D&R Headline News (November 2016)
Headlines for Wednesday Nov. 30, 2016
IoT and Automotive to Drive IC Market Growth Through 2020
Integrated circuit sales for connections to the Internet of Things are forecast to grow more than three times faster than total IC revenues during the last half of this decade, according to IC Insights’ new 2017 Integrated Circuit Market Drivers report.- New EEMBC Benchmark Targets Internet of Things Security Functions
- Intel Snags Exec from ARM to Run IoT
Headlines for Tuesday Nov. 29, 2016
Uniquify's LPDDR4 Super Combo IP Delivers 3200Mbps Performance in 28nm Low-Power Process Node
- SiFive Launches Industry's First Open-Source RISC-V SoC
- eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- BaySand, Codasip, Codeplay and UltraSoC accelerate IoT development with "silicon-to-intelligence" RISC-V platform
- ICScape SPICE Simulator Chosen by Kilopass for Pre- and Post-Layout Simulation of Memory IP
- Lattice Deal May Hit A Snag
Headlines for Monday Nov. 28, 2016
M&A Takes New Twists
The volume of mergers and acquisitions in the last two years has far surpassed historical records. But now the quality of the deals is changing, tooHeadlines for Thursday Nov. 24, 2016
Samsung said to be developing its own CPU core based on RISC-V
Samsung’s semiconductor division made a big leap forward this year with the development of its first custom CPU core inside its Exynos 8890 processor for the Galaxy S7, and it looks like the company intends to expand its CPU development efforts. According to industry sources, Samsung’s Device Solution division is working on its own CPU core for 32-bit microcontrollers, most likely targeted at the wearables and internet-of-things markets.- Global Patent Applications Rose to 2.9 Million in 2015 on Strong Growth From China; Demand Also Increased for Other Intellectual Property Rights
- North American Semiconductor Equipment Industry Posts October 2016 Book-to-Bill Ratio of 0.91
- Strategy Analytics: Apple Captures Record 91 Percent Share of Global Smartphone Profits in Q3 2016
- Barefoot Networks' Ecosystem Attracts New Investors
- Ambiq Micro's Ultra-Low Power Apollo Platform Selected by Fossil Group for its Hybrid Smartwatches
- Ningbo Semiconductor International Corporation Officially Inaugurated
Headlines for Tuesday Nov. 22, 2016
Codasip and UltraSoC deliver advanced RISC-V SoC analysis and debug
Codasip, the leading RISC-V processor IP provider, and UltraSoC, the leading provider of semiconductor IP for on-chip analytics, performance optimization and hardware-based security and debug, announced a broad collaboration to integrate the Codix-Bk series of RISC-V compliant processor cores seamlessly with the UltraSoC environment.Headlines for Monday Nov. 21, 2016
MACOM Announces Definitive Agreement to Acquire AppliedMicro
MACOM, a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire Applied Micro Circuits Corporation (NASDAQ:AMCC) (“AppliedMicro”).- Abaco Systems Acquires 4DSP
- Mobileye Adopts Key Synopsys Automotive Functional Safety Verification Solution to Enable ISO 26262 Compliance of its Next-Generation ADAS SoCs
- Intel's Nervana Attacks GPUs
Headlines for Friday Nov. 18, 2016
Latest NewsHeadlines for Thursday Nov. 17, 2016
Siemens Acquires Mentor Graphics: What Does This Mean for EDA?
The announcement of Mentor Graphics’ acquisition by Siemens is a huge step toward the convergence of the EDA and mechanical design markets. Siemens is a leading player in mechanical CAx design tools, while Mentor has an expansive EDA product portfolio. This acquisition shows that the future for the EDA industry is system-level design and that future is now.- Qualcomm and Samsung Collaborate on 10nm Process Technology For the Latest Snapdragon 835 Mobile Processor
- CEVA and NextG-Com Partner to offer Integrated LTE Cat-M1 and Cat-NB1 Solutions for Cost-Sensitive IoT applications
- Mobiveil to Target Its Universal NOR Flash Controller (U-NFC) to Support Adesto Technologies New eXecute-in-Place Non-volatile Memory (NVM) EcoXiP Chip
- Inomize and Verisense to Merge
- ST's Bozotti on 'back-to-silicon' differentiation
- MegaChips Adopts Omni Design's Ultra-Low Power Analog-to-Digital Converter Front-Ends for Next-Generation Communication Networks
- Gartner Says Chinese Smartphone Vendors Were Only Vendors in the Global Top Five to Increase Sales in the Third Quarter of 2016
Headlines for Wednesday Nov. 16, 2016
eMemory's NeoFuse IP Verified in TSMC 10nm FinFET Process
eMemory today announced the successful demonstration of its security-enhanced NeoFuse IP in TSMC’s 10nm FinFET process, along with IP design kits available to customers for product design-in.- Enyx Premieres 25G TCP and UDP Offload Engines with Xilinx Virtex UltraScale+ 16nm FPGA on BittWare's XUPP3R PCIe Board
- DELTA Microelectronics Expands UK Presence, Partners with Solution in Silicon
- Microsemi is First FPGA Provider to Offer Open Architecture RISC-V IP Core and Comprehensive Software Solution for Embedded Designs
- Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development
- NXP's New SmartMX2 P60 Step-Up! Secure Element is Enabled with Intrinsic-ID's Technology to Provide Secure Authentication and Confidential Data Exchange
- Five Top-20 Semiconductor Suppliers to Show Double-Digit Gains in 2016
- Blue Pearl Software Enters in to Agreement with FUJISOFT to Provide RTL Verification Solutions to Japan
Headlines for Tuesday Nov. 15, 2016
Brite Semiconductor Announces DDR4 IP Achieve 2400 Mbps on SMIC 40nm Process
Brite Semiconductor announced today, the YouPHY-DDR DDR4, DDR3/LPDDR3 subsystem had been silicon proven on SMIC 40nm low leakage process. According to the silicon data, the data rate of YouPHY-DDR reached to 2400Mbps in DDR4 protocol and 2133Mbps in DDR3/LPDDR3 with low power and small area successfully.- Packet Introduces Global ARMv8-A Bare Metal Cloud to Power Container and IoT Workloads
- Imagination Technologies Adopts Synopsys STAR Memory System for Embedded Memory Test and Repair for New MIPS Processor
- SMIC and IMECAS Sign A Cooperation Agreement for MEMS R&D and Foundry Platform
- Real Intent Announces Meridian RDC, a New Product for Reset Domain Crossing Sign-off
Headlines for Monday Nov. 14, 2016
Siemens to expand its digital industrial leadership with acquisition of Mentor Graphics
Siemens and Mentor Graphics (NASDAQ: MENT) ("Mentor") today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for $37.25 per share in cash, which represents an enterprise value of $4.5 billion.- Cadence Modus Test Solution Enables Support for Safety-Critical SoC Designs Using ARM MBIST Interface
- Denso to launch joint research on multithreaded CPU cores with Imagination Technologies
- Socionext Announces New Low-Power, Scalable ARM-based Multi-Core Processor SoC
- Xilinx to Dive in Hyperscale Race
- Synopsys Advances Test and Yield Analysis Solution for 7-nm Process Node
- ARM and US TrustedCare Inc., partner to integrate wearable and medical devices for accountable care
- Asiczen Releases its SMBus Verification IP
- Xilinx Reconfigurable Acceleration Stack Delivers Fastest Path to 2-6x Compute Efficiency over FPGA Competition
- France Brevets Licenses NFC Patents to HTC
- Omnitek announce availability of IP for SDI I/O, SDI Gearbox and SDI Standards Conversion for Xilinx FPGAs
- Socionext Develops 4K/60p HEVC Compatible Multi-Format Codec IC
Headlines for Thursday Nov. 10, 2016
Creonic Delivers New CCSDS LDPC Forward Error Correction IP Core
The new core provides block length and code rate flexibility, complementing the field-proven CCSDS LDPC (8160, 7136) encoder and decoder IP core. It extends Creonic’s broadest product portfolio of LDPC IP cores on the market.- SMIC Expects Record Roll to Continue
- Dolphin Integration offers a live webinar on the proven recipe for uLP SoC
- videantis wins second Deloitte Technology Fast 50 award fueled by rapid growth in automotive
- Codasip and BaySand Partnership Makes RISC-V Based ASICs an Ideal Choice for IoT Designs
- TSMC October 2016 Revenue Report
Headlines for Wednesday Nov. 09, 2016
Latest News- Thread Group Opens Testing to Members as ARM, NXP and Silicon Labs Bring First Conforming Stacks to Market
- Xilinx Unveils Details for New 16nm Virtex UltraScale+ FPGAs with High Bandwidth Memory and CCIX Technology
- Arteris Names Antonio J. Viana to its Board of Directors
- UMC Reports Sales for October 2016
Headlines for Tuesday Nov. 08, 2016
Xylon Introduces New Development Kit for Building Multi-Camera Embedded Vision Systems
Integrated kit accelerates development of embedded vision systems based on the Xilinx® Zynq®-7000 All Programmable SoC by providing comprehensive programmable platform, reference designs and Linux demo applications- Macnica Releases SLVS-EC Interface IP Core for FPGA
- Synopsys to Expand Software Security Signoff Solution with Acquisition of Cigital and Codiscope
Headlines for Monday Nov. 07, 2016
Dialog Semiconductor Announces Strategic Partnership and Investment with Energous Corporation to Accelerate Wireless Charging Adoption
Dialog Semiconductor today announced a strategic investment in Energous Corporation, the developer of WattUp®, a revolutionary wire-free charging technology that provides over-the-air power at a distance.- Faraday Monthly Consolidated Sales Report - October 2016
- SMIC Reports 2016 Third Quarter Results
- Digital Blocks Validates Existing I2C Slave Controller IP Core Family Compatibility with MIPI I3Cs
- GUC Monthly Sales Report - October 2016
- Excelsior's Ahead-Of-Time Java Compiler Now Available For ARM Platforms
- Verayo PUF IP on Xilinx Zynq UltraScale+ MPSoC Devices Addresses Security Demands
Headlines for Thursday Nov. 03, 2016
Lattice Semiconductor to be Acquired by Canyon Bridge Capital Partners, Inc. for $1.3 Billion
Lattice and Canyon Bridge today announced that the Company and Canyon Bridge Acquisition Company, Inc. (“Parent”), an affiliate of Canyon Bridge, have signed a definitive agreement under which Parent will acquire all outstanding shares of Lattice for approximately $1.3 billion inclusive of Lattice’s net debt, or $8.30 per share in cash.- SMIC Shenzhen Launches Construction of the First 12-Inch IC Production Line in South China
- The UNH-IOL Approved as First Independent Test Lab for the MIPI Product Registry
- ANSYS Acquired KPIT Medini Technologies
- Faraday Reports Third Quarter 2016 Consolidated Results
- Digital Blocks Celebrates 19 Years of Offering 82xx Peripheral Replacements
Headlines for Wednesday Nov. 02, 2016
StarChip and Cortus announce a strategic partnership to deliver Secure Solutions for the IoT, M2M and Industry 4.0 markets
This partnership will combine StarChip‘s expertise in hardware security with Cortus’s strong competency in developing advanced low powered 32-bit processors to provide root of trust solutions for today’s interconnected world facing complex security threats.- Anticipating a More Virtual Moore's Law
- Imperas and T&VS Partner to Update Software Verification and Validation Methodology for Embedded Systems
- CEVA, Inc. Announces Third Quarter 2016 Financial Results
- DCD Presents the DBLCD32, a Fully Configurable, Universal LCD/TFT Display Controller
- Global Semiconductor Sales Increase 11.5 Percent in Q3
- Microsemi Achieves MIL-STD-883 Class B Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs
- Arteris Ncore Cache Coherent Interconnect IP Licensed by Toshiba Corporation (Toshiba) for Automotive ADAS
- AI Chip Startup Shares Insights
- CAN Bus Design IP from CAST Now Bundles In Avery Verification IP
- Mentor Graphics Expands Mentor Embedded Linux Support for the latest AMD Embedded G-series Family of Processors
- Mindtree 4.2 Bluetooth Smart IP Powers NXP Kinetis KW41Z Wireless MCU