D&R Headline News (October 2016)

Headlines for Monday Oct. 31, 2016

Top Story

$35B Qualcomm Question: What Next?

Now that Qualcomm has formally announced its purchase of NXP Semiconductors, it’s time to examine the deal’s potential consequences.

• Actions, Imagination, and Nibiru team to bring an immersive graphics experience to new all-in-one 2K VR headset solution
• MediaTek May Be Among First with 10nm SoCs
• Graphcore Secures $30m to Accelerate Artificial Intelligence
• Analog Devices Acquires Innovasic
• Lattice Semiconductor Releases Optimized Connectivity Solutions Based on ECP5-5G FPGAs for Communications and Industrial Markets
• ARM meets Generation Z demand for richer mobile VR and 4K streaming experiences
• Minimize power domain leakage and design margins while shortening Time-To-Market

Headlines for Thursday Oct. 27, 2016

Top Story

Qualcomm to Acquire NXP

Qualcomm and NXP Semiconductors today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

• ARM Fellow Surveys Moore's Law
• Advantech and ARM partner on end-to-end IoT Platform, from device to cloud
• Green Hills Software Extends Support for ARMv8-M Architecture
• ARM adopts ubisys ZigBee 3.0 technology for its Cordio radio IP
• Semiconductor IP Market to Exceed $8 Billion by 2020, According to Semico Research
• M31 Receives TSMC's 2016 Partner of the Year Award for Specialty Technology IP
• BrainChip Raises A$5.355 Million Through an Oversubscribed Placement
• Analog Devices Collaborates with ARM to Improve Security and Energy Efficiency for IoT Connected Devices

Headlines for Wednesday Oct. 26, 2016

• GlobalSign and Intrinsic-ID Deliver Scalable Hardware-Rooted Device Identities for the IoT Ecosystem
• TSMC Likely to Lock up Apple A10, A11 Orders
• Montage Technology Standardizes on Arteris FlexNoC Interconnect IP Licenses for Set-Top Box (STB) Chips
• Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip
• Movidius licenses Allegro DVT's multi-format video encoder IP for its next generation low-power machine vision systems-on-chip (SoCs)
• Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors
• SMIC Standardizes on Synopsys StarRC for Signoff Parasitic Extraction
• Xilinx Addresses Rigorous Security Demands at Fifth Annual Working Group for Broad Range of Applications
• UltraSoC enhances support for ARM with industry first AMBA 5 CHI NoC monitor

Headlines for Tuesday Oct. 25, 2016

Top Story

ARM accelerates secure IoT from chip to cloud

ARM has released its most comprehensive product suite ever to deliver new levels of security, efficiency, low-power connectivity and device life cycle management for the Internet of Things (IoT). With new processors, radio technology, subsystems, end-to-end security and a cloud-based services platform, ARM is aiming to increase the rate at which IoT scales globally.

• Synopsys Tools Enable Secure, Efficient IoT Designs Based On New ARM Cortex-M23 and Cortex-M33 Processors
• SilabTech Announces Release of Trace Port PHY (HSSTP) for debug of Multiple Cores designs
• Arteris Adds Support for ARM AMBA 5 AHB5 Protocol
• Intel, ARM Battle over IoT
• IDT Announces Wireless 5G Technology Solutions for Xilinx Devices
• Cadence Reports Third Quarter 2016 Financial Results
• Allegro DVT Enriches its Video Decoder Verification Packages With The Release of Multi-Codec Coverage Tool
• EnSilica opens specialist Design Centre for RF and low power sensing applications based near Oxford
• Chipus Microelectronics becomes an official Silterra's design partner
• Intrinsic-ID collaborates with Wind River to offer robust PUF-Based security library integrated with VxWorks
• Rambus Reports Third Quarter Financial Results
• Zebra Technologies, Bosch Connected Devices and Solutions and ARM Collaborate on Enterprise-Class Food Safety Solution to Better Protect Consumers
• Faraday Presents High-Performance IP and Ultra-Low-Power SoC Solutions at SEDEX 2016
• PRO DESIGN Expands FPGA Prototyping Portfolio with High-Speed proFPGA Virtex UltraScale based FPGA Modules

Headlines for Monday Oct. 24, 2016

Top Story

Netspeed Raises $10M in Series C Funding Led by Intel Capital to Bring Machine learning to SoC design and architecture

NetSpeed Systems Inc., announced today it has closed a $10 million Series C funding round led by Intel Capital with participation from investors SK Hynix and Walden-Riverwood Ventures.

• Qualcomm-NXP: Another Testosterone-Driven Deal?
• Rambus Licenses its DPA Countermeasures to NVIDIA
• Synopsys' Galaxy Design Platform Enables Superior Low-Power Designs on Samsung's 10-nm Process Technology
• Synopsys Custom Compiler Certified for Samsung's 10-nm Process Technology
• Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments
• Xilinx Zynq SoCs and MPSoCs Power Embedded Vision and IIoT Applications at ARM TechCon 2016
• TSMC, GF/Samsung Battle at 7nm
• Hisense selects their SoC Fabric for IoT from Dolphin Integration
• Moortec to exhibit at the TSMC 2016 China OIP Ecosystem Forum in Beijing
• SoC Solutions joins asicNorth's IoT Design Ecosystem
• Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung's 10nm Process Technology
• Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development

Headlines for Friday Oct. 21, 2016

Top Story

New NEMA|GFX Graphics API Enhances Rapid High Quality GUI Development for Embedded and Wearable Devices

Think Silicon announced the NEMA|GFX API (Application Programming Interface) designed to accelerate high quality Graphics User Interface (GUI) development for embedded and wearable devices.

• North American Semiconductor Equipment Industry Posts September 2016 Book-to-Bill Ratio of 1.05

Headlines for Thursday Oct. 20, 2016

Top Story

Allegro DVT Introduces New Lightweight Multi-Format Video Encoder IP

Allegro DVT today announced the availability of a new lightweight version of its multi-format encoder HW IP targeted at consumer applications with requirements for high quality video compression.

• Chips&Media, Inc. Joins the Alliance for Open Media
• Xilinx Announces Second Quarter 2017 Results; Advanced Products Repeat 60% Year-Over-Year Growth
• 2016 IC Market Forecast Raised from -2% to +1%
• asicNorth announces a Development Ecosystem to streamline the creation of mixed-signal IoT SoC's
• Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed

Headlines for Wednesday Oct. 19, 2016

Top Story

Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT

Faraday Technology today introduced the Uranus™ 55nm ultra-low-power SoC development platform for IoT applications. As the latest member of its MCU-based SoC development platform series, Uranus features Faraday’s PowerSlash™ IP, USB 2.0 interface, 12-bit 8-channel ADC, 10-bit DAC, embedded flash memory, and comprehensive SDK support, demonstrating the next level of IoT chip power-saving.

• Oxygen Layer May Extend Moore's Law
• CAST Expands Streaming Video IP Line with Motion JPEG Subsystem
• Chongqing Yubei District fuels mass entrepreneurship and innovation through a new ARM IP Pool
• Appeals Court Affirms Finding of Patent Invalidity in Suit Against Mentor in California
• Cadence Enables Customer Innovation with ARM-Optimized Solutions from Chips to Boards to Systems at ARM TechCon 2016

Headlines for Tuesday Oct. 18, 2016

Top Story

HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices

CEVA and HMicro, a wireless solutions firm developing integrated products for medical, industrial and the broad Internet of Things, today announced that HMicro has licensed and deployed CEVA's RivieraWaves Sense Wi-Fi IP in its WiPoint Wireless Technology platform.

• Imagination and Actions strengthen partnership on MIPS CPUs
• eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row
• SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line
• S2C's Latest Prodigy Interface Module For Juno ARM Development Platform Speeds FPGA Prototyping And Increases Scalability

Headlines for Monday Oct. 17, 2016

Top Story

Newracom Announces Availability of Ultra-Low Power ARM Core Based Wi-Fi 802.11 b/g/n MAC/PHY/Subsystem and RFIC IP for Internet of Things Applications

Newracom, Inc., a leading developer and licensor in wireless intellectual property of cutting-edge Wi-Fi technology, today announced the availability of NRC6181, a proven ultra-low power ARM Core based IEEE 802.11b/g/n MAC/PHY/full Wi-Fi subsystem and RFIC IP especially designed for Internet of Things (IoT) applications.

• Canonical and ARM collaborate to offer commercial availability of Ubuntu OpenStack and Ceph for 64-bit ARM-based servers
• Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development
• Baidu Adopts Xilinx to Accelerate Machine Learning Applications in the Data Center
• Mentor Graphics working with Bank of America to explore sale-sources
• DUSB2-ULPI, USB 2.0 device controller with ULPI interface
• Q&A: Embedded FPGA Facilitates Reconfigurable SoC/MCU RTL Blocks
• Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology

Headlines for Friday Oct. 14, 2016

Top Story

Smartlogic Announces PCI Express Multichannel DMA IP Core optimized for Video Streaming

The new release of the Multichannel DMA IP Core for PCI Express® contains important features that greatly simplify the DMA transmission of several independent videodatastreams and supports the Xilinx 7 and Ultrascale FPGAs.

Headlines for Thursday Oct. 13, 2016

Top Story

Did Processor Cause Samsung Note 7 Blowup?

It’s far from clear what exactly caused Samsung Note 7 to catch fire at this point. Samsung isn’t talking until after it finishes its own investigation.

• TSMC Grows Share of Foundry Business
• SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
• TSMC Reports Third Quarter EPS of NT$3.73

Headlines for Wednesday Oct. 12, 2016

Top Story

Faraday's PowerSlash IP Now Available on UMC's 55nm Ultra-Low-Power IoT Platform

Faraday Technology and UMC today announced the availability of Faraday’s PowerSlash™ fundamental IP cells on UMC’s 55nm ultra-low-power process (55ULP) technology.

