D&R Headline News (July 2016)

Headlines for Friday Jul. 29, 2016

• SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology
• Will Semi Industry Consolidation Hurt Innovation, R&D Spending?
• Hardent Launches New DisplayPort 1.4 Forward Error Correction IP Cores
• STMicroelectronics Acquires ams' NFC and RFID Reader Assets

Headlines for Thursday Jul. 28, 2016

• MicroEJ Accelerates the Creation of IoT Software for ARM Cortex-M and Cortex-A Processors
• Synopsys' New Model for Infineon's Next Generation TriCore Architecture Accelerates Early Automotive Software Development and Test
• Xilinx Announces First Quarter 2017 Results; Advanced Products Grow 60% Y-T-Y, Strong Profitability
• ARM Achieves Another Successful Quarter

Headlines for Wednesday Jul. 27, 2016

Top Story

Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the new Cadence® Tensilica® Fusion G3 digital signal processor (DSP), a multi-purpose, high-performance DSP ideal for compute-intensive system-on-chip (SoC) designs.

• Synopsys Delivers Industry's First Verification IP for Ethernet 200G
• ARM Holdings plc Reports Results for the Second Quarter 2016
• China's Final Chance to Achieve Its IC Industry Ambitions Now Underway
• Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for Networking and Data Center Applications
• Analog Devices and Linear Technology to Combine Creating the Premier Analog Technology Company

Headlines for Tuesday Jul. 26, 2016

Top Story

SST and SilTerra Announce Production Readiness of Embedded SuperFlash Macros on SilTerra's 180 nm CMOS Platform

Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, announced today that silicon-proven SuperFlash® macros are now available on SilTerra’s 180 nm CMOS technology.

• FDSOI to Get Embedded MRAM, Flash Options at 28nm
• ams acquires MAZeT
• Kandou's Glasswing IP JEDEC Compliant
• Bessemer Venture Partners Invests $15 Million in Kandou
• Open-Silicon Strengthens Management Team With Key Executive Appointments
• Cadence Reports Second Quarter 2016 Financial Results
• eMemory Announces Comprehensive NVM Solution in 0.13um BCD Process for PMIC Applications
• IP Pioneer Mark Templeton Dies

Headlines for Monday Jul. 25, 2016

Top Story

SoftBank/ARM Deal: Political Hurdles Ahead?

The deal could also face hard scrutiny by the European Commission, which is now becoming more critical about consolidation in the technology sector.

• Kazan Networks Closes $4.5M Series A Funding Round
• GLOBALFOUNDRIES Appoints Wallace Pai as General Manager to Oversee China Business Development
• Save up to 20 % of silicon area with Dolphin Integration's standard cell library SESAME uHD
• SafeZone IoT Security Framework from INSIDE Secure delivers an integrated suite of products that addresses the broad spectrum of critical IoT security needs
• BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept

Headlines for Friday Jul. 22, 2016

Top Story

Brexit, Techxit?

Wolfson Microelectronics gone to Cirrus; CSR gone to Qualcomm; Imagination stumbles; UK votes to leave the European Union; ARM votes to become a subsidiary of a Japanese telecommunications company with IoT dreams of grandeur. Is there a steady-state theory of tech company creation and destruction or are we living in a big-bang technology world? And was the bang we just heard the door closing as UK exits hardware technology?

• OTOY and Imagination unveil breakthrough PowerVR Ray Tracing hardware platform for cinematic real time rendering

Headlines for Thursday Jul. 21, 2016

Top Story

CAST Introduces Low-Power, Ultra-HD Capable Video Compression Cores

Semiconductor intellectual property provider CAST, Inc. recently introduced the newest generation in its eighteen-year-long series of IP cores for video and image compression.

• Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.7 Percent in 2016
• SoftBank's Son: Quixotic or Prophetic?
• PrimeTime Smart ECO Technology Cuts Compute Costs by 10X

Headlines for Wednesday Jul. 20, 2016

Top Story

Synopsys Expands DesignWare MIPI IP Portfolio with DSI and CSI-2 Device Controllers

Synopsys today announced the immediate availability of its new DesignWare® MIPI® CSI-2℠ Device Controller IP and DesignWare MIPI DSI℠ Device Controller IP for mobile, automotive and Internet of Things (IoT) system-on-chips (SoCs).

• RFEL Supplies HyperSpeed FFT IP Core to Arizona Radio Observatory
• Connected devices need e-commerce standard security say cyber security experts
• BaySand to Announce XPresso, the ASIC Wizard to Generate the Intellectual Property (IP) Cores and Accelerate ASIC Design Cycle
• Test and Verification Solutions expands its operations in Silicon Valley, USA

Headlines for Tuesday Jul. 19, 2016

Top Story

If not ARM, which architecture next for IoT

So let’s assume billions of chips are going to get sold for ‘IoT’, what ever that might be. And let’s assume they were going to have ARM Cortex-M_ cores in them. Now that ARM is no longer independent, I can see two futures.

• Synopsys' IC Validator Certified by TowerJazz for Signoff Physical Verification
• ARM Acquisition: What's In It for SoftBank?
• ARM, Softbank and 1,500 Engineers
• Rambus Reports Second Quarter Results

Headlines for Monday Jul. 18, 2016

Top Story

ARM-SoftBank: Selling at Top or Buying at Bottom?

Is ARM cashing in its chips after a successful 25-year run or is it simply looking to SoftBank for financial back up because the best is yet to come in a global IoT revolution?

• Why SoftBank Is Spending $32 Billion on ARM
• ParkerVision Enters into Patent License and Settlement Agreement with Samsung
• Rambus CryptoMedia Security Platform Will Protect Pay TV Content for DishTV India
• Comment: IoT made ARM takeover inevitable
• CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016
• ARM at the Heart of the Industrial Internet of Things
• Recommended acquisition of ARM by SoftBank

Headlines for Friday Jul. 15, 2016

• NXP warns cryptographic keys can be hacked
• TSMC to Adopt Extreme Ultraviolet at 5nm
• TSMC Reports Second Quarter EPS of NT$2.80

Headlines for Thursday Jul. 14, 2016

Top Story

The DTPCI32DC - Dual Clock 32bit PCI Bus Target Interface from Digital Core Design

Digital Core Design, one of the most experienced (since 1999) IP Core providers and a System-on-Chip design house, introduced to its portfolio the DTPCI32DC. It’s a Dual Clock 32-bit PCI Bus Target Interface IP Core which meets all requirements of the PCI 3.0 specification for a target device. Moreover, it compromises a minimal gate count with a high-bandwidth data transfer.

• IEC Formally Adopts USB Type-C, USB Power Delivery and USB 3.1 Specifications
• Boeing Licenses Rambus DPA Countermeasures to Protect Critical Aerospace and Defense Systems from Security Threats

Headlines for Wednesday Jul. 13, 2016

Top Story

Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications

Synopsys, Inc. (Nasdaq:SNPS) today announced it has reduced the power and area of its DesignWare® USB 2.0 Type-C Controller and PHY IP for cost-sensitive and energy-efficient Internet of Things (IoT) edge applications targeting 40-nanometer (nm) and 55-nm ultra-low power processes.

• Chip Equipment Spending SEMI Forecasts: Flat 2016, Rebound in 2017
• LETI Develops 3D Network-on-Chip to Improve High-Performance Computing
• Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
• eMemory's NeoEE Solution Facilitates Module Integration for Fingerprint Applications
• Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
• Synopsys TetraMAX II ATPG Certified for ISO 26262 Automotive Functional Safety
• TetraMAX II Shortens Test Pattern Generation From Days to Hours

Headlines for Tuesday Jul. 12, 2016

Top Story

SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process

Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, announced today qualification and availability of SST's low-mask-count embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES' 130 nm BCDLite® technology platform.

• IP-Maker to release NVMe PCIe Gen 3 reference design
• Ex-Broadcom Unit to Shape Cypress IoT Future
• prpl Foundation Unveils the First Open Source Hypervisor for the Internet of Things
• Huaxintong Semiconductor licenses ARMv8-A architecture
• Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

Headlines for Monday Jul. 11, 2016

Top Story

Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP

Chips&Media Inc. announced today they completed development of 2nd generation VP9 and HEVC(H.265) multi-format Decoder IP - WAVE512 and now are available to customers. This is the second rollout of their high-performance UHD (4K/8K) Video IP series called WAVE5 which are based on the sophisticated new architecture.

• Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect
• SiFive Introduces Industry's First Open-Source Chip Platforms
• AppliedMicro Adopting TSMC 7nm FinFET Process Technology
• Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond
• FPGA Prototyping Becomes Even More Precise with Latest Additions to S2C's World-Class Prodigy Prototype Ready Interface Library
• TSMC June 2016 Revenue Report
• IBM, Samsung Put New Spin on MRAM
• Startup Looks to Put PAs on CMOS Express
• Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes

Headlines for Friday Jul. 08, 2016

• IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1%
• IoT Innovation in the Spotlight as prpl Foundation Continues to Grow

Headlines for Thursday Jul. 07, 2016

• Why Networks Need ASICs
• Faraday Monthly Sales Report -June 2016
• UMC Reports Sales for June 2016
• Open-Silicon to Showcase Breadth of ASIC Solutions at CDNLive 2016, Bangalore, India

Headlines for Wednesday Jul. 06, 2016

• Synopsys' New HAPS Adaptor for Juno ARM Development Platform Accelerates Software Bring-up
• Lossy Imagination Says There's Good Signs in Graphics
• Global Semiconductor Sales Up Slightly in May

Headlines for Tuesday Jul. 05, 2016

Top Story

Imagination Technologies: Full Year Results Statement FY2015-16

Imagination Technologies today announces results for the year ended 30 April 2016.

• PLDA Announces its Newest Expansion with the Launch of PLDA Training, a Full Training Program that Provides Easy-to-access Design Methodologies for SoC, Board and Low-level Software Designs
• GUC Monthly Sales Report - June 2016
• Barefoot Networks Unveils Breakthrough Switching Technology: the World's First Fully Programmable Switches That Also Happen to Be the Fastest Switches Ever Built

Headlines for Friday Jul. 01, 2016

Top Story

sureCore: Second direct investment into 'Emerging Star' from Enterprise Ventures portfolio

Mercia is pleased to announce that it has agreed the Group's second direct investment from the portfolio of investments managed by Enterprise Ventures Group ("EVG") following its acquisition by Mercia on 9 March 2016. The syndicate investment into sureCore Limited ("sureCore"), a low power electronic memory design specialist, provides further confirmation of the strategic benefit EVG brings to Mercia, expanding Mercia's direct investment pipeline sourced via its third party funds significantly.