D&R Headline News (September 2016)

Headlines for Friday Sep. 30, 2016

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Qualcomm, NXP Discuss Merger, Say Reports

Qualcomm is in talks to buy NXP Semiconductors for more than $30 billion, according to multiple press reports. The reports have driven NXP’s stock up about 15% to an estimated market capitalization of about $33 billion.

• INSIDE Secure and Marvell Deliver Open Source Open Data Plane Security VPN Solution

Headlines for Thursday Sep. 29, 2016

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NetSpeed Releases Gemini 3.0 Cache-Coherent NoC IP to Supercharge Heterogeneous SoC Designs

NetSpeed Systems Inc., announced today the release of its Gemini 3.0 cache-coherent network-on-chip IP that maximizes the performance of heterogeneous multicore system-on-chip (SoC) designs for cloud computing, automotive, mobile and IoT applications.

• INVECAS to Enable ASIC Designs for Tomorrow's Intelligent Systems on GLOBALFOUNDRIES' FDX Technology
• ESD Alliance Reports EDA Industry Revenue Increase For Q2 2016
• INVECAS and GLOBALFOUNDRIES Announce Availability of Advanced 14nm FinFET Design IP Library for High-Performance Computing, Networking, and High-End Mobile Applications

Headlines for Wednesday Sep. 28, 2016

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Open-Silicon Tapes Out Industry's First High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in 16nm FF+

Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully taped out the industry’s first High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FF+ process in combination with TSMC’s CoWoS® 2.5D silicon interposer technology

• Moortec Receives 2016 TSMC Open Innovation Platform Partner of the Year New IP Award
• Leading-Edge Leads the Way in Pure-Play Foundry Growth
• USB-IF Announces USB Audio Device Class 3.0 Specification
• Cadence Recognized with Four TSMC Partner of the Year Awards
• Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab
• Via Expands LTE Patent Pool License Coverage to Include LTE-Advanced
• NXP Introduces Industry's Lowest Power ARM Cortex-A7 Based Processor to Fuel Growth of the Internet of Things

Headlines for Tuesday Sep. 27, 2016

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Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices

A comprehensive, scalable, integrated hardware and software silicon IP platform that is centered around a new imaging and vision DSP – the CEVA-XM6 - allows developers to efficiently harness the power of neural networks and machine vision for smartphones, autonomous vehicles, surveillance, robots, drones and other camera-enabled smart devices.

• Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle
• Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS)
• Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT
• Chip Market to Go Down, says Future Horizons
• ARM System IP boosts SoC performance from edge to cloud
• TSMC Recognizes Synopsys with Three Partner Awards for Interface IP and Joint Development of 7-nm Mobile and HPC Design Platforms
• Intrinsic-ID overall winner of EU 2016 Innovation Radar Prize
• Linaro Announces First Development Board Compliant with 96Boards IoT Edition Specification
• Linaro Announces LITE - Collaborative Software Engineering for the Internet of Things (IoT)
• Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs

Headlines for Monday Sep. 26, 2016

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Imagination 2.0 Update Ships

The MIPS core will be used in a new cellular baseband processor shipping next year and a supercomputer in the works in Japan. The two data points are welcome news at Imagination Technologies as it puts the finishing touches on a reorganization and reflects on directions in licensing.

• DCAN FD, A Configurable CAN Bus Controller with Flexible Data-Rate Targets Autonomous Cars & ADAS Systems
• Chip IP Biz & IC Industry M&As
• Kalray Works with Automobile Giants to put its MPPA Manycore Processor into Self-Driving Vehicles
• Asiczen Releases its APB Verification IP
• NetSpeed systems featured in EE TIMES' Silicon 60: Emerging Companies to Watch
• Amazing improvement of power and density for RFID chips with standard cell libraries at 180 nm from Dolphin Integration

Headlines for Friday Sep. 23, 2016

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Shanhai Capital to Acquire Analogix Semiconductor

Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. (Shanhai Capital), today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.

• TSMC Expands its 3D Menu
• Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms
• TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform
• eMemory Receives TSMC IP Partner Award

Headlines for Thursday Sep. 22, 2016

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PLDA Announces a Full Set of Solutions to Immediately Enable PCIe 4.0 Design Success

PLDA, today announced a full set of solutions allowing designers to create products optimized for PCIe® 4.0 now. PCIe 4.0 motherboards are not expected to be obtainable until 2017, but when they become available, the market will expect access to applications and components that can take advantage of PCIe 4.0’s speed and agility.

• 2016 a Sequel to Last Year's M&A Mania
• Analog Bits to deliver two presentations on 16nm IP at TSMC Open Innovation Platform Ecosystem Forum
• Acacia Subsidiary Acquires Additional Patents from Renesas Electronics Corporation
• Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology
• Cortus appoints Philippe Descamps as Director Worldwide Sales
• Brite Semiconductor Settled in Hefei to Jointly Build an IC Industrial Park
• Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum

Headlines for Wednesday Sep. 21, 2016

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iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals

The bill of materials (BOM) for an iPhone 7 equipped with 32 gigabytes (GB) of NAND flash memory carries $219.80 in bill of materials costs, according to a preliminary estimate from IHS Markit (Nasdaq: INFO), a world leader in critical information, analytics and solutions

• Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes
• INSIDE Secure completes the sale of its semiconductor business to Swiss cybersecurity expert WISeKey
• Synopsys and TSMC Collaborate to Certify Custom Compiler for 16FFC Process

Headlines for Tuesday Sep. 20, 2016

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Synopsys Delivers Complete DesignWare Bluetooth Low Energy IP Solution with Link Layer and PHY on TSMC 40ULP Process for IoT SoCs

Synopsys today announced the immediate availability of its complete DesignWare® Bluetooth® Low Energy IP solution consisting of the Link Layer and PHY on TSMC's 40-nanometer (nm) ultra-low-power (ULP) process.

• Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process
• Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Toshiba for Advanced Driver Assistance Systems (ADAS)
• Cambium Networks choses FlexSwitch IP for their PTP 700 platform
• ON Semiconductor Successfully Completes Acquisition of Fairchild Semiconductor for $2.4 Billion in Cash
• Emerging Memories: Ship First, Perfect Later
• Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New ARM Cortex-R52 CPU
• ARM enables autonomous vehicles with its most advanced safety processor
• Synopsys Accelerates Development of Safety-Critical Products with Design Solutions for ARM Cortex-R52
• M31 Technology Develops Complete MIPI PHY Solution Targeting Mobile Device Market
• Rambus Announces New Chief Financial Officer
• Real Intent Sets a New Benchmark in Early Verification of Digital Designs with Release 2016.A of Ascent Lint
• UltraSoC supports RISC-V: "the Linux of the semiconductor industry"

Headlines for Monday Sep. 19, 2016

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Cache Controller Core from CAST Augments Cache-Less 32-bit Processors

A cache memory controller IP core available from semiconductor intellectual property provider CAST, Inc. brings cost- and resource-effective improvements in performance, bandwidth, and function to systems using cache-less 32-bit processors.

• Synopsys and TSMC Collaborate on Development of Interface and Foundation IP for 7-nm FinFET Process
• TSMC Certifies Synopsys IC Compiler II for the Most Advanced 7-nm Process Node Enabling Early Tapeouts
• iPhone 7 Sports Intel, TSMC
• Credo Demonstrates Single-Lane 112G and 56G PAM-4 SerDes IP at TSMC OIP Forum
• Ashling and Synopsys Collaborate to Accelerate Development and Debugging of Software for ARC-Based Embedded Systems

Headlines for Friday Sep. 16, 2016

• Most embedded to become IoT
• North American Semiconductor Equipment Industry Posts August 2016 Book-to-Bill Ratio of 1.03
• GLOBALFOUNDRIES to Deliver Industry's Leading-Performance Offering of 7nm FinFET Technology
• GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX Platform

Headlines for Thursday Sep. 15, 2016

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Chevin Technology releases 25G Ultra Low Latency MAC/PCS for Xilinx Virtex UltraScale FPGAs

Chevin Technology Limited is excited to add the Low Latency 25Gbit/s MAC/PCS IP product to its existing range of Ultra Low Latency IP cores. The 25G LL MAC/PCS combines Chevin Technology’s 25GMAC and 25GPCS IP cores to significantly increase the efficiency and rate of data transfer by providing lowest possible latency.

• Asia-Pacific To Top 2016 Regional IC Sales In Major System Categories
• Inova Semiconductors licenses APIX3 to Socionext
• CEVA and AdasWorks to Demonstrate Free Space Detection for Autonomous Driving at AutoSens Conference 2016
• MIPI Alliance Developing MIPI Touch for Mobile Devices, Tablets and Automotive Applications

Headlines for Tuesday Sep. 13, 2016

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Renesas to Acquire Intersil to Create the World's Leading Embedded Solution Provider

Renesas and Intersil today announced they have signed a definitive agreement for Renesas to acquire Intersil for US$22.50 per share in cash, representing an aggregate equity value of approximately US$3.2 billion (approximately 321.9 billion yen at an exchange rate of 100 yen to the dollar).

• Imagination partners with MOSIS to empower universities to implement leading-edge CPUs in silicon for research projects
• Lattice Semiconductor Expands Automotive Product Portfolio With Addition of ECP5 and CrossLink Programmable Devices
• Arteris FlexNoC IP Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
• Microsemi Announces New Addition to its Imaging/Video Solution to Support Growing Demand for MIPI CSI-2 Interfaces
• Chip Process War Heats Up

Headlines for Monday Sep. 12, 2016

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Synopsys Introduces ARC Security Processors for Low-Power Embedded Applications

Synopsys today announced availability of the DesignWare®ARC® SEM110 and SEM120D security processors for low-power, embedded applications such as smart metering, NFC payment and embedded SIMs.

• Cadence Tensilica HiFi DSP Offers First processor IP Approved for Dolby AC-4 Decoder
• Cadence Offers Industry's First Licensable MPEG-H Audio Decoder for Tensilica HiFi DSPs
• Data Centers Dominate FPGA Event
• Sidense Exhibiting its 1T-OTP Memory Solutions at TSMC Open Innovation Platform (OIP) Ecosystem Forum
• Toshiba's "Easy Prototyping" Solution for Custom SoC Development Platform Reduces Need for Customer's Own Design Resources
• Vidatronic To Attend GLOBALFOUNDRIES Technology Conference - San Jose
• Titan IC licenses Its Helios RegEx Processor to LookingGlass for Network-Based Threat Mitigation.
• OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2016 OIP Ecosystem Forum

Headlines for Friday Sep. 09, 2016

• Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process
• Argon Design releases Argon Streams ARIB
• Synopsys Expands Collaboration with ARM to Deliver Artisan Physical Libraries and POP IP Support for IC Compiler II
• TSMC August 2016 Revenue Report
• UMC Reports Sales for August 2016

Headlines for Thursday Sep. 08, 2016

Top Story

GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology

GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry’s first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company’s next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles.

• Intel Spins out Security Group
• IAR Systems expands ARM tools for developers focused on the Internet of Things
• GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow's Connected Systems
• Technology Momentum Extends Synopsys IC Compiler II Deployments Past 100 Customers

Headlines for Wednesday Sep. 07, 2016

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Mixel MIPI D-PHY IP Integrated into Lattice's CrossLink Low Power pASSP

Mixel and Lattice Semiconductor today announced that Mixel’s complete MIPI® solution has been successfully integrated into Lattice Semiconductor’s recently announced CrossLinkTM solution, the industry’s first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays.

• Imagination teams with SaberTek and Mymo Wireless to deliver end-to-end licensable IP for LTE CAT1/0
• Allegro DVT Unveils Industry's First ATSC3.0 System Compliance Test Suite at IBC 2016
• NGCodec and PathPartner Technology jointly demonstrate H.265/HEVC codecs running on Xilinx FPGA's at the IBC Show
• Intrinsic-ID nominated as one of the 16 most dynamic digital innovators in Europe
• Ridgetop Group and BaySand Partner to Expand Mixed-Signal IP Portfolio and Services into Silicon Valley, Asia
• Newracom and Aviacomm Announce Availability of High-performance 802.11ah Reference Design for IoT Applications using Sub-1GHz ISM Frequency Bands
• Updated Semiconductor Outlook for Internet of Things
• Global Semiconductor Sales Rebound in July
• Faraday Monthly Consolidated Sales Report - August 2016
• Synopsys' New Virtualizer Studio Integrated Development Environment Accelerates Virtual Prototyping Productivity
• Boost Valley Announces its first FPGA proven IP - HDMI-CEC 2.0 Controller IP
• PathPartner Technology Returns to IBC 2016 with Low Latency HEVC Streaming Solutions and Improved Quality for Broadcast Workflows

Headlines for Tuesday Sep. 06, 2016

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Intel to Acquire Movidius: Accelerating Computer Vision through RealSense for the Next Wave of Computing

• Aperi and Barco Silex partner to provide native IP live remote production in 4K
• INSIDE Secure Delivers Secure Content Distribution and Monetization Software for the HTC Vive Ecosystem
• Arteris FlexNoC IP Licensed by Octasic for Industrial/Tactical Systems
• Socionext Introduces High Image Quality, H.264 Full-HD Multi-Channel Codec
• Synopsys Announces Standards Board Ratification of Its New Parasitic Models for Latest FinFET Process Nodes

Headlines for Monday Sep. 05, 2016

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Allegro DVT's AVS2 Compliance Streams Selected by MediaTek Inc.

Allegro DVT, the leader in audio/video compliance streams, announces that MediaTek Inc., a market leader in cutting-edge systems-on-chip (SoC) for mobile devices, wireless networking, HDTV, DVD and Blu-ray, has licensed Allegro DVT's AVS2 compliance streams.

• UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities
• GUC Monthly Sales Report - August 2016

Headlines for Thursday Sep. 01, 2016

Top Story

HDMI Releases Alternate Mode for USB Type-C Connector

HDMI Licensing, LLC today announced that it is releasing the HDMI Alternate Mode (“Alt Mode”) developed by the HDMI Founders for the USB Type-C™ Specification.

• Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles
• Argon Design Licenses Argon Streams HEVC to Socionext