• Imagination rolls out new 'Heterogeneous Inside & Out' MIPS CPU
• Xilinx Announces Production Milestone for 16nm UltraScale+ Portfolio Ahead of Schedule
• Moortec to exhibit at the ARM TechCon Expo in Santa Clara
• Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.3 Percent in 2016
• BaySand Introduces Enhanced FPGA to ASIC Conversion Program With IP Partners and Supporting Tools
• Chips&Media and Goke Microelectronics partner to provide video codec IP

Headlines for Tuesday Oct. 11, 2016

Top Story

Kilopass Delivers 'Refresh' on DRAM Technology

Kilopass today unveiled its Vertical Layered Thyristor (VLT) technology for DRAM applications. VLT eliminates the need for DRAM refresh, is compatible with existing process technologies and offers significant other benefits including lower power, better area efficiency and compatibility.

• Arteris Joins CCIX Consortium to Support Heterogeneous Cache Coherency Deployment
• TTTech Acquires Chip IP Specialist Flexibilis to Strengthen Position in Industrial Domain and to Expand Towards Smart Grid Market
• CCIX Consortium Triples Number of Member Companies and Announces Availability of Specification
• Achronix announces immediate availability of Speedcore embedded FPGA IP for SoC acceleration
• Cortus Launches High Performance Dual-Issue IP Core for Embedded Applications
• CSEM licenses IcyTRX Bluetooth Low Energy silicon RF IP to Oticon for use in advanced hearing aids.
• SureCore SRAMs design-ready, says CEO
• Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology
• Kilopass Reveals New VLT DRAM Technology This Week at MemCon, CSIA-ICCAD
• Aldec to Highlight ASIC Pre-Silicon Verification Spectrum with Network-On-Chip (NoC) Demonstration at DVCon Europe

Headlines for Monday Oct. 10, 2016

Top Story

CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things

CEVA today introduced a new lightweight, multi-purpose, processor IP core to streamline the design of cellular-enabled low data rate industrial and consumer loT devices.

• Cadence Delivers 10 New VIP Solutions to Accelerate Time to Market for Applications Based on Critical New Standards
• Mentor Graphics Acquires Galaxy Semiconductor
• Faraday Monthly Consolidated Sales Report - September 2016
• Innosilicon A4 Dominator, World 1st 14nm Litecoin Miner in Mass Production
• Companies Maximizing 300mm, 200mm Wafer Capacity
• Open-Silicon Extends Long-Term Collaboration with Mentor Graphics Technologies for Custom SoC Design Success
• Sonics to conduct "Energy Processing Units for Power-Sensitive Chip Designs" Seminar in Israel on Tuesday, November 8th

Headlines for Friday Oct. 07, 2016

• GUC Monthly Sales Report - September 2016
• UMC Reports Sales for September 2016
• TSMC September 2016 Revenue Report

Headlines for Thursday Oct. 06, 2016

Top Story

Startup Digs Deep Learning, Snags Big Backers

At a time when “Deep Learning” isn’t just hot but approaching the hype-cycle’s boiling point, nobody should be surprised at the emergence of another deep-learning, vision processing startup.

• EE Slashes CPU Design Cost
• Nokia bolsters its base station power efficiency by acquiring Eta Devices
• INSIDE Secure and 6WIND partner to bring high-performance and scalability to the Cloud
• Mentor Graphics, Northwest Logic, and Krivi Semiconductor Announce Availability of Complete DDR4 SDRAM IP Design and Verification Solution
• Ethernet Flexes Network Muscles
• TSMC Staffing R&D for 3nm Process
• Sony-Inside Huami Watch: Is It Time for FD-SOI?
• OmniPhy Announces 1000Base-T1 "Gigabit" Automotive Ethernet Silicon IP Development
• Ethernet Alliance Applauds Successful Completion of IEEE 802.3bz

Headlines for Wednesday Oct. 05, 2016

Top Story

Accelerate SHA-3 Cryptographic Hash Processing with New Hardware IP Core

A new intellectual property core supports the latest standard for protecting the integrity of electronic transmissions, Secure Hash Algorithm-3 (SHA-3), in a flexible, high-throughput, area-efficient hardware accelerator.

• Khronos Launches Dual Neural Network Standard Initiatives

Headlines for Tuesday Oct. 04, 2016

Top Story

Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics

Arteris Itoday announced that STMicroelectronics has licensed Arteris FlexNoC interconnect IP along with the FlexNoC Resilience Package.

• Google Does Consumer Electronics
• Asiczen Releases its CAN Verification IP
• Mentor Graphics Announces 64-bit ARMv8-A Support for the Nucleus Real-Time Operating System
• HDL Design House Opens New Office in Thessaloniki, Greece

Headlines for Monday Oct. 03, 2016

Top Story

Rambus Signs License Agreement With Xilinx

Rambus today announced it has signed a license agreement with Xilinx Inc., the world's leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs, covering Rambus' patented memory controller, SerDes, and security technologies.

• Kilopass Appoints Sue Kim Vice President of Corporate Marketing
• Intrinsic-ID and Guardtime Announce Alliance on IOT Blockchain
• Do Chip Designers Worry About the Impact of Power Consumption on Sustainability?
• Silicon Labs Acquires Leading RTOS Company Micrium
• Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon
• X-FAB to Acquire Assets of Altis Semiconductor
• MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology