Industry Posts April 2016 Book-to-Bill Ratio of 1.10
• Agnisys and Breker Partner to Generate System-Level Portable Stimulus Sequences
• Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip

Headlines for Tuesday May. 24, 2016

Top Story

Arteris Ncore Cache Coherent Interconnect IP is Implemented by NXP

Arteris today announced that NXP Semiconductors has licensed Ncore cache coherent interconnect IP for use in its SoCs. The design teams at NXP have been long-time users of Arteris IP, having first licensed Arteris FlexNoC interconnect IP in 2011 and successfully implemented FlexNoC interconnects in its QorIQ network processing platform. The first implementation of Ncore interconnect IP in NXP is in heterogeneous cache coherent SoCs for next generation automotive MCU's and processors.

• Alizem releases new Safe Engine Stop-Start Software IP to improve energy-efficiency of delivery vehicles
• ARM Cortex-A72 Models and Virtual Platforms Released by Imperas and Open Virtual Platforms
• Agnisys Expands Product Portfolio With Portable Sequence Generator
• Synopsys Delivers Industry's First Cache Coherent Subsystem Verification Solution for Arteris Ncore Interconnect
• Foundries' Sales Show Hard Times Continuing
• Innosilicon Announces that the world 1st 14nm A4 Dominator ASIC is ready for mass shipment in 2 months
• Synopsys Completes Acquisition of Gold Standard Simulations
• Synopsys Launches Pre-Wafer Simulation Solution to Reduce Semiconductor Process Development Time
• Analogix Licenses USB-C Technology to LG Electronics

Headlines for Monday May. 23, 2016

• GLOBALFOUNDRIES Releases Performance-Enhanced 130nm SiGe RF Technology to Advance Next Generation Wireless Network Communications
• Palma Ceia SemiDesign Tapes Out 802.11ax Analog Frontend for Next-Generation Access Points
• Accelerators Unite ARM, IBM, X86
• Technology Leaders Join Forces to Bring an Open Acceleration Framework to Data Centers and Other Markets
• Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced Technologies for the Data Center
• Semiconductor Merger Mania: A Change From Historical Norms?
• eMemory NeoFuse IP Qualified in 40nm EHV Process
• AMPHION targets DAC 2016 to demonstrate compact HEVC/H.265 hardware decoder IP using H.265 bitstreams from encoder IP innovator NGCodec
• Synopsys Expands Software Integrity Strategy to Enable Development of Safer and More Secure Automotive Software
• Semifore and Breker Partner to Deliver Seamless, Automated Portable Stimulus Flow

Headlines for Thursday May. 19, 2016

Top Story

ARM Drives the Future of Premium Mobile Computing with a Multicore Test Chip based on 10FinFET from TSMC

ARM today announced the first multicore, 64-bit ARM®v8-A processor test chip based on TSMC's 10FinFET process technology. Simulation benchmarks show impressive power and efficiency gains relative to TSMC's 16FinFET+ process technology, which is currently used to implement chips powering many of today's leading premium smartphones.

• INSIDE Secure to sell its semiconductor business to Swiss cybersecurity expert WISeKey
• Synopsys' Custom Compiler Enabled for Samsung Foundry's 14-nm FinFET Process
• Imagination accelerates Debian development for 64-bit MIPS CPUs
• Sivers IMA signs agreement with Blu Wireless Technology
• Microsemi Announces RTG4 PROTO FPGAs to Enable Lower Cost Prototyping and Design Validation for High-Speed Radiation-Tolerant FPGAs
• ANSYS Introduces First Big Data and Machine Learning System for Engineering Simulation

Headlines for Wednesday May. 18, 2016

Top Story

ARM Acquires Apical - a Global Leader in Imaging and Embedded Computer Vision

ARM has acquired Apical, a global leader in imaging and embedded computer vision technology that will allow next generation devices to understand and act intelligently on information from their environment. Apical is one of the UK's fastest-growing technology companies* and its advanced imaging products are used in more than 1.5 billion smartphones and approximately 300 million other consumer/industrial devices including IP cameras, digital stills cameras and tablets.

• Synopsys Completes Acquisition of Simpleware
• M31 Technology Develops a Complete Set of New-Generation High-Performance USB IP solutions

Headlines for Tuesday May. 17, 2016

Top Story

Arteris Redefines Heterogeneous Multicore Cache Coherency with Configurable, Distributed Semiconductor Architecture

Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today introduced a semiconductor design technology that enhances the ability of SoC architects to create efficient cache-coherent systems with IP sourced from multiple vendors.

• Xilinx Appoints Saar Gillai, Ron Jankov, and Tom Lee to its Board of Directors
• Latest Synopsys IC Compiler II Release Boosts Quality-of-Results for Performance-Critical Designs
• Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet Ethernet Packet Generators
• NEWRACOM to exhibit top-notch Wi-Fi and Bluetooth technologies for mobile, IoT, and M2M connected consumer devices at COMPUTEX 2016 and DAC 2016
• First Quarter 2016 Silicon Wafer Shipments Increase Quarter-Over-Quarter
• Xilinx Board Of Directors Increases Repurchase Authorization By $1 Billion
• Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle
• Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs

Headlines for Monday May. 16, 2016

• Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs
• Five Months into the Year and Market Finally Reaching Bottom; IDC Forecasts Worldwide Semiconductor Revenue Still to Fall 2.3% to $324 Billion
• UltraSoC announces significant product update, improved support for analytics and "any CPU" capability
• Truechip announces first customer shipment of CPRI Comprehensive Verification IP (CVIP)
• Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays

Headlines for Friday May. 13, 2016

Top Story

Seven Top-20 1Q16 Semiconductor Suppliers Show Double-Digit Declines

Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.

• Moortec to exhibit at next week's TSMC China Technology Symposium

Headlines for Thursday May. 12, 2016

Top Story

Open-Silicon CEO: Creating a legacy through traditional values

President and CEO of Open-Silicon, Taher Madraswala has a quarter of a century of experience in semiconductor engineering. Here, he outlines his vision of how the market will change over the next five years…

• Sidense Exhibiting Secure and Reliable 1T-OTP at TSMC 2016 China and Taiwan Symposiums
• Istuary Innovation Group Selects Agnisys IDesignSpec for Enterprise Storage Chips
• SMIC Reports 2016 First Quarter Results
• VeriSilicon Supports the Connected Car by Joining Automotive Grade Linux

Headlines for Wednesday May. 11, 2016

Top Story

Synopsys Expands Portfolio of ARC Processors for Safety-Critical Automotive Applications to Include DSP and Cache Support

Synopsys, Inc. (Nasdaq:SNPS) today announced the extension of its Safety Enhancement Package (SEP) to Synopsys' DesignWare® ARC® EM processors that include cache support and DSP acceleration.

• Algo-Logic Systems Launches FPGA Accelerated CME Tick-To-Trade System
• VORAGO Technologies Announces Availability of Industry's First ARM Cortex MCUs Built for Extreme Conditions
• ARM University Program Introduces New Mobile Gaming Education Kit

Headlines for Tuesday May. 10, 2016

Top Story

Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications

Barco Silex, the leading provider of IP cores for security, launches a new IP module to turn ASIC and SoC designs into fully-secured IoT (Internet of Things) applications. The eSecure module functions as a root-of-trust, guaranteeing the authenticity and integrity of the application’s hardware, software, data, and communication.

• Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
• Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard
• HDL Design House Appoints New Representative for Central Europe, Nordic Region and the US
• TSMC April 2016 Revenue Report
• Gartner Says Worldwide Semiconductor Capital Spending to Decline 2 Percent in 2016
• Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
• MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes
• Automotive Electronics System Demand Fails to Boost Automotive IC Market in 2015

Headlines for Monday May. 09, 2016

Top Story

Credo 16-nm 28G and 56G PAM-4 SerDes Now Available on TSMC FinFET Compact Process

Credo Semiconductor today announced the availability of its 28G and 56G PAM-4 SerDes transceiver IP on TSMC's 16-nm FinFET Compact (16FFC) process, enabling its growing customer base to take advantage of the low-power benefits of this advanced, new process in next-generation designs.

• InvenSense and ARM Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry
• Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software
• UMC Reports Sales for April 2016
• EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications
• RFEL adds Wideband capability to its award-winning ChannelCore Flex advanced channeliser IP core

Headlines for Friday May. 06, 2016

• Faraday Monthly Consolidated Sales Report - April 2016
• GUC Monthly Sales Report - April 2016
• OmniPHY Named One of 2016 20 Most Promising Semiconductor Companies by SiliconIndia

Headlines for Wednesday May. 04, 2016

Top Story

Texas Instruments Leads Industrial Semiconductor Vendor Share Ranking in 2015; Market Rises to $40.7 billion

According to the latest analysis by Semicast Research, Texas Instruments was the leading vendor of semiconductors to the industrial sector in 2015, ahead of Infineon Technologies. Intel passed STMicroelectronics to become the third largest vendor following the acquisition of Altera, with Renesas Electronics completing the top five.

• Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect Designer and SiP Layout
• eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips
• Creonic Participates in International SENDATE-TANDEM Research Project
• CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years
• Faraday Showcases Virtual Platform Solution and 28nm IP at ChipEx 2016

Headlines for Tuesday May. 03, 2016

Top Story

High Performance HEVC decoder IP released by Chips&Media

Chips&Media Inc. has announced today the release of the 2nd-generation UHD (4K/8K) HEVC decoder IP called WAVE510. This is the first rollout of the new WAVE5 series based on brand-new architecture.

• IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016
• NetSpeed Systems expands presence in Taiwan through partnership with Maojet Technology
• Next-generation multi-platform video analytics SoC results from collaboration between Imagination and ELVEES
• Global Semiconductor Sales Increase Slightly in March
• Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture
• Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
• New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies

Headlines for Monday May. 02, 2016

Top Story

Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architecture

Synopsys today announced the availability of its next-generation Verification IP (VIP) for Micron's Hybrid Memory Cube (HMC) architecture. The HMC architecture offers a high performance, low cost memory solution, with 70 percent less energy utilization than existing DRAM technologies.

• How Intel Missed the Smartphone Call
• Indian fabs, the free market and central planning
• Intel to Exit Mobile SoC Business
• Altera's Design Solutions Network Connects Customers with Experts to Help Innovate With Their FPGA-Based Designs
• CEVA, Inc. Announces First Quarter 2016 Financial Results
• BittWare and Atomic Rules announce an FPGA-based UDP Offload Engine IP Core for 10/25/50/100 GbE
• Try and adopt Motu-Uta, the benchmark from Dolphin Integration for a fair evaluation of Standard Cell libraries
• Dongbu HiTek Provides Process Design Kits for Synopsys' Custom Compiler Solution
• Attopsemi Published a Paper in ICMTS 2016, Yokohama, Japan