D&R Headline News (March 2017)

Headlines for Friday Mar. 31, 2017

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Intilop's 10G Full TCP Accelerators with Network Security Features IP Core for Altera/Intel FPGAs qualified by major University and Government clients

Intilop delivers yet another industry first: a full TCP and UDP Accelerator with Network Security capability which performs functions of firewall and other monitoring functions at full line rate. In addition to full TCP/UDP offloading, this security module performs port filtering, blocking, monitoring and related functions in FPGA hardware thereby relieving CPU from these tasks.

• AMPHION appoints AVANT Technology as its distributor for the China and Taiwan markets
• JEDEC DDR5 & NVDIMM-P Standards Under Development
• Moortec to exhibit at the 2017 TSMC Technology Workshop in Boston

Headlines for Thursday Mar. 30, 2017

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Faraday Announces World's Smallest Footprint 40eHV and 40LP SRAM Compiler

Faraday Technology today announced the enhancement of its memory compiler IP offerings on both UMC 40eHV and 40LP processes. Based on UMC’s leading-edge 40nm bit cell and Faraday’s design optimization on the peripheral circuit, the newly-launched compilers are able to generate memory instances based on the world’s smallest footprint.

• Arteris FlexNoC Interconnect IP is Licensed by Ethertone Technologies for Enterprise Storage and Networking SoCs
• Barco Silex Partners With Accelize, Enabling Encryption-as-a-Service and More for Cloud Service Providers
• OmniPHY Unveils 25G Backplane SerDes Silicon on TSMC 28nm Technology
• IC Insights More Than Doubles its 2017 IC Market Growth Forecast
• Argon Design signs up first licensee for Argon360 real-time video stitching IP

Headlines for Wednesday Mar. 29, 2017

• Intel Unveils 10, 22nm Processes

Headlines for Tuesday Mar. 28, 2017

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ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX Technology Platform

ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF’s 22FDX® technology.

• Patent Trolls Plague Chip Vendors
• TDK's subsidiary TDK-Micronas to acquire ASIC specialist ICsense to further grow its sensor business
• Synopsys' IC Validator Used for Physical Sign-Off on More Than 100 FinFET Production Tapeouts

Headlines for Monday Mar. 27, 2017

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PLDA Announces Multiple Corporate-Wide Licenses for their XpressSWITCH PCIe 4.0 Switch IP

PLDA today announced a series of major licenses for their XpressSWITCH™ PCIe switch IP, confirming the expansion of PCIe-embedded switches. These licenses enable several major SoC and system vendors to solve their cost, flexibility, integration, and end-of-life issues by integrating a PLDA sub-system IP instead of an off-the-shelf ASSP.

• Aura Semiconductor Announces Partnership with Mindtree to Deliver Advanced Wireless Personal Area Network (WPAN) Solutions for IoT Devices
• EEMBC Benchmark Reveals True Energy Cost of Using Bluetooth LE for the Internet of Things
• ESD Alliance Reports EDA Industry Sees Highest Quarterly Revenue Increase in Five Years
• C-SKY Microsystems selects Dolphin Integration's energy management offering for smart voice-interacted devices
• RC Module Licenses OmniPHY's Gigabit Ethernet Technology
• SMIC 2016 Annual Results Announcement

Headlines for Friday Mar. 24, 2017

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BitSim's IP, Bit-MIPI CSI-2 used in Flir's new generation of thermal cameras, the Exx-series

Flir Systems is using BitSim's FPGA-IP, Bit-MIPI CSI-2 in their newly launched advanced thermal cameras.

• Roadmap Says CMOS Ends ~2024
• Moortec to exhibit at the 2017 TSMC China Technology Symposium in Shanghai

Headlines for Thursday Mar. 23, 2017

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Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced a successful network processor tape-out based on Samsung’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus.

• GlobalSign Joins ARM mbed IoT Device Platform Partnership Program
• ST's SPAD Imager Likely Linked to iPhone 8
• Apple hires group of UK GPU engineers
• Mythic Launches AI Platform and Announces $9M Funding Round to Enable Datacenter-Scale Local AI in the Smallest Form Factor on Any Device

Headlines for Wednesday Mar. 22, 2017

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High-performance, high-bandwidth IP platform for Samsung 14LPP process technology

eSilicon enables high-speed networking and communications and high-performance computing with complete IP platform and 2.5D implementation

• Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier
• Arteris FlexNoC Interconnect IP is Licensed by Samsung for its Foundry Customers
• Samsung Edges TSMC in 10 nm

Headlines for Tuesday Mar. 21, 2017

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Village Island releases world-wide the VICO-4, the "4K over single 3G-SDI" appliance empowered by TICO

Village Island, a video equipment supplier and integrator head-quartered in Japan, announces VICO-4 from the VICO series enabling UHD smart transport and powered by TICO, the revolutionary high-efficiency compression engine from intoPIX.

• MIPS, execution culture and getting into AI
• Synopsys Announces Availability of Comprehensive Low Power Reference Kit for Design and Verification
• Inside Secure delivers Application Protection to defend against malicious attacks on Android Java devices
• BrainChip Advances its Position as a Leading Artificial Intelligence Provider with an Exclusive License for Next-Generation Neural Network Technology
• ARM DynamIQ: Expanding the possibilities for artificial intelligence
• Space Codesign to Announce SpaceStudio V3 to Facilitate Functional Verification and Validation of Embedded Systems

Headlines for Monday Mar. 20, 2017

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Synopsys' New High-Performance Secure Module with Cryptography Acceleration Speeds Security Functions by 100x

Synopsys today announced availability of its new high-performance DesignWare® tRoot H5 Hardware Secure Module (HSM) with Root of Trust, providing designers with a Trusted Execution Environment (TEE) that protects sensitive information and data processing within their system-on-chips (SoCs).

• NXP Goes All In on FD-SOI
• Why ARM wants to do more
• Peregrine Semiconductor, A Murata Company, Acquires Arctic Sand Technologies

Headlines for Friday Mar. 17, 2017

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U.S. Companies Still Hold Largest Share of Fabless Company IC Sales

Largest fabless IC marketshare increase has come from Chinese suppliers, who now hold a 10% share.

• SEMI Reports 2016 Global Semiconductor Equipment Sales of $41.2 Billion
• Appeals Court Reverses Dismissal of Patents in Oregon Proceeding
• North American Semiconductor Equipment Industry Posts February 2017 Billings

Headlines for Thursday Mar. 16, 2017

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Comcores announces commercial availability of a complete Radio-Over-Ethernet and L1 offload solution for fronthaul enabling easy bring up of Ethernet based connectivity in radio systems

Comcores ApS, a specialized supplier of silicon intellectual property (SIP) today launched a complete IP solution enabling Radio-Over-Ethernet.

• TSMC Tips 7+, 12, 22nm Nodes
• Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
• Cypherbridge Systems and eWBM Introduce Solutions Based on FIDO Alliance U2F and UAF Specifications Powered by Synopsys Security IP
• Synopsys and TSMC Collaborate to Develop Interface, Analog and Foundation IP for 12-nm FinFET Process
• Synopsys' IC Compiler II Certified for TSMC's 12-nm Process Technology
• Moortec to exhibit at the 2017 TSMC Technology Workshop in Austin

Headlines for Wednesday Mar. 15, 2017

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Intel/Mobileye Duopoly: Dream or Nightmare?

Intel’s Mobileye acquisition Monday has stirred mixed emotions and contrasting reviews among those who cover the industry. Excitement, puzzlement, surprise, fear, confidence and some disappointment.

• Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology
• Green Hills Software and Imagination Announce INTEGRITY RTOS Support for MIPS I6400 CPU
• NXP Announces ARM Cortex-M4-based MCU with Industry's Largest Embedded SRAM Memory, Optimized for Portable Devices
• SMIC Signs License Agreement For Invensas' DBI(R) Technology
• Xilinx Debuts Industry-First Solutions at OFC 2017 and Further Expands High Speed Data Center Interconnect Offerings
• GUC PCIe 3 PHY IP & PLDA EP Controller Combo Passes Compliance Test
• True Circuits Showcases State-of-the-art Ultra PLL, Low Power IoT PLL and 16nm IP Portfolio at TSMC NA Technology Symposiums
• ICE-G3 EPU Adds Cluster Controller to Save More Energy For Complex Chip Power Architectures

Headlines for Tuesday Mar. 14, 2017

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Arteris Ncore Cache Coherent Interconnect and FlexNoC IP are Licensed by ZTE

Arteris today announced that the chip design division of ZTE has licensed the highly-configurable Arteris® Ncore™ cache coherent interconnect IP as well as the Arteris FlexNoC® interconnect IP for use in its advanced systems-on-chip (SoC).

• The System(s)-on-a-Chip (SoC) Market to Reach a 7.7% CAGR through 2021, says Semico Research
• OVH and Accelize Partner to Deliver FPGA Acceleration-as-a-Service through OVH RunAbove Lab
• Cadence Achieves Certification for TSMC's 7nm Process Technology
• Barco Silex and Imagination collaborate on SoC security
• Silicon Creations Delivers 12.7G SERDES PMA for TSMC 40LP Process and PLL IP for TSMC 7nm Process
• CAST Expands CAN Bus Solutions Suite with New PHY Daughter Card
• Andes Technology Corporation Goes IPO On the Taiwan Stock Exchange
• Synopsys Extends Automotive Ecosystem for Virtual Prototyping to Include Silicon Mobility Semiconductor Solutions
• InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology
• Innovium Raises $38.3M in Oversubscribed Series C Funding and Announces Advisory Board
• Synopsys' IC Compiler II Completed Certification for TSMC's 7-nm Process Technology
• Kalray Announces the Release of an Efficient Manycore Processing Solution Dedicated to Deep Learning
• UMC and Synopsys Collaboration Speeds 14-nm Custom Design
• ARM's new RTOS gets visualization from Percepio
• Imagination and Intercede demonstrate the power of the Trust Continuum in securing the IoT

Headlines for Monday Mar. 13, 2017

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Intel to Acquire Mobileye

Intel Corporation (NASDAQ: INTC) and Mobileye N.V. (NYSE: MBLY) today announced a definitive agreement under which Intel would acquire Mobileye, a global leader in the development of computer vision and machine learning, data analysis, localization and mapping for advanced driver assistance systems and autonomous driving.

• PLDA Announces XpressRICH4-AXI PCIe 4.0 IP, Providing a High Performance and Reliable AXI Bridge for SoC designs
• GreenWaves Technologies Selects Dolphin Integration's low power virtual components for the industry's first IoT processor
• Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium
• GreenWaves Technologies Partners with Open-Silicon to Develop Industry's First IoT Processor Based on PULP and RISC-V
• Open-Silicon Announces IoT Gateway SoC Platform
• New embedded chip from Socionext features PowerVR Series8XE GPU from Imagination
• Imagination Technologies and Express Logic announce expansion of ThreadX RTOS support for MIPS CPUs
• eSOL's eMCOS Scalable RTOS Platform Supports Xilinx Zynq UltraScale+ MPSoC for Next-Generation ADAS and Industrial IoT
• NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors
• Xilinx Expands into Wide Range of Vision-Guided Machine Learning Applications with reVISION
• Easily Implement Efficient Public-Key Crypto to Protect IoT Devices and Data Paths with Maxim's Embedded Security Platform
• QuickLogic Releases Aurora Software for Evaluation of ArcticPro eFPGA IP
• eT-Kernel Real-Time Operating System Supports ARMv8-M Architecture for Next-Generation ARM Cortex-M Family
• Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology
• Mentor Graphics Achieves ISO 26262 Certification for Questa Product Line Tool Qualification Report
• Moortec to exhibit at the 2017 TSMC NA Technology Symposium in Santa Clara

Headlines for Friday Mar. 10, 2017

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Codasip and TVS Deliver Advanced RISC-V Verification Solutions

Codasip, a leading RISC-V processor IP provider, and T&VS (Test and Verification Solutions), a leading verification services provider for semiconductor IP, hardware and software, today announced a broad collaboration to accelerate the verification of products based on the Codix-Bk series of RISC-V compliant processor cores.

• RISC-V Enters Mainstream at Embedded World 2017
• TSMC February 2017 Revenue Report
• Auto SoCs: Race to ASIL D
• Alibaba Collaborating with Intel on an FPGA-based Solution to Help Customers Accelerate Business Applications

Headlines for Thursday Mar. 09, 2017

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ARM Servers 'Compelling' for Microsoft

Microsoft is testing ARM server SoCs from Cavium, Qualcomm and at least one other supplier, boosting their hopes of cutting into the lucrative dominance of Intel’s x86 in servers.

• UMC Reports Sales for February 2017
• ReFLEX CES Introduces the 1st Arria 10 SoC System-On-Module, Named "Achilles"
• JEDEC Updates Standards for Low Power Memory Devices
• Leti announces backside shield that protects microchip from physical attacks

Headlines for Wednesday Mar. 08, 2017

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SoftBank to sell 25% of ARM to Saudi-backed fund

Japan’s SoftBank is set to sell a roughly $8bn stake in Arm, the UK chip designer it purchased only six months ago, placing 25 per cent of Britain’s largest technology company into a new, Saudi-backed $100bn investment fund.

• Imagination's new PowerVR Furian GPU architecture will deliver captivating and engaging visual and vision experiences
• Synopsys Advances Virtual Prototyping to Enable System and Semiconductor Supply Chain Collaboration for Next-Generation SoCs
• Arteris Announces PIANO 2.0 Automated Interconnect Timing Closure Technology
• Achronix Semiconductor Corporation joins the OpenCAPI Consortium
• M31 Deploys a Full Range of IP for TSMC 16nm FFC Process
• Record Spending for Fab Equipment Expected in 2017 and 2018
• eMemory's NeoFuse Implemented in HV Process for OLED Application
• Aldec Introduces End-to-end HW/SW Co-verification for Xilinx Zynq SoC FPGAs at Embedded World 2017
• NEC and AIST Develop LSI with NanoBridge Technology Featuring High Radiation Tolerance for use in Space
• Everspin Expands MRAM Ecosystem with Xilinx FPGAs
• Imagination shows latest technologies for IoT, automotive and security at Embedded World 2017
• Sidense Exhibiting at TSMC 2017 North American Technology Symposiums

Headlines for Tuesday Mar. 07, 2017

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Synopsys Announces Industry's First ASIL D Ready Dual-Core Lockstep Processor IP with Integrated Safety Monitor

Synopsys, Inc. (Nasdaq: SNPS) today announced availability of DesignWare® ARC® EM Safety Island IP, dual-core lockstep processors that simplify development of safety-critical applications and accelerate ISO 26262 certification of automotive system-on-chips (SoCs).

• Faraday Monthly Consolidated Sales Report - February 2017
• Brazil's Unitec licenses MIPS CPU from Imagination Technologies for chip targeting smart cities
• Startup Taps TSMC to Attack Broadcom
• Rambus Signs License Agreement with Western Digital

Headlines for Monday Mar. 06, 2017

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AMPHION releases 2 extended performance variants of its highly successful HEVC/H.265 'Malone' video decoder IP core

Amphion Semiconductor today announced the immediate availability of 2 extended performance variants of its highly successful HEVC/H.265 ‘Malone’ video decoder core for SoC implementation.

• Ultra-low power memory generators silicon proven at TSMC 55 nm uLP and uLP eFlash
• Linaro Announces Fujitsu's Collaboration to Accelerate High Performance Computing on ARM
• Additional unlicensed spectrum needed to deliver future Wi-Fi connectivity
• January Semiconductor Sales Up 14 Percent Compared to Last Year
• HXT Semiconductor Joins Linaro to Accelerate Advanced Server Development on ARM
• GUC Monthly Sales Report - February 2017
• Cypress Closes Sale of Minnesota Wafer Fabrication Facility

Headlines for Friday Mar. 03, 2017

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Eleven Companies Forecast to Account for 78% of Semi Capex in 2017

Survey results that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report show that eleven companies are forecast to have semiconductor capital expenditure budgets greater than $1.0 billion in 2017, and account for 78% of total worldwide semiconductor industry capital spending this year.

• China's Xiaomi Develops First In-House Smartphone Processor in co-operation with ARM
• Socionext Develops World's First Graphics Display Controller with OpenVX Compliant Hardware Accelerator

Headlines for Thursday Mar. 02, 2017

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D'Crypt to include Barco Silex IP for public key cryptography in cutting-edge communication chip

Barco Silex, leading provider of security IP cores, has entered into an agreement with D’Crypt Pte Ltd, Singapore’s premier design house for hardware cryptography solutions. Barco Silex will provide D’Crypt with its BA414EP core for public key cryptography for inclusion in their FPGA solutions that will secure automotive car-to-infrastructure communication.

• Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
• Daliworks Inc. joins ARM mbed partnership to expand its Thing+ IoT ecosystem.
• Texas Multicore Technologies Announces Full Support for ARM Processors
• High-Performance Computing gets more energy-efficient data transfer
• ARM's soft launch for machine learning library
• Intel, Spreadtrum Demo Brainchild
• TSMC Joins Semiconductor Research Corporation
• Xilinx Demonstrates Responsive and Reconfigurable Vision Guided Intelligent Systems at Embedded World 2017

Headlines for Wednesday Mar. 01, 2017

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Autotalks Turns to Athena for its Truly Secure V2X Solution

After years of development, testing and prototyping, Autotalks' 2nd generation V2X solution is mass-market ready and, starting in 2019, will be implemented in new cars. To satisfy critical security demands of Autotalks' V2X communications architecture, Athena's TeraFire® EC Ultra security microprocessors are embedded to authenticate each incoming packet received.

• Masayoshi Son, Softbank Founder Betting on ARM, Preaches Security
• Merger Agreement Approved by Shareholders of Lattice Semiconductor
• Aldec unveils Xilinx UltraScale FPGA-based prototyping board enabling Simulation Acceleration and Emulation with the latest release of HES-DVM
• NetSpeed Gains ISO 26262 Certification, ASIL-D Ready, for Its Interconnect IP