D&R Headline News (February 2017)

Headlines for Tuesday Feb. 28, 2017

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Avery Design Systems Focuses on Ultra HD Display VIP Portfolio

Avery Design Systems today announced availability its expanded Display VIP portfolio including support for HDMI 2.0b, DisplayPort 1.4, Embedded DisplayPort (eDP) 1.4b, DSI-2, and DSC 1.2.

• Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols, viz.: PCIe Gen4 and USB 3.1
• Dream Chip Technologies Demonstrates Automotive ADAS SoC using Arteris FlexNoC IP at Mobile World Congress
• CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
• SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices
• Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs
• Microsemi Announces Open Source Switchtec PCIe Switch Linux Drivers Enabling Rapid, Open Development of High Reliability PCIe Switching Solutions
• Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML

Headlines for Monday Feb. 27, 2017

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CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices

CEVAand Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) today introduced Dragonfly NB1, a comprehensive cost- and power-optimized NB-IoT solution aimed at streamlining the development of LTE IoT devices.

• Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8
• Nigel Toon Appointed as Advisor to Moortec Board
• Imagination's PowerVR graphics provide huge performance boost and power savings in MediaTek's new Helio X30 chipset
• DSR launches its ZBOSS 3.0, LightLink, GreenPower on CSEM RF
• Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC
• Truechip announces first customer shipment of 25G/ 50G Ethernet Comprehensive Verification IP (CVIP)
• Spreadtrum Launches 14nm 8-core 64-bit Mid- and High-end LTE SoC Platform
• Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator
• Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development
• ZTE Sued for AVC Patent Infringement
• Synopsys Announces Expansion of Liberty Modeling Standard, Paving Way for Ultra Low-Power IC Design
• Huawei Sued for AVC Patent Infringement

Headlines for Friday Feb. 24, 2017

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CommSolid Unveils Market's First Integration-Ready NarrowBand-IoT Modem IP Solution

CommSolid, the cellular IoT IP company, presents CSN130, the market’s first integration-ready NarrowBand-IoT IP (Intellectual Property) solution, at the Mobile World Congress 2017.

• CommSolid and Rohde & Schwarz Collaborate on NarrowBand IoT and its Evolution

Headlines for Thursday Feb. 23, 2017

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Neowine selects Barco Silex public key cryptography IP as most efficient hardware block

Barco Silex announces that Neowine, the Korean leader in security solutions for mobile communication and IoT applications, has selected Barco Silex’ IP core for public key cryptography. With an unrivaled ratio between performance and size, the BA414EP core will add asymmetric encryption to Neowine’s product line of ASICs, which are designed to secure communication and data exchanges in e.g. smartphones and IoT devices.

• Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip
• Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
• Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP
• Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT
• Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
• UMC Enters Mass Production for 14nm Customer ICs
• Goke Licenses SonicsGN and MemMax Products for STB SoC Platform
• CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

Headlines for Wednesday Feb. 22, 2017

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Blu Wireless Technology secures backing from ARM

Blu Wireless Technology has received a significant investment from ARM and other strategic and private investors. This will allow the companies’ mutual customers to deploy high performance mmWave and software defined networks (SDN) demanded for the cost-effective deployment of the forthcoming 5G standard.

• Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols
• Faraday's High Margin Products Delivered Positive Results, IP Revenues Reached a 9-Year High of NT$830 Million in 2016
• SST Announces Qualification of Embedded SuperFlash on 110 nm CMOS Process
• Silab Tech wins the "SME of the Year" Award at the Small Enterprise Business Awards 2016.

Headlines for Tuesday Feb. 21, 2017

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Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP

Allegro DVT today announced that Anyka Microelectronics, a leading fabless IC design house in China, has licensed Allegro DVT's multi-format H.264/AVC, H.265/HEVC and JPEG encoder IP for its next-generation System-on-Chips (SoCs).

• First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP
• Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP
• GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications
• Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology
• Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets
• Cyberon and Andes Collaborate on Voice Interface Solutions for IoT Devices
• Synopsys IC Compiler II Sets the Bar in Quality-of-Results
• Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

Headlines for Monday Feb. 20, 2017

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Intel Continues to Drive Semiconductor Industry R&D Spending

Intel continued to top all other chip companies in R&D expenditures in 2016 with spending that reached $12.7 billion and represented 22.4% of its semiconductor sales last year. Intel accounted for 36% of the top-10 R&D spending and about 23% of the $56.5 billion total worldwide semiconductor R&D expenditures in 2016.

• Inside Secure announces strong 2016 results following completion of strategic transformation
• A Roadmap to Emulation of 15 Billion Gate ICs
• Globalfoundries to build FDSOI fab in China
• Save time during the evaluation of silicon IPs thanks to MyDolphin

Headlines for Thursday Feb. 16, 2017

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Microsemi Collaborates with Silicon Creations to Enable Industry's Lowest Power FPGA 12.7G Transceivers With PHYs for Microsemi's PolarFire FPGAs

Microsemi and Silicon Creations, today announced their collaboration in developing the industry's lowest power field programmable gate array (FPGA) with 12.7 Gbps transceivers, using a Serializer/Deserializer (SerDes) PHY from Silicon Creations.

• Truechip Partners with SoAR Solution Inc. to Market Verification IP Products in Korea
• Mentor Graphics Announces Veloce Strato Platform Scales Up to 15BG
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2017
• Nvidia, and AMD Increase GPU Attach Rates While Total GPU Shipments Remain Flat Quarter to Quarter

Headlines for Wednesday Feb. 15, 2017

• VESA Highlights Growing DisplayPort Alt Mode Adoption and Latest DisplayPort Developments at Mobile World Congress
• SMIC Reports 2016 Fourth Quarter Results
• Ex-Leadcore Team Crafts SoC for Xiaomi
• Automotive Grade Linux Continues Rapid Growth

Headlines for Tuesday Feb. 14, 2017

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Winners & Losers of GloFo's China Deal

Globalfoundries' $10 billion Chengdu fab announcement is a reminder of China's inexorable arms race for semiconductor production capacity. Who just gained from the deal? Who's losing ground as the fab tsunami sweeps over China?

• QuickLogic Signs Agreement with Second Top-Tier Foundry for ArcticPro eFPGA IP
• IDT to Buy Optical Interconnect IC Vendor GigPeak
• Microsemi Unveils Industry's Lowest Power Cost-Optimized FPGA Product Family for Access Networks, Wireless Infrastructure, Defense and Industry 4.0 Markets
• Aldec sets a new paradigm with a single platform for Design Rule Checking and Clock Domain Crossing Verification for FPGA and ASIC designs
• Core Wireless Announces Patent License Agreement With Global Consumer Electronics Manufacturer

Headlines for Monday Feb. 13, 2017

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Profile: Restructured Imagination focusses on PowerVR, MIPS and wireless IP

Imagination Technologies is back on track, and focussing on intellectual property licencing, according to CEO Andrew Heath.

• Intel Introduces Versatile New FPGA for Industrial and Automotive Markets
• Extending 2 to 5 times the operation time of your battery-powered SoC
• Intrinsic ID Introduces CITADEL, the SRAM PUF-based Key Provisioning System that Breaks the Barriers of IoT Security
• Ford Invests in Argo AI, a New Artificial Intelligence Company, in Drive for Autonomous Vehicle Leadership
• StreamDSP Serial FPDP Now Supports Xilinx UltraScale+ and Altera Stratix-10 FPGAs
• Qualcomm Announces First End-to-End 802.11ax Wi-Fi Portfolio
• Semitech's Multi-Mode PLC Platform Receives G3-PLC Certification

Headlines for Friday Feb. 10, 2017

• Thread Group Takes Leap Forward with Availability of First Certified Software Stacks from ARM, NXP, OpenThread and Silicon Labs; Launches Product Certification Program
• TSMC January 2017 Revenue Report
• GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand
• Intrinsic ID's BROADKEY Secures IoT with Key Management Software Powered by SRAM PUF

Headlines for Thursday Feb. 09, 2017

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Intel Supports American Innovation with $7 Billion Investment in Next-Generation Semiconductor Factory in Arizona

Intel Corporation today announced plans to invest more than $7 billion to complete Fab 42, which is expected to be the most advanced semiconductor factory in the world. The high-volume factory is in Chandler, Ariz., and is targeted to use the 7 nanometer (nm) manufacturing process.

• IC Market Growth Limited by Narrow Window of Global GDP Expansion
• MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
• Faraday Monthly Consolidated Sales Report - January 2017
• Data Center Calls for 800GE Spec
• HOPU-ARM Innovation Fund officially launched
• UMC Reports Sales for January 2017

Headlines for Wednesday Feb. 08, 2017

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Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology

Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory.

• Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
• Report: Apple to add ARM processor to Mac computers
• Micron, Hynix Reportedly Seek Stake in Toshiba
• Crestron Moves to Intel FPGAs to Improve Video Quality, Connections
• TSMC, Samsung Diverge at 7nm
• eMemory Qualified NeoFuse in TSMC 16FFC Process

Headlines for Tuesday Feb. 07, 2017

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TSMC Calls for New EDA Paradigm

Engineers need a new class of tools to keep up with the complexity of designing today’s semiconductors, said a keynoter at the International Solid State Circuits Conference (ISSCC).

• Arteris FlexNoC Interconnect IP is Licensed by Nextchip for Automotive Advanced Driver Assistance Systems (ADAS)
• Crestron Leverages intoPIX Ultra-Low Latency JPEG 2000 Technology in New DigitalMedia NVX Series
• Significant IP-core Announcements for Omnitek
• Intel Shows 2.5D FPGA at ISSCC
• Valens and Lattice Semiconductor Partner to Deliver HDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions
• Aquantia and AptoVision Unveil First Software-Defined Video over Ethernet (SDVoE) Solution for Pro-AV Market utilizing Aquantia's FPGA Programmable PHY
• SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor

Headlines for Monday Feb. 06, 2017

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Flex Logix Qualifies Serial I/O IP From CAST And SOC Solutions For EFLX Embedded FPGA

• AI Attracts Embedded Chip Veteran
• AI Tapped to Improve Design
• GUC Monthly Sales Report - January 2017
• R-Stratus-LP silicon IP reduces significantly power consumption of flash memories
• StarChip's Secure IC for Bank Cards Enabled by SST's SuperFlash Technology
• IntoPIX and Icron co-host at ISE Conferences 2017

Headlines for Friday Feb. 03, 2017

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Global Semiconductor Sales Reach $339 Billion in 2016

The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $338.9 billion in 2016, the industry’s highest-ever annual sales and a modest increase of 1.1 percent compared to the 2015 total.

• UMC to Start 14nm Shipments in Q1
• Panasonic and UMC Partner for 40nm ReRAM Process Platform

Headlines for Thursday Feb. 02, 2017

• Virtual Reality Market To Grow When Hardware & Content Cost Less
• Rambus Selects Synopsys' ARC EM Processors for Embedded Security Platform
• Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach
• Aldec delivers DO-254 Compliant Templates and Checklists with the latest release of Spec-TRACER
• Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results
• GUC Unveils Solid State Drive ASIC Capabilities

Headlines for Wednesday Feb. 01, 2017

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Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology

Rambus Inc. (NASDAQ:RMBS) today announced its industry-leading 56G SerDes PHY which delivers enterprise-class performance across the challenging signal environments typical of high-speed communication systems. Developed on cutting-edge second generation FinFET (Fin Field Effect Transistor) process technology, this solution meets the growing demands of communications and data center applications.

• WiLAN Subsidiary Enters into Agreement with Microsemi
• CEVA, Inc. Announces Fourth Quarter and Year End 2016 Financial Results
• Barco Silex demonstrates Viper OEM solution for real-time 4K Video networking at ISE 2017
• Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
• Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform