D&R Headline News (August 2016)

Headlines for Wednesday Aug. 31, 2016

Top Story

Moortec Announce Embedded Process Monitor on TSMC 16FF+

Moortec Semiconductor, specialists in Process, Voltage and Temperature (PVT) sensors announce the availability of their Embedded Process Monitor on TSMC’s 16nm FinFET+ process.

• IC Industry M&A: Who's Left to Buy?
• Fujitsu Semiconductor and Mie Fujitsu Semiconductor License Nantero's NRAM And Have Begun Developing Breakthrough Memory Products for Multiple Markets
• ARM Investors Nod to Its Sale to SoftBank
• World's first Chinese AVS2 decoder IP release by Chips&Media

Headlines for Tuesday Aug. 30, 2016

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Intel Debuts 14nm+ Processors

Intel Corp. officially announced Kaby Lake, its seventh-generation Core PC processors made in a 14nm+ process and focused on delivering better 4K video.

• Linaro Announces First Development Board Compliant with 96Boards TV Platform Specification
• MCU Market Forecast to Reach Record High Revenues Through 2020
• Microsemi Announces LiteFast Serial Communication Protocol to Reduce Customers' Design-In Efforts and Time to Market

Headlines for Monday Aug. 29, 2016

Top Story

Flex Logix Reconfigurable, Low-Power IP Cores Now Available for TSMC 40ULP

Now in fabrication and expected to be fully validated in silicon during Q4 2016, the EFLX IP Core family for TSMC 40ULP will enable customers to design their next-generation MCUs and SoCs with reconfigurable RTL that can be quickly, easily and cost-effectively updated or changed at any time after fabrication, even in-system

• Mobile Sensor Technology Company Acconeer AB Closes $7M Investment Round
• eMemory Unveils EcoBit Technology for RFID and NFC Applications

Headlines for Friday Aug. 26, 2016

Top Story

Eminent Reached 10 Millions of Successful Production Chips Incorporating Attopsemi's I-Fuse OTP

Attopsemi announced today that its customer Eminent Electronic Technology, a leading fabless sensor IC company successfully embedded I-Fuse™’s OTP IP at UMC’s 0.35um mixed-signal process in proximity sensor products, and had shipped more than 10 millions of these chips for name-brand smartphones.

Headlines for Wednesday Aug. 24, 2016

• Weltrend Adopts AndesCore in WT8893 Around View Monitor Video Processor Shipping in a Major Sports Utility Vehicle
• AMD increased market share in Q2 2016 despite overall GPU shipments declining 4%, from last quarter
• North American Semiconductor Equipment Industry Posts July 2016 Book-to-Bill Ratio of 1.05
• TowerJazz and SMIC's Sales Forecast to Surge in 2016

Headlines for Tuesday Aug. 23, 2016

Top Story

Sidense Demonstrates Successful 1T-OTP Operation in TSMC 16nm FinFET Process

Sidense today announced that it has demonstrated successful operation of its patented SHF 1T-OTP memory macros at TSMC’s 16FF+ and 16FFC process nodes.

• Starblaze Integrates Enterprise Solid State Drive Controller Chip Using SonicsGN
• Irida Labs' NoiseSweeper and EnLight Software Now Available on Cadence Tensilica Imaging/Vision DSPs
• Movidius licenses UltraSoC analytics IP to speed debug and development
• Microsoft Gives Peek at HoloLens Chip
• Renesas Sets Sights on Intersil
• Oticon Licenses and Deploys CEVA Bluetooth Low Energy Technology in Breakthrough Hearing Aid
• ARM Reaches for Supercomputers

Headlines for Monday Aug. 22, 2016

• Dolphin Integration unveils a Smart Modulator for lowest power-consumption of digital microphones

Headlines for Friday Aug. 19, 2016

Top Story

Intel to Accelerate Altera, Says CEO

Intel’s chief executive pledged to support of the former Altera’s base business including use of ARM cores and long product lead times at the first event of the merged x86 and FPGA makers. In a Q&A session he also provided some insights on the company’s acceleration strategy in light of its recent acquisition of startup Nervana.

Headlines for Thursday Aug. 18, 2016

Top Story

Intel Foundry embraces ARM; the start of the end?

Intel Custom Foundry has made a statement of intent that it is serious about competing with the likes of TSMC, Samsung and Globalfoundries by agreeing a full support package for ARM intellectual property on the upcoming 10nm FinFET manufacturing process.

• eWBM Achieves First-Pass Silicon Success for Highly Secure Microcontroller with Synopsys Security IP
• MIPI Alliance Releases MIPI Gigabit Debug for IP Sockets
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2016
• InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage

Headlines for Wednesday Aug. 17, 2016

Top Story

Intel Grabs ARM for 10nm Foundry

Intel revealed its 10nm process could outperform other foundries and will be used to make ARM-based mobile chips for companies including LG Electronics. To enable the move, Intel partnered with ARM’s Artisan division that is porting a reference design for one of its 64-bit cores to the process.

• EnSilica teams with BaySand to provide ASIC UltraShuttle-65 multi-project wafer customers with configurable IP solutions
• ArcherMind Joins 96Boards and Launches Deci-Core ARMv8 Product
• BaySand Expands Its Board of Directors With Senior Semiconductor Veteran Executive
• Aldec Delivers Verification Support for Embedded Applications with New TySOM Embedded Development Kit

Headlines for Tuesday Aug. 16, 2016

• JEDEC Announces Annual Serial Presence Detect Enhancements
• Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence
• Seven Top-20 Semiconductor Suppliers Show Double-Digit Gains in 2Q16

Headlines for Monday Aug. 15, 2016

Top Story

Arasan Announces MIPI DPHY IP Core for TSMC 40uLP Process Targeting IoT

Arasan Chip Systems a leading provider of semiconductor IP for mobile and automobile SoCs today announced the availability of its MIPI DPHY IP Core for TSMC’s latest TSMC 40uLP process supporting 0.9v & 1.1v.

• Accellera Announces Relicensing of SystemC Reference Implementation under the Apache 2.0 License

Headlines for Thursday Aug. 11, 2016

• Orange Tree announces SuperSpeed USB 3.0 FPGA module
• SMIC Reports 2016 Second Quarter Results
• IP-Maker to showcase OLTP SQL acceleration

Headlines for Wednesday Aug. 10, 2016

Top Story

Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP

CEVA today announced that Rockchip, China's leading fabless semiconductor company, has licensed the CEVA-XM4 imaging and vision DSP to enhance the imaging and computer vision capabilities of its System-on-Chip (SoC) product lines targeting smartphones, ADAS, drones, robotics and other smart camera devices.

• Intel to Acquire Deep Learning Nervana
• TSMC July 2016 Revenue Report
• Rambus Signs License Agreement with Idaho Scientific
• GUC President Jim Lai Announces Retirement

Headlines for Tuesday Aug. 09, 2016

Top Story

Artosyn selects Chips&Media Lossy&Lossless Compression IP for Drone, Robots, AR, and VR SoCs

Artosyn Microelectronics, a leading supplier of Drone system on chip (SoC) in China, today announced that they have licensed Chips&Media’s Lossy&Lossless compression IP core, CFrame50 for their next-generation drone SoCs. Artosyn is well known as the world’s leading drone SoC company. This is the second purchase following the previous license of WAVE420 HEVC codec IP in last December.

• CAST and PLDA GROUP Demonstrate x86-Compliant High Compression Ratio GZIP Acceleration on FPGA, Accessible to non-FPGA Experts Using the QuickPlay Software Defined FPGA Development Tool
• Samsung to License Patent Portfolio From Tela Innovations
• Kalray Launches Krypto128 Accelerator Card
• Avery Design Systems Scale-Out With NVMe over Fabrics Verification Solutions
• Rambus Completes Acquisition of Snowbush IP Assets
• Semtech Completes Divestiture of Its Snowbush IP Business
• UMC Reports Sales for July 2016

Headlines for Monday Aug. 08, 2016

• MPEG LA Expands DisplayPort License Coverage
• Flex Logix Appoints Tony Kozaczuk as Director of Solutions Architecture
• Qualcomm Signs 3G/4G China Patent License Agreement with vivo
• Faraday Monthly Consolidated Sales Report - July 2016

Headlines for Friday Aug. 05, 2016

Top Story

Arastu Systems announces highly flexible and compact DDR3/4 single controller

Systems, a company that specializes in developing IPs in the Memory and Networking area today announced the immediate availability of an optimized DDR3/4 DRAM Controller Core, which gives users the flexibility to choose DRAM memories that fits best into their needs.

• Rambus Completes Acquisition of Inphi Memory Interconnect Business
• GUC Monthly Sales Report - July 2016
• IntelliProp Announces NVMe Host Accelerator IP Core With User-Friendly Hardware Interface

Headlines for Thursday Aug. 04, 2016

• Huge 2H16 Spending Surge Expected From Samsung, TSMC, and Intel

Headlines for Wednesday Aug. 03, 2016

Top Story

Faraday 12.5G SerDes PHY Debuts on UMC 28HPC(U) Process

Faraday Technology Corporation and UMC today announced the availability of Faraday's 12.5Gbps programmable SerDes PHY IP on UMC's 28HPCU process technology.

• Everspin Readies Industry's First 256Mb Perpendicular Spin Torque MRAM for Production and is Now Sampling Customers
• CEVA, Inc. Announces Second Quarter 2016 Financial Results

Headlines for Tuesday Aug. 02, 2016

Top Story

Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that they have delivered the industry’s first Design and Verification IP for MIPI SoundWire v1.1 and demonstrated interoperability of MIPI SoundWire solutions in collaboration with Realtek.

• MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications
• Global Semiconductor Sales Increase in Second Quarter
• PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay.
• INSIDE Secure signs a binding agreement to sell its semiconductor business to Swiss cybersecurity expert WISeKey

Headlines for Monday Aug. 01, 2016

Top Story

ARM expands IoT security team in Israel

ARM is expanding its Internet of Things (IoT) engineering team at the Kfar Netter design center in Israel one year on from its opening when ARM acquired Sansa Security.

• PLDA and Epostar to Demonstrate New PCIe/NVMe Solution, Delivering the Increased Throughput and Decreased Latency Required for Today's PCIe SSD Storage Applications
• Pierre Lamond Joins Flex Logix's Board of Directors
• Faraday Receives ISO9001: 2015 Plus Award, Proving the High Quality of its Design Service for Customers
• Socionext Bleeds Top Network SoC Talent to Acacia
• UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs