D&R Headline News (December 2016)

Headlines for Friday Dec. 30, 2016

• ASolid Adopts AndesCore N9 for its AS2726 eMMC Controller to Deliver Competitive Market Advantage
• ATopTech Responds to Recent Court Ruling in Copyright Case
• Nokia expands patent litigation against Apple in Asia, Europe and the US

Headlines for Thursday Dec. 29, 2016

• Korea Fines Qualcomm Nearly $1B

Headlines for Wednesday Dec. 28, 2016

• IPrium releases 40G I.3 Encoder/Decoder for DWDM systems
• TSMC Says 10nm on Track, Countering Reports

Headlines for Friday Dec. 23, 2016

Top Story

Arastu System's LPDDR3 Controller Core for Extended Battery Life

Arastu Systems, a company that specializes in developing IPs in the Memory and Networking area today announced the immediate availability of their LPDDR3 DRAM Memory Controller along with LPDDR4, that is optimized for FPGA and ASIC designs.

• Total Memory Market Forecast to Increase 10% in 2017

Headlines for Thursday Dec. 22, 2016

Top Story

Synopsys Obtains Injunction in Copyright Suit Against ATopTech

Synopsys, Inc. (Nasdaq:SNPS) today announced that a California Federal District Court has issued a permanent injunction against ATopTech and in favor of Synopsys. The injunction prohibits ATopTech from developing, using, selling, offering to sell, licensing or distributing any product containing PrimeTime report formats or certain PrimeTime non-SDC commands, variables or attributes.

• ESD Alliance Reports EDA Industry Revenue Increase for Q3 2016

Headlines for Wednesday Dec. 21, 2016

Top Story

TDK to Acquire InvenSense

TDK Corporation (President and CEO: Shigenao Ishiguro, hereinafter referred to as “TDK”) and InvenSense, Inc. (President and CEO: Behrooz Abdi, hereinafter referred to as “InvenSense”) entered into a definitive agreement today wherein TDK agrees to acquire all of the outstanding InvenSense shares for cash at an acquisition price of USD 13.00 per InvenSense share, for a total acquisition price of USD 1.3 billion.

• CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES
• Chips Execs See Maturing Industry
• FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform (IPU2.0)

Headlines for Tuesday Dec. 20, 2016

• HDL Design House Selected as ARM Approved Design Partner

Headlines for Monday Dec. 19, 2016

Top Story

PLDA Group Spins Off its QuickPlay FPGA Accelerator Activities into the Newly Formed Accelize

PLDA Group today announced the next step in its quest to make the hardware acceleration capabilities of FPGAs available to more developers: the spin-off of its QuickPlay® and QuickStore™ activities into a newly formed Accelize™ organization.

• Celeno and NGCodec demonstrate sub-frame latency 5GHz Wi-Fi Wireless Virtual Reality Solutions
• Cypress Commences Volume Shipments of MCUs Based on eCT Embedded Flash Memory Manufactured at UMC
• Inside Secure appoints Catherine Blanchet to its Supervisory Board

Headlines for Friday Dec. 16, 2016

Top Story

ARM extends HPC offering with acquisition of software tools provider Allinea Software

ARM has acquired Allinea Software, an industry leader in development and performance analysis tools that maximize the efficiency of software for high performance computing (HPC) systems. Currently, 80 percent of the world's top 25 supercomputers use Allinea's tools, with key customers including the US Department of Energy, NASA, a range of supercomputing national labs and universities, and private companies using HPC systems for their own scientific computation.

• China Dominates Planned Chip Fabs
• Number of IC Manufacturers Using 300mm Wafers Less than Half Using 200mm Wafers
• Jury Awards Core Wireless $7.3 Million in Patent Litigation Against Apple
• GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX Solutions
• Imagination's PowerVR GPU is first to pass OpenVX 1.1 conformance with Khronos

Headlines for Thursday Dec. 15, 2016

Top Story

Silicon-proven HBM Gen2 Hardened PHY from eSilicon

eSilicon today announced the availability of its silicon-proven 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY solution. High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).

• Imagination's Ensigma wireless communications IP now Wi-Fi CERTIFIED on chip that powers Creator Ci40 board
• Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
• Microsemi Adds IP for Resolver Sensors to FPGA-Based Multi-Axis Motor Control Solution Targeting Aerospace and Defense, Automotive and Industrial Applications
• GUC Opens New Netherlands Office
• Hardent to Demo Visually Lossless 4K Display Stream Compression at CES 2017
• Faraday Readies MCU ASIC Migration Path with 55nm eFlash
• Chip Market Brightens in 2017
• Samsung Reportedly Mulls Foundry Spinoff

Headlines for Wednesday Dec. 14, 2016

Top Story

Himax, emza and CEVA Partner to Create Ultra-Low Power, Always-On Vision Sensor for IoT

CEVA together with Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc. and emza Visual Sense, today announced that the companies have developed the industry's first intelligent always- on visual sensor specifically designed to overcome the power- and cost -constraints of vision processing for IoT applications.

• Rambus Renews License Agreement with Thales

Headlines for Tuesday Dec. 13, 2016

Top Story

Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC

Flex Logix Technologies, Inc., the leading developer of embedded FPGA IP cores and software, today announced it has completed design of a high-performance IP core for TSMC 16FF+ and 16FFC, with performance for wide, single-stage logic around ~1GHz at worst case PVT conditions.

• WiLAN Subsidiary Acquires Patent Portfolio from GLOBALFOUNDRIES
• Lurking Behind Every M&A Is China
• SRT Group License CEVA Signal Processing IP
• Alizem Releases its New DC Motor Control Embedded Software IP for Intel MAX 10 FPGAs
• GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology

Headlines for Monday Dec. 12, 2016

Top Story

Moortec Announce Embedded Voltage Monitor on TSMC 16FF+ and FFC Processes

Moortec Semiconductor, specialists in Process, Voltage and Temperature (PVT) sensors, announce the availability of their Embedded Voltage Monitor on TSMC’s 16nm FF+ and FFC processes.

• TSMC Plans New Fab for 3nm
• Lawmakers Urge Rejection of Lattice Semi Takeover
• CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors

Headlines for Friday Dec. 09, 2016

• TSMC November 2016 Revenue Report
• UMC Reports Sales for November 2016
• ARM Offers Support For TSMC 7nm Manufacturing
• Nantero Secures More Than $21M in Additional Funding
• Arasan Chip Sytems Announces Xilinx Alliance Program Membership

Headlines for Thursday Dec. 08, 2016

Top Story

Synopsys Announces Industry's First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites

Synopsys today announced the availability of the industry's first Verification IP (VIP) and source code test suite for DisplayPort 1.4 with DSC 1.2 and for eDP 1.4a/b.

• UNH-IOL Shines Spotlight on Internet of Things Interoperability
• Qualcomm Begins Commercial Sampling of World's First 10nm Server Processor and Reshapes the Future of Datacenter Computing
• Silexica Receives Series A Financing Led by Merus Capital
• Alliance between prpl Foundation and IoTSF puts 'security by design' at the heart of embedded computing

Headlines for Wednesday Dec. 07, 2016

Top Story

CEVA Leads the Bluetooth 5 IP Wave

CEVA today announced the general release of its RivieraWaves Bluetooth 5 IP. With multiple enhancements including longer range, higher speed and extended support for connectionless services, Bluetooth 5 is a significant upgrade over prior Bluetooth standards, offering both improved features for existing use cases and breakout features to open up exciting new IoT applications for the smart environment.

• Nexell's release of new AP supporting 4K 60fps with Chips&Media' HEVC/H.265 and VP9
• Synopsys Takes Hierarchical Timing Signoff Mainstream
• Smartlogic PCI Express DMA IP Cores now available for Intel FPGAs
• Xilinx FPGAs to be Deployed in New Amazon EC2 F1 Instances - Accelerating Genomics, Financial Analytics, Video Processing, Big Data, Security, and Machine Learning Inference
• Comcores demonstrates Radio-Over-Ethernet and L1 offload solution live at ITU FG IMT-2020 Workshop and Demo Day: Wireline Technology Enablers for 5G
• Five Suppliers Hold 41% of Global Semiconductor Marketshare in 2016
• What Siemens' Mentor Buy Means to IC Designers

Headlines for Tuesday Dec. 06, 2016

Top Story

TSMC, IBM Detail 7-nm Work

Like presents under a Christmas tree, separate papers on 7-nm process technology from TSMC and IBM energized a packed ballroom on the first day of the International Electron Devices Meeting (IEDM).

• Global Semiconductor Sales Increase 5 Percent Year-over-Year in October; Industry Forecast Revised Upward

Headlines for Monday Dec. 05, 2016

• GUC Monthly Sales Report - November 2016
• BrainChip and Cisco Internet of Everything Innovation Center Sign Agreement to Demonstrate the Capabilities of BrainChip's Spiking Neural Adaptive Processor (SNAP) Technology
• prpl Foundation and CABA create important alliance to advance smart home security
• Is Mobileye-Intel New 'Wintel' of Auto?
• Vanguard International Completed Qualifying Attopsemi's OTP in several CMOS nodes
• D32PRO, a 32-bit CPU from DCD named the Product of the Future by Polish Agency for Enterprise Development

Headlines for Friday Dec. 02, 2016

• No, The Sky Is Not Falling
• Will China Grab ARM Servers?

Headlines for Thursday Dec. 01, 2016

Top Story

Arasan Announces MIPI C-PHY IP Core compliant to the latest C-PHY v1.1 Specifications

Arasan today announced the immediate availability of its MIPI C-PHY IP Core fully compliant to the C-PHY specification Version 1.1 while also being compliant to the D-PHY 1.2 Specification. It supports the MIPI® Camera Serial Interface (CSI-2) and Display Serial Interface (DSI-2) protocols.

• RISC-V Expands its Audience
• Synopsys Completes Acquisitions of Cigital and Codiscope
• CEITEC chooses 8051 IP from CAST for Embedded Security Controller Platform
• QuickLogic Announces ArcticPro Ultra-Low Power Embedded FPGA IP Licensing Initiative
• QuickLogic Joins GLOBALFOUNDRIES FDXcelerator Partner Program
• WiLAN Subsidiary Enters into License Agreement with Elite Semiconductor Memory Technology Inc.
• Chipus Microelectronics launches a battery charger IP in a 0.18um BCD process
• Can Intel Win Auto Brain Chip Race?
• NGCodec uses Amazon EC2 F1 instances with custom FPGAs running 4k Video Compression
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2016
• Silvaco Launches MIPI I3C Sensor Connectivity IP Family