D&R Headline News (May 2017)

Headlines for Wednesday May. 31, 2017

Top Story

Flex Logix Delivers High-Performance, High-Density Embedded FPGA for Deep Learning, Data Center and Base Station Chips

Flex Logix™ Technologies, Inc., a leading developer of embedded FPGA IP cores and software, today announced it has completed design of its second-generation high-performance IP core for TSMC 16FF+ and 16FFC processes. Enabling embedded FPGA arrays greater than 100,000 LUTs, the new Flex Logix core enables chips to be easily customizable and upgradeable in-field.

• Cadence Announces VirtualBridge Adapter for Palladium Z1 Emulator to Accelerate Software Bring-Up Time by Up to Three Months
• "Billion Dollar Capex Club" Forecast to Swell to 15 Companies in 2017
• Synopsys Integrates VESA Display Stream Compression into DesignWare MIPI DSI IP to Enable 4K Ultra HD and Higher Resolution Displays
• QuickLogic Establishes eFPGA Support Center to Accelerate IP Licensing Model
• Altair Semiconductor Employs Sonics' NoC to Integrate Baseband IC of ALT1250 IoT LTE Chipset
• New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board

Headlines for Tuesday May. 30, 2017

Top Story

Report: Apple working on neural processor

Consumer giant Apple Inc. is designing a processor IC specifically to perform artificial intelligence tasks, according to a Bloomberg report that references an unnamed source.

• Atomic Rules announces DPDK-aware FPGA/GPP data mover
• Synopsys ZeBu Server Emulation System Selected by Konica Minolta
• S2C Prodigy Player Pro New Configuration Cockpit Streamlines FPGA Prototyping And Debug Setup
• Moortec to exhibit at the 2017 TSMC Europe OIP Ecosystem Forum and Technology Symposium in Amsterdam
• GIGABYTE Technology Announces Expansion of their ARM Server Portfolio based on Cavium's ThunderX2 Workload Optimized Processor Family
• ARM's next Mali GPU tweaks Bifrost

Headlines for Monday May. 29, 2017

Top Story

ARM Cores Target AI-powered Future

ARM plc Monday (May 29) announced its two new application processor cores, the high-end Cortex-A75 and the mid-range Cortex-A55, as part of an ambitious goal to accelerate AI adoption and get an ARM processor core into every IoT device by 2035.

• 2017 Automotive IC Market on Pace for Record Year
• Programmable Battery Charger IPs For SoC Applications
• Sankalp Semiconductor to Exhibit at DAC 2017
• ARM launches flagship cores in 'DynamIQ' style
• Synopsys Design and Verification Tools Enable Successful Tape-outs by Early Adopters of New ARM Cortex-A75, Cortex-A55 and Mali-G72 Cores

Headlines for Friday May. 26, 2017

Top Story

Reports: ARM agrees to create Chinese IP firm

Processor intellectual property (IP) company ARM and a venture capital fund it helped form in China have agreed to form a Chinese joint venture to create intellectual property for IC designs, according to reports.

• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
• UltraSoC attracts fresh investment as technology industry recognizes huge potential for embedded intelligence
• Sensory and ARM Processors Enabling AI at the Edge
• Kalray Announces the Release of its Third-Generation MPPA Processor "Coolidge"

Headlines for Thursday May. 25, 2017

Top Story

Samsung Set to Lead the Future of Foundry with Comprehensive Process Roadmap Down to 4nm

Samsung Electronics, a world leader in advanced semiconductor technology, today announced a comprehensive foundry process technology roadmap to help customers design and manufacture faster, more power efficient chips.

• Perceptia Joins GlobalFoundries FDXcelerator Program to Bring PLL Technology to Portable Devices
• Intrinsic ID Announces SPARTAN Authentication Family for IoT Device Security
• Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Technology
• Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technologies

Headlines for Wednesday May. 24, 2017

Top Story

SST Announces Qualification of Smartbit OTP NVM Technology for ON Semiconductor's 110 nm CMOS Process

Microchip Technology through its Silicon Storage Technology (SST) subsidiary announced that ON Semiconductor, driving energy efficient innovations, has qualified SST’s Smartbit™ One-Time Programmable (OTP) Non-Volatile Memory (NVM) technology for SP110, ON Semiconductor’s 110 nm process node.

• Synopsys Announces Availability of DesignWare IP on Samsung 14LPP and 10LPP Process Technologies
• Synopsys Custom Compiler Certified by Samsung for 28FDS Process Technology
• Synopsys Enables the Next Wave of Design Innovation on Samsung's Latest Foundry Processes, 8LPP and 7LPP
• Israel's Vayyar Imaging Licenses Sonics NoC For Use in 3D Sensor Chips
• New SHA-3 hashing IP from Barco Silex helps customers implement future-proof security
• New Open Virtual Platforms Processor Models for ARM, Imagination Technologies, RISC-V and Renesas Accelerate Software Development
• Synopsys IC Validator Certified by Samsung for 10LPP Process Technology Physical Signoff
• Mentor Announces Availability of Tools and Flows for Samsung 8LPP and 7LPP Process Technologies

Headlines for Tuesday May. 23, 2017

• Sidense SHF Memory Macros Target IoT and Other Very Low Power Applications in TSMC's 40ULP Process
• Synopsys' New Superscalar ARC HS Processors Boost RISC and DSP Performance for High-End Embedded Applications
• GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China
• RFEL's Wideband Channeliser - ChannelCore Flex Now Available on the Ettus USRP X310 Platform
• IPrium releases 40G LDPC I.6 Encoder/Decoder for DWDM systems

Headlines for Monday May. 22, 2017

Top Story

Synopsys Delivers Industry's First Multi-Protocol 25G PHY IP in 7-nm FinFET Process

Synopsys today announced its new DesignWare® Multi-Protocol 25G PHY IP for high-performance computing applicationslligence. The PHY IP gives designers the flexibility to efficiently integrate multiple protocols including PCI Express® 4.0, 25G Ethernet, SATA and CCIX into system-on-chips (SoCs) targeting the 7-nanometer (nm) and 16-nm FinFET processes

• Shanghai Zhaoxin Semiconductor Co., Ltd Licenses OmniPHY's Fast Ethernet Technology
• Palma Ceia Joins Wi-Fi Alliance to Promote Adoption of Wi-Fi HaLow (802.11ah) for IoT
• Unprecedented growth at EnSilica sees a major recruitment drive to fuel its continued expansion
• SiFive Unveils the first RISC-V-based Arduino Board
• Dolphin Integration unveils its new generation of 32-kHz oscillators for IoT and wearable applications

Headlines for Friday May. 19, 2017

Top Story

TDK Completes Acquisition of InvenSense

TDK Corporation and InvenSense, Inc. announce that TDK has completed the all-cash acquisition of InvenSense. The acquisition price was $13.00 USD per InvenSense share, and the total acquisition price was approximately $1.3 billion USD.

• First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
• Moortec to exhibit at DAC 2017 in Austin

Headlines for Thursday May. 18, 2017

Top Story

ASIX Adopts Synopsys' USB Type-C Subsystem Verification Solution

Synopsys today announced that ASIX Electronics Corporation has adopted Synopsys' USB Type-C™ Subsystem Verification Solution for USB, USB Power Delivery and DisplayPort, including subsystem test suites and automated testbench generation.

• Xilinx Invests in Machine Learning Pioneer DeePhi Tech
• Qualcomm Takes on the World, in Court
• Acacia Communications Reduces Simulation Regression Turnaround Time by 2X Using Synopsys VCS Fine-Grained Parallelism Technology for High-Speed Optical Interconnect SoCs
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2017
• Rambus, PLDA and Avery Design Announce Comprehensive PCIe 4.0 Solution

Headlines for Wednesday May. 17, 2017

Top Story

Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard

Xilinx today announced an achievement in PCI Express® Gen4 capability. Together with IBM, the two companies are first to double interconnect performance between an accelerator and CPU through the use of PCI Express Gen4 compared to the existing widely-deployed PCI Express Gen3 standard.

• Samsung Spinoff Likely to Grab Foundry Share
• Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs
• Rambus to Demonstrate CryptoManager IoT Device Management with STMicroelectronics
• Alma Technologies Introduces an Online Tool for Comparison of Image Compression Standards

Headlines for Tuesday May. 16, 2017

Top Story

ARM and CSNE from the University of Washington partner to develop brain-implantable chips

ARM and the Center for Sensorimotor Neural Engineering (CSNE) have signed an agreement whereby the CSNE will develop a unique ‘brain-implantable’ system-on-a-chip (SoC) for bi-directional brain-computer interfaces (BBCI) aimed at solving neurodegenerative disorders.

• Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff
• Novatek Reduces TV Boot Time with Data Decompression IP Core from CAST
• Faraday Introduces UrLib+ Add-on Library on UMC 40LP Process
• Rambus Launches Turnkey Secure Connectivity with CryptoManager IoT Device Management
• Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics

Headlines for Monday May. 15, 2017

Top Story

Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies

Sondrel announced today that it has signed an agreement to acquire the IMGworks division of Imagination Technologies. The IMGworks engineering team will join with Sondrel’s existing engineering consultancy to create a combined IC design capability comprising more than 250 highly skilled employees.

• Magnachip starts mass production of AMOLED Smart Phone Driver with TITC Compression IP
• Xilinx Debuts Industry-First P4_16 to FPGA Compilation and Introduces New P4-NetFPGA Workflow for Networking Researchers at P4 Industry Events
• eMemory Taps into IoT Markets with its Game-Changing Security IP
• Worldwide Semiconductor Revenue Grew 2.6 Percent in 2016, According to Final Results by Gartner
• Microsoft Outlines Hardware Architecture for Deep Learning on Intel FPGAs
• Dolphin Integration offers a live webinar on how to get an SoC power consumption under 0.5 uA in sleep mode

Headlines for Thursday May. 11, 2017

• ST opts for phase-change memory on 28nm FDSOI
• Rambus Joins Microsemi's SoC Partner Program

Headlines for Wednesday May. 10, 2017

Top Story

Imagination announces first PowerVR Series8XT IP core based on new Furian GPU architecture

Imagination Technologies (IMG.L) announces the first GPU IP core based on its new PowerVR Furian architecture, the Series8XT GT8525. Furian is designed to enable a new generation of consumer devices to deliver high-resolution, immersive graphics content and data computation for sustained time periods within mobile power budgets.

• Racyics Launches "makeChip" Design Service Platform for GLOBALFOUNDRIES' 22FDX Technology
• TSMC April 2017 Revenue Report
• SMIC Reports 2017 First Quarter Results
• SMIC Transitions CEO Responsibility to Dr. Haijun Zhao While Dr. Tzu-Yin Chiu Stays as Vice Chairman and Non-Executive Director
• Logic Fruit and Accelize Announce Strategic Partnership to deliver Next Gen IP cores
• Andes, First Mainstream CPU IP Provider to Adopt RISC-V, Expands Product Line with New 64bit Processor IP
• Algo-Logic Systems Launches Third Generation FPGA Accelerated CME Tick-To-Trade System

Headlines for Tuesday May. 09, 2017

Top Story

Sonics And Northwest Logic Partner On High Throughput Memory Subsytem Solutions

Sonics and Northwest Logic today announced their partnership to deliver high throughput memory subsystem solutions for complex System-On-Chip (SOC) designs.

• Xilinx Spartan-7 FPGAs Now in Production
• Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking
• UMC Reports Sales for April 2017
• VESA Forms Special Interest Group Focused on Emergent Virtual and Augmented Reality Markets
• Enea Adds Support for Xilinx Zynq UltraScale+ MPSoC Devices

Headlines for Monday May. 08, 2017

Top Story

SiFive Secures $8.5 Million Series B Funding to Advance RISC-V Based Semiconductors

SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it has raised $8.5 million in a Series B round led by Spark Capital with participation from Osage University Partners and existing investor Sutter Hill Ventures.

• Flex Logix Raises $5 Million In Series B Funding
• Moortec to exhibit at ChipEx 2017 in Israel
• Credo Unveils Robust Portfolio of 56G and 112G PAM-4 PHY Connectivity Solutions

Headlines for Friday May. 05, 2017

Top Story

As Apple Jilts Imagination, MIPS Goes on Block

With the potential loss of Apple -- which accounts for about half of the U.K.-based company’s revenue -- looming large, Imagination is fighting for its survival.

• Faraday Monthly Consolidated Sales Report - April 2017
• GUC Monthly Sales Report - April 2017
• After Moore's Law - What?

Headlines for Thursday May. 04, 2017

Top Story

Imagination: Year end trading update, Apple dispute resolution procedure and planned sale of MIPS and Ensigma

Imagination Technologies Group plc (LSE: IMG, “Imagination”, “the Group”), a leading multimedia, processor and communications technology company, publishes a trading update for the year to 30 April 2017, has commenced a dispute resolution procedure with Apple Inc. (“Apple”) and announces that it intends to sell its MIPS and Ensigma businesses.

• Synopsys Announces Industry's First Verification IP and Test Suites for Latest MIPI CSI-2 v2.0 and PHY Specifications
• China Mobile, ARM, Cavium and Enea Sign Agreement for Cooperation in China Mobile Open NFV Testlab
• Microsemi and Synopsys Extend 20-Year OEM Relationship and Collaborate on New PolarFire FPGAs to Deliver Customized Synthesis Support
• CEVA, Inc. Announces First Quarter 2017 Financial Results
• SiFive Launches CPU IP Industry into the Cloud with New RISC-V Cores and an Easy Online Business Model
• Sankalp Semiconductor Strengthens Management Team
• MIPI Alliance Forms Birds of a Feather Group to Define Embedded Security Considerations for Mobile and Mobile-Influenced Designs
• TSMC Prosecutes Ex-Employee for Leaking Secrets
• Hitek Announces Ultra Low Latency 10G Ethernet FPGA IP Core Integrated with Solarflare SFA7942Q AOE

Headlines for Wednesday May. 03, 2017

Top Story

VeriSilicon's Vivante VIP8000 Neural Network Processor IP Delivers Over 3 Tera MACs Per Second

VeriSilicon Holdings Co., Ltd. (VeriSilicon), a Silicon Platform as a Service (SiPaaS®) company, today announces VIP8000, a highly scalable and programmable processor for computer vision and artificial intelligence.

• InfoSec Global and Synopsys Collaborate to Deliver Complete Hardware/Software Root of Trust Solution
• Mentor enables 64-bit ARM-v8 Cortex-A72 support in its Nucleus Real-Time Operating System

Headlines for Tuesday May. 02, 2017

• Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers
• Synopsys and jNet ThingX Optimize JavaCard OS for Synopsys' ARC SEM Security Processors
• Samsung Poised to Become World's Largest Semi Supplier in 2Q17
• Aldec unveils the newest Xilinx Zynq-based TySOM Embedded Prototyping Board at Embedded Vision Summit 2017
• Khronos Releases OpenVX 1.2 Specification for Cross-Platform Acceleration of Power-Efficient Vision Processing

Headlines for Monday May. 01, 2017

Top Story

Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile Markets

Cadence today unveiled the Cadence® Tensilica® Vision C5 DSP, the industry’s first standalone, self-contained neural network DSP IP core optimized for vision, radar/lidar and fused-sensor applications with high-availability neural network computational needs.

• eASIC and Comcores Announce Support for CPRI V7.0
• Global Semiconductor Sales in March Up 18.1 Percent Year-to-Year
• Renesas Electronics America, Intrinsic ID, and Medium One Introduce Complete Sensor-to-Cloud Platform to Simplify Secure IoT Development
• Lattice Semiconductor Releases New Embedded Vision Development Kit Targeted for Mobile-Influenced Applications at the Edge
• Faster Networks Push Interface Development
• Apple Stops Royalties to Qualcomm